Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18796069 | Electrostatic Discharge Protection Structure, Semiconductor Power Device and Manufacturing Method Thereof | August 2024 | April 2025 | Allow | 8 | 0 | 1 | No | No |
| 18761884 | ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE | July 2024 | February 2025 | Allow | 7 | 0 | 0 | No | No |
| 18760817 | Semiconductor Device and Method of Manufacture | July 2024 | September 2025 | Allow | 15 | 1 | 0 | No | No |
| 18758423 | PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY | June 2024 | October 2025 | Allow | 15 | 1 | 0 | No | No |
| 18656112 | LIGHT EMITTING DEVICE PACKAGE AND DISPLAY DEVICE HAVING THE SAME | May 2024 | June 2025 | Allow | 13 | 0 | 0 | No | No |
| 18635347 | Integrated Circuit with a Fin and Gate Structure and Method Making the Same | April 2024 | January 2025 | Allow | 9 | 0 | 0 | No | No |
| 18631966 | INTEGRATED CIRCUIT PACKAGE AND METHOD | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18629424 | DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE | April 2024 | June 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18609836 | GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE | March 2024 | August 2025 | Allow | 17 | 1 | 0 | No | No |
| 18603181 | OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | March 2024 | September 2025 | Allow | 18 | 1 | 0 | No | No |
| 18602033 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | March 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18586549 | PACKAGE AND MANUFACTURING METHOD THEREOF | February 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18388712 | IMAGE SENSOR AND A METHOD OF MANUFACTURING THE SAME | November 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18387127 | METHOD FOR MANUFACTURING ORGANIC SEMICONDUCTOR ELEMENT | November 2023 | March 2026 | Allow | 28 | 0 | 0 | No | No |
| 18385667 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | October 2023 | December 2024 | Allow | 14 | 0 | 0 | No | No |
| 18494710 | CONTROL OF WAFER BOW IN MULTIPLE STATIONS | October 2023 | March 2026 | Allow | 29 | 0 | 0 | No | No |
| 18487216 | IMAGE SENSOR DEVICE | October 2023 | March 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18378803 | LATE SRAM CUT WITH BACKSIDE CONTACT | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18477258 | TRENCH MOSFET AND MANUFACTURING METHOD THEREFOR | September 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18477138 | SILICON CARBIDE SEMICONDUCTOR DEVICE | September 2023 | February 2026 | Allow | 29 | 0 | 0 | No | No |
| 18475546 | SEMICONDUCTOR PACKAGES | September 2023 | May 2025 | Allow | 20 | 1 | 0 | No | No |
| 18372977 | LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES | September 2023 | January 2026 | Allow | 28 | 1 | 0 | No | No |
| 18234914 | SEMICONDUCTOR PACKAGE | August 2023 | August 2025 | Allow | 24 | 2 | 0 | Yes | No |
| 18231614 | METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING REPAIRED LIGHT EMITTING DEVICE | August 2023 | April 2025 | Allow | 21 | 1 | 0 | No | No |
| 18365997 | ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE | August 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18365232 | PACKAGE COMPONENT, ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | August 2023 | May 2025 | Allow | 22 | 1 | 0 | No | No |
| 18359684 | Semiconductor Device and Method of Manufacture | July 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18355824 | Architecture for Computing System Package | July 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18355004 | SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM | July 2023 | February 2026 | Allow | 31 | 0 | 0 | No | No |
| 18346319 | Integrated Circuit Package and Method Forming Same | July 2023 | June 2024 | Allow | 12 | 0 | 0 | No | No |
| 18339132 | DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES | June 2023 | November 2025 | Allow | 29 | 3 | 0 | Yes | No |
| 18338273 | ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | June 2023 | September 2025 | Allow | 27 | 0 | 0 | No | No |
| 18336561 | Methods Of Forming Air Spacers In Semicondutor Devices | June 2023 | October 2024 | Allow | 16 | 0 | 0 | No | No |
| 18329871 | Semiconductor Device and Method of Making an EMI Shield Using Intensive Pulsed Light Irradiation | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18328322 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | June 2023 | January 2024 | Allow | 8 | 0 | 0 | No | No |
| 18318864 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | May 2023 | June 2024 | Allow | 13 | 1 | 0 | No | No |
| 18138180 | SEMICONDUCTOR PACKAGE | April 2023 | March 2026 | Allow | 34 | 1 | 0 | No | No |
| 18305516 | SEMICONDUCTOR DEVICE | April 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18302589 | INTEGRATED CIRCUIT PACKAGE AND METHOD | April 2023 | January 2024 | Allow | 9 | 0 | 0 | No | No |
| 18134767 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | April 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18134333 | TUNNEL JUNCTION ULTRAVIOLET LIGHT EMITTING DIODES WITH ENHANCED LIGHT EXTRACTION EFFICIENCY | April 2023 | April 2025 | Allow | 24 | 2 | 0 | No | No |
| 18122285 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | March 2023 | February 2026 | Allow | 35 | 2 | 0 | Yes | No |
| 18184222 | HETEROGENEOUS INTEGRATION FOR MEMRISTOR-BASED HARDWARE ACCELERATORS | March 2023 | August 2025 | Allow | 29 | 0 | 0 | No | No |
| 18182728 | PACKAGE STRUCTURE WITH REINFORCED ELEMENT | March 2023 | September 2024 | Allow | 18 | 2 | 0 | No | No |
| 18120555 | ELECTRONIC DEVICE | March 2023 | February 2026 | Abandon | 35 | 1 | 0 | No | No |
| 18174129 | SEMICONDUCTOR PACKAGE | February 2023 | October 2024 | Allow | 20 | 0 | 0 | No | No |
| 18112430 | SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE | February 2023 | September 2024 | Allow | 19 | 0 | 0 | No | No |
| 18169713 | SEMICONDUCTOR PACKAGE | February 2023 | May 2025 | Allow | 27 | 4 | 0 | Yes | No |
| 18041694 | LIGHT EMITTING MODULE, METHOD OF MANUFACTURING LIGHT EMITTING MODULE, AND DISPLAY DEVICE | February 2023 | February 2026 | Allow | 36 | 1 | 0 | No | No |
| 18098987 | SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | January 2023 | December 2025 | Allow | 35 | 1 | 0 | No | No |
| 18153380 | Zero Mask High Density Capacitor | January 2023 | April 2024 | Allow | 15 | 1 | 0 | No | No |
| 18153458 | RF BRIDGE | January 2023 | July 2025 | Allow | 30 | 0 | 0 | No | No |
| 18015576 | CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR | January 2023 | December 2025 | Allow | 35 | 0 | 0 | No | No |
| 18091048 | DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE | December 2022 | February 2024 | Allow | 14 | 2 | 0 | No | No |
| 18091197 | SELECTIVE GATE OXIDE FORMATION ON 2D MATERIAL BASED TRANSISTOR DEVICES | December 2022 | February 2026 | Allow | 38 | 0 | 0 | No | No |
| 18063377 | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF | December 2022 | October 2025 | Allow | 34 | 1 | 0 | No | No |
| 17979761 | LIGHT EMITTING DEVICE PACKAGE AND DISPLAY DEVICE HAVING THE SAME | November 2022 | February 2024 | Allow | 15 | 0 | 0 | No | No |
| 17979480 | SEMICONDUCTOR PACKAGE HAVING TWO-DIMENSIONAL INPUT AND OUTPUT DEVICE | November 2022 | June 2025 | Allow | 31 | 0 | 0 | No | No |
| 17973318 | SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE | October 2022 | March 2024 | Allow | 17 | 2 | 0 | Yes | No |
| 17957012 | CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME | September 2022 | December 2025 | Allow | 38 | 1 | 0 | No | No |
| 17954745 | DISPLAY MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME | September 2022 | September 2025 | Allow | 35 | 1 | 0 | No | No |
| 17902902 | ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | September 2022 | November 2025 | Allow | 38 | 1 | 0 | Yes | No |
| 17902912 | PACKAGE-LEVEL ESD PROTECTION | September 2022 | June 2025 | Allow | 33 | 1 | 0 | No | No |
| 17888177 | DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE | August 2022 | March 2024 | Allow | 19 | 2 | 0 | No | No |
| 17815634 | SEMICONDUCTOR PACKAGE | July 2022 | October 2025 | Allow | 39 | 2 | 0 | Yes | No |
| 17874402 | Semiconductor Device Package and Method of Manufacture | July 2022 | August 2024 | Allow | 25 | 2 | 0 | No | No |
| 17814716 | Controlling Threshold Voltages Through Blocking Layers | July 2022 | December 2023 | Allow | 17 | 1 | 0 | No | No |
| 17814730 | Packages with Thick RDLs and Thin RDLs Stacked Alternatingly | July 2022 | March 2024 | Allow | 20 | 1 | 0 | No | No |
| 17870099 | GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE | July 2022 | December 2023 | Allow | 17 | 2 | 0 | No | No |
| 17869080 | Connector Formation Methods and Packaged Semiconductor Devices | July 2022 | January 2026 | Allow | 42 | 5 | 0 | Yes | No |
| 17862482 | FAN-OUT SEMICONDUCTOR PACKAGE | July 2022 | January 2025 | Allow | 30 | 0 | 0 | No | No |
| 17858905 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | July 2022 | April 2025 | Allow | 33 | 0 | 0 | No | No |
| 17809921 | Silicon Oxide Layer for Oxidation Resistance and Method Forming Same | June 2022 | July 2024 | Allow | 24 | 2 | 0 | No | No |
| 17790247 | DISPLAY PANEL | June 2022 | February 2025 | Allow | 31 | 0 | 0 | No | No |
| 17853204 | LOW INSERTION LOSS COAXIAL THROUGH-HOLE FOR HIGHSPEED INPUT-OUPUT | June 2022 | March 2026 | Allow | 45 | 1 | 0 | No | No |
| 17847407 | PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES | June 2022 | September 2025 | Allow | 39 | 0 | 0 | No | No |
| 17807475 | ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS | June 2022 | November 2024 | Allow | 29 | 3 | 0 | No | No |
| 17824194 | SEMICONDUCTOR PACKAGE | May 2022 | January 2025 | Allow | 32 | 1 | 0 | No | No |
| 17776685 | SUBSTRATE BONDING | May 2022 | April 2025 | Allow | 35 | 0 | 0 | No | No |
| 17733170 | METHODS AND APPARATUS TO IMPROVE SIGNAL INTEGRITY PERFORMANCE IN INTEGRATED CIRCUIT PACKAGES | April 2022 | December 2025 | Allow | 44 | 1 | 0 | Yes | No |
| 17728761 | HOMOGENEOUS CHIPLETS CONFIGURABLE AS A TWO-DIMENSIONAL SYSTEM OR A THREE-DIMENSIONAL SYSTEM | April 2022 | July 2024 | Allow | 27 | 0 | 0 | No | No |
| 17717250 | SIGNAL LINES IN MEMORY DEVICES AND METHODS FOR FORMING THE SAME | April 2022 | January 2025 | Allow | 34 | 1 | 0 | No | No |
| 17656729 | MULTI-LAYERED STRUCTURE INTERFACE BETWEEN A BALL GRID ARRAY DEVICE AND A PRINTED CIRCUIT BOARD | March 2022 | May 2024 | Allow | 26 | 0 | 0 | No | No |
| 17695859 | DISPLAY DEVICE AND SPLICING DISPLAY DEVICE | March 2022 | May 2025 | Allow | 38 | 1 | 0 | No | No |
| 17683774 | SEMICONDUCTOR PACKAGE | March 2022 | January 2025 | Allow | 35 | 2 | 0 | Yes | No |
| 17682238 | DIELECTRIC ANCHORS FOR ANCHORING A CONDUCTIVE PILLAR | February 2022 | August 2024 | Allow | 30 | 0 | 1 | No | No |
| 17638681 | DISPLAY DEVICE AND DISPLAY UNIT | February 2022 | December 2024 | Allow | 33 | 2 | 0 | Yes | No |
| 17679861 | SEMICONDUCTOR PACKAGE | February 2022 | February 2024 | Allow | 24 | 2 | 0 | Yes | No |
| 17676862 | PACKAGE SUBSTRATE AND PACKAGE STRUCTURE | February 2022 | August 2024 | Allow | 30 | 0 | 0 | No | No |
| 17677702 | SEMICONDUCTOR DIE DIPPING STRUCTURE | February 2022 | March 2025 | Allow | 37 | 0 | 0 | No | No |
| 17676233 | STACKED DIE STRUCTURE AND METHOD OF FABRICATING THE SAME | February 2022 | May 2024 | Allow | 27 | 2 | 0 | No | No |
| 17670391 | MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIATED METHODS | February 2022 | March 2025 | Allow | 37 | 2 | 1 | No | No |
| 17670393 | MONOLITHIC CONDUCTIVE CYLINDER IN A SEMICONDUCTOR DEVICE AND ASSOCIATED METHODS | February 2022 | April 2025 | Allow | 38 | 1 | 1 | No | No |
| 17591084 | INTEGRATED CIRCUIT PACKAGE WITH DECOUPLING CAPACITORS | February 2022 | March 2025 | Allow | 38 | 3 | 0 | Yes | No |
| 17631254 | MOLDED SILICON INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACKAGES | January 2022 | October 2024 | Allow | 32 | 2 | 0 | No | No |
| 17648425 | SEMICONDUCTOR PACKAGE | January 2022 | September 2024 | Allow | 32 | 2 | 0 | No | No |
| 17580368 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | January 2022 | July 2024 | Allow | 30 | 1 | 0 | No | No |
| 17578965 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | January 2022 | May 2024 | Abandon | 28 | 2 | 0 | Yes | No |
| 17562477 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | December 2021 | March 2024 | Allow | 26 | 1 | 0 | No | No |
| 17561722 | ULTRA LOW LOSS ROUTING BETWEEN GLASS CORES | December 2021 | July 2025 | Allow | 43 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner TYNES JR., LAWRENCE C.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner TYNES JR., LAWRENCE C works in Art Unit 2899 and has examined 75 patent applications in our dataset. With an allowance rate of 94.7%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 35 months.
Examiner TYNES JR., LAWRENCE C's allowance rate of 94.7% places them in the 83% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by TYNES JR., LAWRENCE C receive 1.88 office actions before reaching final disposition. This places the examiner in the 45% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by TYNES JR., LAWRENCE C is 35 months. This places the examiner in the 40% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +7.3% benefit to allowance rate for applications examined by TYNES JR., LAWRENCE C. This interview benefit is in the 36% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 38.1% of applications are subsequently allowed. This success rate is in the 87% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 45.5% of cases where such amendments are filed. This entry rate is in the 69% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 96% percentile among all examiners. Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 0.0% are granted (fully or in part). This grant rate is in the 5% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 28% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.