Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18967029 | SYSTEMS AND METHODS FOR COOLING ELECTRONIC CIRCUITS | December 2024 | May 2025 | Allow | 5 | 1 | 0 | No | No |
| 18907770 | LATERALLY-DIFFUSED METAL-OXIDE-SEMICONDUCTOR DEVICES WITH A FIELD PLATE | October 2024 | February 2025 | Allow | 4 | 1 | 1 | No | No |
| 18821747 | LEAD FRAME AND METHOD FOR STACKING DISCRETE COMPONENTS TO BE EMBEDDED IN SEMICONDUCTOR DEVICE | August 2024 | November 2024 | Allow | 2 | 0 | 0 | No | No |
| 18793277 | OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE INTEGRATED CHIP-SIZE DOUBLE-LAYER OR MULTI-LAYER MICROCHANNELS | August 2024 | January 2025 | Allow | 5 | 0 | 0 | No | No |
| 18758069 | HIGH-VOLTAGE SEMICONDUCTOR DEVICE STRUCTURES | June 2024 | October 2024 | Allow | 3 | 1 | 0 | No | No |
| 18626579 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | April 2024 | June 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18626592 | SEMICONDUCTOR DEVICE | April 2024 | September 2024 | Allow | 6 | 1 | 0 | No | No |
| 18622153 | POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD | March 2024 | February 2025 | Allow | 10 | 2 | 0 | No | No |
| 18610102 | DISPLAY DEVICE WITH BLOCK MEMBERS | March 2024 | March 2025 | Allow | 12 | 2 | 0 | No | No |
| 18598856 | IMAGE SENSOR INCLUDING CONTROL ELECTRODE, TRANSPARENT ELECTRODE, AND CONNECTION LAYER ELECTRICALLY CONNECTING CONTROL ELECTRODE TO SIDE SURFACE OF TRANSPARENT ELECTRODE | March 2024 | April 2025 | Allow | 13 | 1 | 0 | No | No |
| 18596649 | DISPLAY PANEL AND DISPLAY APPARATUS | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18596673 | 3D Cooling Block for Heat Dissipation in Electronic Devices | March 2024 | May 2024 | Allow | 2 | 0 | 0 | No | No |
| 18596399 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | March 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18592693 | ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18440381 | Structures With Deformable Conductors | February 2024 | August 2024 | Allow | 7 | 0 | 0 | No | No |
| 18438916 | SERIES INDUCTORS | February 2024 | February 2025 | Allow | 12 | 2 | 0 | Yes | No |
| 18435362 | Integrated Circuit Package and Method | February 2024 | December 2024 | Allow | 10 | 1 | 0 | No | No |
| 18432852 | SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STANCHION | February 2024 | February 2025 | Allow | 13 | 2 | 0 | No | No |
| 18422759 | Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module | January 2024 | June 2025 | Allow | 16 | 2 | 1 | No | No |
| 18411930 | PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME | January 2024 | June 2025 | Allow | 17 | 2 | 0 | No | No |
| 18395351 | IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18531711 | POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE | December 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18522582 | ELECTRONIC DEVICE WITH REDUCED NON-DEVICE EDGE AREA | November 2023 | June 2025 | Allow | 19 | 2 | 0 | No | No |
| 18510599 | SEMICONDUCTOR DEVICE | November 2023 | June 2025 | Allow | 19 | 3 | 0 | No | No |
| 18499527 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF | November 2023 | May 2024 | Allow | 7 | 0 | 0 | No | No |
| 18494784 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | October 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18491223 | POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD | October 2023 | January 2024 | Allow | 3 | 1 | 0 | No | No |
| 18375867 | MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS | October 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18284751 | SEMICONDUCTOR MODULE ASSEMBLY HAVING A COOLING BODY AND AT LEAST ONE SEMICONDUCTOR MODULE | September 2023 | January 2024 | Allow | 4 | 0 | 0 | No | No |
| 18468933 | IMAGING DEVICE AND IMAGING SYSTEM | September 2023 | March 2025 | Abandon | 18 | 1 | 0 | No | No |
| 18244909 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME | September 2023 | December 2024 | Allow | 15 | 2 | 0 | No | No |
| 18460091 | DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING | September 2023 | March 2024 | Allow | 7 | 1 | 0 | No | No |
| 18460070 | Electronic Package Construction for Immersion Cooling of Integrated Circuits | September 2023 | January 2025 | Abandon | 16 | 2 | 1 | No | No |
| 18239514 | SYSTEMS FOR THERMAL MANAGEMENT AND METHODS THEREOF | August 2023 | January 2025 | Abandon | 16 | 1 | 0 | No | No |
| 18452515 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND FABRICATION METHOD THEREOF | August 2023 | March 2024 | Allow | 7 | 0 | 0 | No | No |
| 18446166 | ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME | August 2023 | September 2024 | Allow | 13 | 2 | 0 | No | No |
| 18230975 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | August 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18362320 | CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE | July 2023 | November 2024 | Allow | 16 | 2 | 0 | Yes | No |
| 18360265 | INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS | July 2023 | March 2024 | Allow | 8 | 0 | 0 | No | No |
| 18355212 | Dummy Patterns in Redundant Region of Double Seal Ring | July 2023 | February 2025 | Allow | 19 | 2 | 0 | No | No |
| 18354668 | METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18354632 | MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME | July 2023 | June 2025 | Allow | 23 | 3 | 1 | No | No |
| 18223221 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18219422 | ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18344965 | SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF | June 2023 | June 2024 | Allow | 12 | 1 | 0 | No | No |
| 18215744 | MODULE HAVING A MOULDED PLASTIC BODY AND A MULTIPLICITY OF LOAD TERMINAL ELEMENTS AND POWER SEMICONDUCTOR DEVICE THEREWITH | June 2023 | September 2023 | Allow | 2 | 0 | 0 | No | No |
| 18342449 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | June 2023 | March 2025 | Allow | 21 | 2 | 0 | No | No |
| 18214141 | OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE INTEGRATED CHIP-SIZE DOUBLE-LAYER OR MULTI-LAYER MICROCHANNELS | June 2023 | May 2024 | Allow | 10 | 2 | 0 | No | No |
| 18328387 | High Efficiency Heat Dissipation Using Thermal Interface Material Film | June 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18327615 | Boiler Enhancement Coatings with Active Boiling Management | June 2023 | October 2023 | Allow | 5 | 2 | 0 | Yes | No |
| 18318844 | SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR FORMING THE SAME | May 2023 | August 2024 | Allow | 15 | 2 | 0 | No | No |
| 18197655 | DISPLAY APPARATUS | May 2023 | February 2024 | Allow | 9 | 0 | 0 | No | No |
| 18313809 | DISPLAY APPARATUS | May 2023 | November 2024 | Allow | 18 | 2 | 0 | No | No |
| 18307114 | PACKAGE STRUCTURE | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18307775 | SEMICONDUCTOR DEVICE | April 2023 | August 2024 | Allow | 15 | 2 | 0 | No | No |
| 18302452 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | April 2023 | June 2024 | Allow | 14 | 1 | 1 | No | No |
| 18302223 | METHOD FOR FORMING PACKAGE STRUCTURE | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18301564 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | April 2023 | January 2024 | Allow | 9 | 0 | 0 | No | No |
| 18300576 | SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT | April 2023 | April 2024 | Allow | 12 | 1 | 0 | No | No |
| 18299293 | FILM COVERS FOR SENSOR PACKAGES | April 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18297927 | Integrated Circuit Package and Method | April 2023 | November 2023 | Allow | 7 | 0 | 0 | No | No |
| 18297897 | Fan-Out Structure and Method of Fabricating the Same | April 2023 | February 2024 | Allow | 11 | 1 | 0 | No | No |
| 18295111 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND MODULE | April 2023 | December 2024 | Allow | 20 | 2 | 0 | No | No |
| 18194236 | Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring | March 2023 | November 2024 | Allow | 20 | 3 | 0 | No | No |
| 18187662 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | March 2023 | February 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 17601712 | NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | March 2023 | June 2025 | Allow | 44 | 0 | 0 | No | No |
| 18114420 | Structures With Deformable Conductors | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18114358 | SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME | February 2023 | January 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18023024 | SEMICONDUCTOR MODULE WITH A DEPRESSION | February 2023 | February 2024 | Abandon | 12 | 2 | 0 | No | No |
| 18172208 | CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18171686 | POWER SUPPLY SYSTEM | February 2023 | September 2023 | Allow | 7 | 0 | 0 | No | No |
| 18169735 | HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION | February 2023 | December 2023 | Allow | 10 | 1 | 0 | No | No |
| 18098668 | Semiconductor devices having a serial power system | January 2023 | December 2023 | Allow | 10 | 1 | 0 | No | No |
| 18155067 | SEMICONDUCTOR DEVICE | January 2023 | August 2023 | Allow | 7 | 0 | 0 | No | No |
| 18154993 | Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module | January 2023 | November 2023 | Allow | 10 | 2 | 0 | No | No |
| 18096997 | POWER MODULE | January 2023 | July 2023 | Allow | 6 | 0 | 0 | No | No |
| 18149301 | SEMICONDUCTOR DEVICE | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18090795 | MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS | December 2022 | July 2023 | Allow | 6 | 0 | 0 | No | No |
| 18068032 | SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | December 2022 | January 2024 | Allow | 13 | 1 | 0 | No | No |
| 18080674 | PACKAGE STRUCTURE | December 2022 | August 2024 | Allow | 21 | 3 | 0 | No | No |
| 18075892 | Housing, Semiconductor Module Comprising a Housing and Method for Producing a Housing | December 2022 | April 2025 | Allow | 28 | 0 | 0 | No | No |
| 18008190 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | December 2022 | May 2025 | Allow | 30 | 0 | 0 | No | No |
| 17994494 | ELECTRO-MIGRATION BARRIER FOR INTERCONNECT | November 2022 | October 2023 | Allow | 11 | 1 | 0 | No | No |
| 17992766 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS | November 2022 | February 2024 | Allow | 15 | 1 | 0 | No | No |
| 17990645 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | November 2022 | November 2023 | Allow | 11 | 1 | 0 | No | No |
| 17925423 | POWER MODULE | November 2022 | June 2025 | Allow | 31 | 1 | 0 | No | No |
| 18053957 | SEMICONDUCTOR STRUCTURE | November 2022 | October 2023 | Allow | 11 | 1 | 0 | No | No |
| 18052456 | POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD | November 2022 | November 2023 | Allow | 12 | 1 | 0 | No | No |
| 18052017 | SUPERLATTICE STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND DEVICE INCLUDING THE SUPERLATTICE STRUCTURE | November 2022 | February 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 17965583 | HYBRID CHIP CARRIER PACKAGE | October 2022 | March 2025 | Allow | 29 | 0 | 0 | No | No |
| 17963149 | RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL | October 2022 | January 2024 | Allow | 16 | 2 | 0 | No | No |
| 17956653 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | September 2022 | June 2025 | Allow | 33 | 1 | 0 | No | No |
| 17950914 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | September 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 17906873 | SEMICONDUCTOR DEVICE | September 2022 | March 2025 | Allow | 29 | 0 | 0 | No | No |
| 17945822 | ELECTRONIC DEVICE COMPRISING A CHIP AND AT LEAST ONE SMT ELECTRONIC COMPONENT | September 2022 | April 2023 | Allow | 7 | 0 | 0 | No | No |
| 17945638 | HEAT DISSIPATING ELEMENT | September 2022 | June 2025 | Allow | 33 | 1 | 0 | No | No |
| 17944453 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | September 2022 | June 2025 | Allow | 33 | 1 | 0 | No | No |
| 17942317 | Power Semiconductor Modules | September 2022 | July 2025 | Allow | 34 | 1 | 0 | No | No |
| 17910483 | SEMICONDUCTOR DEVICE | September 2022 | July 2025 | Allow | 34 | 1 | 0 | No | No |
| 17901784 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | September 2022 | April 2025 | Allow | 32 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner GUMEDZOE, PENIEL M.
With a 22.2% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 36.4% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner GUMEDZOE, PENIEL M works in Art Unit 2899 and has examined 1,088 patent applications in our dataset. With an allowance rate of 90.0%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 19 months.
Examiner GUMEDZOE, PENIEL M's allowance rate of 90.0% places them in the 70% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by GUMEDZOE, PENIEL M receive 1.55 office actions before reaching final disposition. This places the examiner in the 39% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by GUMEDZOE, PENIEL M is 19 months. This places the examiner in the 92% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +6.9% benefit to allowance rate for applications examined by GUMEDZOE, PENIEL M. This interview benefit is in the 36% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 29.7% of applications are subsequently allowed. This success rate is in the 48% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 48.1% of cases where such amendments are filed. This entry rate is in the 67% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 111.1% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 78% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 60.9% of appeals filed. This is in the 33% percentile among all examiners. Of these withdrawals, 57.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 45.1% are granted (fully or in part). This grant rate is in the 50% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.3% of allowed cases (in the 53% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.6% of allowed cases (in the 51% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.