USPTO Examiner CHAMPION RICHARD DAVID - Art Unit 1737

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18404934METHOD AND APPARATUS FOR DIRECT WRITING PHOTOETCHING BY PARALLEL INTERPENETRATING SUPER-RESOLUTION HIGH-SPEED LASERJanuary 2024July 2024Allow600NoNo
18249011POLYVINYL ACETATE BASED PHOTOPOLYMERApril 2023August 2023Allow400NoNo
17992837LITHOGRAPHICALLY PATTERNED ELECTRICALLY CONDUCTIVE HYDROGELS, PHOTO-CURABLE COMPOSITIONS, AND ELASTOMERS FORMED FROM SUCH COMPOSITIONSNovember 2022January 2025Allow2610NoNo
17873130PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERNJuly 2022September 2024Allow2600NoNo
17732807METHOD OF FORMING PATTERNS USING RESIST UNDERLAYER COMPOSITIONApril 2022January 2024Allow2000NoNo
17675770METHOD FOR MANUFACTURING INDIUM-CONTAINING ORGANIC POLYMER FILM, PATTERNING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEFebruary 2022March 2025Allow3700NoNo
17669711PHOTOSENSITIVE COLORING COMPOSITION, CURED FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICEFebruary 2022April 2025Abandon3830NoNo
17650676PHOTOCURABLE COMPOSITION INCLUDING A NON-REACTIVE POLYMERFebruary 2022July 2025Allow4110YesNo
17628594QUANTUM DOT LIGHT-EMITTING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUSJanuary 2022March 2025Allow3811NoNo
17564476PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODSDecember 2021May 2025Abandon4140YesNo
17455294RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNNovember 2021April 2025Abandon4130NoNo
17452360ENERGY-SENSITIVE COMPOSITION, CURED PRODUCT, FORMING METHOD OF CURED PRODUCT, THERMAL BASE GENERATOR AND COMPOUNDOctober 2021October 2024Abandon3511NoNo
17450528RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNOctober 2021June 2025Allow4440YesNo
17449033RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNSeptember 2021April 2025Abandon4340NoNo
17438962PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PLATED FORMED PRODUCTSeptember 2021December 2024Abandon3920NoNo
17368231COATED UNDERLAYER FOR OVERCOATED PHOTORESISTJuly 2021March 2025Allow4530NoNo
17345516RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND, AND RESINJune 2021April 2025Abandon4740NoNo
17246855CARBOXYLATE, QUENCHER, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERNMay 2021March 2024Allow3520NoNo
17245326AROMATIC UNDERLAYERApril 2021July 2025Allow5020NoNo
17215363PHOTOACID GENERATOR FOR CHEMICALLY AMPLIFIED PHOTORESISTSMarch 2021June 2024Allow3920YesNo
17051394ELECTROSTATIC INK COMPOSITIONOctober 2020May 2023Abandon3121NoNo
17004484ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND POLYESTERAugust 2020June 2024Abandon4620YesNo
17003373PHOTORESIST COMPOSITION, PHOTOLITHOGRAPHY METHOD USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAMEAugust 2020March 2025Abandon5440YesNo
17003414RESIST COMPOSITIONAugust 2020November 2023Abandon3920YesNo
16975609PATTERN-FORMING MATERIAL, PATTERN-FORMING METHOD, AND MONOMER FOR PATTERN-FORMING MATERIALAugust 2020December 2023Abandon4010NoNo
16999755RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNAugust 2020November 2024Abandon5140NoYes
16942981POSITIVE RESIST COMPOSITION AND PATTERNING PROCESSJuly 2020October 2022Allow2600NoNo
16934259RESIST COMPOSITION AND PATTERNING PROCESSJuly 2020June 2022Allow2300NoNo
16930539CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESSJuly 2020February 2023Allow3100NoNo
16928666PHOTORESIST COMPOSITION FOR THICK FILM AND METHOD OF FORMING THICK FILM PHOTORESIST PATTERNJuly 2020September 2024Abandon5020NoYes
16924752RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNJuly 2020April 2025Abandon5850NoNo
16923228RESIST UNDERLAYER SURFACE MODIFICATIONJuly 2020September 2024Abandon5040YesNo
16919574RESIST COMPOSITION AND PATTERNING PROCESSJuly 2020June 2022Allow2400NoNo
16918082POSITIVE RESIST COMPOSITION AND PATTERNING PROCESSJuly 2020September 2022Allow2700NoNo
16916453POSITIVE RESIST COMPOSITION AND PATTERNING PROCESSJune 2020December 2022Allow3010NoNo
16958046CROSSLINKING AGENT COMPOUND, PHOTOSENSITIVE COMPOSITION COMPRISING THE SAME, AND PHOTOSENSITIVE MATERIAL USING THE SAMEJune 2020May 2023Allow3410NoNo
16889959SALT, QUENCHER, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERNJune 2020January 2025Abandon5560YesNo
16890501RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNJune 2020June 2025Abandon6050NoNo
16765354COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, FILM FOR LITHOGRAPHY, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CIRCUIT PATTERNMay 2020September 2022Abandon2810NoNo
16874079SALT, QUENCHER, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERNMay 2020July 2024Allow5050YesNo
16858160ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESSApril 2020November 2024Allow5550NoNo
16858092MOLECULAR RESIST COMPOSITION AND PATTERNING PROCESSApril 2020December 2023Allow4330YesNo
16758347LITHOGRAPHICALLY PATTERNED ELECTRICALLY CONDUCTIVE HYDROGELS, PHOTO-CURABLE COMPOSITIONS, AND ELASTOMERS FORMED FROM SUCH COMPOSITIONSApril 2020December 2022Abandon3211NoNo
16830216LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF PRODUCING LITHOGRAPHIC PRINTING PLATEMarch 2020January 2024Abandon4640YesNo
16826454CURABLE COMPOSITION, CURED FILM, SOLID-STATE IMAGING DEVICE, AND MANUFACTURING METHOD OF CURED FILMMarch 2020August 2023Abandon4120YesNo
16824037COMPOSITION AND METHOD FOR FORMING INSULATING PARTMarch 2020September 2024Abandon5440YesNo
16813062PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE AND METHOD OF MANUFACTURING PLATED ARTICLEMarch 2020March 2025Abandon6051YesNo
16805922ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICEMarch 2020May 2022Allow2610NoNo
16642848RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNFebruary 2020May 2025Abandon6060YesNo
16794925LIQUID DEVELOPER AND METHOD OF PRODUCING LIQUID DEVELOPERFebruary 2020September 2021Allow1920YesNo
16789233RESIST UNDERLAYER COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITIONFebruary 2020September 2021Allow2000NoNo
16788467RESIST COMPOUND, METHOD OF FORMING PATTERN USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAMEFebruary 2020March 2023Allow3720NoNo
16787743RESIST COMPOSITION AND PATTERNING PROCESSFebruary 2020March 2022Allow2500NoNo
16750616METAL-CONTAINING FILM-FORMING COMPOSITION, METAL-CONTAINING FILM AND PATTERN-FORMING METHODJanuary 2020December 2023Abandon4730NoNo
16631765PHOTORESIST COMPOSITIONJanuary 2020September 2022Allow3210YesNo
16731373Photosensitive dry film sheetsDecember 2019April 2024Abandon5131YesNo
16728153PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESSDecember 2019April 2024Allow5240YesNo
16722026ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICEDecember 2019October 2022Allow3420YesNo
16720729CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLEDecember 2019May 2025Abandon6070NoNo
16718377Resist Composition and Resist Pattern Forming MethodDecember 2019July 2024Abandon5541NoNo
16716821PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESSDecember 2019July 2022Allow3110NoNo
16713471RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST PATTERN-FORMING METHODDecember 2019June 2023Abandon4330NoNo
16621978SILSESQUIOXANE COMPOSITION WITH BOTH POSITIVE AND NEGATIVE PHOTO RESIST CHARACTERISTICSDecember 2019December 2021Abandon2410NoNo
16711916PATTERN-FORMING METHOD, AND SILICON-CONTAINING FILM-FORMING COMPOSITIONDecember 2019June 2023Abandon4330NoNo
16710007POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION AND CURED FILM USING THE SAMEDecember 2019December 2021Abandon2510NoNo
16708684COLORING COMPOSITION, CURED FILM, PATTERN FORMING METHOD, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICEDecember 2019December 2021Allow2421NoNo
16701720NEGATIVE-TONE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIST FILM, AND METHOD OF FORMING PATTERNDecember 2019April 2025Abandon6070NoNo
16700846RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUNDDecember 2019January 2023Allow3720NoNo
16682431RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNNovember 2019December 2022Allow3840YesNo
16678175RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNNovember 2019April 2023Abandon4121NoNo
16677269RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNNovember 2019June 2024Abandon5650NoNo
16676591SILOXANE POLYMER CONTAINING ISOCYANURIC ACID AND POLYETHER SKELETONS, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICENovember 2019September 2022Allow3521NoNo
16670481CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE AND METHOD OF MANUFACTURING PLATED ARTICLEOctober 2019July 2024Abandon5640NoNo
16598264AROMATIC UNDERLAYEROctober 2019July 2024Allow5741NoYes
16584234PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERNSeptember 2019December 2023Allow5131YesNo
16498306COMPOUND, RESIST COMPOSITION CONTAINING COMPOUND AND PATTERN FORMATION METHOD USING SAMESeptember 2019February 2022Abandon2910NoNo
16496986NEGATIVE RESIST FORMULATION FOR PRODUCING UNDERCUT PATTERN PROFILESSeptember 2019July 2024Allow5832NoNo
16579014ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICESeptember 2019June 2025Abandon6060YesNo
16494670PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, INSULATING FILM, AND ELECTRONIC COMPONENTSeptember 2019November 2023Abandon5040NoNo
16570176PHASE SHIFT-TYPE PHOTOMASK BLANK AND PHASE SHIFT-TYPE PHOTOMASKSeptember 2019June 2024Abandon5760YesNo
16567121PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAMESeptember 2019June 2024Abandon5870YesNo
16559062PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERNSeptember 2019January 2025Allow6050YesNo
16558486RESIST UNDERLAYER COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITIONSeptember 2019March 2022Allow3021NoNo
16489145POLYMER AND POSITIVE RESIST COMPOSITIONAugust 2019May 2021Abandon2110NoNo
16541895PELLICLE MEMBER AND RETICLE ASSEMBLY INCLUDING THE SAMEAugust 2019January 2022Abandon2920NoNo
16534968PROTECTION LAYER ON LOW THERMAL EXPANSION MATERIAL (LTEM) SUBSTRATE OF EXTREME ULTRAVIOLET (EUV) MASKAugust 2019January 2024Allow5451YesNo
16480572CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION AND PHOTORESIST FILM USING THE SAMEJuly 2019June 2022Allow3410NoNo
16519420RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHODJuly 2019November 2021Abandon2701NoNo
16512693Extreme Ultraviolet Mask Absorber MaterialsJuly 2019August 2021Abandon2511NoNo
16507373COLORING COMPOSITION, CURED FILM, STRUCTURE, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICEJuly 2019February 2023Abandon4340NoNo
16506751Acid-Labile, Crosslinked Polymers, Compositions and Methods of Their UseJuly 2019February 2023Abandon4320YesNo
16504745PHOTOSENSITIVE COLORING COMPOSITION, CURED FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICEJuly 2019November 2021Allow2820YesNo
16502918PHOTORESIST COMPOSITION FOR LINE DOUBLINGJuly 2019December 2022Abandon4130NoNo
16459905PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESSJuly 2019January 2022Allow3020NoNo
16454650PHOTOSENSITIVE COMPOSITION, CURED FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT AND IMAGE DISPLAY DEVICEJune 2019March 2023Abandon4540NoNo
16449720RADIATION-SENSITIVE COMPOSITION, PATTERN-FORMING METHOD AND METAL OXIDEJune 2019November 2021Abandon2811NoNo
16447092RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERNJune 2019August 2023Abandon5051NoNo
16431752PHOTOSENSITIVE COMPOSITION, COLOR FILTER AND METHOD FOR FORMING THE COLOR FILTERJune 2019December 2024Allow6061YesNo
16432499REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD OF MANUFACTURING REFLECTIVE MASK BLANKJune 2019April 2024Abandon5861YesNo
16432043ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICEJune 2019June 2022Abandon3720NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHAMPION, RICHARD DAVID.

Strategic Value of Filing an Appeal

Total Appeal Filings
3
Allowed After Appeal Filing
0
(0.0%)
Not Allowed After Appeal Filing
3
(100.0%)
Filing Benefit Percentile
1.3%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.

Strategic Recommendations

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Examiner CHAMPION, RICHARD DAVID - Prosecution Strategy Guide

Executive Summary

Examiner CHAMPION, RICHARD DAVID works in Art Unit 1737 and has examined 108 patent applications in our dataset. With an allowance rate of 46.3%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 41 months.

Allowance Patterns

Examiner CHAMPION, RICHARD DAVID's allowance rate of 46.3% places them in the 6% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by CHAMPION, RICHARD DAVID receive 2.70 office actions before reaching final disposition. This places the examiner in the 90% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by CHAMPION, RICHARD DAVID is 41 months. This places the examiner in the 6% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.

Interview Effectiveness

Conducting an examiner interview provides a -1.2% benefit to allowance rate for applications examined by CHAMPION, RICHARD DAVID. This interview benefit is in the 7% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 9.4% of applications are subsequently allowed. This success rate is in the 2% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 20.6% of cases where such amendments are filed. This entry rate is in the 18% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 2% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 86% percentile among all examiners. Of these withdrawals, 100.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.

Petition Practice

When applicants file petitions regarding this examiner's actions, 120.0% are granted (fully or in part). This grant rate is in the 98% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 4% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 5% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Prepare for rigorous examination: With a below-average allowance rate, ensure your application has strong written description and enablement support. Consider filing a continuation if you need to add new matter.
  • Expect multiple rounds of prosecution: This examiner issues more office actions than average. Address potential issues proactively in your initial response and consider requesting an interview early in prosecution.
  • Plan for RCE after final rejection: This examiner rarely enters after-final amendments. Budget for an RCE in your prosecution strategy if you receive a final rejection.
  • Appeal filing as negotiation tool: This examiner frequently reconsiders rejections during the appeal process. Filing a Notice of Appeal may prompt favorable reconsideration during the mandatory appeal conference.
  • Plan for extended prosecution: Applications take longer than average with this examiner. Factor this into your continuation strategy and client communications.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.