Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18766596 | TRENCH ISOLATION STRUCTURES WITH VARYING DEPTHS AND METHOD OF FORMING THE SAME | July 2024 | December 2024 | Allow | 5 | 1 | 0 | No | No |
| 18744482 | FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACKSIDE CONDUCTIVE MATERIAL AND METHOD FOR MAKING THE SAME | June 2024 | January 2025 | Allow | 7 | 1 | 0 | No | No |
| 18655471 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | May 2024 | July 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18398429 | FLEXIBLE FABRIC BASED TRANSISTORS FOR ELECTROMECHANICAL SENSING ON 2D and 3D CURVED SURFACES | March 2024 | March 2025 | Allow | 15 | 2 | 0 | No | No |
| 18594321 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18587993 | SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | February 2024 | August 2024 | Allow | 6 | 1 | 0 | No | No |
| 18422795 | CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES | January 2024 | April 2025 | Allow | 14 | 2 | 1 | Yes | No |
| 18423229 | SEMICONDUCTOR PACKAGE | January 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18404178 | DEVICE OVER PHOTODETECTOR PIXEL SENSOR | January 2024 | June 2025 | Allow | 17 | 1 | 0 | No | No |
| 18575243 | METHOD OF MANUFACTURING GALLIUM NITRIDE SINGLE-CRYSTAL SUBSTRATE AND METHOD OF MANUFACTURING SINGLE-CRYSTAL SUBSTRATE OF NITRIDE OF GROUP 13 ELEMENT IN PERIODIC TABLE | December 2023 | January 2025 | Allow | 13 | 1 | 0 | No | No |
| 18538152 | LASER ANNEALING APPARATUS, LASER ANNEALING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18389582 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS | November 2023 | April 2024 | Allow | 5 | 1 | 0 | No | No |
| 18503453 | System, Device and Methods of Manufacture | November 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18491678 | MEMORY DEVICES AND ELECTRONIC SYSTEMS | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18381929 | Method of Forming a Semiconductor Module | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18376437 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | October 2023 | June 2024 | Allow | 8 | 1 | 0 | No | No |
| 18285064 | FLEXIBLE FABRIC BASED TRANSISTORS FOR ELECTROMECHANICAL SENSING ON 2D and 3D CURVED SURFACES | September 2023 | March 2025 | Allow | 18 | 1 | 1 | No | No |
| 18369512 | CHANNEL CONDUCTION IN SEMICONDUCTOR DEVICES | September 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18241954 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS | September 2023 | October 2023 | Allow | 2 | 1 | 0 | No | No |
| 18236868 | HIGH-SPEED LIGHT SENSING APPARATUS | August 2023 | April 2024 | Allow | 8 | 1 | 0 | No | No |
| 18235997 | IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18231830 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | August 2023 | June 2024 | Allow | 10 | 1 | 0 | No | No |
| 18362507 | WIDE CHANNEL SEMICONDUCTOR DEVICE | July 2023 | July 2025 | Allow | 23 | 1 | 0 | No | No |
| 18227908 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18361196 | CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18348478 | SEMICONDUCTOR DEVICE | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18218909 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | July 2023 | March 2024 | Allow | 8 | 1 | 0 | No | No |
| 18344460 | LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME | June 2023 | May 2025 | Allow | 22 | 1 | 0 | No | No |
| 18339964 | CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES | June 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18339137 | BONDED STRUCTURE WITH INTERCONNECT STRUCTURE | June 2023 | August 2024 | Allow | 14 | 1 | 0 | No | No |
| 18204596 | IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING APPARATUS | June 2023 | June 2025 | Allow | 25 | 2 | 0 | No | No |
| 18320321 | Two-Port SRAM Structure | May 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18319610 | CHIP PACKAGE STRUCTURE | May 2023 | April 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18314569 | INTEGRATED CIRCUIT (IC) DEVICE | May 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18140917 | SEMICONDUCTOR DEVICES | April 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18130952 | POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES | April 2023 | September 2024 | Allow | 18 | 0 | 0 | No | No |
| 18184295 | SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS | March 2023 | November 2023 | Allow | 8 | 1 | 0 | No | No |
| 18106448 | SEMICONDUCTOR DEVICE | February 2023 | July 2023 | Allow | 5 | 0 | 0 | No | No |
| 18105432 | HIGH-SPEED LIGHT SENSING APPARATUS | February 2023 | July 2023 | Allow | 5 | 1 | 0 | No | No |
| 18104299 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS | February 2023 | August 2023 | Allow | 7 | 1 | 0 | No | No |
| 18096914 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | January 2023 | August 2023 | Allow | 7 | 1 | 0 | No | No |
| 18145221 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | December 2022 | September 2023 | Allow | 9 | 0 | 0 | No | No |
| 18068718 | METHOD OF MAKING A SEMICONDUCTOR DEVICE USING A DUMMY GATE | December 2022 | May 2025 | Allow | 29 | 1 | 1 | No | No |
| 18078734 | SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS | December 2022 | August 2023 | Allow | 9 | 1 | 0 | No | No |
| 17991184 | IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS | November 2022 | May 2023 | Allow | 6 | 0 | 0 | No | No |
| 17979793 | SEMICONDUCTOR SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF | November 2022 | November 2023 | Allow | 13 | 1 | 0 | No | No |
| 17973561 | PACKAGE STRUCTURE | October 2022 | March 2025 | Allow | 29 | 2 | 1 | No | No |
| 17959530 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | October 2022 | April 2023 | Allow | 6 | 0 | 0 | No | No |
| 17958849 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | October 2022 | April 2023 | Allow | 6 | 0 | 0 | No | No |
| 17951099 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS | September 2022 | January 2023 | Allow | 4 | 1 | 0 | No | No |
| 17898656 | INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIRCUIT PACKAGE | August 2022 | July 2024 | Allow | 23 | 1 | 1 | No | No |
| 17886530 | INTEGRATED CIRCUIT (IC) DEVICE | August 2022 | February 2023 | Allow | 6 | 0 | 0 | No | No |
| 17886977 | DETECTION DEVICE | August 2022 | June 2025 | Allow | 35 | 1 | 0 | No | No |
| 17877534 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | July 2022 | June 2025 | Allow | 34 | 1 | 0 | No | No |
| 17876114 | DISPLAY DEVICE | July 2022 | June 2025 | Allow | 35 | 1 | 0 | No | No |
| 17870075 | System, Device and Methods of Manufacture | July 2022 | August 2023 | Allow | 12 | 1 | 0 | No | No |
| 17869003 | Semiconductor Device and Method of Forming the Same | July 2022 | September 2023 | Allow | 14 | 1 | 0 | No | No |
| 17867702 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | July 2022 | August 2023 | Allow | 12 | 1 | 0 | No | No |
| 17862267 | PACKAGE STRUCTURE HAVING TRENCH CAPACITOR | July 2022 | June 2025 | Allow | 35 | 1 | 0 | No | No |
| 17854316 | SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES | June 2022 | September 2023 | Allow | 15 | 1 | 0 | No | No |
| 17835415 | DISPLAY APPARATUS AND METHOD OF PROVIDING DISPLAY APPARATUS | June 2022 | July 2025 | Allow | 37 | 1 | 0 | Yes | No |
| 17805817 | SECURITY CIRCUITRY FOR BONDED STRUCTURES | June 2022 | August 2024 | Allow | 26 | 1 | 0 | No | No |
| 17831591 | SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER PORTION | June 2022 | March 2025 | Allow | 34 | 1 | 0 | No | No |
| 17781977 | METHOD FOR PRODUCING SINGULATED ENCAPSULATED COMPONENTS | June 2022 | February 2025 | Allow | 32 | 1 | 0 | No | No |
| 17830403 | SEMICONDUCTOR DEVICE | June 2022 | April 2025 | Allow | 34 | 1 | 0 | Yes | No |
| 17827801 | METHOD OF FORMING SEMICONDUCTOR DEVICE | May 2022 | July 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17827480 | Method of Forming Trenches with Different Depths | May 2022 | February 2023 | Allow | 8 | 0 | 0 | No | No |
| 17752867 | CLEANING METHOD AND PLASMA PROCESSING APPARATUS | May 2022 | February 2025 | Allow | 32 | 1 | 0 | No | No |
| 17750086 | SELF-ALIGNED CONTACT FOR EMBEDDED MEMORY | May 2022 | May 2025 | Allow | 36 | 1 | 1 | No | No |
| 17744753 | APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT, METHOD FOR TRANSFERRING ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PANEL | May 2022 | June 2025 | Allow | 37 | 1 | 1 | No | No |
| 17743470 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | May 2022 | March 2025 | Allow | 34 | 1 | 0 | No | No |
| 17741402 | MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION | May 2022 | July 2023 | Allow | 14 | 1 | 0 | No | No |
| 17741431 | SEMICONDUCTOR DEVICE | May 2022 | December 2022 | Allow | 7 | 0 | 0 | No | No |
| 17775757 | HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEM | May 2022 | May 2025 | Abandon | 36 | 1 | 0 | No | No |
| 17662532 | Non-Conformal Gate Oxide Formation on FinFET | May 2022 | February 2025 | Allow | 33 | 1 | 0 | No | No |
| 17735090 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES | May 2022 | July 2024 | Allow | 26 | 1 | 0 | No | No |
| 17734436 | INTEGRATED CIRCUIT DEVICE | May 2022 | February 2025 | Allow | 34 | 1 | 0 | Yes | No |
| 17769760 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPARATUS | April 2022 | April 2025 | Allow | 36 | 1 | 0 | Yes | No |
| 17720899 | Interconnect Structure and Method of Forming the Same | April 2022 | June 2025 | Allow | 38 | 1 | 1 | No | No |
| 17717291 | SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF | April 2022 | April 2025 | Allow | 36 | 2 | 0 | Yes | No |
| 17712225 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES | April 2022 | January 2023 | Allow | 9 | 0 | 0 | No | No |
| 17711509 | RF POWER PALLET WITH MANAGEMENT DAUGHTER BOARD | April 2022 | March 2025 | Allow | 36 | 1 | 0 | No | No |
| 17710830 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME | March 2022 | December 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17709250 | LIGHT EMITTING DEVICE | March 2022 | October 2024 | Allow | 31 | 1 | 0 | No | No |
| 17702927 | Surface Mount Radiofrequency Component | March 2022 | May 2025 | Allow | 38 | 1 | 1 | No | No |
| 17702765 | SEMICONDUCTOR PACKAGE WITH HIGH DENSITY OF THROUGH-SILICON VIAS (TSV) | March 2022 | July 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17702171 | SEMICONDUCTOR STRUCTURE AND METHODS FOR BONDING TESTED WAFERS AND TESTING PRE-BONDED WAFERS | March 2022 | October 2024 | Allow | 31 | 1 | 0 | Yes | No |
| 17700447 | DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE | March 2022 | November 2024 | Allow | 32 | 1 | 0 | No | No |
| 17687790 | SEMICONDUCTOR DEVICES | March 2022 | January 2023 | Allow | 10 | 1 | 0 | No | No |
| 17686055 | Transistor Gate Contacts and Methods of Forming the Same | March 2022 | February 2025 | Allow | 36 | 1 | 1 | No | No |
| 17683074 | CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES | February 2022 | December 2024 | Allow | 33 | 1 | 0 | No | No |
| 17683154 | SHAPED METAL EDGE FOR GALVANIC OR CAPACITIVE ISOLATOR | February 2022 | October 2024 | Allow | 32 | 1 | 0 | No | No |
| 17679896 | SEMICONDUCTOR DEVICE | February 2022 | July 2024 | Allow | 29 | 1 | 0 | No | No |
| 17677453 | SEMICONDUCTOR PACKAGE | February 2022 | May 2024 | Allow | 27 | 1 | 0 | Yes | No |
| 17676052 | DISPLAY DEVICE | February 2022 | October 2023 | Allow | 20 | 2 | 0 | No | No |
| 17636309 | METHOD OF MANUFACTURING LAMINATE | February 2022 | January 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17671553 | METHOD FOR TRANSFERRING ELECTRONIC ELEMENTS | February 2022 | February 2025 | Abandon | 36 | 1 | 0 | No | No |
| 17669252 | CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE | February 2022 | July 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17666904 | THREE-DIMENSIONAL PACKAGING STRUCTURE AND METHOD FOR FAN-OUT OF BONDING WALL OF DEVICE | February 2022 | April 2024 | Allow | 27 | 1 | 0 | No | No |
| 17665070 | SEMICONDUCTOR STORAGE DEVICE WITH BONDING ELECTRODES | February 2022 | May 2024 | Allow | 27 | 1 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner HA, NATHAN W.
With a 60.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 42.2% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner HA, NATHAN W works in Art Unit 2814 and has examined 1,724 patent applications in our dataset. With an allowance rate of 90.4%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 20 months.
Examiner HA, NATHAN W's allowance rate of 90.4% places them in the 72% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by HA, NATHAN W receive 1.31 office actions before reaching final disposition. This places the examiner in the 26% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by HA, NATHAN W is 20 months. This places the examiner in the 89% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +5.2% benefit to allowance rate for applications examined by HA, NATHAN W. This interview benefit is in the 30% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 30.8% of applications are subsequently allowed. This success rate is in the 53% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 35.1% of cases where such amendments are filed. This entry rate is in the 45% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 100.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 71% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 83.3% of appeals filed. This is in the 74% percentile among all examiners. Of these withdrawals, 38.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 38.3% are granted (fully or in part). This grant rate is in the 36% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 7.5% of allowed cases (in the 93% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 1.7% of allowed cases (in the 62% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.