Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18843295 | Nanoelectric System for Cooling Processors and RAM Memories | September 2024 | April 2025 | Allow | 8 | 1 | 0 | No | No |
| 18765888 | METHODS AND APPARATUS FOR MASK PATTERNING DEBRIS REMOVAL | July 2024 | July 2025 | Allow | 12 | 1 | 0 | No | No |
| 18604671 | DISPLAY DEVICE WITH IMAGE SENSOR | March 2024 | March 2026 | Abandon | 24 | 4 | 0 | No | No |
| 18465914 | POWER SEMICONDUCTOR DEVICE WITH FORCED CARRIER EXTRACTION AND METHOD OF MANUFACTURE | September 2023 | May 2025 | Abandon | 20 | 1 | 0 | No | No |
| 18347510 | SCALABLE ARCHITECTURE FOR REDUCED CYCLES ACROSS SOC | July 2023 | January 2025 | Allow | 18 | 2 | 0 | Yes | No |
| 18306003 | POWER GATING SWITCH TREE STRUCTURE FOR REDUCED WAKE-UP TIME AND POWER LEAKAGE | April 2023 | April 2025 | Allow | 24 | 3 | 0 | No | No |
| 18114557 | DISPLAY APPARATUS having inorganic insulating layers with contact holes and grooves | February 2023 | March 2026 | Allow | 36 | 6 | 0 | No | No |
| 18174095 | STACKED IMAGE SENSOR DEVICE AND METHOD OF FORMING SAME | February 2023 | July 2025 | Allow | 29 | 3 | 0 | Yes | No |
| 18169889 | SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED THROUGH VIAS TO LOWER WIRING | February 2023 | April 2024 | Allow | 14 | 2 | 0 | No | No |
| 18168354 | METHODS, DEVICES, AND SYSTEMS RELATED TO FORMING SEMICONDUCTOR POWER DEVICES WITH A HANDLE SUBSTRATE | February 2023 | September 2025 | Abandon | 31 | 4 | 0 | No | No |
| 18155386 | OPTIMIZATION OF SEMICONDUCTOR CELL OF VERTICAL FIELD EFFECT TRANSISTOR (VFET) | January 2023 | April 2024 | Allow | 15 | 1 | 1 | Yes | No |
| 18090835 | INTEGRATED FREEWHEELING DIODE AND EXTRACTION DEVICE | December 2022 | August 2025 | Abandon | 31 | 5 | 0 | No | No |
| 18058318 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE INCLUDING PARASITIC MOSFET FORMED USING TRENCH | November 2022 | October 2025 | Abandon | 35 | 2 | 0 | No | No |
| 18056724 | SEMICONDUCTOR STRUCTURE INCLUDING BIT LINE STRUCTURE COVERED BY OXIDE BARRIER LAYER AND MANUFACTURING METHOD THEREOF | November 2022 | May 2025 | Allow | 29 | 3 | 0 | No | No |
| 17980869 | LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING TADF COMPOUND | November 2022 | August 2025 | Allow | 33 | 4 | 0 | No | No |
| 17971206 | EPITAXIAL WAFER, PREPARING METHOD THEREOF, AND LIGHT-EMITTING DEVICE | October 2022 | November 2025 | Abandon | 37 | 0 | 1 | No | No |
| 17915908 | Semiconductor Memory having discrete active regions and Method of Making The Same | September 2022 | December 2025 | Allow | 39 | 1 | 0 | No | No |
| 17945462 | CONTACT STRUCTURES IN RC-NETWORK COMPONENTS | September 2022 | December 2024 | Allow | 27 | 1 | 0 | Yes | No |
| 17946000 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD | September 2022 | August 2025 | Abandon | 35 | 2 | 0 | No | No |
| 17930096 | STACKED RANDOM-ACCESS-MEMORY WITH COMPLEMENTARY ADJACENT CELLS | September 2022 | December 2025 | Allow | 39 | 1 | 1 | Yes | No |
| 17802166 | SEMICONDUCTOR DEVICE REDUCING CHANNEL LENGTH AND ELECTRONIC DEVICE WITH THE SAME | August 2022 | April 2025 | Allow | 32 | 1 | 0 | No | No |
| 17891413 | Electro-Static Discharge Protection Structure and High-Voltage Integrated Circuit | August 2022 | September 2025 | Abandon | 36 | 2 | 0 | No | No |
| 17886850 | MULTI-COLOR LED PIXEL UNIT AND MICRO-LED DISPLAY PANEL | August 2022 | May 2025 | Allow | 33 | 2 | 0 | No | No |
| 17872471 | STRAP TECHNOLOGY TO IMPROVE ESD HBM PERFORMANCE | July 2022 | July 2024 | Allow | 23 | 2 | 1 | Yes | No |
| 17867745 | DIFFUSION BARRIER LAYER IN TOP ELECTRODE TO INCREASE BREAK DOWN VOLTAGE | July 2022 | November 2024 | Allow | 28 | 3 | 0 | No | No |
| 17810614 | DISPLAY PANEL AND DISPLAY DEVICE for voiding fixed grating in light-transmissive regions | July 2022 | March 2025 | Allow | 33 | 2 | 0 | No | No |
| 17856884 | ORGANIC ELECTROLUMINESCENT DEVICE CONFIGURED TO EMIT LIGHT WITH HIGH LUMINOUS EFFICIENCY | July 2022 | May 2024 | Abandon | 22 | 1 | 0 | No | No |
| 17855468 | ELECTROSTATIC DISCHARGE (ESD) PROTECTION CIRCUIT | June 2022 | October 2025 | Allow | 40 | 4 | 0 | No | No |
| 17852416 | SEMICONDUCTOR STRUCTURE HAVING AIR GAP | June 2022 | June 2024 | Allow | 23 | 4 | 0 | No | No |
| 17843594 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME | June 2022 | October 2024 | Abandon | 28 | 2 | 0 | Yes | No |
| 17840516 | MULTI-COLOR LED PIXEL UNIT AND MICRO-LED DISPLAY PANEL | June 2022 | February 2026 | Allow | 44 | 4 | 0 | Yes | No |
| 17838099 | ELECTRONIC PACKAGE having connector for guiding light carrying medium | June 2022 | March 2026 | Allow | 45 | 3 | 1 | Yes | No |
| 17781128 | DISPLAY PANEL INCLUDING FIRST DUMMY CONDUCTIVE PATTERNS BETWEEN TWO ADJACENT DATA CONNECTION LINES | May 2022 | September 2025 | Allow | 40 | 2 | 0 | No | No |
| 17826736 | SEMICONDUCTOR STRUCTURE WITH A GATE AND A SHIELDING STRUCTURE | May 2022 | October 2025 | Allow | 41 | 6 | 1 | Yes | No |
| 17825252 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH PROGRAMMABLE FEATURE | May 2022 | December 2024 | Abandon | 30 | 4 | 0 | No | No |
| 17750783 | LIGHT-EMITTING ELEMENT INCLUDING FIRST SEMICONDUCTOR LAYER HAVING EXPOSED PORTION WITH FIRST REGION AND SECOND REGIONS | May 2022 | May 2025 | Allow | 36 | 2 | 1 | Yes | No |
| 17703036 | HIGH DENSITY IMAGE SENSOR | March 2022 | October 2025 | Allow | 43 | 4 | 1 | Yes | No |
| 17701632 | Pixel Cell Having Anti-Blooming Structure and Image Sensor | March 2022 | February 2025 | Allow | 35 | 3 | 1 | Yes | No |
| 17699839 | SEMICONDUCTOR MEMORY DEVICE INCLUDING CAPACITOR WITH A DIELECTRIC FILM ON AN UPPER PLATE REGION, A LOWER PLATE REGION, AND A SIDE SURFACE OF A CONNECTING REGION THEREBETWEEN | March 2022 | January 2025 | Allow | 34 | 4 | 0 | Yes | No |
| 17685520 | MEMORY DEVICE HAVING ACTIVE AREA IN STRIP AND MANUFACTURING METHOD THEREOF | March 2022 | March 2025 | Abandon | 36 | 4 | 1 | No | No |
| 17682889 | SEMICONDUCTOR DEVICE WITH EDGE SEAL | February 2022 | November 2025 | Abandon | 44 | 4 | 1 | Yes | No |
| 17678853 | ARRAYED SWITCH CIRCUITRY SYSTEM AND SWITCHING CIRCUIT | February 2022 | December 2025 | Allow | 45 | 3 | 1 | Yes | No |
| 17676858 | Cross-type semiconductor capacitor array layout | February 2022 | July 2024 | Abandon | 29 | 2 | 0 | No | No |
| 17668886 | SEMICONDUCTOR DEVICE | February 2022 | September 2024 | Abandon | 31 | 2 | 0 | No | No |
| 17667955 | SEMICONDUCTOR MEMORY DEVICE with three-dimensionally stacked memory cells having improved yield | February 2022 | September 2024 | Allow | 31 | 3 | 0 | Yes | No |
| 17646735 | BIDIRECTIONAL ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE | January 2022 | July 2024 | Allow | 31 | 2 | 0 | No | No |
| 17540323 | OPTOELECTRONIC DEVICE HAVING AN ARRAY OF GERMANIUM-BASED DIODES WITH LOW DARK CURRENT | December 2021 | August 2024 | Allow | 32 | 2 | 0 | No | No |
| 17537645 | ORGANIC DEVICE with pixels | November 2021 | July 2024 | Allow | 32 | 3 | 0 | Yes | No |
| 17613075 | MANUFACTURING METHOD OF A SEMICONDUCTOR STRUCTURE AND THE SEMICONDUCTOR STRUCTURE | November 2021 | December 2024 | Abandon | 37 | 2 | 0 | No | No |
| 17519765 | MULTI-LAYERED POLYSILICON AND OXYGEN-DOPED POLYSILICON DESIGN FOR RF SOI TRAP-RICH POLY LAYER | November 2021 | April 2024 | Allow | 29 | 3 | 1 | Yes | No |
| 17514580 | CELL ARCHITECTURE WITH EXTENDED TRANSISTOR GEOMETRY | October 2021 | September 2024 | Allow | 35 | 2 | 1 | No | Yes |
| 17451943 | SEMICONDUCTOR DEVICE HAVING SERIALLY CONNECTED TRANSISTORS WITH DISCONNECTED BODIES, AND METHOD OF MANUFACTURING THE SAME | October 2021 | December 2025 | Allow | 50 | 6 | 1 | Yes | No |
| 17504536 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | October 2021 | December 2024 | Abandon | 38 | 1 | 0 | No | No |
| 17485306 | MEMORY DEVICES WITH REDUCED READ DISTURBANCE EFFECTS | September 2021 | December 2025 | Abandon | 51 | 2 | 0 | No | No |
| 17478054 | ELECTROSTATIC PROTECTION ELEMENT AND SEMICONDUCTOR DEVICE | September 2021 | May 2025 | Abandon | 44 | 5 | 0 | No | No |
| 17469819 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM INCLUDING ELECTRO STATIC DISCHARGE (ESD) PROTECTIVE DEVICE | September 2021 | July 2024 | Allow | 34 | 1 | 0 | No | No |
| 17467069 | SEMICONDUCTOR DEVICE INCLUDING ELECTRODE PAD AND PROTECTION CIRCUIT FOR PROTECTION INTERNAL CIRCUITS | September 2021 | October 2025 | Abandon | 50 | 4 | 1 | Yes | No |
| 17410183 | SUPERCONDUCTING ANTI-FUSE BASED FIELD PROGRAMMABLE GATE ARRAY | August 2021 | July 2025 | Allow | 47 | 8 | 0 | Yes | No |
| 17432407 | COMPACT OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A COMPACT OPTOELECTRONIC COMPONENT | August 2021 | January 2026 | Abandon | 53 | 4 | 0 | No | No |
| 17394607 | DISPLAY DEVICES WITH IMAGE SENSOR | August 2021 | September 2024 | Abandon | 37 | 4 | 0 | No | No |
| 17381565 | ELECTROSTATIC DISCHARGE PROTECTION SEMICONDUCTOR STRUCTURE AND A METHOD OF MANUFACTURE | July 2021 | August 2024 | Allow | 37 | 4 | 0 | Yes | Yes |
| 17423463 | DISPLAY DEVICE WITH IMPROVED EMISSION EFFICIENCY AND METHOD FOR MANUFACTURING SAME | July 2021 | May 2025 | Allow | 46 | 4 | 0 | No | No |
| 17423455 | METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT USING FIRST AND SECOND SUPPORTS, AND DISPLAY DEVICE COMPRISING LIGHT-EMITTING ELEMENT | July 2021 | April 2025 | Allow | 45 | 3 | 1 | Yes | No |
| 17352252 | THREE-DIMENSIONAL MEMORY DEVICES WITH DUMMY CHANNEL STRUCTURES OF A TWO-DIMENSIONAL SHAPE WITH DIRECTIONALITY AND METHODS FOR FORMING THE SAME | June 2021 | May 2025 | Abandon | 47 | 4 | 0 | Yes | No |
| 17309714 | CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND ELECTRONIC EQUIPMENT | June 2021 | November 2025 | Abandon | 53 | 4 | 0 | No | No |
| 17311796 | DOUBLE-SIDED DISPLAY PANEL AND DOUBLE-SIDED DISPLAY DEVICE | June 2021 | July 2025 | Abandon | 49 | 3 | 1 | No | No |
| 17339615 | Fabrication of Field Effect Transistors With Ferroelectric Materials | June 2021 | May 2025 | Allow | 47 | 7 | 0 | Yes | Yes |
| 17338574 | PANEL WITH HIGH TRANSPARENCY AND METHOD FOR MANUFACTURING THE SAME | June 2021 | May 2024 | Abandon | 36 | 3 | 1 | No | No |
| 17333687 | LOW-LEAKAGE ESD PROTECTION CIRCUIT AND OPERATING METHOD THEREOF | May 2021 | November 2025 | Allow | 54 | 8 | 1 | Yes | No |
| 17318528 | OLED ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | May 2021 | August 2024 | Allow | 39 | 2 | 1 | No | No |
| 17291725 | MOLD TOOL FOR MOLDING A SEMICONDUCTOR POWER MODULE WITH TOP-SIDED PIN CONNECTORS AND METHOD OF MANUFACTURING SUCH A SEMICONDUCTOR POWER MODULE | May 2021 | February 2025 | Abandon | 46 | 4 | 0 | Yes | No |
| 17245995 | SILICON-BASED SUBSTRATE, SUBSTRATE, MANUFACTURING METHOD THEREOF, AND OPTOELECTRONIC DEVICE | April 2021 | December 2024 | Abandon | 43 | 2 | 0 | No | No |
| 17241796 | LANDING PAD IN INTERCONNECT AND MEMORY STACKS: STRUCTURE AND FORMATION OF THE SAME | April 2021 | December 2025 | Abandon | 55 | 8 | 0 | No | No |
| 17239458 | MULTILAYER SUPERCONDUCTING STRUCTURES FOR CRYOGENIC ELECTRONICS | April 2021 | December 2025 | Abandon | 55 | 4 | 1 | Yes | Yes |
| 17287120 | MICRO LIGHT-EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | April 2021 | November 2024 | Abandon | 43 | 2 | 1 | No | No |
| 17286700 | MICRO LED DEVICE AND METHOD FOR MANUFACTURING MICRO LED DEVICE | April 2021 | May 2024 | Abandon | 37 | 0 | 1 | No | No |
| 17225452 | SILICON AND SILICON GERMANIUM NANOWIRE STRUCTURES | April 2021 | June 2024 | Allow | 39 | 5 | 1 | No | No |
| 17219082 | METHODS AND APPARATUS FOR MASK PATTERNING DEBRIS REMOVAL | March 2021 | April 2024 | Allow | 37 | 1 | 1 | Yes | No |
| 17215682 | DISPLAY DEVICE with a static electricity discharging circuit | March 2021 | June 2024 | Allow | 38 | 5 | 1 | Yes | No |
| 17181196 | DUAL SUBSTRATE SIDE ESD DIODE FOR HIGH SPEED CIRCUIT | February 2021 | December 2023 | Allow | 34 | 5 | 1 | Yes | No |
| 17138179 | DISPLAY PANEL HAVING CATHODE ELECTRODE IN CONTACT WITH CONNECTION ELECTRODE IN SHADE REGION AND METHOD OF MANUFACTURING SAME | December 2020 | April 2024 | Allow | 39 | 4 | 1 | Yes | No |
| 17257291 | SEMICONDUCTOR DEVICE WITH LOW CONDUCTION RESISTANCE AND FABRICATION METHOD THEREOF | December 2020 | October 2025 | Abandon | 57 | 4 | 1 | No | No |
| 17257220 | SEMICONDUCTOR DEVICE FOR IMPROVING RELIABILITY | December 2020 | July 2025 | Abandon | 55 | 4 | 0 | No | No |
| 17253645 | MICRO-LED DISPLAY AND METHOD FOR MANUFACTURING SAME | December 2020 | October 2025 | Abandon | 58 | 5 | 1 | Yes | No |
| 17253827 | SPUTTER PROTECTIVE LAYER FOR ORGANIC ELECTRONIC DEVICES | December 2020 | September 2025 | Allow | 57 | 4 | 0 | Yes | Yes |
| 17104124 | SEMICONDUCTOR DEVICE INCLUDING INPUT/OUTPUT AREAS | November 2020 | April 2024 | Abandon | 40 | 4 | 1 | Yes | No |
| 17052589 | SEMICONDUCTOR DEVICE HAVING DEPRESSION PORTION OF CONDUCTOR FILLED WITH ANOTHER CONDUCTOR | November 2020 | May 2024 | Abandon | 42 | 6 | 1 | Yes | No |
| 17031816 | MOLD-IN-MOLD STRUCTURE TO IMPROVE SOLDER JOINT RELIABILITY | September 2020 | October 2024 | Abandon | 49 | 2 | 0 | No | No |
| 16785478 | DEVICE INCLUDING FIRST AND SECOND CAPACITORS AND A STORAGE CAPACITOR | February 2020 | September 2022 | Allow | 31 | 6 | 0 | Yes | Yes |
| 16672802 | FANOUT INTEGRATION FOR STACKED SILICON PACKAGE ASSEMBLY | November 2019 | February 2024 | Allow | 52 | 8 | 1 | Yes | No |
| 16552551 | INTEGRATED CIRCUIT DEVICES WITH CAPACITORS FOR TAMPER DETECTION | August 2019 | February 2026 | Allow | 60 | 8 | 1 | No | No |
| 16454752 | SEMICONDUCTOR DEVICE INCLUDING SILICON CARBIDE BODY AND TRANSISTOR CELLS | June 2019 | May 2025 | Allow | 60 | 12 | 0 | Yes | No |
| 16444438 | INTEGRATED CIRCUIT STRUCTURE WITH FILLED RECESSES | June 2019 | May 2025 | Allow | 60 | 7 | 1 | Yes | No |
| 16389672 | METAL OXYCARBIDE RESISTS AS LEAVE BEHIND PLUGS | April 2019 | June 2024 | Allow | 60 | 4 | 1 | No | No |
| 15167782 | NESTED THROUGH GLASS VIA TRANSFORMER | May 2016 | December 2017 | Allow | 19 | 2 | 0 | Yes | No |
| 14826937 | METHOD AND STRUCTURE FOR FORMING ON-CHIP ANTI-FUSE WITH REDUCED BREAKDOWN VOLTAGE | August 2015 | December 2016 | Allow | 16 | 1 | 1 | No | No |
| 14701232 | NONVOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | April 2015 | February 2016 | Allow | 9 | 1 | 0 | No | No |
| 14656649 | FINFET WITH ACTIVE REGION SHAPED STRUCTURES AND CHANNEL SEPARATION | March 2015 | February 2016 | Allow | 11 | 1 | 0 | No | No |
| 14529824 | REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER | October 2014 | June 2016 | Allow | 20 | 2 | 1 | No | No |
| 14286144 | METHODS FOR FORMING SEMICONDUCTOR FIN SUPPORT STRUCTURES | May 2014 | August 2015 | Allow | 15 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ZHU, SHENG-BAI.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 66.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner ZHU, SHENG-BAI works in Art Unit 2897 and has examined 98 patent applications in our dataset. With an allowance rate of 76.5%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 37 months.
Examiner ZHU, SHENG-BAI's allowance rate of 76.5% places them in the 43% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by ZHU, SHENG-BAI receive 3.45 office actions before reaching final disposition. This places the examiner in the 93% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.
The median time to disposition (half-life) for applications examined by ZHU, SHENG-BAI is 37 months. This places the examiner in the 33% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +4.4% benefit to allowance rate for applications examined by ZHU, SHENG-BAI. This interview benefit is in the 28% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 18.9% of applications are subsequently allowed. This success rate is in the 19% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 21.2% of cases where such amendments are filed. This entry rate is in the 26% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 133.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 86% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 88.9% of appeals filed. This is in the 82% percentile among all examiners. Of these withdrawals, 62.5% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 40.0% are granted (fully or in part). This grant rate is in the 30% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 1.0% of allowed cases (in the 67% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.