Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18662460 | SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODES, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | May 2024 | August 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18647786 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2024 | August 2025 | Allow | 16 | 1 | 0 | No | No |
| 18584469 | SEMICONDUCTOR PACKAGE | February 2024 | April 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18399178 | LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL | December 2023 | May 2025 | Allow | 16 | 2 | 0 | No | No |
| 18518448 | SEMICONDUCTOR PACKAGES | November 2023 | December 2024 | Allow | 13 | 2 | 0 | Yes | No |
| 18501489 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | November 2023 | April 2025 | Allow | 18 | 2 | 0 | Yes | No |
| 18499436 | SEMICONDUCTOR DEVICE | November 2023 | November 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18496372 | SEMICONDUCTOR PACKAGE | October 2023 | May 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18484966 | Method of Fabricating a Semiconductor Device | October 2023 | July 2025 | Allow | 21 | 1 | 0 | No | No |
| 18367506 | SEMICONDUCTOR PACKAGES | September 2023 | March 2026 | Allow | 30 | 1 | 0 | Yes | No |
| 18448148 | POWER DISTRIBUTION METHOD | August 2023 | February 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18448155 | INTEGRATED CIRCUIT LAYOUT METHOD | August 2023 | September 2025 | Allow | 25 | 1 | 0 | No | No |
| 18230135 | SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME | August 2023 | December 2024 | Allow | 17 | 2 | 0 | No | No |
| 18225920 | DENDRITE MITIGATION OF PASSIVE COMPONENTS | July 2023 | February 2026 | Allow | 30 | 0 | 1 | No | No |
| 18341880 | CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18323418 | MEMORY DEVICE | May 2023 | January 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18316962 | Embedded Packaging Concepts for Integration of ASICs and Optical Components | May 2023 | March 2025 | Abandon | 22 | 2 | 0 | Yes | No |
| 18316482 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | May 2023 | January 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18195905 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | May 2023 | December 2025 | Allow | 32 | 2 | 0 | No | No |
| 18303257 | SEMICONDUCTOR DEVICE | April 2023 | May 2025 | Allow | 24 | 1 | 0 | No | No |
| 18107397 | GATE FABRICATION METHOD OF AN U-METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR AND TRENCH GATE STRUCTURE FORMED THEREOF | February 2023 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18012370 | THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES | December 2022 | October 2025 | Allow | 34 | 1 | 0 | Yes | No |
| 18077186 | PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | December 2022 | January 2026 | Allow | 37 | 1 | 0 | No | No |
| 17964258 | LOW POWER CONSUMPTION OLED DISPLAY | October 2022 | April 2025 | Allow | 30 | 3 | 0 | Yes | No |
| 17935146 | MRAM DEVICE WITH ANNULAR ELECTRODES | September 2022 | January 2026 | Allow | 40 | 1 | 1 | Yes | No |
| 17818062 | METHOD OF FORMING PATTERNED STRUCTURES | August 2022 | November 2025 | Allow | 40 | 1 | 0 | Yes | No |
| 17815443 | FinFET Structures and Methods of Forming the Same | July 2022 | May 2025 | Allow | 34 | 3 | 0 | Yes | No |
| 17815068 | Epitaxial Layers In Source/Drain Contacts And Methods Of Forming The Same | July 2022 | March 2025 | Allow | 32 | 2 | 0 | No | No |
| 17867787 | SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION STRUCTURE | July 2022 | July 2024 | Allow | 24 | 1 | 0 | No | No |
| 17860027 | PATTERNING OF 3D NAND PILLARS AND FLYING BUTTRESS SUPPORTS WITH THREE STRIPE TECHNIQUE | July 2022 | February 2026 | Allow | 44 | 1 | 1 | No | No |
| 17857043 | SEMICONDUCTOR PACKAGES | July 2022 | April 2024 | Allow | 21 | 1 | 0 | No | No |
| 17809905 | METHOD OF FORMING SEMICONDUCTOR DEVICE | June 2022 | March 2026 | Allow | 44 | 1 | 1 | No | No |
| 17853870 | SEMICONDUCTOR PACKAGE USING HYBRID-TYPE ADHESIVE | June 2022 | April 2024 | Allow | 22 | 1 | 0 | No | No |
| 17848219 | Wafer Level Integration of Passive Devices | June 2022 | May 2025 | Allow | 34 | 0 | 0 | No | No |
| 17848069 | MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE | June 2022 | January 2026 | Allow | 43 | 1 | 0 | No | No |
| 17807899 | FORKSHEET SEMICONDUCTOR STRUCTURE INCLUDING AT LEAST ONE BIPOLAR JUNCTION TRANSISTOR AND METHOD | June 2022 | June 2025 | Allow | 35 | 1 | 0 | No | No |
| 17805563 | Forming Nitrogen-Containing Layers as Oxidation Blocking Layers | June 2022 | November 2024 | Allow | 29 | 2 | 0 | Yes | No |
| 17831594 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER PORTION | June 2022 | March 2025 | Allow | 33 | 2 | 0 | No | No |
| 17831331 | ORGANIC ELECTROLUMINESCENCE ELEMENT | June 2022 | January 2026 | Abandon | 43 | 3 | 0 | Yes | No |
| 17829940 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | June 2022 | November 2025 | Allow | 41 | 1 | 1 | Yes | No |
| 17740649 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR | May 2022 | November 2025 | Allow | 42 | 3 | 0 | Yes | No |
| 17734451 | SEMICONDUCTOR PACKAGE | May 2022 | January 2026 | Allow | 44 | 3 | 0 | Yes | No |
| 17731149 | TRANSISTOR CELLS INCLUDING A DEEP VIA LINED WITH A DIELECTRIC MATERIAL | April 2022 | January 2026 | Allow | 45 | 2 | 0 | No | Yes |
| 17771259 | LIGHT EMITTING DEVICE | April 2022 | April 2025 | Allow | 36 | 2 | 0 | Yes | No |
| 17658704 | Deep Trench Isolation Structures Resistant to Cracking | April 2022 | June 2025 | Allow | 39 | 2 | 0 | Yes | No |
| 17701796 | DISPLAY PANEL AND METHOD OF MANUFACTURING THEREOF | March 2022 | March 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17641427 | TRENCH-GATE SIC MOSFET DEVICE AND MANUFACTURING METHOD THEREFOR | March 2022 | July 2025 | Allow | 40 | 3 | 0 | No | No |
| 17686504 | SEMICONDUCTOR DEVICES | March 2022 | April 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17671040 | HIGH-EFFICIENCY CAPACITOR STRUCTURE | February 2022 | December 2023 | Allow | 22 | 2 | 0 | Yes | No |
| 17631372 | STRETCHABLE DISPLAY PANEL AND DISPLAY DEVICE | January 2022 | December 2024 | Allow | 35 | 1 | 0 | No | No |
| 17624170 | NITROGEN-CONTAINING COMPOUND, ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE | December 2021 | September 2022 | Allow | 8 | 1 | 0 | No | No |
| 17559608 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | December 2021 | May 2025 | Allow | 41 | 2 | 1 | Yes | No |
| 17616550 | DISPLAY DEVICE USING MICRO LED | December 2021 | March 2025 | Allow | 40 | 2 | 0 | No | No |
| 17456728 | Schottky Device and Method of Manufacturing the Same | November 2021 | July 2025 | Allow | 43 | 3 | 0 | Yes | No |
| 17526840 | SEMICONDUCTOR DEVICE | November 2021 | July 2023 | Allow | 20 | 1 | 0 | No | No |
| 17454120 | HIGH FREQUENCY DEVICES INCLUDING ATTENUATING DIELECTRIC MATERIALS | November 2021 | June 2025 | Allow | 43 | 2 | 1 | Yes | No |
| 17510594 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME | October 2021 | February 2025 | Allow | 40 | 2 | 0 | Yes | No |
| 17505662 | METHOD FOR FABRICATING SHIELD GATE MOSFET | October 2021 | October 2023 | Allow | 24 | 2 | 0 | Yes | No |
| 17504313 | Device, a Method Used in Forming a Circuit Structure, a Method Used in Forming an Array of Elevationally-Extending Transistors and a Circuit Structure Adjacent Thereto | October 2021 | September 2023 | Allow | 23 | 1 | 0 | No | No |
| 17472207 | PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPECTIONABILITY AND MANUFACTURING METHOD THEREOF | September 2021 | August 2024 | Allow | 35 | 2 | 1 | Yes | No |
| 17472181 | SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME | September 2021 | February 2025 | Allow | 41 | 3 | 1 | Yes | No |
| 17411697 | TRANSISTOR DEVICE HAVING A COMB-SHAPED CHANNEL REGION TO INCREASE THE EFFECTIVE GATE WIDTH | August 2021 | January 2025 | Allow | 41 | 5 | 0 | Yes | No |
| 17411040 | ELECTRONIC DEVICE | August 2021 | March 2025 | Allow | 43 | 2 | 1 | No | No |
| 17405696 | SEMICONDUCTOR PACKAGE | August 2021 | July 2023 | Allow | 23 | 1 | 0 | No | No |
| 17393751 | SOLID-STATE IMAGING DEVICE | August 2021 | February 2024 | Allow | 31 | 1 | 0 | Yes | No |
| 17358149 | SEMICONDUCTOR PACKAGE INCLUDING THERMAL EXHAUST PATHWAY | June 2021 | February 2024 | Allow | 31 | 1 | 1 | Yes | No |
| 17340780 | Reduction of Capping Layer Resistance Area Product for Magnetic Device Applications | June 2021 | November 2023 | Allow | 29 | 2 | 0 | No | No |
| 17339082 | Conductive Feature Formation and Structure | June 2021 | March 2024 | Allow | 33 | 2 | 0 | No | No |
| 17329980 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | May 2021 | May 2024 | Allow | 35 | 4 | 1 | Yes | No |
| 17317558 | SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODES, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | May 2021 | February 2024 | Allow | 33 | 1 | 1 | No | No |
| 17227850 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME | April 2021 | December 2024 | Allow | 44 | 4 | 1 | Yes | No |
| 17218171 | SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME | March 2021 | August 2024 | Allow | 41 | 4 | 1 | Yes | No |
| 17219681 | ENHANCED MOLD COMPOUND THERMAL CONDUCTIVITY | March 2021 | August 2025 | Allow | 52 | 5 | 1 | No | Yes |
| 17217749 | SYSTEMS AND METHODS FOR FLASH STACKING | March 2021 | November 2024 | Abandon | 44 | 2 | 0 | No | No |
| 17210660 | STACKED RF CIRCUIT TOPOLOGY | March 2021 | April 2025 | Allow | 49 | 3 | 1 | No | No |
| 17206378 | CHIP-PACKAGE-ANTENNA INTEGRATED STRUCTURE BASED ON SUBSTRATE INTEGRATED WAVEGUIDE (SIW) MULTI-FEED NETWORK | March 2021 | November 2023 | Allow | 32 | 2 | 0 | No | No |
| 17205761 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | March 2021 | October 2024 | Allow | 43 | 4 | 0 | No | No |
| 17193478 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | March 2021 | December 2024 | Allow | 46 | 5 | 0 | Yes | No |
| 17178029 | POWER DISTRIBUTION STRUCTURE AND METHOD | February 2021 | November 2024 | Allow | 45 | 2 | 1 | No | No |
| 17163401 | SEMICONDUCTOR PACKAGE | January 2021 | April 2025 | Allow | 50 | 5 | 1 | Yes | No |
| 17156793 | INTEGRATED CAPACITOR WITH SIDEWALL HAVING REDUCED ROUGHNESS | January 2021 | July 2023 | Allow | 29 | 1 | 0 | No | No |
| 17150960 | DESIGN METHOD OF DUMMY PATTERN LAYOUT | January 2021 | September 2022 | Allow | 20 | 1 | 0 | No | No |
| 17136721 | INTEGRATED CIRCUIT (IC) STRUCTURE PROTECTION SCHEME | December 2020 | May 2024 | Allow | 40 | 4 | 1 | Yes | No |
| 17126598 | PACKAGE STRUCTURE AND METHOD | December 2020 | July 2024 | Allow | 42 | 3 | 1 | Yes | No |
| 17104919 | POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY TO ENABLE BUMP PITCH SCALING | November 2020 | September 2025 | Abandon | 58 | 2 | 1 | No | No |
| 17090286 | GRAPHENE SEMICONDUCTOR JUNCTION DEVICE | November 2020 | June 2023 | Abandon | 32 | 4 | 0 | No | No |
| 17089741 | 3D STACKED DIE PACKAGE WITH MOLDED INTEGRATED HEAT SPREADER | November 2020 | September 2023 | Abandon | 35 | 3 | 1 | Yes | No |
| 17086479 | SEMICONDUCTOR PACKAGE | November 2020 | August 2024 | Allow | 45 | 5 | 0 | Yes | No |
| 17072590 | IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | October 2020 | June 2024 | Allow | 44 | 4 | 0 | No | No |
| 17038838 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | September 2020 | August 2023 | Allow | 34 | 2 | 0 | No | No |
| 17036144 | SEMICONDUCTOR PACKAGE | September 2020 | June 2024 | Abandon | 44 | 3 | 1 | Yes | No |
| 17040631 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | September 2020 | March 2024 | Allow | 42 | 4 | 1 | Yes | No |
| 17040420 | SEMICONDUCTOR DEVICE | September 2020 | January 2023 | Allow | 28 | 1 | 0 | No | No |
| 17018721 | PACKAGING FOR RF TRANSISTOR AMPLIFIERS | September 2020 | August 2023 | Allow | 35 | 2 | 1 | No | No |
| 17004202 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2020 | January 2024 | Allow | 41 | 3 | 1 | No | No |
| 17001617 | NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING NITRIDE SEMICONDUCTOR DEVICE | August 2020 | August 2023 | Allow | 36 | 3 | 0 | Yes | No |
| 16997980 | Semiconductor Device and Method | August 2020 | July 2023 | Allow | 34 | 2 | 1 | No | No |
| 16986270 | MARK PATTERN IN SEMICONDUCTOR DEVICE | August 2020 | December 2021 | Allow | 17 | 1 | 0 | No | No |
| 16985079 | ORGANIC COMPOUND, AND ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME | August 2020 | September 2023 | Allow | 37 | 1 | 0 | No | No |
| 16942264 | INTEGRATED CIRCUIT DEVICE, METHOD, LAYOUT, AND SYSTEM | July 2020 | November 2024 | Allow | 51 | 3 | 1 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner BRASFIELD, QUINTON A.
With a 60.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 61.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner BRASFIELD, QUINTON A works in Art Unit 2814 and has examined 398 patent applications in our dataset. With an allowance rate of 70.1%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 33 months.
Examiner BRASFIELD, QUINTON A's allowance rate of 70.1% places them in the 32% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by BRASFIELD, QUINTON A receive 3.03 office actions before reaching final disposition. This places the examiner in the 87% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.
The median time to disposition (half-life) for applications examined by BRASFIELD, QUINTON A is 33 months. This places the examiner in the 48% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +18.5% benefit to allowance rate for applications examined by BRASFIELD, QUINTON A. This interview benefit is in the 61% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 19.1% of applications are subsequently allowed. This success rate is in the 19% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 26.5% of cases where such amendments are filed. This entry rate is in the 37% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 84.2% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 65% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 70.6% of appeals filed. This is in the 57% percentile among all examiners. Of these withdrawals, 50.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 54.5% are granted (fully or in part). This grant rate is in the 56% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.3% of allowed cases (in the 54% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 30% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.