Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18792267 | THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON | August 2024 | May 2025 | Allow | 9 | 2 | 0 | Yes | No |
| 18658521 | AIR SPACERS AROUND CONTACT PLUGS AND METHOD FORMING SAME | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18406345 | RESISTANCE MEASURING STRUCTURES OF STACKED DEVICES | January 2024 | February 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18398194 | SEMICONDUCTOR PACKAGE | December 2023 | April 2025 | Allow | 16 | 1 | 0 | No | No |
| 18390928 | SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTACHMENT | December 2023 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18519263 | INTEGRATED CIRCUITS WITH GATE CUT FEATURES | November 2023 | May 2025 | Allow | 17 | 1 | 0 | No | No |
| 18512092 | 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES | November 2023 | February 2025 | Allow | 15 | 1 | 0 | No | No |
| 18508255 | ELECTRONIC DEVICE | November 2023 | October 2024 | Allow | 11 | 1 | 0 | No | No |
| 18503673 | CHIP FABRICATION METHOD AND PRODUCT INCLUDING RAISED AND RECESSED ALIGNMENT STRUCTURES | November 2023 | April 2024 | Allow | 5 | 1 | 0 | No | No |
| 18386497 | THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR ARCHITECTURE AND METHOD OF MANUFACTURING THE SAME | November 2023 | August 2024 | Allow | 10 | 0 | 0 | No | No |
| 18489915 | THROUGH SUBSTRATE VIA (TSV) VALIDATION STRUCTURE FOR AN INTEGRATED CIRCUIT AND METHOD TO FORM THE TSV VALIDATION STRUCTURE | October 2023 | February 2025 | Allow | 16 | 1 | 1 | No | No |
| 18381668 | OXIDE SEMICONDUCTOR FILM AND SEMICONDUCTOR DEVICE | October 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18379946 | LIGHT-EMITTING DEVICE | October 2023 | November 2024 | Allow | 13 | 1 | 0 | No | No |
| 18368772 | STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE | September 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18365199 | MANUFACTURING METHOD OF AN INPUT CIRCUIT OF A FLIP-FLOP | August 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18227798 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18227779 | SEMICONDUCTOR DEVICE INCLUDING A GATE-ALL-AROUND FIELD EFFECT TRANSISTOR | July 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18226784 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG CONNECTED TO GATE STRUCTURE ON PMOS REGION | July 2023 | April 2024 | Allow | 9 | 1 | 0 | No | No |
| 18360118 | Multi-Gate Device Integration with Separated Fin-Like Field Effect Transistor Cells and Gate-All-Around Transistor Cells | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18359892 | MICRO ELECTRO MECHANICAL SYSTEM (MEMS) DEVICE HAVING METAL SEALING ON NECKING PORTION OF VENT HOLE | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18357198 | MULTIPLEXER CELL AND SEMICONDUCTOR DEVICE HAVING CAMOUFLAGE DESIGN, AND METHOD FOR FORMING MULTIPLEXER CELL | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18219374 | INTERCONNECT TECHNIQUES FOR ELECTRICALLY CONNECTING SOURCE/DRAIN REGIONS OF STACKED TRANSISTORS | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18326841 | INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES | May 2023 | September 2024 | Allow | 16 | 1 | 0 | No | No |
| 18324643 | THROUGH VIAS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | May 2023 | December 2024 | Allow | 18 | 2 | 0 | No | No |
| 18302210 | THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL INTERCONNECT STRUCTURE | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18301461 | SEMICONDUCTOR DEVICE HAVING A PLURALITY OF III-V SEMICONDUCTOR LAYERS | April 2023 | June 2024 | Allow | 14 | 1 | 0 | No | No |
| 18110971 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS | February 2023 | January 2024 | Allow | 11 | 1 | 0 | No | No |
| 18105648 | SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE SAME | February 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18156287 | HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION | January 2023 | April 2025 | Allow | 26 | 2 | 0 | No | No |
| 18005418 | CARTRIDGE FOR INSPECTION | January 2023 | November 2024 | Allow | 22 | 1 | 0 | No | No |
| 18150934 | SEMICONDUCTOR STRUCTURE HAVING BURIED WORD LINE STRUCTURE WITH DIELECTRIC LAYERS OF DIFFERENT DIELECTRIC CONSTANTS, AND MANUFACTURING METHOD THEREOF | January 2023 | June 2025 | Allow | 30 | 1 | 0 | No | No |
| 17994841 | Semiconductor Devices and Methods of Manufacturing | November 2022 | April 2024 | Allow | 17 | 1 | 0 | No | No |
| 17990733 | SEMICONDUCTOR DEVICE FOR ENHANCING QUALITY FACTOR OF INDUCTOR AND METHOD OF FORMING THE SAME | November 2022 | October 2024 | Allow | 23 | 1 | 0 | No | No |
| 18053021 | METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES | November 2022 | June 2024 | Allow | 19 | 1 | 0 | No | No |
| 18052510 | SILICON CARBIDE POWER DEVICE WITH IMPROVED ROBUSTNESS AND CORRESPONDING MANUFACTURING PROCESS | November 2022 | June 2024 | Allow | 20 | 1 | 0 | No | No |
| 18046387 | SEMICONDUCTOR DEVICE, IMAGING UNIT, AND ELECTRONIC APPARATUS | October 2022 | June 2024 | Allow | 20 | 1 | 0 | No | No |
| 17934959 | SEMICONDUCTOR DEVICE HAVING WORD LINE SEPARATION LAYER | September 2022 | February 2024 | Allow | 16 | 1 | 0 | No | No |
| 17888727 | SEMICONDUCTOR DEVICES INCLUDING SUPPORTER | August 2022 | January 2024 | Allow | 17 | 1 | 0 | No | No |
| 17871310 | MEMS ELECTRICAL AND PHYSICAL CONNECTION VIA SOLDER COUPLINGS | July 2022 | May 2025 | Allow | 34 | 0 | 0 | No | No |
| 17845891 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | June 2022 | March 2024 | Allow | 21 | 1 | 0 | No | No |
| 17838507 | METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL | June 2022 | June 2025 | Allow | 36 | 1 | 0 | No | No |
| 17805552 | Air Spacers Around Contact Plugs and Method Forming Same | June 2022 | February 2024 | Allow | 20 | 2 | 0 | No | No |
| 17752795 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | May 2022 | March 2025 | Allow | 34 | 2 | 0 | Yes | No |
| 17752078 | THREE-DIMENSIONAL MEMORY DEVICE WITH CAPACITORS AND VERTICAL WORD-LINE | May 2022 | June 2025 | Allow | 36 | 1 | 1 | No | No |
| 17749842 | STANDARD CELL DESIGN WITH DUMMY PADDING | May 2022 | April 2025 | Allow | 35 | 1 | 0 | No | No |
| 17663290 | NANOSTRUCTURE FET AND METHOD OF FORMING SAME | May 2022 | May 2025 | Allow | 36 | 1 | 1 | Yes | No |
| 17755934 | MEMS DEVICE, ASSEMBLY COMPRISING THE MEMS DEVICE, AND METHODS FOR OPERATING THE MEMS DEVICE | May 2022 | November 2024 | Allow | 30 | 0 | 0 | No | No |
| 17741983 | IMAGE SENSOR, CAMERA DEVICE INCLUDING THE IMAGE SENSOR, ELECTRONIC DEVICE INCLUDING THE CAMERA DEVICE, AND METHOD OF MANUFACTURING THE IMAGE SENSOR | May 2022 | May 2025 | Allow | 36 | 1 | 0 | Yes | No |
| 17731821 | DISPLAY DEVICE | April 2022 | June 2025 | Allow | 38 | 2 | 1 | No | No |
| 17720695 | MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES, AND RELATED ELECTRONIC SYSTEMS AND METHODS OF FORMING THE MICROELECTRONIC DEVICES | April 2022 | May 2025 | Allow | 37 | 1 | 1 | No | No |
| 17719281 | SEMICONDUCTOR DEVICE PACKAGE | April 2022 | July 2024 | Allow | 28 | 1 | 0 | No | No |
| 17718801 | MAGNETIC DOMAIN WALL MOVEMENT ELEMENT AND MAGNETIC ARRAY | April 2022 | March 2025 | Allow | 35 | 1 | 0 | No | No |
| 17715872 | ELECTRONIC PACKAGE | April 2022 | March 2025 | Allow | 35 | 1 | 0 | No | No |
| 17710499 | SEMICONDUCTOR DEVICE STRUCTURE WITH FIN AND METHOD FOR FORMING THE SAME | March 2022 | June 2025 | Allow | 38 | 1 | 1 | No | No |
| 17754250 | ARRAY SUBSTRATE AND DISPLAY PANEL | March 2022 | February 2025 | Allow | 35 | 1 | 0 | No | No |
| 17704095 | DISPLAY APPARATUS | March 2022 | April 2025 | Allow | 37 | 2 | 0 | No | No |
| 17674803 | DISPLAY APPARATUS HAVING DISPLAY AREA SURROUNDING PORTION OF OPENING AREA | February 2022 | April 2025 | Allow | 38 | 1 | 1 | No | No |
| 17672757 | THROUGH VIAS WITH TEST STRUCTURE | February 2022 | April 2025 | Allow | 38 | 1 | 1 | No | No |
| 17672215 | GATE METAL-INSULATOR-FIELD PLATE METAL INTEGRATED CIRCUIT CAPACITOR AND METHOD OF FORMING THE SAME | February 2022 | December 2024 | Allow | 34 | 1 | 0 | No | No |
| 17648903 | SEMICONDUCTOR STRUCTURE, METHOD FOR FORMING SAME AND STACKED STRUCTURE | January 2022 | September 2024 | Allow | 32 | 1 | 0 | No | No |
| 17648598 | INTEGRATED CIRCUIT DEVICE | January 2022 | September 2024 | Allow | 32 | 1 | 0 | No | No |
| 17581084 | SEMICONDUCTOR DEVICE INCLUDING BACKSIDE WIRING STRUCTURE WITH SUPER VIA | January 2022 | November 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17577800 | GATE TO SOURCE DRAIN INTERCONNECTS | January 2022 | January 2025 | Allow | 36 | 1 | 1 | No | No |
| 17576007 | INTEGRATED CIRCUIT DEVICES INCLUDING A POWER RAIL AND METHODS OF FORMING THE SAME | January 2022 | October 2024 | Allow | 33 | 1 | 1 | No | No |
| 17571564 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | January 2022 | October 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17647458 | SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND STACKED STRUCTURE | January 2022 | September 2024 | Allow | 33 | 1 | 0 | No | No |
| 17647046 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING CAPACITOR STRUCTURE | January 2022 | April 2025 | Allow | 40 | 2 | 0 | No | No |
| 17551754 | DISPLAY APPARATUS | December 2021 | August 2024 | Allow | 32 | 1 | 0 | No | No |
| 17547700 | INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS OF FORMING THE SAME | December 2021 | January 2025 | Allow | 38 | 1 | 1 | No | No |
| 17545373 | ELECTRONIC DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE SAME | December 2021 | February 2025 | Allow | 38 | 2 | 1 | Yes | No |
| 17595704 | SEMICONDUCTOR DEVICE INCLUDING BASE MEMBER WITH PROTRUDING PORTION AT CIRCUMFERENTIAL EDGE | November 2021 | August 2024 | Allow | 33 | 1 | 1 | Yes | No |
| 17455576 | RECESS STRUCTURE FOR PADLESS STACK VIA | November 2021 | December 2024 | Allow | 36 | 2 | 0 | Yes | No |
| 17522376 | INTEGRATED CIRCUIT DEVICE WITH ANTENNA EFFECT PROTECTION CIRCUIT AND METHOD OF MANUFACTURING | November 2021 | April 2024 | Allow | 30 | 1 | 0 | No | No |
| 17453041 | ELECTRONIC DEVICES INCLUDING TIERED STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS | November 2021 | August 2024 | Allow | 33 | 1 | 0 | No | No |
| 17451393 | SEMICONDUCTOR STRUCTURE | October 2021 | March 2024 | Allow | 29 | 1 | 0 | No | No |
| 17502140 | DIRECTIONAL ETCH FOR IMPROVED DUAL DECK THREE-DIMENSIONAL NAND ARCHITECTURE MARGIN | October 2021 | June 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17450504 | DOUBLE GATE THIN FILM TRANSISTOR DEVICE WITH MIXED SEMICONDUCTOR LAYERS | October 2021 | May 2025 | Allow | 43 | 4 | 0 | Yes | No |
| 17496185 | THREE-DIMENSIONAL CAPACITIVE STRUCTURES AND THEIR MANUFACTURING METHODS | October 2021 | January 2024 | Allow | 28 | 0 | 0 | Yes | No |
| 17602138 | PIXEL, DISPLAY DEVICE INCLUDING SAME, AND MANUFACTURING METHOD THEREFOR | October 2021 | April 2024 | Allow | 31 | 1 | 0 | No | No |
| 17449414 | DISPLAY APPARATUS | September 2021 | January 2024 | Allow | 27 | 0 | 0 | No | No |
| 17448892 | SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE PLUG AND CAPACITOR ARRAY | September 2021 | April 2024 | Allow | 30 | 1 | 0 | No | No |
| 17442382 | ELECTRONIC ELEMENT HOUSING PACKAGE AND ELECTRONIC APPARATUS | September 2021 | September 2024 | Allow | 36 | 1 | 0 | Yes | No |
| 17441738 | DISPLAY DEVICE, DISPLAY PANEL AND FABRICATION METHOD THEREOF | September 2021 | November 2024 | Allow | 38 | 2 | 0 | No | No |
| 17476140 | NANOSHEET DEVICE ARCHITECTURE FOR CELL-HEIGHT SCALING | September 2021 | June 2024 | Allow | 33 | 1 | 1 | Yes | No |
| 17463022 | SEMICONDUCTOR DEVICE SEGMENTED INTERCONNECT | August 2021 | February 2024 | Allow | 30 | 1 | 1 | No | No |
| 17434712 | DISPLAY SUBSTRATE, SPLICED DISPLAY PANEL AND DISPLAY APPARATUS | August 2021 | May 2024 | Allow | 33 | 1 | 0 | No | No |
| 17408485 | Semiconductor Device Including Three-Dimensional Inductor Structure and Method of Forming the Same | August 2021 | May 2024 | Allow | 32 | 2 | 1 | No | No |
| 17402416 | INSPECTION DEVICE, RESIN MOLDING APPARATUS, AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT | August 2021 | September 2024 | Abandon | 37 | 2 | 0 | No | No |
| 17427805 | FLEXIBLE INTERPOSER | August 2021 | August 2024 | Allow | 37 | 6 | 0 | Yes | No |
| 17444026 | STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE | July 2021 | April 2024 | Allow | 32 | 2 | 0 | Yes | No |
| 17348882 | DISPLAY PANEL AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE | June 2021 | January 2025 | Allow | 43 | 1 | 1 | No | No |
| 17414113 | SURFACE SHIELDING ASSEMBLY FOR LED PACKAGE | June 2021 | December 2024 | Abandon | 42 | 1 | 0 | No | No |
| 17347447 | PHOTOELECTRIC CONVERSION DEVICE | June 2021 | January 2025 | Allow | 43 | 1 | 0 | Yes | No |
| 17347147 | DISPLAY DEVICE HAVING BANK AND A LIGHT EMITTING ELEMENT IN AN OPENING | June 2021 | January 2025 | Allow | 43 | 1 | 1 | No | No |
| 17347411 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | June 2021 | January 2025 | Allow | 43 | 1 | 1 | No | No |
| 17312934 | GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME | June 2021 | January 2025 | Allow | 44 | 3 | 0 | Yes | No |
| 17299901 | IMAGING DEVICE HAVING A PLURALITY OF IN-LAYER LENSES WITH CORRESPONDING ON-CHIP LENSES | June 2021 | April 2025 | Allow | 47 | 5 | 0 | Yes | No |
| 17332782 | DISPLAY DEVICE | May 2021 | December 2024 | Allow | 43 | 2 | 1 | Yes | No |
| 17327027 | CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE | May 2021 | August 2024 | Allow | 38 | 2 | 0 | Yes | No |
| 17187179 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | February 2021 | February 2024 | Allow | 35 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ASSOUMAN, HERVE-LOUIS Y.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner ASSOUMAN, HERVE-LOUIS Y works in Art Unit 2812 and has examined 137 patent applications in our dataset. With an allowance rate of 98.5%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 30 months.
Examiner ASSOUMAN, HERVE-LOUIS Y's allowance rate of 98.5% places them in the 96% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by ASSOUMAN, HERVE-LOUIS Y receive 1.36 office actions before reaching final disposition. This places the examiner in the 28% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by ASSOUMAN, HERVE-LOUIS Y is 30 months. This places the examiner in the 42% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +2.0% benefit to allowance rate for applications examined by ASSOUMAN, HERVE-LOUIS Y. This interview benefit is in the 19% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 43.1% of applications are subsequently allowed. This success rate is in the 94% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 39.3% of cases where such amendments are filed. This entry rate is in the 52% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 200.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 95% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 91% percentile among all examiners. Of these withdrawals, 100.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 33.3% are granted (fully or in part). This grant rate is in the 27% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 21% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 27% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.