Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18997405 | METHOD FOR CHIP PACKAGING WITH HIGH-DENSITY CONNECTION LAYER, AND CHIP PACKAGING STRUCTURE | January 2025 | August 2025 | Allow | 7 | 1 | 0 | No | No |
| 19004392 | SUBSTRATE AND MANUFACTURING METHOD THEREOF | December 2024 | October 2025 | Allow | 9 | 1 | 0 | No | No |
| 18991037 | COLD PLATE AND MANIFOLD INTEGRATION FOR HIGH RELIABILITY | December 2024 | May 2025 | Allow | 5 | 1 | 0 | No | No |
| 18967029 | SYSTEMS AND METHODS FOR COOLING ELECTRONIC CIRCUITS | December 2024 | May 2025 | Allow | 5 | 1 | 0 | No | No |
| 18861583 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | October 2024 | July 2025 | Allow | 9 | 1 | 0 | No | No |
| 18907770 | LATERALLY-DIFFUSED METAL-OXIDE-SEMICONDUCTOR DEVICES WITH A FIELD PLATE | October 2024 | February 2025 | Allow | 4 | 1 | 1 | No | No |
| 18821747 | LEAD FRAME AND METHOD FOR STACKING DISCRETE COMPONENTS TO BE EMBEDDED IN SEMICONDUCTOR DEVICE | August 2024 | November 2024 | Allow | 2 | 0 | 0 | No | No |
| 18793277 | OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE INTEGRATED CHIP-SIZE DOUBLE-LAYER OR MULTI-LAYER MICROCHANNELS | August 2024 | January 2025 | Allow | 5 | 0 | 0 | No | No |
| 18758069 | HIGH-VOLTAGE SEMICONDUCTOR DEVICE STRUCTURES | June 2024 | October 2024 | Allow | 3 | 1 | 0 | No | No |
| 18626592 | SEMICONDUCTOR DEVICE | April 2024 | September 2024 | Allow | 6 | 1 | 0 | No | No |
| 18626579 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | April 2024 | June 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18622153 | POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD | March 2024 | February 2025 | Allow | 10 | 2 | 0 | No | No |
| 18618843 | FILM COVERS FOR SENSOR PACKAGES | March 2024 | November 2025 | Allow | 19 | 3 | 0 | No | No |
| 18610102 | DISPLAY DEVICE WITH BLOCK MEMBERS | March 2024 | March 2025 | Allow | 12 | 2 | 0 | No | No |
| 18598856 | IMAGE SENSOR INCLUDING CONTROL ELECTRODE, TRANSPARENT ELECTRODE, AND CONNECTION LAYER ELECTRICALLY CONNECTING CONTROL ELECTRODE TO SIDE SURFACE OF TRANSPARENT ELECTRODE | March 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18596649 | DISPLAY PANEL AND DISPLAY APPARATUS | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18596673 | 3D Cooling Block for Heat Dissipation in Electronic Devices | March 2024 | May 2024 | Allow | 2 | 0 | 0 | No | No |
| 18596399 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | March 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18592693 | ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18440381 | Structures With Deformable Conductors | February 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18438916 | SERIES INDUCTORS | February 2024 | February 2025 | Allow | 12 | 2 | 0 | Yes | No |
| 18435362 | Integrated Circuit Package and Method | February 2024 | December 2024 | Allow | 10 | 1 | 0 | No | No |
| 18432852 | SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STANCHION | February 2024 | February 2025 | Allow | 13 | 2 | 0 | No | No |
| 18422759 | Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module | January 2024 | June 2025 | Allow | 16 | 2 | 1 | No | No |
| 18411930 | PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME | January 2024 | June 2025 | Allow | 17 | 2 | 0 | No | No |
| 18400219 | THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS | December 2023 | November 2025 | Allow | 22 | 4 | 0 | No | No |
| 18395351 | IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18531711 | POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE | December 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18532652 | SEMICONDUCTOR DEVICE | December 2023 | March 2026 | Allow | 27 | 0 | 0 | No | No |
| 18522582 | ELECTRONIC DEVICE WITH REDUCED NON-DEVICE EDGE AREA | November 2023 | June 2025 | Allow | 19 | 2 | 0 | No | No |
| 18519516 | SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME | November 2023 | December 2025 | Allow | 24 | 1 | 0 | Yes | No |
| 18510599 | SEMICONDUCTOR DEVICE | November 2023 | June 2025 | Allow | 19 | 3 | 0 | No | No |
| 18504332 | SEMICONDUCTOR DEVICE | November 2023 | March 2026 | Allow | 28 | 0 | 0 | No | No |
| 18499527 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF | November 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18494784 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | October 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18491223 | POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD | October 2023 | January 2024 | Allow | 3 | 1 | 0 | No | No |
| 18375867 | MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS | October 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18553210 | POWER SEMICONDUCTOR PACKAGE | September 2023 | December 2025 | Allow | 27 | 0 | 0 | No | No |
| 18284751 | SEMICONDUCTOR MODULE ASSEMBLY HAVING A COOLING BODY AND AT LEAST ONE SEMICONDUCTOR MODULE | September 2023 | January 2024 | Allow | 4 | 0 | 0 | No | No |
| 18468933 | IMAGING DEVICE AND IMAGING SYSTEM | September 2023 | March 2025 | Abandon | 18 | 1 | 0 | No | No |
| 18468376 | DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME | September 2023 | December 2025 | Allow | 27 | 0 | 0 | No | No |
| 18244909 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME | September 2023 | December 2024 | Allow | 15 | 2 | 0 | No | No |
| 18460091 | DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING | September 2023 | March 2024 | Allow | 7 | 1 | 0 | No | No |
| 18460070 | Electronic Package Construction for Immersion Cooling of Integrated Circuits | September 2023 | January 2025 | Abandon | 16 | 2 | 1 | No | No |
| 18239514 | SYSTEMS FOR THERMAL MANAGEMENT AND METHODS THEREOF | August 2023 | January 2025 | Abandon | 16 | 1 | 0 | No | No |
| 18236542 | DISPLAY DEVICE | August 2023 | February 2026 | Allow | 30 | 0 | 0 | No | No |
| 18452515 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND FABRICATION METHOD THEREOF | August 2023 | March 2024 | Allow | 7 | 0 | 0 | No | No |
| 18448323 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | August 2023 | February 2026 | Allow | 30 | 1 | 0 | No | No |
| 18446166 | ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME | August 2023 | September 2024 | Allow | 13 | 2 | 0 | No | No |
| 18230975 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18362320 | CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE | July 2023 | November 2024 | Allow | 16 | 2 | 0 | Yes | No |
| 18360265 | INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS | July 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18354668 | METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18354655 | HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE | July 2023 | October 2025 | Allow | 27 | 0 | 0 | No | No |
| 18355212 | Dummy Patterns in Redundant Region of Double Seal Ring | July 2023 | February 2025 | Allow | 19 | 2 | 0 | No | No |
| 18223221 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18354632 | MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME | July 2023 | June 2025 | Allow | 23 | 3 | 1 | No | No |
| 18020634 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE | July 2023 | October 2025 | Allow | 32 | 0 | 0 | No | No |
| 18219422 | ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18344965 | SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF | June 2023 | June 2024 | Allow | 12 | 1 | 0 | No | No |
| 18344314 | METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18215744 | MODULE HAVING A MOULDED PLASTIC BODY AND A MULTIPLICITY OF LOAD TERMINAL ELEMENTS AND POWER SEMICONDUCTOR DEVICE THEREWITH | June 2023 | September 2023 | Allow | 2 | 0 | 0 | No | No |
| 18343232 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | June 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18342449 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | June 2023 | March 2025 | Allow | 21 | 2 | 0 | No | No |
| 18342149 | SEMICONDUCTOR PACKAGE STRUCTURE | June 2023 | January 2026 | Allow | 31 | 1 | 0 | No | No |
| 18214141 | OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE INTEGRATED CHIP-SIZE DOUBLE-LAYER OR MULTI-LAYER MICROCHANNELS | June 2023 | May 2024 | Allow | 10 | 2 | 0 | No | No |
| 18209470 | ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKAGING METHOD | June 2023 | December 2025 | Allow | 31 | 1 | 0 | No | No |
| 18257067 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | June 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18328387 | High Efficiency Heat Dissipation Using Thermal Interface Material Film | June 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18327446 | SEMICONDUCTOR STORAGE DEVICE | June 2023 | December 2025 | Allow | 31 | 1 | 0 | No | No |
| 18327615 | Boiler Enhancement Coatings with Active Boiling Management | June 2023 | October 2023 | Allow | 5 | 2 | 0 | Yes | No |
| 18255248 | Electronic Package and Device Comprising the Same | May 2023 | March 2026 | Allow | 34 | 0 | 0 | No | No |
| 18325805 | Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive Devices | May 2023 | September 2025 | Allow | 28 | 1 | 1 | No | No |
| 18318844 | SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR FORMING THE SAME | May 2023 | August 2024 | Allow | 15 | 2 | 0 | No | No |
| 18253382 | SUBSTRATE STRUCTURE, MANUFACTURING METHOD THEREFOR, LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR | May 2023 | December 2025 | Allow | 31 | 1 | 0 | No | No |
| 18197655 | DISPLAY APPARATUS | May 2023 | February 2024 | Allow | 9 | 0 | 0 | No | No |
| 18313809 | DISPLAY APPARATUS | May 2023 | November 2024 | Allow | 18 | 2 | 0 | No | No |
| 18309149 | SEMICONDUCTOR PACKAGE | April 2023 | October 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 18307114 | PACKAGE STRUCTURE | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18307775 | SEMICONDUCTOR DEVICE | April 2023 | August 2024 | Allow | 15 | 2 | 0 | No | No |
| 18302452 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | April 2023 | June 2024 | Allow | 14 | 1 | 1 | No | No |
| 18302223 | METHOD FOR FORMING PACKAGE STRUCTURE | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18301564 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | April 2023 | January 2024 | Allow | 9 | 0 | 0 | No | No |
| 18300576 | SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18299293 | FILM COVERS FOR SENSOR PACKAGES | April 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18297927 | Integrated Circuit Package and Method | April 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18297897 | Fan-Out Structure and Method of Fabricating the Same | April 2023 | February 2024 | Allow | 11 | 1 | 0 | No | No |
| 18295111 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND MODULE | April 2023 | December 2024 | Allow | 20 | 2 | 0 | No | No |
| 18194236 | Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring | March 2023 | November 2024 | Allow | 20 | 3 | 0 | No | No |
| 18187662 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | March 2023 | February 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18185160 | SEMICONDUCTOR ASSEMBLY HAVING DUAL CONDUCTION CHANNELS FOR ELECTRICITY AND HEAT PASSAGE | March 2023 | December 2025 | Allow | 33 | 1 | 0 | No | No |
| 18184436 | SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES | March 2023 | November 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 18026270 | Power Semiconductor Device | March 2023 | August 2025 | Allow | 29 | 0 | 0 | No | No |
| 18024389 | SILICON-BASED FAN OUT PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR | March 2023 | September 2025 | Allow | 30 | 1 | 0 | No | No |
| 18114358 | SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME | February 2023 | January 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18114420 | Structures With Deformable Conductors | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18023024 | SEMICONDUCTOR MODULE WITH A DEPRESSION | February 2023 | February 2024 | Abandon | 12 | 2 | 0 | No | No |
| 18113585 | THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE | February 2023 | September 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 18172208 | CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18171686 | POWER SUPPLY SYSTEM | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner GUMEDZOE, PENIEL M.
With a 22.2% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 36.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner GUMEDZOE, PENIEL M works in Art Unit 2899 and has examined 954 patent applications in our dataset. With an allowance rate of 89.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 19 months.
Examiner GUMEDZOE, PENIEL M's allowance rate of 89.0% places them in the 70% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by GUMEDZOE, PENIEL M receive 1.63 office actions before reaching final disposition. This places the examiner in the 32% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by GUMEDZOE, PENIEL M is 19 months. This places the examiner in the 95% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +7.6% benefit to allowance rate for applications examined by GUMEDZOE, PENIEL M. This interview benefit is in the 37% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 28.7% of applications are subsequently allowed. This success rate is in the 53% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 47.1% of cases where such amendments are filed. This entry rate is in the 71% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 111.1% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 80% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 60.9% of appeals filed. This is in the 38% percentile among all examiners. Of these withdrawals, 57.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 58.3% are granted (fully or in part). This grant rate is in the 61% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.3% of allowed cases (in the 56% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.7% of allowed cases (in the 58% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.