Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19190655 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | April 2025 | August 2025 | Allow | 4 | 0 | 0 | No | No |
| 19084370 | SOLDER REFLOW WITH OPTICAL ENDPOINT CONTROL | March 2025 | October 2025 | Allow | 7 | 1 | 1 | Yes | No |
| 18754448 | IMAGE SENSOR AND MANUFACTURING PROCESS THEREOF | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18748489 | METHOD FOR MAKING SEMICONDUCTOR DEVICE INCLUDING A SUPERLATTICE AND ENRICHED SILICON 28 EPITAXIAL LAYER | June 2024 | February 2025 | Allow | 7 | 1 | 0 | No | No |
| 18740970 | TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT | June 2024 | July 2025 | Allow | 13 | 1 | 1 | No | No |
| 18674136 | DISPLAY DEVICE AND ELECTRONIC APPARATUS | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18656987 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | May 2024 | August 2025 | Allow | 15 | 2 | 1 | No | No |
| 18653955 | METHODS OF SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH ACTIVE STEAM GENERATION | May 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18637723 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | April 2024 | April 2025 | Allow | 12 | 2 | 0 | No | No |
| 18636545 | METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER | April 2024 | January 2025 | Allow | 9 | 1 | 0 | No | No |
| 18636253 | DISPLAY DEVICE | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18633854 | SPUTTERING TARGET, METHOD FOR MANUFACTURING SPUTTERING TARGET, AND METHOD FOR FORMING THIN FILM | April 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18615654 | HYPERCHIP | March 2024 | March 2025 | Allow | 12 | 0 | 0 | No | No |
| 18597421 | Transmission-Based Temperature Measurement of a Workpiece in a Thermal Processing System | March 2024 | June 2025 | Allow | 16 | 1 | 0 | No | No |
| 18587031 | BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME | February 2024 | April 2025 | Allow | 13 | 2 | 0 | Yes | No |
| 18444112 | LED DISPLAY APPARATUS HAVING MICRO LED MODULE | February 2024 | January 2026 | Allow | 23 | 4 | 0 | No | No |
| 18440306 | METHOD OF SELECTIVELY TRANSFERRING SEMICONDUCTOR DEVICE | February 2024 | March 2025 | Allow | 13 | 1 | 0 | No | No |
| 18435283 | Semiconductor Device And Method For Manufacturing The Same | February 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18429845 | SINGLE CRYSTAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | February 2024 | May 2025 | Allow | 16 | 1 | 1 | No | No |
| 18416363 | SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | January 2024 | October 2025 | Allow | 21 | 2 | 0 | No | No |
| 18401989 | SEMICONDUCTOR DEVICE PRE-CLEANING | January 2024 | January 2025 | Allow | 12 | 1 | 0 | No | No |
| 18531801 | Alignment-Tolerant Gallium Oxide Device | December 2023 | November 2025 | Abandon | 23 | 2 | 0 | No | No |
| 18530748 | SEMICONDUCTOR MEMORY DEVICE | December 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18530183 | SEMICONDUCTOR STRUCTURE AND MEMORY | December 2023 | March 2026 | Allow | 27 | 0 | 0 | No | No |
| 18527753 | SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND LIGHT SPREADING LENSES | December 2023 | December 2025 | Abandon | 25 | 1 | 0 | No | No |
| 18566317 | A SYSTEM AND METHOD FOR MASS FLOW MEASUREMENT AND CONTROL OF PROCESS GASES IN A CARRIER STREAM USING ONE OR MORE QUARTZ CRYSTAL MICROBALANCE SENSORS | December 2023 | November 2025 | Allow | 24 | 1 | 0 | No | No |
| 18523167 | METHOD FORMING A MICRO LED DISPLAY DEVICE | November 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18516238 | Shutter Disk | November 2023 | September 2024 | Allow | 10 | 0 | 0 | No | No |
| 18513008 | SYSTEM AND METHOD FOR RADICAL AND THERMAL PROCESSING OF SUBSTRATES | November 2023 | February 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18386571 | Integrated Method For Low-Cost Wide Band Gap Semiconductor Device Manufacturing | November 2023 | September 2024 | Allow | 10 | 0 | 1 | No | No |
| 18498804 | METHOD OF FORMING GRAPHENE ON A SILICON SUBSTRATE | October 2023 | December 2025 | Abandon | 25 | 2 | 1 | No | No |
| 18382251 | MEMORY DEVICE AND FABRICATION METHOD THEREOF | October 2023 | January 2025 | Allow | 15 | 1 | 1 | Yes | No |
| 18488505 | INTEGRATED CIRCUIT DEVICE | October 2023 | April 2025 | Allow | 18 | 1 | 0 | No | No |
| 18487200 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, INVERTER CIRCUIT, DRIVE DEVICE, VEHICLE, AND ELEVATOR | October 2023 | April 2024 | Allow | 6 | 0 | 0 | No | No |
| 18486786 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | October 2023 | January 2025 | Allow | 16 | 1 | 1 | No | No |
| 18378978 | HYPERCHIP | October 2023 | April 2024 | Allow | 7 | 0 | 0 | No | No |
| 18377671 | SOLID-STATE IMAGING DEVICE | October 2023 | April 2024 | Allow | 6 | 2 | 0 | No | No |
| 18554168 | SEMICONDUCTOR DEVICE AND METHODS FOR FABRICATING AND OPERATING THE DEVICE | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18481961 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | October 2023 | September 2024 | Allow | 11 | 1 | 1 | No | No |
| 18471859 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | September 2023 | March 2025 | Allow | 18 | 1 | 1 | No | No |
| 18369847 | ELECTRONIC DEVICE | September 2023 | September 2024 | Allow | 12 | 1 | 0 | No | No |
| 18369207 | METHOD FOR FABRICATING PHYSICALLY UNCLONABLE FUNCTION DEVICE | September 2023 | March 2026 | Allow | 30 | 1 | 0 | No | No |
| 18368098 | INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | September 2023 | February 2026 | Allow | 29 | 0 | 0 | No | No |
| 18243501 | FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED DIMENSIONAL VARIATIONS | September 2023 | September 2024 | Allow | 12 | 1 | 0 | No | No |
| 18461326 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | September 2023 | February 2026 | Allow | 30 | 0 | 1 | No | No |
| 18460325 | SEMICONDUCTOR MEMORY DEVICE | September 2023 | November 2025 | Allow | 26 | 0 | 0 | No | No |
| 18237196 | METHOD FOR MAKING SEMICONDUCTOR DEVICE INCLUDING A SUPERLATTICE AND ENRICHED SILICON 28 EPITAXIAL LAYER | August 2023 | March 2024 | Allow | 7 | 1 | 0 | No | No |
| 18546484 | METHOD TO IMPROVE PERFORMANCES OF TUNNEL JUNCTIONS GROWN BY METAL ORGANIC CHEMICAL VAPOR DEPOSITION | August 2023 | October 2025 | Allow | 26 | 0 | 0 | No | No |
| 18450083 | WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION | August 2023 | February 2026 | Allow | 30 | 1 | 0 | No | No |
| 18448766 | SYSTEMS AND METHODS FOR WAFER BOND MONITORING | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18446521 | Integrated Circuit Package and Method | August 2023 | July 2025 | Allow | 23 | 1 | 1 | No | No |
| 18230664 | MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING | August 2023 | July 2025 | Allow | 23 | 2 | 1 | Yes | No |
| 18362921 | WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE | July 2023 | October 2025 | Allow | 27 | 0 | 0 | No | No |
| 18362676 | Bottom-up Formation of Contact Plugs | July 2023 | June 2024 | Allow | 10 | 1 | 0 | No | No |
| 18362731 | THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF | July 2023 | September 2024 | Allow | 14 | 1 | 1 | No | No |
| 18226185 | SEMICONDUCTOR DEVICE WITH FIN END SPACER PLUG AND METHOD OF MANUFACTURING THE SAME | July 2023 | June 2024 | Allow | 10 | 1 | 0 | No | No |
| 18358508 | Forming Low-Stress Silicon Nitride Layer Through Hydrogen Treatment | July 2023 | November 2024 | Allow | 16 | 1 | 1 | Yes | No |
| 18356212 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | July 2023 | February 2025 | Allow | 19 | 2 | 0 | No | No |
| 18219846 | SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK AND SYSTEM FOR MANUFACTURING THE SAME | July 2023 | July 2025 | Allow | 24 | 1 | 1 | No | No |
| 18346840 | METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE | July 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18345296 | MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATES | June 2023 | February 2026 | Allow | 32 | 0 | 1 | No | No |
| 18342745 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | June 2023 | April 2024 | Allow | 10 | 1 | 0 | No | No |
| 18341332 | Semiconductor Devices | June 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18258902 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | June 2023 | September 2025 | Allow | 26 | 0 | 0 | No | No |
| 18336263 | Info Structure with Copper Pillar Having Reversed Profile | June 2023 | November 2024 | Allow | 17 | 2 | 0 | No | No |
| 18327063 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | June 2023 | December 2025 | Allow | 30 | 1 | 1 | No | No |
| 18327875 | MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE | June 2023 | December 2023 | Allow | 7 | 0 | 0 | No | No |
| 18039675 | PHOSPHOR POWDER, LIGHT-EMITTING DEVICE, IMAGE DISPLAY DEVICE, AND ILLUMINATION DEVICE | May 2023 | January 2026 | Allow | 31 | 2 | 0 | No | No |
| 18323241 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | May 2023 | July 2024 | Allow | 13 | 2 | 0 | Yes | No |
| 18320046 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2023 | January 2026 | Allow | 32 | 1 | 1 | Yes | No |
| 18195354 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | May 2023 | December 2025 | Allow | 32 | 1 | 1 | No | No |
| 18314224 | SPAD ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREOF | May 2023 | September 2025 | Allow | 28 | 1 | 0 | No | No |
| 18035420 | SELF-HEALABLE, RECYCLABLE, AND RECONFIGURABLE WEARABLE ELECTRONICS DEVICE | May 2023 | December 2025 | Allow | 31 | 1 | 0 | No | No |
| 18307798 | SEMICONDUCTOR SUBSTRATE | April 2023 | April 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18140553 | SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME | April 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18306463 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | April 2023 | April 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18303909 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2023 | July 2025 | Allow | 26 | 0 | 0 | No | No |
| 18303854 | SEMICONDUCTOR MEMORY DEVICE | April 2023 | March 2026 | Allow | 35 | 1 | 1 | No | No |
| 18300157 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DEVICE | April 2023 | April 2024 | Allow | 12 | 2 | 0 | No | No |
| 18298799 | SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADS | April 2023 | January 2026 | Abandon | 33 | 1 | 0 | No | No |
| 18132843 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | April 2023 | February 2024 | Allow | 10 | 0 | 1 | No | No |
| 18296161 | MEMORY DEVICE WITH WORD LINES AND CONTACT LANDING | April 2023 | October 2025 | Allow | 30 | 0 | 1 | No | No |
| 18128958 | HYPERCHIP | March 2023 | January 2024 | Allow | 10 | 1 | 1 | No | No |
| 18127732 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | March 2023 | August 2025 | Allow | 29 | 0 | 1 | No | No |
| 18186656 | METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION | March 2023 | March 2026 | Allow | 36 | 1 | 1 | Yes | No |
| 18185970 | Transmission-Based Temperature Measurement of a Workpiece in a Thermal Processing System | March 2023 | December 2023 | Allow | 9 | 1 | 1 | No | No |
| 18121064 | SYSTEMS AND METHODS FOR DEPOSITION OF MOLYBDENUM FOR SOURCE/DRAIN CONTACTS | March 2023 | March 2026 | Allow | 36 | 2 | 0 | Yes | No |
| 18183866 | FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON 3C-SIC, AND 3C-SIC ELECTRONIC DEVICE | March 2023 | December 2025 | Allow | 33 | 0 | 1 | No | No |
| 18120731 | ANTIFUSE-TYPE ONE TIME PROGRAMMING MEMORY CELL WITH GATE-ALL-AROUND TRANSISTOR | March 2023 | October 2025 | Allow | 31 | 0 | 0 | No | No |
| 18044685 | ADDITIVES TO ENHANCE THE PROPERTIES OF DIELECTRIC FILMS | March 2023 | October 2025 | Allow | 32 | 1 | 0 | No | No |
| 18180680 | FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON 3C-SIC, AND 3C-SIC ELECTRONIC DEVICE | March 2023 | February 2026 | Allow | 36 | 1 | 1 | No | No |
| 18025033 | WAFER TREATMENT METHOD | March 2023 | February 2026 | Allow | 35 | 2 | 0 | No | No |
| 18116414 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18177399 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18171293 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | February 2023 | August 2025 | Allow | 30 | 0 | 1 | No | No |
| 18165639 | NANOSHEET DEVICES AND METHODS OF FABRICATING THE SAME | February 2023 | March 2026 | Allow | 37 | 1 | 1 | No | No |
| 18040542 | LED AND METHOD OF MANUFACTURE | February 2023 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18162685 | SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD | January 2023 | December 2025 | Allow | 35 | 1 | 1 | No | No |
| 18155761 | CAPACITOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND METHOD FOR MANUFACTURING THE SAME | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18155419 | IMAGE SENSOR COMPRISING ENTANGLED PIXEL | January 2023 | June 2023 | Allow | 5 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner GHYKA, ALEXANDER G.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 40.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner GHYKA, ALEXANDER G works in Art Unit 2812 and has examined 2,149 patent applications in our dataset. With an allowance rate of 86.4%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 23 months.
Examiner GHYKA, ALEXANDER G's allowance rate of 86.4% places them in the 64% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by GHYKA, ALEXANDER G receive 1.41 office actions before reaching final disposition. This places the examiner in the 22% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by GHYKA, ALEXANDER G is 23 months. This places the examiner in the 86% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +7.2% benefit to allowance rate for applications examined by GHYKA, ALEXANDER G. This interview benefit is in the 35% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 33.9% of applications are subsequently allowed. This success rate is in the 74% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 43.7% of cases where such amendments are filed. This entry rate is in the 67% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 147.8% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 89% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 78.5% of appeals filed. This is in the 70% percentile among all examiners. Of these withdrawals, 54.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 39.8% are granted (fully or in part). This grant rate is in the 29% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 7.0% of allowed cases (in the 89% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 8.9% of allowed cases (in the 88% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.