Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18735302 | SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF | June 2024 | December 2025 | Allow | 18 | 1 | 1 | No | No |
| 18732022 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | June 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18731996 | SEMICONDUCTOR DEVICE WITH AIR-VOID IN SPACER | June 2024 | February 2026 | Allow | 20 | 1 | 0 | No | No |
| 18671941 | WORK FUNCTION METAL GATE DEVICE | May 2024 | August 2025 | Allow | 15 | 1 | 0 | No | No |
| 18670753 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | May 2024 | July 2025 | Allow | 14 | 1 | 0 | No | No |
| 18657175 | METHODS OF FORMING SEMICONDUCTOR DEVICES | May 2024 | August 2025 | Allow | 15 | 1 | 0 | No | No |
| 18656133 | Structure and Method for FinFET Device with Asymmetric Contact | May 2024 | November 2025 | Allow | 18 | 1 | 1 | No | No |
| 18652628 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME | May 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18646277 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18644270 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18636490 | Source/Drain Device and Method of Forming Thereof | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18624386 | Isolation Structures Of Semiconductor Devices | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18622230 | METAL GATE STRUCTURES AND METHODS OF FABRICATING THE SAME IN FIELD-EFFECT TRANSISTORS | March 2024 | August 2025 | Allow | 17 | 2 | 0 | No | No |
| 18614945 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE | March 2024 | July 2025 | Allow | 16 | 1 | 0 | No | No |
| 18595033 | Fill Structures With Air Gaps | March 2024 | February 2025 | Allow | 11 | 0 | 0 | No | No |
| 18429755 | SEMICONDUCTOR STRUCTURE WITH EXTENDED CONTACT STRUCTURE | February 2024 | April 2025 | Allow | 14 | 1 | 0 | No | No |
| 18430568 | INTEGRATED FAN-OUT PACKAGE | February 2024 | February 2025 | Allow | 13 | 1 | 0 | No | No |
| 18426010 | DIELECTRIC ISOLATION STRUCTURE FOR MULTI-GATE TRANSISTORS | January 2024 | March 2025 | Allow | 13 | 1 | 0 | No | No |
| 18422778 | SEMICONDUCTOR PACKAGE HAVING CHIP STACK | January 2024 | February 2025 | Allow | 13 | 0 | 1 | No | No |
| 18410917 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS | January 2024 | September 2024 | Allow | 8 | 0 | 0 | No | No |
| 18409509 | INTEGRATED CIRCUIT STRUCTURES HAVING GERMANIUM-BASED CHANNELS | January 2024 | November 2024 | Allow | 10 | 0 | 1 | No | No |
| 18404855 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | January 2024 | January 2025 | Allow | 13 | 2 | 0 | No | No |
| 18402734 | SEMICONDUCTOR DEVICE | January 2024 | March 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18398120 | SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS | December 2023 | November 2024 | Allow | 10 | 0 | 0 | No | No |
| 18526444 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | December 2023 | December 2024 | Allow | 13 | 0 | 0 | No | No |
| 18524033 | SEMICONDUCTOR DEVICE | November 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18520958 | Semiconductor Device and Method of Manufacture | November 2023 | February 2025 | Allow | 15 | 1 | 1 | No | No |
| 18520214 | SEMICONDUCTOR DEVICE STRUCTURE | November 2023 | April 2025 | Allow | 16 | 1 | 0 | No | No |
| 18509874 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | November 2023 | March 2026 | Allow | 28 | 0 | 0 | No | No |
| 18506742 | SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF | November 2023 | August 2024 | Allow | 9 | 0 | 1 | No | No |
| 18504027 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | November 2023 | December 2024 | Allow | 13 | 0 | 0 | No | No |
| 18493894 | TIN OXIDE NANORIBBON ACETONE GAS SENSOR, PREPARATION METHOD THEREOF AND USE THEREOF | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18383461 | LATERAL DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE | October 2023 | July 2024 | Allow | 9 | 1 | 0 | No | No |
| 18491794 | PACKAGE STRUCTURE | October 2023 | January 2025 | Allow | 15 | 1 | 0 | No | No |
| 18487213 | SEMICONDUCTOR STRUCTURE WITH NANOSTRUCTURE | October 2023 | December 2024 | Allow | 14 | 1 | 0 | No | No |
| 18487141 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | October 2023 | January 2026 | Allow | 27 | 0 | 0 | No | No |
| 18486194 | MEMORY DEVICE | October 2023 | December 2024 | Allow | 14 | 2 | 0 | No | No |
| 18485322 | SEMICONDUCTOR DEVICE | October 2023 | July 2024 | Allow | 9 | 1 | 0 | No | No |
| 18376839 | TRANSISTOR STRUCTURE WITH METAL INTERCONNECTION DIRECTLY CONNECTING GATE AND DRAIN/SOURCE REGIONS | October 2023 | November 2024 | Allow | 13 | 0 | 1 | No | No |
| 18285724 | DISPLAY APPARATUS, DISPLAY MODULE, AND ELECTRONIC DEVICE | October 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18284028 | SEMICONDUCTOR PACKAGE | September 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18468861 | DEVICE PACKAGE SUBSTRATE STRUCTURE AND METHOD THEREFOR | September 2023 | May 2025 | Allow | 20 | 1 | 1 | No | No |
| 18235585 | Semiconductor Device Including Bonding Pad Metal Layer Structure | August 2023 | August 2024 | Allow | 12 | 1 | 0 | No | No |
| 18232533 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | August 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18232544 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | August 2023 | December 2024 | Allow | 16 | 1 | 1 | No | No |
| 18362401 | SYMMETRICAL SUBSTRATE FOR SEMICONDUCTOR PACKAGING | July 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18362722 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | July 2023 | January 2025 | Allow | 18 | 2 | 1 | No | No |
| 18361530 | SEMICONDUCTOR PACKAGE | July 2023 | November 2025 | Allow | 27 | 0 | 0 | No | No |
| 18227646 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | July 2023 | October 2025 | Allow | 27 | 0 | 0 | No | No |
| 18359909 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2023 | August 2024 | Allow | 13 | 1 | 1 | No | No |
| 18360148 | CONTACTS FOR HIGHLY SCALED TRANSISTORS | July 2023 | February 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18360457 | ACTIVE PATTERN STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | July 2023 | July 2024 | Allow | 12 | 1 | 1 | Yes | No |
| 18358620 | SEMICONDUCTOR MEMS STRUCTURE | July 2023 | September 2024 | Allow | 14 | 1 | 1 | No | No |
| 18358653 | HIGH VOLTAGE FIELD EFFECT TRANSISTORS WITH DIFFERENT SIDEWALL SPACER CONFIGURATIONS AND METHOD OF MAKING THE SAME | July 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18357792 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18357307 | Parasitic Capacitance Reduction | July 2023 | April 2024 | Allow | 9 | 0 | 0 | No | No |
| 18357509 | GATE STRUCTURE AND METHODS THEREOF | July 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18225139 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | July 2023 | August 2024 | Allow | 13 | 1 | 1 | No | No |
| 18221518 | EMBEDDED FLIP CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF | July 2023 | January 2026 | Allow | 30 | 0 | 1 | No | No |
| 18347512 | SEMICONDUCTOR DEVICE | July 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18346554 | INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING STRUCTURE | July 2023 | January 2026 | Allow | 31 | 0 | 1 | No | No |
| 18215707 | SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR | June 2023 | April 2024 | Allow | 9 | 0 | 1 | No | No |
| 18341529 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18340193 | SEMICONDUCTOR PACKAGES | June 2023 | August 2025 | Allow | 26 | 0 | 0 | No | No |
| 18212939 | SEMICONDUCTOR PACKAGE | June 2023 | August 2025 | Allow | 26 | 0 | 0 | No | No |
| 18336005 | SEMICONDUCTOR STRUCTURE | June 2023 | September 2024 | Allow | 15 | 1 | 1 | No | No |
| 18257484 | ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MANUFACTURING THE SAME | June 2023 | January 2026 | Allow | 31 | 0 | 0 | No | No |
| 18331150 | CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF | June 2023 | November 2025 | Allow | 29 | 0 | 1 | No | No |
| 18327786 | DIRECT N/P LOCAL INTERCONNECT | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18326241 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | May 2023 | January 2026 | Allow | 32 | 1 | 1 | No | No |
| 18202735 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | May 2023 | January 2026 | Allow | 32 | 0 | 1 | No | No |
| 18200638 | SEMICONDUCTOR DEVICES HAVING GATE ISOLATION LAYERS | May 2023 | February 2024 | Allow | 9 | 0 | 0 | No | No |
| 18200735 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | May 2023 | March 2024 | Allow | 10 | 0 | 1 | Yes | No |
| 18200248 | SEMICONDUCTOR DEVICE | May 2023 | October 2025 | Allow | 29 | 0 | 0 | No | No |
| 18318752 | SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THEREOF | May 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18316586 | CONTINUOUS INTERCONNECTS BETWEEN HETEROGENEOUS MATERIALS | May 2023 | September 2024 | Allow | 16 | 1 | 0 | No | No |
| 18313971 | SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF | May 2023 | February 2024 | Allow | 9 | 0 | 0 | No | No |
| 18311223 | SEMICONDUCTOR STRUCTURE HAVING PASSIVE COMPONENT AND METHOD OF MANUFACTURING THEREOF | May 2023 | October 2025 | Allow | 30 | 0 | 1 | No | No |
| 18308229 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | April 2023 | July 2024 | Allow | 14 | 1 | 0 | No | No |
| 18305636 | DUAL METAL CAPPED VIA CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES | April 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18137733 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME | April 2023 | January 2024 | Allow | 9 | 0 | 0 | No | No |
| 18137803 | SEMICONDUCTOR PACKAGE | April 2023 | December 2023 | Allow | 7 | 0 | 0 | No | No |
| 18133575 | SEMICONDUCTOR DEVICES HAVING IMPROVED ELECTRICAL CHARACTERISTICS AND METHODS OF FABRICATING THE SAME | April 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18297849 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18188710 | INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | March 2023 | July 2024 | Allow | 16 | 1 | 0 | No | No |
| 18188875 | Fin Field-Effect Transistor and Method of Forming The Same | March 2023 | April 2024 | Allow | 12 | 0 | 0 | No | No |
| 18178371 | SEMICONDUCTOR DEVICE WITH STACKED MEMORY PERIPHERY AND ARRAY AND METHOD FOR FORMING THE SAME | March 2023 | September 2025 | Allow | 30 | 0 | 1 | No | No |
| 18177962 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | March 2023 | February 2026 | Allow | 36 | 1 | 1 | No | No |
| 18174687 | TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | February 2023 | July 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18173547 | STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME | February 2023 | November 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 18112753 | SEMICONDUCTOR DEVICE WITH DEEP TRENCH ISOLATION | February 2023 | July 2025 | Allow | 29 | 0 | 0 | No | No |
| 18171311 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | February 2023 | June 2024 | Allow | 16 | 1 | 0 | No | No |
| 18170754 | MICROELECTRONIC DEVICES HAVING AIR GAP STRUCTURES INTEGRATED WITH INTERCONNECT FOR REDUCED PARASITIC CAPACITANCES | February 2023 | July 2024 | Allow | 17 | 1 | 1 | No | No |
| 18169928 | STEPPED ISOLATION REGIONS | February 2023 | July 2025 | Allow | 29 | 0 | 1 | No | No |
| 18163424 | Treatment for Adhesion Improvement | February 2023 | February 2024 | Allow | 12 | 1 | 0 | No | No |
| 18100248 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | January 2023 | December 2025 | Allow | 35 | 1 | 0 | No | No |
| 18100570 | ELECTRONIC DEVICE | January 2023 | February 2026 | Allow | 37 | 1 | 0 | No | No |
| 18099543 | FIELD EFFECT TRANSISTOR HAVING A DIELECTRIC STRUCTURE | January 2023 | July 2025 | Allow | 30 | 0 | 0 | No | No |
| 18015711 | ANODIZED FILM SUBSTRATE BASE, ANODIZED FILM SUBSTRATE PART HAVING SAME, ANODIZED FILM-BASED INTERPOSER HAVING SAME, AND SEMICONDUCTOR PACKAGE HAVING SAME | January 2023 | September 2025 | Allow | 32 | 1 | 0 | No | No |
| 18095629 | ELECTRONIC IC DEVICE COMPRISING INTEGRATED OPTICAL AND ELECTRONIC CIRCUIT COMPONENT AND FABRICATION METHOD | January 2023 | October 2023 | Allow | 9 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner DOAN, THERESA T.
With a 12.5% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 40.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner DOAN, THERESA T works in Art Unit 2814 and has examined 1,624 patent applications in our dataset. With an allowance rate of 89.3%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 18 months.
Examiner DOAN, THERESA T's allowance rate of 89.3% places them in the 71% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by DOAN, THERESA T receive 1.01 office actions before reaching final disposition. This places the examiner in the 10% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by DOAN, THERESA T is 18 months. This places the examiner in the 96% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +1.3% benefit to allowance rate for applications examined by DOAN, THERESA T. This interview benefit is in the 20% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 35.2% of applications are subsequently allowed. This success rate is in the 79% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 40.4% of cases where such amendments are filed. This entry rate is in the 62% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 100.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 73% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 74.2% of appeals filed. This is in the 63% percentile among all examiners. Of these withdrawals, 60.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 37.0% are granted (fully or in part). This grant rate is in the 25% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 8.9% of allowed cases (in the 92% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 1.5% of allowed cases (in the 65% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.