USPTO Examiner GUMEDZOE PENIEL M - Art Unit 2899

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
18997405METHOD FOR CHIP PACKAGING WITH HIGH-DENSITY CONNECTION LAYER, AND CHIP PACKAGING STRUCTUREJanuary 2025August 2025Allow710NoNo
19004392SUBSTRATE AND MANUFACTURING METHOD THEREOFDecember 2024October 2025Allow910NoNo
18991037COLD PLATE AND MANIFOLD INTEGRATION FOR HIGH RELIABILITYDecember 2024May 2025Allow510NoNo
18967029SYSTEMS AND METHODS FOR COOLING ELECTRONIC CIRCUITSDecember 2024May 2025Allow510NoNo
18861583METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICEOctober 2024July 2025Allow910NoNo
18907770LATERALLY-DIFFUSED METAL-OXIDE-SEMICONDUCTOR DEVICES WITH A FIELD PLATEOctober 2024February 2025Allow411NoNo
18821747LEAD FRAME AND METHOD FOR STACKING DISCRETE COMPONENTS TO BE EMBEDDED IN SEMICONDUCTOR DEVICEAugust 2024November 2024Allow200NoNo
18793277OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE INTEGRATED CHIP-SIZE DOUBLE-LAYER OR MULTI-LAYER MICROCHANNELSAugust 2024January 2025Allow500NoNo
18758069HIGH-VOLTAGE SEMICONDUCTOR DEVICE STRUCTURESJune 2024October 2024Allow310NoNo
18626592SEMICONDUCTOR DEVICEApril 2024September 2024Allow610NoNo
18626579SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGEApril 2024June 2025Allow1410YesNo
18622153POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLDMarch 2024February 2025Allow1020NoNo
18618843FILM COVERS FOR SENSOR PACKAGESMarch 2024November 2025Allow1930NoNo
18610102DISPLAY DEVICE WITH BLOCK MEMBERSMarch 2024March 2025Allow1220NoNo
18598856IMAGE SENSOR INCLUDING CONTROL ELECTRODE, TRANSPARENT ELECTRODE, AND CONNECTION LAYER ELECTRICALLY CONNECTING CONTROL ELECTRODE TO SIDE SURFACE OF TRANSPARENT ELECTRODEMarch 2024April 2025Allow1310NoNo
18596649DISPLAY PANEL AND DISPLAY APPARATUSMarch 2024September 2024Allow700NoNo
185966733D Cooling Block for Heat Dissipation in Electronic DevicesMarch 2024May 2024Allow200NoNo
18596399SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGEMarch 2024January 2025Allow1110NoNo
18592693ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACKMarch 2024January 2025Allow1010NoNo
18440381Structures With Deformable ConductorsFebruary 2024August 2024Allow700NoNo
18438916SERIES INDUCTORSFebruary 2024February 2025Allow1220YesNo
18435362Integrated Circuit Package and MethodFebruary 2024December 2024Allow1010NoNo
18432852SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STANCHIONFebruary 2024February 2025Allow1320NoNo
18422759Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP ModuleJanuary 2024June 2025Allow1621NoNo
18411930PACKAGE STRUCTURES AND METHOD OF FORMING THE SAMEJanuary 2024June 2025Allow1720NoNo
18400219THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITSDecember 2023November 2025Allow2240NoNo
18395351IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTSDecember 2023December 2024Allow1210NoNo
18531711POWER SUPPLY SYSTEM AND POWER SUPPLY MODULEDecember 2023August 2024Allow900NoNo
18532652SEMICONDUCTOR DEVICEDecember 2023March 2026Allow2700NoNo
18522582ELECTRONIC DEVICE WITH REDUCED NON-DEVICE EDGE AREANovember 2023June 2025Allow1920NoNo
18519516SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAMENovember 2023December 2025Allow2410YesNo
18510599SEMICONDUCTOR DEVICENovember 2023June 2025Allow1930NoNo
18504332SEMICONDUCTOR DEVICENovember 2023March 2026Allow2800NoNo
18499527SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOFNovember 2023May 2024Allow700NoNo
18494784PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFOctober 2023June 2024Allow700NoNo
18491223POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLDOctober 2023January 2024Allow310NoNo
18375867MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIASOctober 2023August 2024Allow1010NoNo
18553210POWER SEMICONDUCTOR PACKAGESeptember 2023December 2025Allow2700NoNo
18284751SEMICONDUCTOR MODULE ASSEMBLY HAVING A COOLING BODY AND AT LEAST ONE SEMICONDUCTOR MODULESeptember 2023January 2024Allow400NoNo
18468933IMAGING DEVICE AND IMAGING SYSTEMSeptember 2023March 2025Abandon1810NoNo
18468376DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAMESeptember 2023December 2025Allow2700NoNo
18244909ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAMESeptember 2023December 2024Allow1520NoNo
18460091DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATINGSeptember 2023March 2024Allow710NoNo
18460070Electronic Package Construction for Immersion Cooling of Integrated CircuitsSeptember 2023January 2025Abandon1621NoNo
18239514SYSTEMS FOR THERMAL MANAGEMENT AND METHODS THEREOFAugust 2023January 2025Abandon1610NoNo
18236542DISPLAY DEVICEAugust 2023February 2026Allow3000NoNo
18452515ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND FABRICATION METHOD THEREOFAugust 2023March 2024Allow700NoNo
18448323ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOFAugust 2023February 2026Allow3010NoNo
18446166ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAMEAugust 2023September 2024Allow1320NoNo
18230975METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICEAugust 2023July 2024Allow1110NoNo
18362320CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICEJuly 2023November 2024Allow1620YesNo
18360265INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILSJuly 2023March 2024Allow800NoNo
18354668METHOD FOR FABRICATING SEMICONDUCTOR PACKAGEJuly 2023June 2024Allow1110NoNo
18354655HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICEJuly 2023October 2025Allow2700NoNo
18355212Dummy Patterns in Redundant Region of Double Seal RingJuly 2023February 2025Allow1920NoNo
18223221ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAMEJuly 2023June 2024Allow1110NoNo
18354632MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAMEJuly 2023June 2025Allow2331NoNo
18020634SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICEJuly 2023October 2025Allow3200NoNo
18219422ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERSJuly 2023June 2024Allow1110NoNo
18344965SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOFJune 2023June 2024Allow1210NoNo
18344314METHOD FOR MANUFACTURING SEMICONDUCTOR MODULEJune 2023February 2026Allow3210NoNo
18215744MODULE HAVING A MOULDED PLASTIC BODY AND A MULTIPLICITY OF LOAD TERMINAL ELEMENTS AND POWER SEMICONDUCTOR DEVICE THEREWITHJune 2023September 2023Allow200NoNo
18343232SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHODJune 2023February 2026Allow3110NoNo
18342449SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEJune 2023March 2025Allow2120NoNo
18342149SEMICONDUCTOR PACKAGE STRUCTUREJune 2023January 2026Allow3110NoNo
18214141OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE INTEGRATED CHIP-SIZE DOUBLE-LAYER OR MULTI-LAYER MICROCHANNELSJune 2023May 2024Allow1020NoNo
18209470ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKAGING METHODJune 2023December 2025Allow3110NoNo
18257067SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEJune 2023March 2026Allow3310NoNo
18328387High Efficiency Heat Dissipation Using Thermal Interface Material FilmJune 2023May 2024Allow1210NoNo
18327446SEMICONDUCTOR STORAGE DEVICEJune 2023December 2025Allow3110NoNo
18327615Boiler Enhancement Coatings with Active Boiling ManagementJune 2023October 2023Allow520YesNo
18255248Electronic Package and Device Comprising the SameMay 2023March 2026Allow3400NoNo
18325805Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive DevicesMay 2023September 2025Allow2811NoNo
18318844SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR FORMING THE SAMEMay 2023August 2024Allow1520NoNo
18253382SUBSTRATE STRUCTURE, MANUFACTURING METHOD THEREFOR, LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFORMay 2023December 2025Allow3110NoNo
18197655DISPLAY APPARATUSMay 2023February 2024Allow900NoNo
18313809DISPLAY APPARATUSMay 2023November 2024Allow1820NoNo
18309149SEMICONDUCTOR PACKAGEApril 2023October 2025Allow3010YesNo
18307114PACKAGE STRUCTUREApril 2023April 2024Allow1210NoNo
18307775SEMICONDUCTOR DEVICEApril 2023August 2024Allow1520NoNo
18302452SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAMEApril 2023June 2024Allow1411NoNo
18302223METHOD FOR FORMING PACKAGE STRUCTUREApril 2023August 2024Allow1610NoNo
18301564SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGEApril 2023January 2024Allow900NoNo
18300576SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENTApril 2023April 2024Allow1210NoNo
18299293FILM COVERS FOR SENSOR PACKAGESApril 2023December 2023Allow800NoNo
18297927Integrated Circuit Package and MethodApril 2023November 2023Allow700NoNo
18297897Fan-Out Structure and Method of Fabricating the SameApril 2023February 2024Allow1110NoNo
18295111SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND MODULEApril 2023December 2024Allow2020NoNo
18194236Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener RingMarch 2023November 2024Allow2030NoNo
18187662SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAMEMarch 2023February 2024Allow1110YesNo
18185160SEMICONDUCTOR ASSEMBLY HAVING DUAL CONDUCTION CHANNELS FOR ELECTRICITY AND HEAT PASSAGEMarch 2023December 2025Allow3310NoNo
18184436SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLESMarch 2023November 2025Allow3210YesNo
18026270Power Semiconductor DeviceMarch 2023August 2025Allow2900NoNo
18024389SILICON-BASED FAN OUT PACKAGE STRUCTURE AND PREPARATION METHOD THEREFORMarch 2023September 2025Allow3010NoNo
18114358SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAMEFebruary 2023January 2024Allow1110YesNo
18114420Structures With Deformable ConductorsFebruary 2023September 2023Allow700NoNo
18023024SEMICONDUCTOR MODULE WITH A DEPRESSIONFebruary 2023February 2024Abandon1220NoNo
18113585THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICEFebruary 2023September 2025Allow3110YesNo
18172208CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGSFebruary 2023September 2023Allow700NoNo
18171686POWER SUPPLY SYSTEMFebruary 2023September 2023Allow700NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner GUMEDZOE, PENIEL M.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
9
Examiner Affirmed
7
(77.8%)
Examiner Reversed
2
(22.2%)
Reversal Percentile
35.6%
Lower than average

What This Means

With a 22.2% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
22
Allowed After Appeal Filing
8
(36.4%)
Not Allowed After Appeal Filing
14
(63.6%)
Filing Benefit Percentile
59.7%
Higher than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 36.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.

Strategic Recommendations

Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Examiner GUMEDZOE, PENIEL M - Prosecution Strategy Guide

Executive Summary

Examiner GUMEDZOE, PENIEL M works in Art Unit 2899 and has examined 954 patent applications in our dataset. With an allowance rate of 89.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 19 months.

Allowance Patterns

Examiner GUMEDZOE, PENIEL M's allowance rate of 89.0% places them in the 70% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.

Office Action Patterns

On average, applications examined by GUMEDZOE, PENIEL M receive 1.63 office actions before reaching final disposition. This places the examiner in the 32% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by GUMEDZOE, PENIEL M is 19 months. This places the examiner in the 95% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a +7.6% benefit to allowance rate for applications examined by GUMEDZOE, PENIEL M. This interview benefit is in the 37% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 28.7% of applications are subsequently allowed. This success rate is in the 53% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 47.1% of cases where such amendments are filed. This entry rate is in the 71% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 111.1% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 80% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 60.9% of appeals filed. This is in the 38% percentile among all examiners. Of these withdrawals, 57.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.

Petition Practice

When applicants file petitions regarding this examiner's actions, 58.3% are granted (fully or in part). This grant rate is in the 61% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 0.3% of allowed cases (in the 56% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).

Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.7% of allowed cases (in the 58% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • Request pre-appeal conferences: PACs are highly effective with this examiner. Before filing a full appeal brief, request a PAC to potentially resolve issues without full PTAB review.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.