USPTO Examiner GHYKA ALEXANDER G - Art Unit 2812

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
19190655SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOFApril 2025August 2025Allow400NoNo
19084370SOLDER REFLOW WITH OPTICAL ENDPOINT CONTROLMarch 2025October 2025Allow711YesNo
18754448IMAGE SENSOR AND MANUFACTURING PROCESS THEREOFJune 2024March 2025Allow900NoNo
18748489METHOD FOR MAKING SEMICONDUCTOR DEVICE INCLUDING A SUPERLATTICE AND ENRICHED SILICON 28 EPITAXIAL LAYERJune 2024February 2025Allow710NoNo
18740970TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENTJune 2024July 2025Allow1311NoNo
18674136DISPLAY DEVICE AND ELECTRONIC APPARATUSMay 2024March 2025Allow1010NoNo
18656987SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEMay 2024August 2025Allow1521NoNo
18653955METHODS OF SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH ACTIVE STEAM GENERATIONMay 2024March 2025Allow1110NoNo
18637723METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE STRUCTUREApril 2024April 2025Allow1220NoNo
18636545METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYERApril 2024January 2025Allow910NoNo
18636253DISPLAY DEVICEApril 2024March 2025Allow1110NoNo
18633854SPUTTERING TARGET, METHOD FOR MANUFACTURING SPUTTERING TARGET, AND METHOD FOR FORMING THIN FILMApril 2024November 2024Allow700NoNo
18615654HYPERCHIPMarch 2024March 2025Allow1200NoNo
18597421Transmission-Based Temperature Measurement of a Workpiece in a Thermal Processing SystemMarch 2024June 2025Allow1610NoNo
18587031BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAMEFebruary 2024April 2025Allow1320YesNo
18444112LED DISPLAY APPARATUS HAVING MICRO LED MODULEFebruary 2024January 2026Allow2340NoNo
18440306METHOD OF SELECTIVELY TRANSFERRING SEMICONDUCTOR DEVICEFebruary 2024March 2025Allow1310NoNo
18435283Semiconductor Device And Method For Manufacturing The SameFebruary 2024January 2025Allow1110NoNo
18429845SINGLE CRYSTAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAMEFebruary 2024May 2025Allow1611NoNo
18416363SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHOD OF FORMING THE SEMICONDUCTOR DEVICEJanuary 2024October 2025Allow2120NoNo
18401989SEMICONDUCTOR DEVICE PRE-CLEANINGJanuary 2024January 2025Allow1210NoNo
18531801Alignment-Tolerant Gallium Oxide DeviceDecember 2023November 2025Abandon2320NoNo
18530748SEMICONDUCTOR MEMORY DEVICEDecember 2023February 2026Allow2700NoNo
18530183SEMICONDUCTOR STRUCTURE AND MEMORYDecember 2023March 2026Allow2700NoNo
18527753SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND LIGHT SPREADING LENSESDecember 2023December 2025Abandon2510NoNo
18566317A SYSTEM AND METHOD FOR MASS FLOW MEASUREMENT AND CONTROL OF PROCESS GASES IN A CARRIER STREAM USING ONE OR MORE QUARTZ CRYSTAL MICROBALANCE SENSORSDecember 2023November 2025Allow2410NoNo
18523167METHOD FORMING A MICRO LED DISPLAY DEVICENovember 2023February 2026Allow2700NoNo
18516238Shutter DiskNovember 2023September 2024Allow1000NoNo
18513008SYSTEM AND METHOD FOR RADICAL AND THERMAL PROCESSING OF SUBSTRATESNovember 2023February 2025Allow1510YesNo
18386571Integrated Method For Low-Cost Wide Band Gap Semiconductor Device ManufacturingNovember 2023September 2024Allow1001NoNo
18498804METHOD OF FORMING GRAPHENE ON A SILICON SUBSTRATEOctober 2023December 2025Abandon2521NoNo
18382251MEMORY DEVICE AND FABRICATION METHOD THEREOFOctober 2023January 2025Allow1511YesNo
18488505INTEGRATED CIRCUIT DEVICEOctober 2023April 2025Allow1810NoNo
18487200SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, INVERTER CIRCUIT, DRIVE DEVICE, VEHICLE, AND ELEVATOROctober 2023April 2024Allow600NoNo
18486786METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUMOctober 2023January 2025Allow1611NoNo
18378978HYPERCHIPOctober 2023April 2024Allow700NoNo
18377671SOLID-STATE IMAGING DEVICEOctober 2023April 2024Allow620NoNo
18554168SEMICONDUCTOR DEVICE AND METHODS FOR FABRICATING AND OPERATING THE DEVICEOctober 2023February 2026Allow2800NoNo
18481961SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFOctober 2023September 2024Allow1111NoNo
18471859SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAMESeptember 2023March 2025Allow1811NoNo
18369847ELECTRONIC DEVICESeptember 2023September 2024Allow1210NoNo
18369207METHOD FOR FABRICATING PHYSICALLY UNCLONABLE FUNCTION DEVICESeptember 2023March 2026Allow3010NoNo
18368098INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAMESeptember 2023February 2026Allow2900NoNo
18243501FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED DIMENSIONAL VARIATIONSSeptember 2023September 2024Allow1210NoNo
18461326SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICESeptember 2023February 2026Allow3001NoNo
18460325SEMICONDUCTOR MEMORY DEVICESeptember 2023November 2025Allow2600NoNo
18237196METHOD FOR MAKING SEMICONDUCTOR DEVICE INCLUDING A SUPERLATTICE AND ENRICHED SILICON 28 EPITAXIAL LAYERAugust 2023March 2024Allow710NoNo
18546484METHOD TO IMPROVE PERFORMANCES OF TUNNEL JUNCTIONS GROWN BY METAL ORGANIC CHEMICAL VAPOR DEPOSITIONAugust 2023October 2025Allow2600NoNo
18450083WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTIONAugust 2023February 2026Allow3010NoNo
18448766SYSTEMS AND METHODS FOR WAFER BOND MONITORINGAugust 2023July 2024Allow1110NoNo
18446521Integrated Circuit Package and MethodAugust 2023July 2025Allow2311NoNo
18230664MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTINGAugust 2023July 2025Allow2321YesNo
18362921WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTUREJuly 2023October 2025Allow2700NoNo
18362676Bottom-up Formation of Contact PlugsJuly 2023June 2024Allow1010NoNo
18362731THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOFJuly 2023September 2024Allow1411NoNo
18226185SEMICONDUCTOR DEVICE WITH FIN END SPACER PLUG AND METHOD OF MANUFACTURING THE SAMEJuly 2023June 2024Allow1010NoNo
18358508Forming Low-Stress Silicon Nitride Layer Through Hydrogen TreatmentJuly 2023November 2024Allow1611YesNo
18356212SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFJuly 2023February 2025Allow1920NoNo
18219846SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK AND SYSTEM FOR MANUFACTURING THE SAMEJuly 2023July 2025Allow2411NoNo
18346840METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICEJuly 2023September 2025Allow2600NoNo
18345296MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATESJune 2023February 2026Allow3201NoNo
18342745MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTUREJune 2023April 2024Allow1010NoNo
18341332Semiconductor DevicesJune 2023July 2024Allow1210NoNo
18258902SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFORJune 2023September 2025Allow2600NoNo
18336263Info Structure with Copper Pillar Having Reversed ProfileJune 2023November 2024Allow1720NoNo
18327063SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOFJune 2023December 2025Allow3011NoNo
18327875MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGEJune 2023December 2023Allow700NoNo
18039675PHOSPHOR POWDER, LIGHT-EMITTING DEVICE, IMAGE DISPLAY DEVICE, AND ILLUMINATION DEVICEMay 2023January 2026Allow3120NoNo
18323241SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMEMay 2023July 2024Allow1320YesNo
18320046SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAMEMay 2023January 2026Allow3211YesNo
18195354SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFMay 2023December 2025Allow3211NoNo
18314224SPAD ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREOFMay 2023September 2025Allow2810NoNo
18035420SELF-HEALABLE, RECYCLABLE, AND RECONFIGURABLE WEARABLE ELECTRONICS DEVICEMay 2023December 2025Allow3110NoNo
18307798SEMICONDUCTOR SUBSTRATEApril 2023April 2024Allow1210YesNo
18140553SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAMEApril 2023July 2025Allow2700NoNo
18306463METHODS OF MANUFACTURING SEMICONDUCTOR DEVICESApril 2023April 2024Allow1210YesNo
18303909SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAMEApril 2023July 2025Allow2600NoNo
18303854SEMICONDUCTOR MEMORY DEVICEApril 2023March 2026Allow3511NoNo
18300157SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DEVICEApril 2023April 2024Allow1220NoNo
18298799SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADSApril 2023January 2026Abandon3310NoNo
18132843METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICEApril 2023February 2024Allow1001NoNo
18296161MEMORY DEVICE WITH WORD LINES AND CONTACT LANDINGApril 2023October 2025Allow3001NoNo
18128958HYPERCHIPMarch 2023January 2024Allow1011NoNo
18127732METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICEMarch 2023August 2025Allow2901NoNo
18186656METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSIONMarch 2023March 2026Allow3611YesNo
18185970Transmission-Based Temperature Measurement of a Workpiece in a Thermal Processing SystemMarch 2023December 2023Allow911NoNo
18121064SYSTEMS AND METHODS FOR DEPOSITION OF MOLYBDENUM FOR SOURCE/DRAIN CONTACTSMarch 2023March 2026Allow3620YesNo
18183866FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON 3C-SIC, AND 3C-SIC ELECTRONIC DEVICEMarch 2023December 2025Allow3301NoNo
18120731ANTIFUSE-TYPE ONE TIME PROGRAMMING MEMORY CELL WITH GATE-ALL-AROUND TRANSISTORMarch 2023October 2025Allow3100NoNo
18044685ADDITIVES TO ENHANCE THE PROPERTIES OF DIELECTRIC FILMSMarch 2023October 2025Allow3210NoNo
18180680FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON 3C-SIC, AND 3C-SIC ELECTRONIC DEVICEMarch 2023February 2026Allow3611NoNo
18025033WAFER TREATMENT METHODMarch 2023February 2026Allow3520NoNo
18116414SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAMEMarch 2023June 2025Allow2700NoNo
18177399SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICEMarch 2023June 2025Allow2700NoNo
18171293SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMEFebruary 2023August 2025Allow3001NoNo
18165639NANOSHEET DEVICES AND METHODS OF FABRICATING THE SAMEFebruary 2023March 2026Allow3711NoNo
18040542LED AND METHOD OF MANUFACTUREFebruary 2023October 2025Allow3310NoNo
18162685SEMICONDUCTOR DEVICE AND MANUFACTURE METHODJanuary 2023December 2025Allow3511NoNo
18155761CAPACITOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND METHOD FOR MANUFACTURING THE SAMEJanuary 2023May 2025Allow2800NoNo
18155419IMAGE SENSOR COMPRISING ENTANGLED PIXELJanuary 2023June 2023Allow510NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner GHYKA, ALEXANDER G.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
14
Examiner Affirmed
14
(100.0%)
Examiner Reversed
0
(0.0%)
Reversal Percentile
10.7%
Lower than average

What This Means

With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.

Strategic Value of Filing an Appeal

Total Appeal Filings
66
Allowed After Appeal Filing
27
(40.9%)
Not Allowed After Appeal Filing
39
(59.1%)
Filing Benefit Percentile
68.2%
Higher than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 40.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.

Strategic Recommendations

⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Examiner GHYKA, ALEXANDER G - Prosecution Strategy Guide

Executive Summary

Examiner GHYKA, ALEXANDER G works in Art Unit 2812 and has examined 2,149 patent applications in our dataset. With an allowance rate of 86.4%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 23 months.

Allowance Patterns

Examiner GHYKA, ALEXANDER G's allowance rate of 86.4% places them in the 64% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.

Office Action Patterns

On average, applications examined by GHYKA, ALEXANDER G receive 1.41 office actions before reaching final disposition. This places the examiner in the 22% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by GHYKA, ALEXANDER G is 23 months. This places the examiner in the 86% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a +7.2% benefit to allowance rate for applications examined by GHYKA, ALEXANDER G. This interview benefit is in the 35% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 33.9% of applications are subsequently allowed. This success rate is in the 74% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 43.7% of cases where such amendments are filed. This entry rate is in the 67% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 147.8% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 89% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 78.5% of appeals filed. This is in the 70% percentile among all examiners. Of these withdrawals, 54.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.

Petition Practice

When applicants file petitions regarding this examiner's actions, 39.8% are granted (fully or in part). This grant rate is in the 29% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 7.0% of allowed cases (in the 89% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 8.9% of allowed cases (in the 88% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Request pre-appeal conferences: PACs are highly effective with this examiner. Before filing a full appeal brief, request a PAC to potentially resolve issues without full PTAB review.
  • Examiner cooperation: This examiner frequently makes examiner's amendments to place applications in condition for allowance. If you are close to allowance, the examiner may help finalize the claims.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.