Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19232184 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS | June 2025 | March 2026 | Allow | 9 | 0 | 0 | No | No |
| 19004133 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS | December 2024 | June 2025 | Allow | 5 | 0 | 0 | No | No |
| 18772247 | PACKAGE STRUCTURES | July 2024 | July 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18771052 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | July 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18738707 | METHODS OF REDUCING PARASITIC CAPACITANCE IN SEMICONDUTOR DEVICES | June 2024 | July 2025 | Allow | 14 | 1 | 0 | No | No |
| 18736766 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18668941 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18643474 | INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME | April 2024 | April 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18631900 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME | April 2024 | February 2025 | Allow | 10 | 0 | 0 | No | No |
| 18626594 | SEMICONDUCTOR DEVICE | April 2024 | June 2024 | Allow | 2 | 0 | 0 | No | No |
| 18615151 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | March 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18614499 | OLED PANEL LOWER PART PROTECTION FILM, AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS COMPRISING SAME | March 2024 | December 2024 | Allow | 9 | 0 | 0 | No | No |
| 18593775 | HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES | March 2024 | July 2025 | Allow | 17 | 1 | 0 | No | No |
| 18438158 | UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | February 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18429471 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | February 2024 | April 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18402755 | APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME | January 2024 | November 2025 | Allow | 22 | 2 | 1 | No | No |
| 18396302 | SEMICONDUCTOR DEVICE HAVING SUPPORTER PATTERN | December 2023 | September 2024 | Allow | 9 | 1 | 0 | No | No |
| 18544747 | INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CONTACT WITH A HIGH VOLTAGE BONDING PAD AND METHOD OF MAKING | December 2023 | July 2025 | Allow | 19 | 2 | 0 | No | No |
| 18567143 | DISPLAY PANEL AND DISPLAY DEVICE | December 2023 | March 2026 | Allow | 27 | 0 | 0 | No | No |
| 18520996 | Source/Drain Metal Contact and Formation Thereof | November 2023 | June 2025 | Allow | 18 | 1 | 0 | No | No |
| 18516969 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | November 2023 | January 2026 | Allow | 26 | 2 | 1 | Yes | No |
| 18513167 | Asymmetric Stackup Structure for SoC Package Substrates | November 2023 | February 2025 | Allow | 15 | 1 | 0 | No | No |
| 18509801 | Seal Ring Designs Supporting Efficient Die to Die Routing | November 2023 | May 2025 | Allow | 18 | 1 | 0 | No | No |
| 18508807 | SEMICONDUCTOR PACKAGE | November 2023 | April 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18386345 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND | November 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18497691 | DIE WITH METAL PILLARS | October 2023 | March 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18488627 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | October 2023 | March 2026 | Allow | 29 | 0 | 0 | No | No |
| 18488990 | METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN QFN PACKAGES | October 2023 | November 2024 | Allow | 13 | 0 | 0 | No | No |
| 18380404 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | October 2023 | October 2024 | Allow | 12 | 1 | 0 | No | No |
| 18485291 | SEMICONDUCTOR DEVICE | October 2023 | July 2025 | Allow | 21 | 2 | 0 | No | No |
| 18483977 | METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER | October 2023 | June 2024 | Allow | 9 | 0 | 0 | No | No |
| 18474234 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | September 2023 | January 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18449253 | METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE | August 2023 | January 2026 | Allow | 29 | 0 | 1 | No | No |
| 18447968 | Storage Layers For Wafer Bonding | August 2023 | January 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18447467 | CIRCUIT DEVICES WITH GATE SEALS | August 2023 | April 2025 | Allow | 20 | 2 | 0 | No | No |
| 18366844 | BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STRUCTURES THROUGH TRENCH IN SUBSTRATE | August 2023 | February 2025 | Allow | 18 | 1 | 0 | No | No |
| 18228907 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS | August 2023 | December 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18363458 | Semiconductor Package and Methods of Forming the Same | August 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18363731 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | August 2023 | November 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18360169 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18225286 | Grain Structure Engineering for Metal Gapfill Materials | July 2023 | December 2025 | Allow | 29 | 0 | 0 | No | No |
| 18357421 | Supporting InFO Packages to Reduce Warpage | July 2023 | March 2025 | Allow | 20 | 2 | 0 | Yes | No |
| 18357500 | Partial Barrier Free Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof | July 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18356843 | Protection Structures for Bonded Wafers | July 2023 | November 2024 | Allow | 15 | 1 | 0 | No | No |
| 18217898 | VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS | July 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18346573 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH PROTECTION LAYER AND METHOD FOR FORMING THE SAME | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18213759 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | June 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18209173 | THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME | June 2023 | October 2024 | Allow | 16 | 1 | 0 | No | No |
| 18329347 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUCTURES | June 2023 | November 2024 | Allow | 18 | 1 | 0 | No | No |
| 18326554 | SEMICONDUCTOR PACKAGE | May 2023 | March 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18321439 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | May 2023 | August 2024 | Allow | 15 | 1 | 0 | No | No |
| 18197800 | Semiconductor Package and Method for Fabricating a Semiconductor Package | May 2023 | September 2024 | Allow | 16 | 1 | 0 | No | No |
| 18141519 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | May 2023 | March 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18309218 | THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES | April 2023 | February 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18140960 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME | April 2023 | November 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 18138110 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS | April 2023 | June 2023 | Allow | 2 | 0 | 0 | No | No |
| 18302884 | PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME | April 2023 | February 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18303345 | INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING | April 2023 | March 2025 | Allow | 23 | 2 | 0 | No | No |
| 18301374 | SEMICONDUCTOR PACKAGE | April 2023 | February 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18249351 | METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR COMPONENT | April 2023 | November 2025 | Allow | 31 | 1 | 0 | No | No |
| 18135035 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | April 2023 | February 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18132500 | Differential Sensing With Biofet Sensors | April 2023 | February 2025 | Allow | 22 | 1 | 1 | No | No |
| 18127206 | STRESS LAYOUT OPTIMIZATION FOR DEVICE PERFORMANCE | March 2023 | February 2025 | Allow | 23 | 2 | 0 | Yes | No |
| 18190206 | COMPENSATION METHOD FOR WAFER BONDING | March 2023 | February 2026 | Allow | 34 | 2 | 0 | No | No |
| 18188621 | DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND METHODS FOR PERFORMING THE SAME | March 2023 | August 2025 | Allow | 29 | 0 | 1 | No | No |
| 18123967 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE | March 2023 | August 2025 | Allow | 29 | 3 | 0 | Yes | No |
| 18043731 | ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | March 2023 | February 2026 | Allow | 36 | 1 | 0 | No | No |
| 18170270 | PIXEL CIRCUIT AND METHOD OF OPERATING THE SAME IN AN ALWAYS-ON MODE | February 2023 | October 2024 | Allow | 20 | 1 | 0 | No | No |
| 18108984 | Module with Gas Flow-Inhibiting Sealing at Module Interface to Mounting Base | February 2023 | June 2025 | Allow | 28 | 3 | 0 | No | No |
| 18106883 | BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES | February 2023 | July 2025 | Allow | 29 | 0 | 0 | No | No |
| 18099777 | Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines | January 2023 | July 2024 | Allow | 18 | 1 | 0 | No | No |
| 18153847 | Packaged Semiconductor Device and Method of Forming Thereof | January 2023 | September 2024 | Allow | 21 | 1 | 0 | No | No |
| 18151663 | Adding Sealing Material to Wafer edge for Wafer Bonding | January 2023 | September 2025 | Allow | 32 | 0 | 1 | No | No |
| 18151622 | PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME | January 2023 | June 2024 | Allow | 17 | 1 | 0 | No | No |
| 18092253 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS | December 2022 | April 2023 | Allow | 3 | 0 | 0 | No | No |
| 18085746 | SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR CHIP, AND METHOD OF FORMING A CHIP SYSTEM | December 2022 | January 2026 | Allow | 37 | 2 | 0 | No | No |
| 18081047 | NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT | December 2022 | May 2024 | Allow | 17 | 0 | 0 | No | No |
| 18064641 | SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR | December 2022 | September 2024 | Allow | 21 | 1 | 0 | No | No |
| 18064624 | Fan-Out Wafer Level Package Structure | December 2022 | August 2024 | Allow | 20 | 1 | 0 | No | No |
| 18076364 | INTEGRATED MECHANICAL AIDS FOR HIGH ACCURACY ALIGNABLE-ELECTRICAL CONTACTS | December 2022 | June 2024 | Allow | 18 | 2 | 0 | No | No |
| 18076210 | VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE A SUBSTRATE | December 2022 | December 2025 | Allow | 37 | 1 | 1 | Yes | No |
| 18054172 | SEMICONDUCTOR DEVICE | November 2022 | April 2024 | Allow | 17 | 0 | 0 | No | No |
| 17982524 | PIXEL DEVICE FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME | November 2022 | February 2026 | Allow | 40 | 3 | 0 | Yes | No |
| 17980571 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | November 2022 | September 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17971321 | INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE INTERPOSER | October 2022 | September 2024 | Allow | 23 | 2 | 0 | No | No |
| 18048513 | Solder Ball Application for Singular Die | October 2022 | March 2024 | Allow | 17 | 1 | 0 | No | No |
| 17970964 | MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER | October 2022 | December 2025 | Allow | 38 | 1 | 0 | No | No |
| 17969402 | DIODE AND BIPOLAR JUNCTION TRANSISTOR FOR 3D SFET WITH BSPDN STRUCTURE | October 2022 | February 2026 | Allow | 40 | 3 | 0 | Yes | No |
| 17918038 | SUBSTRATE BONDING METHOD | October 2022 | January 2025 | Allow | 28 | 0 | 0 | No | No |
| 17962131 | SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF PRODUCING THE SEMICONDUCTOR DIE | October 2022 | July 2025 | Allow | 33 | 0 | 0 | No | No |
| 17938135 | Stacked Integrated Circuit Device | October 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 17959585 | CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES | October 2022 | November 2024 | Allow | 26 | 1 | 0 | No | No |
| 17957926 | INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME | September 2022 | January 2026 | Allow | 39 | 1 | 1 | Yes | No |
| 17952925 | SEMICONDUCTOR PACKAGE HAVING IMPROVED HEAT DISSIPATION CHARACTERISTICS | September 2022 | July 2025 | Allow | 33 | 0 | 0 | No | No |
| 17951523 | DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE MOUNT DEVICES | September 2022 | February 2026 | Allow | 41 | 1 | 1 | No | No |
| 17934346 | Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding | September 2022 | July 2025 | Allow | 34 | 1 | 0 | No | No |
| 17946883 | STACKED SEMICONDUCTOR METHOD AND APPARATUS | September 2022 | November 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17931796 | MANUFACTURING METHOD OF SEMICONDUCTOR CHIP | September 2022 | May 2025 | Allow | 32 | 0 | 0 | No | No |
| 17899541 | Semiconductor Device with a Nickel Comprising Layer and Method for Fabricating the Same | August 2022 | March 2025 | Allow | 30 | 0 | 1 | No | No |
| 17898421 | METHOD FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS | August 2022 | December 2022 | Allow | 3 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner JEAN BAPTISTE, WILNER.
With a 66.7% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 34.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner JEAN BAPTISTE, WILNER works in Art Unit 2899 and has examined 564 patent applications in our dataset. With an allowance rate of 93.8%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 23 months.
Examiner JEAN BAPTISTE, WILNER's allowance rate of 93.8% places them in the 81% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by JEAN BAPTISTE, WILNER receive 1.60 office actions before reaching final disposition. This places the examiner in the 31% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by JEAN BAPTISTE, WILNER is 23 months. This places the examiner in the 87% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a -3.4% benefit to allowance rate for applications examined by JEAN BAPTISTE, WILNER. This interview benefit is in the 7% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 29.2% of applications are subsequently allowed. This success rate is in the 55% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 33.5% of cases where such amendments are filed. This entry rate is in the 50% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 130.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 84% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 80.6% of appeals filed. This is in the 74% percentile among all examiners. Of these withdrawals, 52.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 20.7% are granted (fully or in part). This grant rate is in the 11% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.7% of allowed cases (in the 64% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 1.9% of allowed cases (in the 67% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.