Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18938407 | MEMORY DEVICE STRUCTURES THAT INCLUDE A CAPACITOR | November 2024 | September 2025 | Allow | 10 | 1 | 1 | Yes | No |
| 18900000 | SEMICONDUCTOR DEVICE INCLUDING BOTTOM ISOLATION STRUCTURE FOR PREVENTING CURRENT LEAKAGE | September 2024 | July 2025 | Allow | 10 | 1 | 1 | No | No |
| 18823808 | DEVICE STRUCTURES FOR A HIGH-VOLTAGE SEMICONDUCTOR DEVICE | September 2024 | April 2025 | Allow | 8 | 1 | 1 | No | No |
| 18814958 | BI-DIRECTIONAL SEMICONDUCTOR-CONTROLLED RECTIFIER WITH DUAL-LEVEL ISOLATION STRUCTURES AND METHOD | August 2024 | July 2025 | Allow | 10 | 1 | 1 | No | No |
| 18770582 | SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES | July 2024 | January 2026 | Allow | 19 | 2 | 0 | Yes | No |
| 18742543 | LIGHT EMITTING DIODES WITH ALUMINUM-CONTAINING LAYERS INTEGRATED THEREIN AND ASSOCIATED METHODS | June 2024 | October 2025 | Allow | 16 | 1 | 1 | Yes | No |
| 18739890 | CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR STRUCTURE AND METHODS FOR CLEAVING SUCH STRUCTURES | June 2024 | February 2025 | Allow | 8 | 0 | 0 | Yes | No |
| 18661083 | MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS | May 2024 | August 2024 | Allow | 4 | 0 | 0 | No | No |
| 18637959 | HAFNIUM NITRIDE ADHESION LAYER | April 2024 | February 2025 | Allow | 10 | 1 | 1 | No | No |
| 18633488 | SHIELDED INDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | April 2024 | March 2025 | Allow | 11 | 1 | 1 | No | No |
| 18626726 | CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING CAPACITOR | April 2024 | September 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18622977 | SINGULATION SYSTEMS AND RELATED METHODS | March 2024 | March 2025 | Allow | 12 | 0 | 0 | Yes | No |
| 18608878 | SONOS memory cell structure and fabricating method of the same | March 2024 | November 2024 | Allow | 7 | 0 | 0 | No | No |
| 18605526 | NORMAL-INCIDENCE IN-SITU PROCESS MONITOR SENSOR | March 2024 | November 2024 | Allow | 8 | 0 | 0 | Yes | No |
| 18602040 | SILICON-OXIDE-NITRIDE-OXIDE-SILICON MEMORY CELL | March 2024 | February 2025 | Allow | 11 | 1 | 0 | No | No |
| 18686810 | IN-RESIST PROCESS FOR HIGH DENSITY CONTACT FORMATION | February 2024 | June 2025 | Allow | 15 | 0 | 0 | No | No |
| 18585489 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | February 2024 | May 2024 | Allow | 2 | 0 | 0 | No | No |
| 18444785 | SEMICONDUCTOR MEMORY DEVICE AND FABRICATION METHOD THEREOF | February 2024 | December 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18432087 | SEMICONDUCTOR DIE | February 2024 | March 2025 | Allow | 13 | 2 | 0 | No | No |
| 18425633 | CONFINED CHARGE TRAP LAYER | January 2024 | October 2025 | Allow | 20 | 2 | 1 | No | No |
| 18407011 | METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT | January 2024 | January 2025 | Allow | 13 | 1 | 0 | No | No |
| 18541257 | INTEGRATED SHIELD PACKAGE AND METHOD | December 2023 | January 2026 | Allow | 25 | 2 | 1 | Yes | No |
| 18524259 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2023 | January 2025 | Allow | 14 | 1 | 0 | No | No |
| 18517232 | PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN | November 2023 | April 2025 | Allow | 17 | 1 | 0 | No | No |
| 18487931 | METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS | October 2023 | August 2025 | Allow | 22 | 3 | 0 | No | No |
| 18483250 | Oxide-Nitride-Oxide Stack Having Multiple Oxynitride Layers | October 2023 | November 2024 | Abandon | 14 | 1 | 0 | No | No |
| 18477055 | SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER | September 2023 | November 2025 | Allow | 26 | 1 | 0 | No | No |
| 18470427 | INTEGRATED CIRCUIT PACKAGE STRUCTURE | September 2023 | February 2025 | Allow | 17 | 2 | 0 | No | No |
| 18465733 | LIGHT-EMITTING DEVICE | September 2023 | June 2024 | Allow | 9 | 0 | 0 | Yes | No |
| 18242014 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | September 2023 | March 2025 | Allow | 19 | 3 | 0 | No | No |
| 18224652 | METHOD OF FORMING THIN FILM FOR MINIMIZING INCREASE IN DEFECTS AT INTERFACE DURING HIGH-TEMPERATURE OXIDATION PROCESS | July 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18262145 | MATCHING PRE-PROCESSING AND POST-PROCESSING SUBSTRATE SAMPLES | July 2023 | November 2025 | Allow | 28 | 0 | 0 | No | No |
| 18349925 | FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES | July 2023 | April 2024 | Allow | 10 | 0 | 1 | No | No |
| 18346164 | SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS | June 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18332919 | METHODS OF FORMING A STAIRCASE STRUCTURE | June 2023 | September 2024 | Allow | 16 | 1 | 0 | No | No |
| 18330062 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE | June 2023 | September 2024 | Allow | 15 | 1 | 0 | No | No |
| 18316722 | WAFER LEVEL TESTING OF OPTICAL COMPONENTS | May 2023 | October 2024 | Allow | 17 | 1 | 1 | No | No |
| 18132435 | SEMICONDUCTOR STRUCTURE | April 2023 | August 2024 | Allow | 17 | 2 | 0 | No | No |
| 18191726 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | March 2023 | February 2026 | Allow | 34 | 1 | 0 | No | No |
| 18175395 | LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MODULE USING THE SAME | February 2023 | March 2024 | Allow | 13 | 0 | 0 | No | No |
| 18175095 | CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING CAPACITOR | February 2023 | March 2024 | Allow | 12 | 1 | 0 | No | No |
| 18175381 | LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MODULE USING THE SAME | February 2023 | May 2024 | Allow | 14 | 1 | 0 | No | No |
| 18170977 | CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING CAPACITOR | February 2023 | January 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18105390 | INTEGRATED LASER AND PLASMA ETCH DICING | February 2023 | September 2025 | Allow | 32 | 0 | 0 | No | No |
| 17910049 | LASER PROCESSING DEVICE AND LASER PROCESSING METHOD | January 2023 | February 2026 | Allow | 41 | 1 | 0 | No | No |
| 18089732 | Structures and Processes for Void-Free Hybrid Bonding | December 2022 | August 2025 | Allow | 32 | 0 | 1 | No | No |
| 18076958 | PMOS HIGH-K METAL GATES | December 2022 | May 2024 | Allow | 17 | 1 | 1 | No | No |
| 18072730 | PLASMA DICED WAFERS AND METHODS THEREOF | December 2022 | March 2026 | Allow | 39 | 1 | 1 | No | No |
| 17989095 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | November 2022 | July 2024 | Allow | 19 | 1 | 1 | No | No |
| 18055618 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | November 2022 | March 2026 | Allow | 40 | 1 | 0 | No | No |
| 18055499 | PACKAGE DEVICE MANUFACTURING METHOD | November 2022 | August 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17987779 | Transistors and Arrays of Elevationally-Extending Strings of Memory Cells | November 2022 | August 2024 | Allow | 21 | 1 | 1 | No | No |
| 18055357 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | November 2022 | May 2025 | Allow | 30 | 0 | 0 | No | No |
| 18052912 | WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS | November 2022 | May 2024 | Allow | 18 | 2 | 0 | Yes | No |
| 18052327 | METHOD OF PROCESSING WAFER | November 2022 | October 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 18051538 | FULL-COLOR LIGHT-EMITTING DIODE MICRO-DISPLAY AND THE FABRICATION METHOD THEREOF | November 2022 | July 2025 | Allow | 33 | 0 | 1 | No | No |
| 18049798 | WAFER PROCESSING METHOD | October 2022 | October 2025 | Allow | 36 | 1 | 0 | No | No |
| 17969904 | SEMICONDUCTOR DEVICE | October 2022 | January 2025 | Allow | 27 | 0 | 0 | No | No |
| 18046433 | COOL ELECTRON ERASING IN THIN-FILM STORAGE TRANSISTORS | October 2022 | September 2024 | Allow | 23 | 1 | 1 | No | No |
| 17916837 | INSPECTION DEVICE AND INSPECTION METHOD | October 2022 | February 2026 | Allow | 41 | 1 | 1 | No | No |
| 17916844 | LASER PROCESSING DEVICE AND LASER PROCESSING METHOD | October 2022 | June 2025 | Allow | 33 | 0 | 1 | No | No |
| 17905274 | METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM | October 2022 | July 2025 | Allow | 35 | 1 | 0 | No | No |
| 17959365 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | October 2022 | February 2026 | Allow | 40 | 1 | 1 | Yes | No |
| 17958424 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE | October 2022 | April 2025 | Allow | 31 | 1 | 0 | No | No |
| 17956402 | CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR STRUCTURE AND METHODS FOR CLEAVING SUCH STRUCTURES | September 2022 | July 2024 | Allow | 21 | 1 | 1 | No | No |
| 17936042 | SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD THEREFOR | September 2022 | February 2026 | Abandon | 41 | 2 | 1 | No | No |
| 17936136 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | September 2022 | June 2025 | Allow | 33 | 1 | 1 | No | No |
| 17915211 | Semiconductor Device and Method For Manufacturing Semiconductor Device | September 2022 | October 2025 | Allow | 37 | 1 | 1 | No | No |
| 17945793 | OXIDE-NITRIDE-OXIDE STACK HAVING MULTIPLE OXYNITRIDE LAYERS | September 2022 | December 2024 | Allow | 27 | 2 | 0 | Yes | No |
| 17908293 | INSPECTION DEVICE AND INSPECTION METHOD | August 2022 | February 2026 | Allow | 42 | 3 | 0 | Yes | No |
| 17898177 | SEMICONDUCTOR DEVICE | August 2022 | April 2024 | Allow | 20 | 1 | 0 | No | No |
| 17894820 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | August 2022 | October 2025 | Allow | 38 | 1 | 1 | No | No |
| 17819738 | Semiconductor Device and Method of Forming Dummy vias in WLP | August 2022 | October 2025 | Allow | 38 | 2 | 1 | No | No |
| 17885739 | SEMICONDUCTOR MEMORY DEVICE | August 2022 | February 2025 | Allow | 31 | 1 | 0 | No | No |
| 17884240 | Semiconductor Packaging and Methods of Forming Same | August 2022 | July 2025 | Allow | 36 | 3 | 1 | No | No |
| 17868765 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | July 2022 | June 2025 | Abandon | 35 | 0 | 1 | No | No |
| 17867853 | UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FABRICATION THEREOF | July 2022 | September 2025 | Allow | 38 | 2 | 1 | No | No |
| 17811560 | METHOD FOR MANUFACTURING ELECTRONIC CHIPS | July 2022 | October 2024 | Allow | 27 | 2 | 0 | Yes | No |
| 17857897 | APPARATUSES INCLUDING A SEMICONDUCTOR TRANSISTOR AND METHODS FOR FORMING SAME | July 2022 | July 2025 | Allow | 36 | 2 | 1 | No | No |
| 17854679 | SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND METHOD OF FORMING THE SAME | June 2022 | October 2024 | Allow | 27 | 1 | 0 | Yes | No |
| 17839182 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | June 2022 | October 2024 | Allow | 28 | 0 | 0 | No | No |
| 17806111 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | June 2022 | February 2025 | Allow | 33 | 1 | 1 | No | No |
| 17833366 | FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION | June 2022 | April 2025 | Allow | 34 | 1 | 0 | No | No |
| 17830013 | DIELECTRIC ENGINEERED TUNNEL REGION IN MEMORY CELLS | June 2022 | January 2026 | Allow | 44 | 2 | 1 | No | No |
| 17732873 | STRUCTURE AND FORMATION METHOD OF DEVICE WITH FERROELECTRIC LAYER | April 2022 | February 2026 | Allow | 45 | 2 | 1 | No | No |
| 17722403 | SONOS memory cell structure and fabricating method of the same | April 2022 | June 2024 | Allow | 26 | 1 | 1 | No | No |
| 17721119 | SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES | April 2022 | May 2024 | Allow | 25 | 3 | 1 | No | No |
| 17716215 | SEMICONDUCTOR MEMORY DEVICES | April 2022 | February 2024 | Allow | 22 | 0 | 0 | No | No |
| 17717033 | SEMICONDUCTOR PROCESS SYSTEM AND METHOD | April 2022 | August 2024 | Allow | 28 | 1 | 1 | No | No |
| 17655799 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD THEREFOR | March 2022 | March 2025 | Allow | 35 | 1 | 1 | No | No |
| 17653212 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | March 2022 | February 2026 | Allow | 47 | 3 | 1 | Yes | No |
| 17678460 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | February 2022 | January 2024 | Allow | 22 | 0 | 0 | No | No |
| 17676700 | Semiconductor Packaging Method, Semiconductor Assembly and Electronic Device Comprising Semiconductor Assembly | February 2022 | August 2025 | Allow | 42 | 1 | 0 | No | No |
| 17674137 | THIN-FILM STORAGE TRANSISTOR WITH FERROELECTRIC STORAGE LAYER | February 2022 | October 2025 | Allow | 44 | 1 | 1 | Yes | No |
| 17589881 | Semiconductor Packaging Method, Semiconductor Assembly and Electronic Device Comprising Semiconductor Assembly | January 2022 | July 2024 | Allow | 30 | 0 | 0 | Yes | No |
| 17575000 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE | January 2022 | August 2025 | Allow | 43 | 2 | 1 | No | No |
| 17562939 | Semiconductor Packaging Method, Semiconductor Assembly and Electronic Device Comprising Semiconductor Assembly | December 2021 | July 2024 | Allow | 31 | 0 | 0 | Yes | No |
| 17562944 | Semiconductor Packaging Method, Semiconductor Assembly and Electronic Device Comprising Semiconductor Assembly | December 2021 | October 2024 | Allow | 34 | 1 | 0 | No | No |
| 17555916 | LIGHT-EMITTING DEVICE, TEMPLATE OF LIGHT-EMITTING DEVICE AND PREPARATION METHODS THEREOF | December 2021 | May 2025 | Allow | 41 | 2 | 1 | No | No |
| 17551266 | IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION | December 2021 | October 2025 | Abandon | 46 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHOUDHRY, MOHAMMAD M.
With a 75.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 66.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner CHOUDHRY, MOHAMMAD M works in Art Unit 2899 and has examined 90 patent applications in our dataset. With an allowance rate of 97.8%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 33 months.
Examiner CHOUDHRY, MOHAMMAD M's allowance rate of 97.8% places them in the 89% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by CHOUDHRY, MOHAMMAD M receive 1.61 office actions before reaching final disposition. This places the examiner in the 31% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by CHOUDHRY, MOHAMMAD M is 33 months. This places the examiner in the 48% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +3.3% benefit to allowance rate for applications examined by CHOUDHRY, MOHAMMAD M. This interview benefit is in the 25% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 35.1% of applications are subsequently allowed. This success rate is in the 78% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 21.9% of cases where such amendments are filed. This entry rate is in the 28% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 66.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 56% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 60.0% of appeals filed. This is in the 36% percentile among all examiners. Of these withdrawals, 33.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 0.0% are granted (fully or in part). This grant rate is in the 5% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 28% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.