Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19308943 | SEMICONDUCTOR DEVICE STRUCTURE WITH EFFICIENT HEAT-REMOVAL STRUCTURES ACROSS THE CHIP AND MONOLITHIC FABRICATION METHOD THEREFOR | August 2025 | February 2026 | Allow | 6 | 1 | 0 | No | No |
| 18954308 | EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAME | November 2024 | May 2025 | Allow | 6 | 1 | 0 | No | No |
| 18945645 | ISOLATION STACK FOR A BIPOLAR TRANSISTOR AND RELATED METHODS | November 2024 | July 2025 | Allow | 8 | 1 | 0 | No | No |
| 18743027 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | June 2024 | October 2025 | Allow | 16 | 1 | 0 | No | No |
| 18741188 | CHIP STRUCTURE AND METHOD FOR FORMING THE SAME | June 2024 | July 2025 | Allow | 13 | 1 | 0 | No | No |
| 18672010 | SEMICONDUCTOR DEVICE | May 2024 | July 2025 | Allow | 14 | 1 | 0 | No | No |
| 18668505 | DISPLAY DEVICE HAVING A BENDING REGION | May 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18660190 | SEMICONDUCTOR DIE | May 2024 | October 2025 | Allow | 17 | 1 | 0 | No | No |
| 18655989 | REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME | May 2024 | June 2025 | Allow | 13 | 0 | 0 | No | No |
| 18648933 | SEMICONDUCTOR DEVICE | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18641836 | REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES | April 2024 | November 2025 | Allow | 19 | 1 | 0 | No | No |
| 18635274 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS | April 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18627896 | SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS | April 2024 | May 2025 | Allow | 13 | 1 | 0 | No | No |
| 18612193 | SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME | March 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18604691 | PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER | March 2024 | January 2026 | Allow | 22 | 2 | 0 | No | No |
| 18591881 | SEMICONDUCTOR PACKAGE AND METHOD | February 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18586866 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | February 2024 | September 2025 | Allow | 18 | 0 | 0 | No | No |
| 18411314 | SEMICONDUCTOR PACKAGE SYSTEM AND METHOD | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18409778 | SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY | January 2024 | August 2024 | Allow | 8 | 0 | 0 | No | No |
| 18399220 | ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES | December 2023 | September 2025 | Allow | 20 | 3 | 0 | No | No |
| 18545082 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | December 2023 | August 2024 | Allow | 8 | 0 | 0 | No | No |
| 18530286 | SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND METHODS OF FORMING THE SAME | December 2023 | April 2025 | Allow | 17 | 1 | 0 | No | No |
| 18526057 | SEMICONDUCTOR DEVICE AND METHOD | December 2023 | March 2025 | Allow | 15 | 2 | 0 | No | No |
| 18519097 | ARRAY SUBSTRATE AND DISPLAY DEVICE | November 2023 | July 2024 | Allow | 8 | 0 | 0 | No | No |
| 18513649 | INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME | November 2023 | July 2025 | Allow | 20 | 2 | 0 | No | No |
| 18491551 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | October 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18477686 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | September 2023 | December 2024 | Abandon | 15 | 1 | 0 | No | No |
| 18374595 | MICROELECTRONIC ASSEMBLIES | September 2023 | July 2024 | Allow | 9 | 0 | 0 | No | No |
| 18372533 | SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DIELECTRICS | September 2023 | August 2025 | Allow | 23 | 3 | 0 | No | No |
| 18235271 | INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME | August 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18451156 | MICROELECTRONIC ASSEMBLIES | August 2023 | December 2024 | Allow | 16 | 2 | 0 | No | No |
| 18446905 | SEMICONDUCTOR DEVICE AND METHOD | August 2023 | June 2024 | Allow | 10 | 0 | 0 | No | No |
| 18231185 | BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF MANUFACTURING THE SAME | August 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18229172 | ELECTRONIC DEVICE, PACKAGE STRUCTURE AND ELECTRONIC MANUFACTURING METHOD | August 2023 | January 2025 | Allow | 17 | 1 | 0 | No | No |
| 18358164 | THROUGH SUBSTRATE VIA LANDING ON FRONT END OF LINE STRUCTURE | July 2023 | January 2026 | Allow | 30 | 1 | 0 | No | No |
| 18226210 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18355098 | Semiconductor Device and Method of Manufacture | July 2023 | March 2025 | Allow | 20 | 1 | 0 | No | No |
| 18351414 | 3D NAND MEMORY DEVICE DEVICES AND RELATED ELECTRONIC SYSTEMS | July 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18350445 | THROUGH-SUBSTRATE-VIA IN PHOTOSENSITIVE MODULE | July 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18218673 | SEMICONDUCTOR PACKAGE | July 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18270840 | PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND METHOD FOR MANUFACTURING THE SAME | July 2023 | October 2025 | Allow | 27 | 1 | 0 | No | No |
| 18215830 | SEMICONDUCTOR PACKAGE USING SUBSTRATE BLOCK INTEGRATION | June 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18216561 | SEMICONDUCTOR PACKAGE USING SUBSTRATE BLOCK INTEGRATION | June 2023 | January 2026 | Allow | 31 | 1 | 0 | No | No |
| 18338095 | REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18334693 | SEMICONDUCTOR DEVICE | June 2023 | February 2024 | Allow | 8 | 0 | 0 | No | No |
| 18331241 | FeFET OF 3D STRUCTURE FOR CAPACITANCE MATCHING | June 2023 | June 2024 | Allow | 13 | 0 | 0 | No | No |
| 18324744 | HYBRID BONDED INTERCONNECT BRIDGING | May 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18322566 | DISPLAY DEVICE HAVING A BENDING REGION | May 2023 | January 2024 | Allow | 8 | 0 | 0 | No | No |
| 18308648 | THREE-DIMENSIONAL FUNCTIONAL INTEGRATION | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18308433 | SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICATING THE SAME | April 2023 | March 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18300045 | INTERCONNECT STRUCTURE FOR ADVANCED PACKAGING AND METHOD FOR THE SAME | April 2023 | December 2025 | Allow | 33 | 1 | 0 | No | No |
| 18132571 | FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF | April 2023 | December 2025 | Allow | 33 | 1 | 0 | No | No |
| 18296793 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2023 | February 2025 | Allow | 23 | 0 | 0 | No | No |
| 18129120 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | March 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18027074 | THREE-DIMENSIONAL STACKED PROCESSING SYSTEMS | March 2023 | December 2025 | Allow | 33 | 1 | 0 | No | No |
| 18120587 | SEMICONDUCTOR PACKAGE | March 2023 | February 2024 | Allow | 12 | 1 | 0 | No | No |
| 18182246 | SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY | March 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18119397 | SEMICONDUCTOR PACKAGE | March 2023 | November 2023 | Allow | 8 | 0 | 0 | No | No |
| 18119270 | PACKAGE STRUCTURE | March 2023 | January 2026 | Allow | 34 | 1 | 0 | No | No |
| 18174784 | SEMICONDUCTOR PACKAGE AND METHOD | February 2023 | November 2023 | Allow | 9 | 0 | 0 | No | No |
| 18171428 | PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE | February 2023 | January 2026 | Allow | 35 | 1 | 0 | No | No |
| 18170857 | SEMICONDUCTOR PACKAGES HAVING VIAS | February 2023 | December 2023 | Allow | 10 | 0 | 0 | No | No |
| 18169976 | ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT | February 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18169161 | SEMICONDUCTOR PACKAGES | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18109337 | FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18167095 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | February 2023 | January 2026 | Allow | 35 | 1 | 0 | No | No |
| 18107800 | Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component | February 2023 | May 2024 | Allow | 16 | 2 | 0 | No | No |
| 18166960 | Redistribution Layers And Methods Of Fabricating The Same In Semiconductor Devices | February 2023 | December 2023 | Allow | 10 | 1 | 0 | No | No |
| 18159132 | METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT | January 2023 | August 2023 | Allow | 6 | 0 | 0 | No | No |
| 18156848 | 3DIC STRUCTURE AND METHODS OF FORMING | January 2023 | January 2024 | Allow | 12 | 1 | 0 | No | No |
| 18154615 | SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME | January 2023 | October 2024 | Allow | 21 | 1 | 0 | No | No |
| 18094794 | SEMICONDUCTOR PACKAGE | January 2023 | August 2023 | Allow | 7 | 0 | 0 | No | No |
| 18151545 | INTEGRATED CIRCUIT PACKAGES AND METHODS | January 2023 | December 2025 | Allow | 35 | 1 | 0 | No | No |
| 18069318 | SEMICONDUCTOR PACKAGE | December 2022 | November 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 18085397 | FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME | December 2022 | June 2023 | Allow | 6 | 0 | 0 | No | No |
| 18066487 | INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | December 2022 | August 2023 | Allow | 8 | 0 | 0 | No | No |
| 18078096 | STACKED SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | December 2022 | January 2026 | Allow | 37 | 1 | 0 | No | No |
| 18063413 | SEMICONDUCTOR PACKAGE | December 2022 | August 2025 | Allow | 32 | 1 | 0 | No | No |
| 18076529 | SEMICONDUCTOR DEVICE | December 2022 | June 2023 | Allow | 7 | 0 | 0 | No | No |
| 18063029 | APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP | December 2022 | April 2024 | Allow | 16 | 2 | 0 | Yes | No |
| 18060574 | STRUCTURE AND PROCESS FOR WARPAGE REDUCTION | December 2022 | December 2025 | Allow | 36 | 1 | 0 | Yes | No |
| 17993638 | CHIP SCALE PACKAGE | November 2022 | November 2023 | Allow | 11 | 2 | 0 | No | No |
| 18056564 | DOUBLE-SIDED LAMINATE PACKAGE WITH 3D INTERCONNECTION STRUCTURE | November 2022 | January 2026 | Allow | 38 | 1 | 0 | No | No |
| 17987132 | SEMICONDUCTOR DEVICE | November 2022 | March 2026 | Allow | 40 | 1 | 1 | Yes | No |
| 17986995 | SEMICONDUCTOR PACKAGE | November 2022 | December 2025 | Allow | 37 | 1 | 1 | No | No |
| 17980914 | Integrated Circuit Package and Method | November 2022 | November 2023 | Allow | 13 | 1 | 0 | No | No |
| 17975054 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | October 2022 | March 2026 | Allow | 41 | 2 | 0 | No | No |
| 17964583 | REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES | October 2022 | December 2025 | Allow | 38 | 1 | 0 | No | No |
| 17959352 | SEMICONDUCTOR PACKAGE | October 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 17960057 | SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DIELECTRICS | October 2022 | July 2023 | Allow | 9 | 1 | 0 | No | No |
| 17936037 | Semiconductor Device and Method of Stacking Hybrid Substrates with Embedded Electric Components | September 2022 | August 2025 | Allow | 35 | 1 | 1 | No | No |
| 17935613 | SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR | September 2022 | December 2025 | Allow | 38 | 1 | 0 | No | No |
| 17949460 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | September 2022 | July 2023 | Allow | 9 | 0 | 0 | No | No |
| 17823461 | FABRICATING AN ELECTROCONDUCTIVE CONTACT ON A TOP LAYER OF A TUNNELING MAGNETORESISTANCE ELEMENT USING TWO HARD MASKS | August 2022 | February 2025 | Allow | 30 | 0 | 0 | No | No |
| 17898398 | PRINT-READY WAFERS WITH BOTTOM-ANCHORED COMPONENTS | August 2022 | February 2026 | Allow | 41 | 1 | 0 | No | No |
| 17897206 | PACKAGE STRUCTURE | August 2022 | January 2026 | Allow | 41 | 2 | 0 | No | No |
| 17817478 | SEMICONDUCTOR DEVICE | August 2022 | March 2023 | Allow | 7 | 0 | 0 | No | No |
| 17875644 | Interfacial Layer Between Fin and Source/Drain Region | July 2022 | March 2023 | Allow | 8 | 0 | 0 | No | No |
| 17815515 | Semiconductor Device and Method of Manufacture | July 2022 | June 2023 | Allow | 10 | 0 | 0 | No | No |
| 17872028 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | July 2022 | March 2024 | Allow | 20 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner HARRISTON, WILLIAM A.
With a 60.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 33.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner HARRISTON, WILLIAM A works in Art Unit 2899 and has examined 824 patent applications in our dataset. With an allowance rate of 93.1%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 19 months.
Examiner HARRISTON, WILLIAM A's allowance rate of 93.1% places them in the 80% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by HARRISTON, WILLIAM A receive 1.52 office actions before reaching final disposition. This places the examiner in the 27% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by HARRISTON, WILLIAM A is 19 months. This places the examiner in the 95% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a -1.1% benefit to allowance rate for applications examined by HARRISTON, WILLIAM A. This interview benefit is in the 10% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 31.2% of applications are subsequently allowed. This success rate is in the 64% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 54.6% of cases where such amendments are filed. This entry rate is in the 81% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 40.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 37% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 64.3% of appeals filed. This is in the 44% percentile among all examiners. Of these withdrawals, 44.4% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 37.8% are granted (fully or in part). This grant rate is in the 26% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.5% of allowed cases (in the 60% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.3% of allowed cases (in the 52% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.