Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18909899 | MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE | October 2024 | September 2025 | Abandon | 11 | 2 | 0 | No | No |
| 18907840 | HIGH-VOLTAGE SEMICONDUCTOR DEVICE STRUCTURES | October 2024 | April 2025 | Allow | 6 | 1 | 0 | No | No |
| 18882721 | Power Semiconductor Apparatus and Bonding Method Thereof | September 2024 | February 2025 | Allow | 5 | 1 | 1 | No | No |
| 18824948 | SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF | September 2024 | March 2025 | Allow | 6 | 1 | 1 | Yes | No |
| 18820847 | SEMICONDUCTOR DEVICE INCLUDING METAL LINES HAVING MULTI-LAYER STRUCTURE | August 2024 | March 2026 | Allow | 19 | 5 | 1 | Yes | No |
| 18773873 | LIGHT-EMITTING DEVICE | July 2024 | October 2025 | Allow | 15 | 0 | 0 | No | No |
| 18769153 | PACKAGE STRUCTURE | July 2024 | March 2026 | Allow | 20 | 1 | 0 | No | No |
| 18748007 | METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDIATE CARRIER | June 2024 | March 2025 | Allow | 9 | 2 | 0 | No | No |
| 18742278 | INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS OF FORMING THE SAME | June 2024 | January 2026 | Allow | 19 | 1 | 0 | No | No |
| 18676343 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | May 2024 | February 2026 | Allow | 21 | 1 | 0 | No | No |
| 18661994 | Laser-Based Processing for Semiconductor Wafers | May 2024 | January 2025 | Allow | 9 | 1 | 1 | No | No |
| 18648069 | METHODS OF REDUCING CAPACITANCE IN FIELD-EFFECT TRANSISTORS | April 2024 | January 2026 | Allow | 21 | 1 | 0 | No | No |
| 18645381 | PACKAGE SUBSTRATE | April 2024 | January 2026 | Allow | 21 | 1 | 0 | No | No |
| 18642173 | BUMP STRUCTURE AND METHOD OF MAKING THE SAME | April 2024 | June 2025 | Allow | 13 | 0 | 0 | No | No |
| 18640838 | ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF | April 2024 | October 2025 | Allow | 18 | 2 | 0 | No | No |
| 18635315 | CHIPLET INTERPOSER | April 2024 | October 2025 | Allow | 18 | 1 | 0 | No | No |
| 18605947 | Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same | March 2024 | February 2026 | Allow | 23 | 3 | 0 | No | No |
| 18597222 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | March 2024 | July 2025 | Allow | 16 | 2 | 0 | No | No |
| 18590965 | LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING A CHUCK | February 2024 | July 2025 | Allow | 17 | 1 | 0 | No | No |
| 18432092 | SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF | February 2024 | August 2024 | Allow | 7 | 1 | 0 | No | No |
| 18393265 | LIGHT IRRADIATION TYPE HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS | December 2023 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18392368 | EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING | December 2023 | August 2025 | Abandon | 20 | 2 | 0 | Yes | No |
| 18543819 | 3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL | December 2023 | February 2025 | Allow | 14 | 1 | 1 | No | No |
| 18538458 | SEMICONDUCTOR PACKAGE | December 2023 | May 2025 | Allow | 17 | 1 | 0 | No | No |
| 18530626 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | December 2023 | March 2026 | Allow | 27 | 0 | 0 | No | No |
| 18520971 | PACKAGE STRUCTURE | November 2023 | June 2025 | Allow | 19 | 1 | 0 | No | No |
| 18521284 | HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME | November 2023 | August 2025 | Allow | 20 | 2 | 0 | No | No |
| 18519290 | SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALLOY ATOMIC LAYER DEPOSITION | November 2023 | February 2025 | Allow | 15 | 1 | 0 | No | No |
| 18517489 | Stacking Via Structures for Stress Reduction | November 2023 | October 2025 | Allow | 23 | 2 | 0 | No | No |
| 18510646 | PACKAGE STRUCTURE | November 2023 | August 2025 | Allow | 21 | 2 | 0 | No | No |
| 18508173 | MANUFACTURING METHOD OF INTEGRATED SUBSTRATE STRUCTURE | November 2023 | January 2025 | Allow | 14 | 1 | 0 | No | No |
| 18380981 | CYCLICAL DEPOSITION METHOD AND APPARATUS FOR FILLING A RECESS FORMED WITHIN A SUBSTRATE SURFACE | October 2023 | January 2025 | Allow | 15 | 1 | 0 | No | No |
| 18376652 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | October 2023 | January 2025 | Allow | 16 | 1 | 0 | No | No |
| 18367039 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE | September 2023 | February 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18235255 | CUTTING DISPLAY PANEL | August 2023 | January 2026 | Allow | 29 | 0 | 0 | No | No |
| 18366908 | High Aspect Ratio Gate Structure Formation | August 2023 | December 2025 | Allow | 28 | 3 | 0 | No | No |
| 18446229 | Semiconductor Package and Method of Forming Same | August 2023 | January 2026 | Allow | 29 | 4 | 0 | No | No |
| 18446291 | Semiconductor Devices and Methods of Manufacturing | August 2023 | March 2025 | Allow | 19 | 1 | 0 | No | No |
| 18365206 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2023 | August 2024 | Allow | 13 | 2 | 0 | No | No |
| 18363750 | LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING A CHUCK | August 2023 | May 2025 | Allow | 22 | 2 | 0 | Yes | No |
| 18360066 | INTEGRATED CHIP WITH INTER-WIRE CAVITIES | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18358038 | METHOD OF FABRICATING PACKAGE | July 2023 | September 2024 | Allow | 14 | 0 | 0 | No | No |
| 18357184 | PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME | July 2023 | October 2024 | Allow | 15 | 2 | 0 | Yes | No |
| 18357385 | SEMICONDUCTOR DEVICE | July 2023 | March 2026 | Allow | 32 | 1 | 0 | No | No |
| 18356839 | MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18223525 | DEVICE PACKAGE | July 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18344039 | CHIP PACKAGE STRUCTURE | June 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18336303 | SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND METHOD FOR FORMING THE SAME | June 2023 | November 2024 | Allow | 17 | 2 | 1 | No | No |
| 18336258 | PACKAGE STRUCTURE | June 2023 | October 2024 | Allow | 16 | 1 | 1 | No | No |
| 18321659 | METHODS OF FORMING MICROELECTRONIC DEVICES | May 2023 | June 2024 | Allow | 13 | 1 | 0 | No | No |
| 18196513 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | May 2023 | August 2024 | Allow | 15 | 2 | 0 | No | No |
| 18317048 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2023 | September 2024 | Allow | 16 | 2 | 0 | No | No |
| 18143983 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | May 2023 | September 2024 | Allow | 16 | 2 | 0 | Yes | No |
| 18307277 | SEMICONDUCTOR PACKAGE | April 2023 | June 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18305913 | Thermally Enhanced FCBGA Package | April 2023 | June 2024 | Allow | 14 | 3 | 0 | No | No |
| 18301420 | SEMICONDUCTOR PACKAGE | April 2023 | April 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18109392 | SEMICONDUCTOR PACKAGE | February 2023 | January 2026 | Allow | 35 | 1 | 0 | No | No |
| 18168319 | DIE EMBEDDED IN SUBSTRATE WITH STRESS BUFFER | February 2023 | May 2024 | Allow | 15 | 2 | 0 | Yes | No |
| 18166450 | INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF | February 2023 | February 2026 | Allow | 37 | 1 | 1 | Yes | No |
| 18164554 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | February 2023 | August 2024 | Allow | 19 | 2 | 0 | No | No |
| 18163033 | HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET | February 2023 | January 2025 | Allow | 23 | 3 | 0 | Yes | No |
| 18155705 | PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME | January 2023 | July 2024 | Allow | 18 | 2 | 0 | Yes | No |
| 18089458 | METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE | December 2022 | August 2024 | Allow | 20 | 2 | 0 | No | No |
| 18086185 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | December 2022 | November 2025 | Allow | 35 | 0 | 1 | No | No |
| 18077149 | PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | December 2022 | January 2026 | Allow | 38 | 1 | 1 | No | No |
| 18062445 | DOUBLE-SIDED MULTICHIP PACKAGES | December 2022 | November 2025 | Allow | 35 | 1 | 0 | No | No |
| 18062166 | MULTICHIP PACKAGES WITH 3D INTEGRATION | December 2022 | February 2026 | Allow | 38 | 2 | 1 | No | No |
| 18070552 | POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDUCTOR MODULE AND HOUSING FOR A POWER SEMICONDUCTOR MODULE | November 2022 | August 2025 | Allow | 32 | 0 | 1 | No | No |
| 18070825 | INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | November 2022 | January 2026 | Allow | 48 | 1 | 1 | No | No |
| 17994880 | SEMICONDUCTOR PACKAGE | November 2022 | July 2025 | Allow | 32 | 1 | 0 | No | No |
| 18058991 | Microelectronic Package RDL Patterns to Reduce Stress in RDLs Across Components | November 2022 | July 2025 | Allow | 31 | 1 | 0 | No | No |
| 18058436 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2022 | June 2025 | Allow | 31 | 0 | 1 | No | No |
| 17973690 | SEMICONDUCTOR DEVICE PACKAGES | October 2022 | July 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17959314 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | October 2022 | December 2025 | Allow | 38 | 2 | 1 | No | No |
| 17821272 | FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES | August 2022 | July 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17892137 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | August 2022 | December 2025 | Allow | 39 | 2 | 1 | No | No |
| 17891449 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, AND RECORDING MEDIUM | August 2022 | June 2024 | Allow | 22 | 1 | 0 | No | No |
| 17886997 | DISPLAY DEVICE | August 2022 | October 2025 | Allow | 38 | 2 | 0 | No | No |
| 17886097 | INSULATED GATE BIPOLAR TRANSISTOR AND DIODE | August 2022 | March 2025 | Abandon | 31 | 3 | 0 | No | No |
| 17814527 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2022 | October 2025 | Allow | 39 | 1 | 1 | No | No |
| 17871375 | INTERPOSER INCLUDING STEPPED SURFACES AND METHODS OF FORMING THE SAME | July 2022 | May 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17870931 | METHODS FOR FORMING A METALLIC FILM ON A SUBSTRATE BY CYCLICAL DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | July 2022 | July 2024 | Allow | 24 | 2 | 0 | No | No |
| 17813873 | Semiconductor Devices and Methods of Manufacturing | July 2022 | August 2024 | Allow | 25 | 4 | 1 | No | No |
| 17865305 | BUMP STRUCTURE AND METHOD OF MAKING THE SAME | July 2022 | January 2024 | Allow | 18 | 1 | 0 | No | No |
| 17859411 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | July 2022 | March 2025 | Allow | 33 | 1 | 0 | No | No |
| 17790706 | DISPLAY DEVICE | July 2022 | June 2025 | Allow | 35 | 1 | 0 | No | No |
| 17855040 | SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS | June 2022 | February 2026 | Allow | 43 | 1 | 1 | No | No |
| 17850393 | Methods Of Reducing Capacitance In Field-Effect Transistors | June 2022 | March 2024 | Allow | 21 | 3 | 0 | Yes | No |
| 17841007 | Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same | June 2022 | December 2023 | Allow | 18 | 2 | 0 | No | No |
| 17824709 | METHOD OF MANUFACTURING DISPLAY PANEL | May 2022 | August 2025 | Allow | 39 | 2 | 0 | No | No |
| 17737966 | Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die Connectivity over package substrates | May 2022 | June 2025 | Allow | 37 | 1 | 1 | No | No |
| 17707183 | GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION | March 2022 | August 2025 | Allow | 40 | 1 | 0 | No | No |
| 17692750 | SEMICONDUCTOR DEVICE INCLUDING EPITAXIAL ELECTRODE LAYER AND DIELECTRIC EPITAXIAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME | March 2022 | February 2025 | Allow | 35 | 1 | 0 | No | No |
| 17691403 | EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | March 2022 | July 2025 | Allow | 40 | 1 | 1 | No | No |
| 17669914 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | February 2022 | March 2025 | Allow | 37 | 2 | 0 | No | No |
| 17630194 | ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MOUNTING SUBSTRATE | January 2022 | December 2024 | Allow | 34 | 1 | 0 | No | No |
| 17579252 | INTERCONNECTION ARRAY DEVICE WITH SUPPORT | January 2022 | May 2025 | Allow | 40 | 2 | 1 | Yes | No |
| 17577687 | PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME | January 2022 | October 2024 | Allow | 33 | 1 | 0 | No | No |
| 17574245 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | January 2022 | February 2025 | Allow | 37 | 2 | 0 | No | No |
| 17568913 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | January 2022 | September 2024 | Allow | 32 | 2 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CLINTON, EVAN GARRETT.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner CLINTON, EVAN GARRETT works in Art Unit 2899 and has examined 83 patent applications in our dataset. With an allowance rate of 90.4%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 32 months.
Examiner CLINTON, EVAN GARRETT's allowance rate of 90.4% places them in the 74% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by CLINTON, EVAN GARRETT receive 1.86 office actions before reaching final disposition. This places the examiner in the 43% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by CLINTON, EVAN GARRETT is 32 months. This places the examiner in the 52% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +11.1% benefit to allowance rate for applications examined by CLINTON, EVAN GARRETT. This interview benefit is in the 45% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 30.3% of applications are subsequently allowed. This success rate is in the 60% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 53.3% of cases where such amendments are filed. This entry rate is in the 79% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
This examiner withdraws rejections or reopens prosecution in 50.0% of appeals filed. This is in the 19% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 100.0% are granted (fully or in part). This grant rate is in the 92% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 28% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.