Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18739344 | TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME | June 2024 | July 2025 | Allow | 13 | 2 | 0 | No | No |
| 18735584 | Light-Emitting Element, Light-Emitting Device, Display Device, Lighting Device, and Electronic Device | June 2024 | September 2025 | Allow | 16 | 1 | 0 | No | No |
| 18732009 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | June 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18404665 | SEMICONDUCTOR SUBSTRATE | January 2024 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18396575 | INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF | December 2023 | May 2025 | Allow | 16 | 1 | 0 | No | No |
| 18526429 | METHOD FOR FORMING SEMICONDUCTOR DEVICE | December 2023 | June 2025 | Allow | 18 | 1 | 0 | No | No |
| 18515961 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | November 2023 | December 2024 | Allow | 13 | 0 | 0 | No | No |
| 18508595 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME | November 2023 | May 2025 | Allow | 18 | 2 | 0 | No | No |
| 18388883 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | November 2023 | July 2025 | Allow | 20 | 2 | 0 | No | No |
| 18500291 | TRENCH CAPACITOR | November 2023 | May 2025 | Allow | 18 | 1 | 0 | No | No |
| 18497172 | METHODS OF CUTTING A FINE PATTERN, METHODS OF FORMING ACTIVE PATTERNS USING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME | October 2023 | January 2025 | Allow | 14 | 1 | 0 | No | No |
| 18383385 | METHODS AND COMPOSITIONS FOR SURFACE FUNCTIONALIZATION OF OPTICAL SEMICONDUCTOR-INTEGRATED BIOCHIPS | October 2023 | March 2025 | Allow | 17 | 1 | 0 | No | No |
| 18486399 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO | October 2023 | March 2025 | Allow | 17 | 1 | 0 | No | No |
| 18479871 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | October 2023 | July 2024 | Allow | 9 | 0 | 0 | No | No |
| 18231912 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME | August 2023 | March 2025 | Allow | 19 | 0 | 0 | No | No |
| 18446583 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | August 2023 | February 2026 | Allow | 30 | 1 | 0 | No | No |
| 18359735 | DEPOSITION WINDOW ENLARGEMENT | July 2023 | January 2025 | Allow | 18 | 2 | 0 | No | No |
| 18224904 | TECHNIQUES FOR VOID-FREE MATERIAL DEPOSITIONS | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18356694 | CAPPING STRUCTURE TO REDUCE DARK CURRENT IN IMAGE SENSORS | July 2023 | December 2024 | Allow | 17 | 1 | 0 | No | No |
| 18354887 | Method of Forming Backside Power Rails | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18223521 | DISPLAY DEVICE | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18343544 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | June 2023 | April 2024 | Allow | 10 | 1 | 0 | No | No |
| 18342192 | SEMICONDUCTOR STRUCTURE INCLUDING DEVICES WITH DIFFERENT CHANNEL LENGTHS, AND METHOD FOR MANUFACTURING THE SAME | June 2023 | January 2026 | Allow | 31 | 0 | 1 | No | No |
| 18209217 | HALOGEN-FREE MOLYBDENUM-CONTAINING PRECURSORS FOR DEPOSITION OF MOLYBDENUM | June 2023 | December 2025 | Allow | 31 | 0 | 0 | No | No |
| 18209035 | SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18209257 | OXIDATION BARRIERS WITH CVD SOAK PROCESSES | June 2023 | August 2025 | Allow | 27 | 0 | 0 | No | No |
| 18206427 | SELECTIVE CAPPING OF CONTACT LAYER FOR CMOS DEVICES | June 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18318917 | BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS | May 2023 | March 2025 | Allow | 22 | 3 | 0 | No | No |
| 18317227 | SEMICONDUCTOR DEVICE WITH LOW NOISE TRANSISTOR AND LOW TEMPERATURE COEFFICIENT RESISTOR | May 2023 | January 2025 | Allow | 20 | 2 | 0 | No | No |
| 18305536 | Method for Reducing Line-End Space in Integrated Circuit Patterning | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18194098 | VAPOR DEPOSITION OF TELLURIUM NANOMESH ELECTRONICS ON ARBITRARY SURFACES AT LOW TEMPERATURE | March 2023 | December 2025 | Allow | 33 | 1 | 0 | No | No |
| 18193041 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | March 2023 | February 2026 | Allow | 35 | 1 | 0 | Yes | No |
| 18191707 | TEMPERATURE CHANGE RATE CONTROL DEVICE, METHOD, AND SEMICONDUCTOR PROCESS APPARATUS | March 2023 | September 2024 | Allow | 18 | 0 | 0 | No | No |
| 18190868 | SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND METHOD OF MAKING SAME | March 2023 | June 2025 | Allow | 26 | 2 | 0 | No | No |
| 18112159 | Methods for Transferring Graphene to Substrates and Related Lithographic Stacks and Laminates | February 2023 | November 2025 | Allow | 33 | 0 | 0 | No | No |
| 18112463 | SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME | February 2023 | December 2024 | Allow | 22 | 2 | 0 | No | No |
| 18112431 | ELECTRONIC PACKAGE ASSEMBLY WITH STIFFENER | February 2023 | November 2025 | Allow | 33 | 5 | 0 | Yes | No |
| 18171839 | SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR MANUFACTURING THE SAME | February 2023 | November 2025 | Allow | 33 | 0 | 1 | No | No |
| 18169799 | THIN FILM DEPOSITION METHOD AND MANUFACTURING METHOD OF ELECTRONIC DEVICE APPLYING THE SAME | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18162951 | METHODS OF MANUFACTURING SEMICONDUCTOR-ON-INSULATOR WAFERS HAVING CHARGE TRAPPING LAYERS WITH CONTROLLED STRESS | February 2023 | March 2026 | Allow | 37 | 2 | 0 | No | No |
| 18018913 | SEMICONDUCTOR LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | January 2023 | November 2025 | Allow | 34 | 1 | 0 | No | No |
| 18152134 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | January 2023 | September 2025 | Allow | 32 | 2 | 0 | No | No |
| 18013370 | METHOD FOR PRODUCING A GALLIUM OXIDE SEMICONDUCTOR FILM AND A FILM FORMING APPARATUS | December 2022 | December 2025 | Allow | 36 | 1 | 0 | No | No |
| 17992905 | MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR | November 2022 | August 2025 | Allow | 33 | 0 | 0 | No | No |
| 17991090 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | November 2022 | August 2025 | Allow | 32 | 2 | 0 | Yes | No |
| 17922846 | METHOD FOR MANUFACTURING SOI WAFER | November 2022 | December 2025 | Allow | 38 | 2 | 0 | No | No |
| 18051182 | Light Emitting Diode and Fabrication Method Thereof | October 2022 | May 2024 | Allow | 19 | 1 | 0 | No | No |
| 17920227 | METHOD FOR FORMING THERMAL OXIDE FILM ON SEMICONDUCTOR SUBSTRATE | October 2022 | February 2025 | Allow | 28 | 0 | 0 | No | No |
| 17959557 | Methods for Forming Self-Aligned Contacts Using Spin-on Silicon Carbide | October 2022 | May 2024 | Allow | 19 | 1 | 0 | No | No |
| 17907224 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | September 2022 | August 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17951756 | Method for Making Silicon Epitaxy of a FDSOI Device | September 2022 | June 2025 | Allow | 33 | 1 | 0 | No | No |
| 17950481 | METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | September 2022 | October 2025 | Allow | 37 | 1 | 0 | No | No |
| 17940949 | TRANSISTOR INCLUDING WRAP AROUND SOURCE AND DRAIN CONTACTS | September 2022 | July 2024 | Allow | 22 | 2 | 0 | Yes | No |
| 17929311 | STRUCTURE MANUFACTURING METHOD | September 2022 | March 2025 | Allow | 30 | 0 | 0 | Yes | No |
| 17822008 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES | August 2022 | January 2026 | Allow | 41 | 1 | 1 | No | No |
| 17880885 | HIGH CONDUCTANCE DIVERT LINE ARCHITECTURE | August 2022 | June 2025 | Allow | 34 | 0 | 0 | No | No |
| 17873313 | FULLY SELF-ALIGNED VIA | July 2022 | April 2024 | Abandon | 20 | 1 | 0 | No | No |
| 17873442 | Integrated Circuit Package and Method | July 2022 | December 2024 | Allow | 29 | 0 | 0 | No | No |
| 17795154 | METHOD FOR FABRICATING ELECTRODE BASED ON LIQUID METAL | July 2022 | October 2025 | Allow | 39 | 2 | 0 | No | No |
| 17868927 | CONTACT PLUG | July 2022 | June 2024 | Allow | 23 | 2 | 0 | No | No |
| 17856173 | METHOD OF MANUFACTURING DIAMOND SUBSTRATE | July 2022 | January 2026 | Allow | 42 | 1 | 0 | No | No |
| 17825664 | DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT | May 2022 | May 2024 | Allow | 24 | 1 | 0 | No | No |
| 17756431 | METHOD FOR BONDING TWO SUBSTRATES | May 2022 | July 2024 | Allow | 26 | 1 | 0 | No | No |
| 17779474 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHODS THEREOF | May 2022 | October 2024 | Allow | 28 | 1 | 0 | No | No |
| 17737011 | TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME | May 2022 | April 2024 | Allow | 24 | 2 | 0 | No | No |
| 17736188 | METHODS FOR NEAR SURFACE WORK FUNCTION ENGINEERING | May 2022 | September 2023 | Allow | 17 | 0 | 0 | No | No |
| 17722611 | THIN FILM TRANSISTOR AND DISPLAY DEVICE INCLUDING THE SAME | April 2022 | February 2025 | Allow | 34 | 4 | 0 | No | No |
| 17720789 | AIR GAP FORMATION METHOD | April 2022 | May 2024 | Allow | 25 | 1 | 0 | No | No |
| 17714660 | Semiconductor Transistor Device and Method of Manufacturing the Same | April 2022 | June 2024 | Allow | 26 | 2 | 0 | No | No |
| 17655510 | SEMICONDUCTOR DEVICES AND METHODS OF FORMATION | March 2022 | February 2025 | Allow | 35 | 2 | 1 | Yes | No |
| 17642533 | SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES | March 2022 | February 2023 | Allow | 11 | 0 | 0 | No | No |
| 17688343 | METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL | March 2022 | December 2024 | Allow | 33 | 2 | 0 | No | No |
| 17678093 | METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS ON A BONDING LAYER AND SEMICONDUCTOR DEVICES FORMED BY THE SAME | February 2022 | June 2024 | Allow | 27 | 2 | 0 | Yes | No |
| 17299051 | METHOD FOR MANUFACTURING GALLIUM OXIDE FILM | February 2022 | February 2025 | Allow | 45 | 2 | 0 | No | No |
| 17588920 | Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices | January 2022 | March 2025 | Allow | 37 | 3 | 0 | Yes | No |
| 17588708 | SEMICONDUCTOR FILM | January 2022 | July 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17582782 | DEVICES WITH ADJUSTED FIN PROFILE AND METHODS FOR MANUFACTURING DEVICES WITH ADJUSTED FIN PROFILE | January 2022 | March 2024 | Allow | 26 | 1 | 0 | No | No |
| 17577656 | FILM FORMING METHOD AND FILM FORMING APPARATUS | January 2022 | April 2024 | Allow | 27 | 0 | 0 | No | No |
| 17569419 | 3D FLASH MEMORY MODULE CHIP AND METHOD OF FABRICATING THE SAME | January 2022 | April 2025 | Allow | 39 | 1 | 0 | No | No |
| 17567613 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | January 2022 | August 2023 | Allow | 19 | 0 | 0 | No | No |
| 17562238 | OPTICAL INSPECTION APPARATUS IN SEMICONDUCTOR PROCESS SYSTEM | December 2021 | May 2025 | Allow | 40 | 1 | 0 | No | No |
| 17548689 | DEPOSITION OF BORON FILMS | December 2021 | June 2025 | Allow | 42 | 3 | 0 | No | No |
| 17547669 | DOPANT-FREE INHIBITOR FOR AREA SELECTIVE DEPOSITIONS | December 2021 | October 2025 | Abandon | 46 | 0 | 1 | No | No |
| 17546303 | METHOD OF PATTERNING TWO-DIMENSIONAL MATERIAL LAYER ON SUBSTRATE, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE | December 2021 | December 2023 | Allow | 24 | 1 | 0 | Yes | No |
| 17545667 | THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES | December 2021 | August 2023 | Allow | 21 | 1 | 0 | No | No |
| 17545209 | FIN FIELD-EFFECT TRANSISTOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | December 2021 | May 2025 | Allow | 42 | 2 | 0 | No | No |
| 17544776 | METHODS AND COMPOSITIONS FOR SURFACE FUNCTIONALIZATION OF OPTICAL SEMICONDUCTOR-INTEGRATED BIOCHIPS | December 2021 | July 2023 | Allow | 19 | 3 | 1 | Yes | No |
| 17540552 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | December 2021 | March 2024 | Allow | 27 | 2 | 0 | No | No |
| 17538760 | THERMAL ATOMIC LAYER DEPOSITION OF TERNARY GALLIUM OXIDE THIN FILMS | November 2021 | June 2025 | Allow | 43 | 3 | 0 | No | No |
| 17613324 | SOLUTION-BASED DEPOSITION METHOD FOR PREPARING SEMICONDUCTING THIN FILMS VIA DISPERSED PARTICLE SELF-ASSEMBLY AT A LIQUID-LIQUID INTERFACE | November 2021 | April 2024 | Allow | 29 | 1 | 0 | No | No |
| 17609629 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2021 | October 2025 | Allow | 47 | 4 | 0 | No | No |
| 17511042 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FINE PATTERNS AT DIFFERENT LEVELS | October 2021 | July 2023 | Allow | 21 | 1 | 0 | No | No |
| 17508419 | CARBON GAP FILL PROCESSES | October 2021 | October 2024 | Allow | 36 | 1 | 0 | Yes | No |
| 17474973 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | September 2021 | July 2024 | Allow | 34 | 1 | 0 | No | No |
| 17474067 | METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE | September 2021 | May 2024 | Allow | 32 | 1 | 0 | No | No |
| 17472825 | METHOD FOR MANUFACTURING SEMICONDUCTOR AND MULTI-PIECE DEPOSITION DEVICE | September 2021 | December 2024 | Abandon | 39 | 2 | 0 | No | No |
| 17473302 | COMPOSITION FOR FORMING UNDERLAYER FILM FOR IMPRINTING, METHOD FOR PRODUCING COMPOSITION FOR FORMING UNDERLAYER FILM, KIT, PATTERN PRODUCING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | September 2021 | June 2025 | Allow | 45 | 2 | 0 | No | No |
| 17471703 | STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF | September 2021 | October 2024 | Allow | 37 | 0 | 1 | No | No |
| 17469992 | METHOD FOR DETERMINING CONTOUR OF SEMICONDUCTOR STRUCTURE | September 2021 | June 2024 | Allow | 33 | 0 | 0 | No | No |
| 17468909 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | September 2021 | May 2024 | Allow | 32 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner JEFFERSON, QUOVAUNDA.
With a 66.7% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 36.8% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner JEFFERSON, QUOVAUNDA works in Art Unit 2899 and has examined 601 patent applications in our dataset. With an allowance rate of 84.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 29 months.
Examiner JEFFERSON, QUOVAUNDA's allowance rate of 84.0% places them in the 59% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by JEFFERSON, QUOVAUNDA receive 2.53 office actions before reaching final disposition. This places the examiner in the 74% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by JEFFERSON, QUOVAUNDA is 29 months. This places the examiner in the 66% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +5.2% benefit to allowance rate for applications examined by JEFFERSON, QUOVAUNDA. This interview benefit is in the 30% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 27.3% of applications are subsequently allowed. This success rate is in the 47% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 38.3% of cases where such amendments are filed. This entry rate is in the 58% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 66.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 56% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 85.0% of appeals filed. This is in the 78% percentile among all examiners. Of these withdrawals, 47.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 52.9% are granted (fully or in part). This grant rate is in the 53% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.2% of allowed cases (in the 51% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 5.1% of allowed cases (in the 81% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.