Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18420686 | PACKAGE STRUCTURE | January 2024 | December 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18531561 | SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSULANT AND A DIE PAD OR LEADS | December 2023 | October 2024 | Allow | 10 | 1 | 0 | No | No |
| 18525958 | Semiconductor Devices and Methods of Manufacture | December 2023 | October 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18518852 | SYSTEM IN A PACKAGE MODIFICATIONS | November 2023 | November 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18516039 | 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME | November 2023 | November 2024 | Allow | 11 | 2 | 1 | No | No |
| 18504136 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | November 2023 | September 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18490468 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | October 2023 | September 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18484321 | COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS | October 2023 | September 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18235668 | Semiconductor Package with Releasable Isolation Layer Protection | August 2023 | April 2024 | Allow | 8 | 1 | 0 | Yes | No |
| 18451366 | INTERCONNECT STRUCTURES | August 2023 | March 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18447655 | Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices | August 2023 | June 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18446146 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | August 2023 | March 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18362968 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | August 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18359036 | Conductive Feature Formation and Structure | July 2023 | February 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18209412 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | June 2023 | April 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18329327 | LOW-STRESS PASSIVATION LAYER | June 2023 | January 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18321686 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | May 2023 | April 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18317699 | SEMICONDUCTOR DEVICE | May 2023 | March 2024 | Allow | 10 | 1 | 0 | No | No |
| 18143750 | SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME | May 2023 | December 2023 | Allow | 7 | 0 | 0 | Yes | No |
| 18310094 | ELECTRONIC DEVICE | May 2023 | November 2023 | Allow | 7 | 0 | 0 | Yes | No |
| 18306948 | THREE-DIMENSIONAL STACKED PACKAGE STRUCTURE WITH MICRO-CHANNEL HEAT DISSIPATION STRUCTURE AND PACKAGING METHOD THEREOF | April 2023 | July 2023 | Allow | 3 | 0 | 0 | Yes | No |
| 18306222 | PACKAGE | April 2023 | June 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18130760 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | April 2023 | February 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18191147 | CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND METHODS FOR FORMING THE SAME | March 2023 | February 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18175189 | Semiconductor Package for Thermal Dissipation | February 2023 | June 2023 | Allow | 4 | 0 | 0 | No | No |
| 18174576 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | February 2023 | September 2023 | Allow | 7 | 0 | 0 | Yes | No |
| 18153929 | METHOD FOR MANUFACTURING ELECTRONIC CHIPS | January 2023 | September 2023 | Allow | 8 | 1 | 0 | Yes | No |
| 18149509 | 3D Package Structure and Methods of Forming Same | January 2023 | February 2024 | Allow | 13 | 1 | 0 | No | No |
| 18087515 | LEADFRAME WITH GROUND PAD CANTILEVER | December 2022 | April 2023 | Allow | 4 | 0 | 0 | Yes | No |
| 18084604 | CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE | December 2022 | December 2024 | Allow | 24 | 4 | 1 | Yes | No |
| 18075141 | PACKAGE STRUCTURE AND FABRICATION METHODS | December 2022 | September 2023 | Allow | 9 | 1 | 0 | No | No |
| 17989498 | CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | November 2022 | August 2023 | Allow | 8 | 1 | 0 | Yes | No |
| 17984195 | SEMICONDUCTOR PACKAGE | November 2022 | February 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 17960632 | SEMICONDUCTOR DEVICE | October 2022 | February 2023 | Allow | 4 | 0 | 0 | Yes | No |
| 17947536 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF | September 2022 | June 2024 | Allow | 21 | 4 | 0 | Yes | No |
| 17891190 | SEMICONDUCTOR PACKAGE | August 2022 | August 2023 | Allow | 12 | 1 | 0 | Yes | No |
| 17886704 | CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | August 2022 | March 2023 | Allow | 7 | 1 | 0 | No | No |
| 17873876 | Semiconductor Devices and Methods of Manufacture | July 2022 | September 2023 | Allow | 13 | 1 | 0 | No | No |
| 17869034 | Semiconductor Device and Method of Forming the Same | July 2022 | July 2023 | Allow | 12 | 1 | 0 | Yes | No |
| 17845867 | SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSULANT AND A DIE PAD OR LEADS | June 2022 | August 2023 | Allow | 14 | 1 | 1 | No | No |
| 17839928 | ELECTRONIC DEVICE | June 2022 | December 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17660441 | SEMICONDUCTOR PACKAGES WITH EMBEDDED WIRING ON RE-DISTRIBUTED BUMPS | April 2022 | February 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17722823 | SEMICONDUCTOR DEVICE | April 2022 | October 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17659379 | METHODS OF FABRICATING LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATIONS | April 2022 | January 2023 | Allow | 9 | 0 | 0 | Yes | No |
| 17658995 | SEMICONDUCTOR DEVICE AND INVERTER DEVICE | April 2022 | November 2024 | Allow | 31 | 1 | 0 | Yes | No |
| 17657432 | METHOD OF PROCESSING WAFER AND PROCESSING APPARATUS FOR WAFER | March 2022 | November 2024 | Allow | 32 | 1 | 1 | No | No |
| 17707094 | EMBEDDED COMPONENT AND METHODS OF MAKING THE SAME | March 2022 | March 2023 | Allow | 11 | 1 | 0 | Yes | No |
| 17705373 | PACKAGE AND METHOD OF MANUFACTURING THE SAME | March 2022 | April 2023 | Allow | 13 | 1 | 0 | Yes | No |
| 17695864 | SEMICONDUCTOR PACKAGES | March 2022 | September 2024 | Allow | 30 | 4 | 0 | Yes | No |
| 17687911 | Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices | March 2022 | July 2023 | Allow | 16 | 1 | 0 | No | No |
| 17653308 | SEMICONDUCTOR DEVICE | March 2022 | February 2025 | Allow | 35 | 1 | 0 | No | No |
| 17683663 | INTEGRATED CIRCUIT PACKAGE SYSTEM | March 2022 | October 2024 | Abandon | 32 | 1 | 0 | No | No |
| 17672729 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | February 2022 | November 2024 | Allow | 33 | 0 | 1 | Yes | No |
| 17668538 | SEMICONDUCTOR PACKAGE | February 2022 | October 2024 | Allow | 32 | 1 | 0 | Yes | No |
| 17580961 | MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY | January 2022 | February 2023 | Allow | 13 | 1 | 0 | Yes | No |
| 17576221 | METALLIC STRUCTURE FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | January 2022 | July 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17570889 | EMBEDDED PACKAGING STRUCTURE, PREPARATION METHOD THEREOF, AND TERMINAL DEVICE | January 2022 | September 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17647144 | SEMICONDUCTOR PACKAGE | January 2022 | November 2024 | Allow | 34 | 1 | 0 | Yes | No |
| 17567435 | Semiconductor Device with Discrete Blocks | January 2022 | September 2023 | Allow | 20 | 1 | 0 | Yes | No |
| 17564197 | INTEGRATED ANTENNA PACKAGE STRUCTURE | December 2021 | February 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17563347 | LINER AND BARRIER LAYER IN DUAL DAMASCENE CU INTERCONNECT FOR ENHANCED EM AND PROCESS | December 2021 | January 2025 | Allow | 36 | 1 | 1 | Yes | No |
| 17560004 | CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUND PTH IN IC PACKAGE SUBSTRATE | December 2021 | February 2023 | Allow | 14 | 1 | 0 | Yes | No |
| 17620345 | METHOD FOR PACKAGING CHIP | December 2021 | February 2024 | Allow | 26 | 2 | 0 | Yes | No |
| 17551366 | LEADLESS SEMICONDUCTOR PACKAGE WITH SHIELDED DIE-TO-PAD CONTACTS | December 2021 | April 2024 | Allow | 28 | 1 | 1 | Yes | No |
| 17547127 | BALL PAD DESIGN FOR SEMICONDUCTOR PACKAGES | December 2021 | February 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17643244 | Semiconductor Device and Method of Forming Leadframe with Clip Bond for Electrical Interconnect | December 2021 | January 2025 | Allow | 37 | 3 | 1 | Yes | No |
| 17537792 | SEMICONDUCTOR DEVICE | November 2021 | September 2023 | Allow | 21 | 1 | 0 | No | No |
| 17536158 | SEMICONDUCTOR PACKAGE DEVICE | November 2021 | July 2023 | Allow | 20 | 0 | 0 | Yes | No |
| 17535983 | Semiconductor Packaging Method, Semiconductor Assembly and Electronic Device Comprising Semiconductor Assembly | November 2021 | December 2023 | Allow | 24 | 1 | 0 | Yes | No |
| 17614434 | CHIP ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD | November 2021 | April 2024 | Allow | 29 | 1 | 0 | Yes | No |
| 17535093 | SEMICONDUCTOR PACKAGE | November 2021 | November 2024 | Allow | 36 | 2 | 0 | Yes | No |
| 17533606 | SEMICONDUCTOR PACKAGE | November 2021 | August 2024 | Allow | 33 | 2 | 0 | Yes | No |
| 17524720 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | November 2021 | August 2024 | Allow | 33 | 3 | 1 | Yes | No |
| 17452188 | SEMICONDUCTOR DEVICES WITH BACKSIDE POWER DISTRIBUTION NETWORK AND FRONTSIDE THROUGH SILICON VIA | October 2021 | July 2023 | Allow | 21 | 1 | 0 | No | No |
| 17502163 | SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL REDISTRIBUTION LAYERS OF DIFFERENT THICKNESSES AND METHODS FOR MANUFACTURING THEREOF | October 2021 | July 2024 | Allow | 33 | 1 | 1 | No | No |
| 17498389 | ELECTRONIC COMPONENT MODULE | October 2021 | June 2024 | Allow | 32 | 1 | 0 | Yes | No |
| 17594029 | FILM FORMING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, FILM FORMING DEVICE, AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE | September 2021 | June 2024 | Allow | 33 | 2 | 1 | Yes | No |
| 17486633 | INTERCONNECT STRUCTURES | September 2021 | April 2023 | Allow | 19 | 1 | 0 | Yes | No |
| 17479042 | SEMICONDUCTOR PACKAGE INCLUDING POST | September 2021 | December 2023 | Allow | 27 | 1 | 0 | Yes | No |
| 17480090 | SEMICONDUCTOR PACKAGE WITH DAMS | September 2021 | September 2023 | Allow | 24 | 1 | 1 | No | No |
| 17476340 | FAN-OUT PACKAGING STRUCTURE AND METHOD | September 2021 | July 2023 | Allow | 22 | 0 | 1 | Yes | No |
| 17472769 | CURRENT SENSOR INTEGRATED CIRCUITS | September 2021 | October 2022 | Allow | 13 | 0 | 0 | Yes | No |
| 17593220 | METHOD AND DEVICE FOR FORMING GRAPHENE STRUCTURE | September 2021 | February 2024 | Allow | 29 | 1 | 1 | Yes | No |
| 17471691 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | September 2021 | December 2023 | Allow | 27 | 1 | 1 | Yes | No |
| 17468372 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | September 2021 | September 2023 | Allow | 24 | 1 | 1 | No | No |
| 17460978 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | August 2021 | July 2024 | Allow | 34 | 1 | 1 | Yes | No |
| 17458663 | Semiconductor Device and Method of Forming Same | August 2021 | February 2024 | Allow | 29 | 1 | 1 | No | No |
| 17459266 | CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE AND METHOD FOR FORMING THE SAME | August 2021 | January 2024 | Allow | 29 | 1 | 1 | No | No |
| 17445968 | SEMICONDUCTOR MEMORY DEVICE | August 2021 | November 2023 | Allow | 26 | 0 | 0 | Yes | No |
| 17446106 | SEMICONDUCTOR STORAGE DEVICE | August 2021 | March 2024 | Allow | 30 | 1 | 0 | No | No |
| 17433801 | EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF | August 2021 | March 2024 | Allow | 31 | 2 | 1 | Yes | No |
| 17407647 | SEMICONDUCTOR PACKAGE | August 2021 | September 2023 | Allow | 25 | 1 | 0 | Yes | No |
| 17431073 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS | August 2021 | February 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17400193 | METHOD FOR PRODUCING POWER MODULE, AND POWER MODULE | August 2021 | January 2024 | Allow | 29 | 1 | 1 | No | No |
| 17430279 | METHODS FOR FORMING SEMICONDUCTOR STRUCTURES AND SEMICONDUCTOR STRUCTURES | August 2021 | April 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17389193 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2021 | February 2023 | Allow | 19 | 0 | 0 | Yes | No |
| 17386096 | ENCAPSULATED SEMICONDUCTOR PACKAGE | July 2021 | August 2023 | Allow | 24 | 1 | 0 | No | No |
| 17384923 | Underfill Structure for Semiconductor Packages and Methods of Forming the Same | July 2021 | August 2023 | Allow | 24 | 0 | 1 | Yes | No |
| 17383953 | Fan-Out Package with Controllable Standoff | July 2021 | September 2023 | Allow | 25 | 2 | 0 | Yes | No |
| 17382283 | SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING | July 2021 | September 2023 | Allow | 26 | 2 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PAREKH, NITIN.
With a 16.7% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 36.2% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner PAREKH, NITIN works in Art Unit 2811 and has examined 1,700 patent applications in our dataset. With an allowance rate of 87.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 23 months.
Examiner PAREKH, NITIN's allowance rate of 87.0% places them in the 61% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by PAREKH, NITIN receive 1.46 office actions before reaching final disposition. This places the examiner in the 34% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by PAREKH, NITIN is 23 months. This places the examiner in the 76% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +18.6% benefit to allowance rate for applications examined by PAREKH, NITIN. This interview benefit is in the 65% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 32.4% of applications are subsequently allowed. This success rate is in the 61% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 24.1% of cases where such amendments are filed. This entry rate is in the 24% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.
When applicants request a pre-appeal conference (PAC) with this examiner, 61.5% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 49% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 88.0% of appeals filed. This is in the 79% percentile among all examiners. Of these withdrawals, 31.8% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 46.4% are granted (fully or in part). This grant rate is in the 53% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 13.1% of allowed cases (in the 97% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.3% of allowed cases (in the 46% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.