USPTO Examiner PHAM THANHHA S - Art Unit 2812

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18872218VERTICAL IGBT WITH COMPLEMENTARY CHANNEL FOR HOLE EXTRACTIONDecember 2024April 2025Allow400NoNo
18752963DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICEJune 2024February 2026Allow1910NoNo
18747615Semiconductor Device with Uneven Electrode Surface and Method for Fabricating the SameJune 2024January 2025Allow700NoNo
18674975SEMICONDUCTOR DEVICES INCLUDING LOW-K METAL GATE ISOLATION AND METHODS OF FABRICATION THEREOFMay 2024July 2025Allow1310NoNo
18673571THREE-DIMENSIONAL MEMORY DEVICE AND METHODMay 2024January 2026Allow2010NoNo
18632542SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR PREPARING THE SAMEApril 2024April 2025Allow1220YesNo
18604557SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAMEMarch 2024October 2025Allow1911NoNo
18691628METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND PREPARATION METHOD THEREFORMarch 2024March 2025Allow1200NoNo
18598173SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR PREPARING THE SAMEMarch 2024February 2025Allow1110NoNo
18598051CONTACT FEATURES OF SEMICONDUCTOR DEVICESMarch 2024July 2025Allow1610YesNo
18594699METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC COMPONENTMarch 2024April 2025Allow1300NoNo
18444651LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFORFebruary 2024July 2025Allow1711NoNo
18406882DISPLAY DEVICEJanuary 2024August 2025Allow1920YesNo
18405365SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORSJanuary 2024March 2025Allow1410NoNo
18537896SEMICONDUCTOR DEVICEDecember 2023October 2024Allow1000NoNo
18514146GATE STACK FOR METAL GATE TRANSISTORNovember 2023March 2025Allow1510YesNo
18381876MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE AND METHOD FOR FABRICATING THE SAMEOctober 2023February 2026Allow2800NoNo
18381670SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAMEOctober 2023May 2025Abandon1911NoNo
18286350CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOROctober 2023February 2026Allow2801NoNo
18240274DISPLAY DEVICEAugust 2023November 2025Allow2600NoNo
18448918METHOD OF FORMING CAPACITORS THROUGH WAFER BONDINGAugust 2023June 2025Allow2200NoNo
18366120HIGH CAPACITANCE MIM DEVICE WITH SELF ALIGNED SPACERAugust 2023June 2025Allow2200NoNo
18359486Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor DevicesJuly 2023March 2025Allow2010NoNo
18359030SELF-ASSEMBLED DIELECTRIC ON METAL RIE LINES TO INCREASE RELIABILITYJuly 2023March 2025Allow2010NoNo
18274200Display ApparatusJuly 2023January 2026Allow3000NoNo
183569702D-Doped Surface Passivation Structure and Method of ManufactureJuly 2023October 2025Allow2700NoNo
18262468DISPLAY SUBSTRATE AND DISPLAY DEVICEJuly 2023October 2025Allow2700NoNo
18218578SEMICONDUCTOR STRUCTUREJuly 2023June 2025Allow2311YesNo
18269711DISPLAY APPARATUS AND ELECTRONIC DEVICEJune 2023January 2026Allow3100NoNo
18213527Organic Light Emitting Display DeviceJune 2023February 2026Allow3210NoNo
18333380INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHOD FOR MANUFACTURING THE SAMEJune 2023February 2026Allow3201YesNo
18206042CONTACT FORMATION PROCESS FOR CMOS DEVICESJune 2023October 2025Allow2801NoNo
18204231REPLACEMENT METAL GATES TO ENHANCE TRANSISTOR STRAINMay 2023October 2025Abandon2820NoNo
18326424CAPACITOR INTEGRATED WITH A TRANSISTOR FOR LOGIC AND MEMORY APPLICATIONSMay 2023November 2024Allow1700NoNo
18326433METHOD OF INTEGRATING A CAPACITOR INCLUDING A NON-LINEAR POLAR MATERIAL WITH A TRANSISTOR THROUGH WAFER BONDINGMay 2023May 2025Allow2410NoNo
18324295ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND GATE VIAMay 2023January 2026Allow3201NoNo
18323325HIGH DOSE IMPLANTATION FOR ULTRATHIN SEMICONDUCTOR-ON-INSULATOR SUBSTRATESMay 2023July 2025Allow2511YesNo
18200356LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOFMay 2023October 2024Allow1700NoNo
18140635METHOD FOR FABRICATING INDUCTOR MODULEApril 2023April 2025Allow2430YesNo
18308875CHIP STRUCTURE WITH ETCH STOP LAYERApril 2023August 2024Allow1600NoNo
18136641MINIMIZING SHORTING BETWEEN FINFET EPITAXIAL REGIONSApril 2023October 2024Allow1810NoNo
18135622SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFApril 2023December 2024Allow2010YesNo
18133065PLASMA ENHANCED TUNGSTEN NUCLEATION FOR LOW RESISTIVITYApril 2023October 2025Allow3000YesNo
18126573MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODEMarch 2023December 2025Allow3311NoNo
18124763SEMICONDUCTOR DEVICE WITH UNEVEN ELECTRODE SURFACE AND METHOD FOR FABRICATING THE SAMEMarch 2023October 2024Allow1911NoNo
18184999Treatment of Electrodes of MIM CapacitorsMarch 2023December 2025Allow3310NoNo
18183165SEMICONDUCTOR STRUCTUREMarch 2023June 2025Allow2700NoNo
18110604SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEFebruary 2023May 2024Allow1500NoNo
18109997SEMICONDUCTOR DEVICE HAVING A TRANSISTOR WITH TRENCHES AND MESASFebruary 2023December 2024Allow2210NoNo
18164965MULTI-GATE SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAMEFebruary 2023February 2025Allow2411NoNo
18162635MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTUREJanuary 2023August 2025Allow3101NoNo
18158240ANALOG-CELLS-BOUNDARY REGION WITH BURIED POWER GRID SEGMENT, SEMICONDUCTOR DEVICE INCLUDING SAME AND METHOD OF MANUFACTURING SAMEJanuary 2023January 2026Allow3601NoNo
18150299PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHYJanuary 2023July 2025Allow3102NoNo
18149719SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFJanuary 2023February 2025Allow2501NoNo
18087802SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAMEDecember 2022June 2024Allow1801NoNo
18087688INTERDECK LAYERS AND PILLAR ALIGNMENTDecember 2022August 2025Allow3200YesNo
18065298SEMICONDUCTOR MEMORY DEVICEDecember 2022December 2024Allow2410YesNo
18061501SEMICONDUCTOR DIE PACKAGE WITH THERMAL MANAGEMENT FEATURESDecember 2022April 2024Allow1700NoNo
17984420DISPLAY APPARATUSNovember 2022November 2025Allow3601NoNo
18053016FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE STRUCTURESNovember 2022October 2025Allow3530NoNo
17980499LIGHT EMITTING DEVICENovember 2022March 2025Allow2820YesNo
17978344SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAMENovember 2022April 2024Allow1700NoNo
17973247OPTOELECTRONIC ARRANGEMENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC ARRANGEMENTOctober 2022March 2025Allow2910NoNo
17970872Ru Liner above a Barrier LayerOctober 2022May 2025Allow3111YesNo
17936714Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale PackagesSeptember 2022September 2025Allow3631NoNo
17915989Semiconductor Structure And Method of Making The SameSeptember 2022April 2025Allow3101NoNo
17950640PLASMA-DOPED TRENCHES FOR MEMORYSeptember 2022March 2025Allow3001NoNo
17933481OLED DISPLAY PANEL AND DISPLAY DEVICESeptember 2022February 2025Allow2910NoNo
17933216SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOFSeptember 2022April 2025Allow3101NoNo
17906317LIGHT RECEIVING ELEMENT AND ELECTRONIC EQUIPMENTSeptember 2022January 2026Abandon4010NoNo
17941688SEMICONDUCTOR DEVICE INCLUDING CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAMESeptember 2022September 2024Allow2400NoNo
17909822SOLID-STATE IMAGING DEVICESeptember 2022June 2025Allow3300NoNo
17823512SEMICONDUCTOR MEMORY DEVICE MANUFACTURING METHODAugust 2022September 2024Allow2400NoNo
17894778Patterning with Self-Assembled MonolayerAugust 2022October 2025Allow3720NoNo
17821209METALLIC SEALANTS IN TRANSISTOR ARRANGEMENTSAugust 2022October 2025Allow3731YesNo
17820049METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEAugust 2022November 2024Allow2700NoNo
17819341Semiconductor Package Including Step Seal Ring and Methods Forming SameAugust 2022July 2025Allow3511NoNo
17818823Deposition Process for Forming Semiconductor Device and SystemAugust 2022June 2024Allow2201NoNo
17883628INTERCONNECT STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAMEAugust 2022July 2024Allow2310YesNo
17818587Conductive Feature of a Semiconductor DeviceAugust 2022November 2024Allow2820YesNo
17881676SEMICONDUCTOR DEVICEAugust 2022September 2024Allow2610NoNo
17815524BARRIER LAYER FOR METAL INSULATOR METAL CAPACITORSJuly 2022September 2024Allow2620YesNo
17873888SINGLE-MASK ALTERNATING LINE DEPOSITIONJuly 2022December 2024Allow2910NoNo
17814626Three-Dimensional Memory Device and MethodJuly 2022February 2024Allow1900NoNo
17866807Semiconductor Structure and Method of ManufactureJuly 2022December 2024Allow2910NoNo
17867011SEMICONDUCTOR DEVICESJuly 2022October 2024Allow2600NoNo
17809938Increasing Contact Areas of Contacts for MIM CapacitorsJune 2022December 2024Abandon3010NoNo
17852423SEMICONDUCTOR DEVICEJune 2022June 2024Allow2310NoNo
17851737MULTI-THRESHOLD VOLTAGE DEVICES AND ASSOCIATED TECHNIQUES AND CONFIGURATIONSJune 2022February 2024Allow2000NoNo
17843966Fully Aligned Subtractive Processes And Electronic Devices TherefromJune 2022February 2024Allow2010NoNo
17807183METAL INSULATOR METAL CAPACITOR STRUCTURE AND METHOD OF MANUFACTURING THE SAMEJune 2022August 2025Allow3831YesNo
17838740SEMICONDUCTOR DEVICEJune 2022August 2024Allow2610NoNo
17824924SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAMEMay 2022September 2024Allow2811NoNo
17752737FIRST METAL STRUCTURE, LAYOUT, AND METHODMay 2022May 2025Allow3611NoNo
17751116Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods ThereofMay 2022May 2024Allow2401NoNo
17663302CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAMEMay 2022December 2024Allow3111NoNo
17737983DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAMEMay 2022January 2024Allow2000NoNo
17755639SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICEMay 2022July 2025Allow3810NoNo
17729250MEMORY DEVICE HAVING BIT LINE WITH STEPPED PROFILEApril 2022May 2024Allow2410NoNo
17714233DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICEApril 2022March 2024Allow2410NoNo

Appeals Overview

No appeal data available for this record. This may indicate that no appeals have been filed or decided for applications in this dataset.

Examiner PHAM, THANHHA S - Prosecution Strategy Guide

Executive Summary

Examiner PHAM, THANHHA S works in Art Unit 2812 and has examined 88 patent applications in our dataset. With an allowance rate of 98.9%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 25 months.

Allowance Patterns

Examiner PHAM, THANHHA S's allowance rate of 98.9% places them in the 92% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by PHAM, THANHHA S receive 1.31 office actions before reaching final disposition. This places the examiner in the 18% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by PHAM, THANHHA S is 25 months. This places the examiner in the 79% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a -4.8% benefit to allowance rate for applications examined by PHAM, THANHHA S. This interview benefit is in the 5% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 35.2% of applications are subsequently allowed. This success rate is in the 79% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 21.4% of cases where such amendments are filed. This entry rate is in the 27% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.

Petition Practice

When applicants file petitions regarding this examiner's actions, 14.3% are granted (fully or in part). This grant rate is in the 8% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 20.5% of allowed cases (in the 98% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 4.6% of allowed cases (in the 79% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • RCEs are effective: This examiner has a high allowance rate after RCE compared to others. If you receive a final rejection and have substantive amendments or arguments, an RCE is likely to be successful.
  • Examiner cooperation: This examiner frequently makes examiner's amendments to place applications in condition for allowance. If you are close to allowance, the examiner may help finalize the claims.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.