Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19200034 | THROUGHPUT IMPROVEMENTS FOR LOW-TEMPERATURE/BEOL-COMPATIBLE HIGHLY SCALABLE GRAPHENE SYNTHESIS METHODS INCLUDING PROCESSING IN RETASKED TOOLS | May 2025 | July 2025 | Allow | 2 | 0 | 0 | No | No |
| 19013905 | HETEROGENEOUS ANNEALING METHOD AND DEVICE | January 2025 | September 2025 | Allow | 8 | 1 | 0 | Yes | No |
| 19000144 | THROUGHPUT IMPROVEMENTS FOR LOW-TEMPERATURE/BEOL-COMPATIBLE HIGHLY SCALABLE GRAPHENE SYNTHESIS METHODS INCLUDING PROCESSING IN RETASKED TOOLS | December 2024 | April 2025 | Allow | 3 | 1 | 0 | No | No |
| 18865491 | METHOD FOR TRANSFERRING A LAYER FROM A SOURCE SUBSTRATE TO A DESTINATION SUBSTRATE | November 2024 | May 2025 | Allow | 6 | 1 | 0 | No | No |
| 18794859 | METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER | August 2024 | June 2025 | Abandon | 10 | 1 | 0 | No | No |
| 18775719 | SELECTIVE TRANSFER OF MICRO DEVICES | July 2024 | March 2026 | Allow | 20 | 1 | 0 | No | No |
| 18668736 | SYSTEM FOR BUILDING BALANCE-POINT-BASED SEASONAL FUEL CONSUMPTION FORECASTING WITH THE AID OF A DIGITAL COMPUTER | May 2024 | January 2025 | Allow | 8 | 1 | 0 | No | No |
| 18657689 | ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE | May 2024 | April 2025 | Allow | 12 | 1 | 0 | No | No |
| 18653575 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | May 2024 | October 2025 | Allow | 18 | 2 | 0 | No | No |
| 18620327 | METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE | March 2024 | August 2024 | Allow | 4 | 1 | 0 | No | No |
| 18606876 | CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS | March 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18589531 | PACKAGE STRUCTURE WITH THROUGH VIAS | February 2024 | August 2025 | Allow | 17 | 2 | 0 | No | No |
| 18589231 | DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS | February 2024 | January 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18439002 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | February 2024 | February 2025 | Allow | 12 | 2 | 0 | Yes | No |
| 18433307 | BAND EDGE EMISSION ENHANCED ORGANIC LIGHT EMITTING DIODE WITH A LOCALIZED EMITTER | February 2024 | March 2025 | Allow | 14 | 1 | 0 | No | No |
| 18420972 | PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS | January 2024 | October 2024 | Allow | 9 | 1 | 0 | No | No |
| 18416215 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | January 2024 | June 2025 | Allow | 17 | 3 | 0 | No | No |
| 18412760 | DISPLAY PANEL AND METHOD OF FABRICATING THE SAME | January 2024 | November 2024 | Allow | 10 | 1 | 0 | No | No |
| 18399189 | NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES | December 2023 | November 2024 | Allow | 11 | 1 | 0 | No | No |
| 18390439 | ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING | December 2023 | February 2025 | Allow | 14 | 2 | 0 | Yes | No |
| 18391075 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | December 2023 | February 2025 | Allow | 14 | 2 | 0 | No | No |
| 18544590 | THERMALLY CONDUCTIVE WAFER LAYER | December 2023 | November 2024 | Allow | 11 | 3 | 0 | No | No |
| 18540220 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | December 2023 | October 2024 | Allow | 11 | 1 | 0 | No | No |
| 18536188 | SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | December 2023 | September 2024 | Allow | 9 | 1 | 0 | No | No |
| 18516703 | SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER | November 2023 | November 2024 | Allow | 12 | 1 | 0 | No | No |
| 18478597 | PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE | September 2023 | August 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18374107 | DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE | September 2023 | August 2024 | Allow | 11 | 2 | 0 | No | No |
| 18550805 | A GIMBAL BONDING TOOL AND A METHOD TO CORRECT SURFACE NON-UNIFORMITIES USING A BONDING TOOL | September 2023 | August 2024 | Allow | 11 | 0 | 0 | No | No |
| 18244789 | LIGHT RECEIVING ELEMENT, RANGING MODULE, AND ELECTRONIC APPARATUS | September 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18459043 | PACKAGING METHOD AND PACKAGE MEMBER | August 2023 | March 2026 | Allow | 31 | 1 | 0 | No | No |
| 18457338 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE | August 2023 | March 2026 | Allow | 30 | 1 | 0 | No | No |
| 18456197 | METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY APPARATUS | August 2023 | August 2024 | Allow | 12 | 1 | 0 | No | No |
| 18453721 | METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCTOR DIE | August 2023 | August 2024 | Allow | 11 | 1 | 0 | No | No |
| 18451538 | LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME | August 2023 | November 2024 | Abandon | 15 | 1 | 0 | No | No |
| 18448220 | SEMICONDUCTOR PACKAGE AND METHOD | August 2023 | March 2026 | Allow | 31 | 1 | 0 | No | No |
| 18448667 | Semiconductor Device Carriers and Methods of Making and Using | August 2023 | February 2026 | Allow | 30 | 1 | 0 | No | No |
| 18362989 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | August 2023 | June 2024 | Allow | 11 | 1 | 0 | No | No |
| 18362960 | INTEGRATED CIRCUIT DEVICE AND METHOD | August 2023 | October 2024 | Allow | 15 | 1 | 0 | No | No |
| 18363247 | JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS | August 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18227348 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | July 2023 | February 2026 | Allow | 31 | 1 | 0 | Yes | No |
| 18360883 | ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME | July 2023 | July 2024 | Allow | 11 | 1 | 0 | No | No |
| 18359887 | METHOD OF TESTING SEMICONDUCTOR PACKAGE | July 2023 | October 2024 | Allow | 15 | 2 | 0 | No | No |
| 18359924 | PACKAGE STRUCTURE WITH UNDERFILL | July 2023 | February 2025 | Allow | 18 | 2 | 0 | No | No |
| 18359138 | LIFT-OFF METHOD | July 2023 | March 2026 | Allow | 31 | 1 | 0 | Yes | No |
| 18358904 | METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR | July 2023 | August 2024 | Allow | 12 | 1 | 0 | No | No |
| 18357942 | APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF | July 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18356227 | METHOD OF FABRICATING PACKAGE STRUCTURE | July 2023 | August 2024 | Allow | 13 | 1 | 0 | No | No |
| 18273507 | SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES | July 2023 | April 2024 | Allow | 9 | 1 | 0 | Yes | No |
| 18223035 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18354633 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18272453 | Method for manufacturing an electronic device and associated transfer device | July 2023 | February 2026 | Allow | 31 | 1 | 0 | No | No |
| 18350730 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | July 2023 | June 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18341085 | DEVICE WAFER PROCESSING METHOD | June 2023 | February 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18339548 | SELF-ALIGNING BONDING BY HYDROPHILIC CONTRAST | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18211656 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | June 2023 | February 2026 | Allow | 32 | 1 | 0 | No | No |
| 18336088 | INTERCALATED METAL/DIELECTRIC STRUCTURE FOR NONVOLATILE MEMORY DEVICES | June 2023 | July 2024 | Allow | 13 | 2 | 0 | No | No |
| 18332508 | PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | June 2023 | February 2026 | Allow | 33 | 1 | 0 | Yes | No |
| 18265902 | CHIP BONDING METHOD | June 2023 | January 2026 | Allow | 31 | 1 | 0 | No | No |
| 18330295 | INTEGRATED PHOTODETECTOR WITH DIRECT BINNING PIXEL | June 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18329588 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | June 2023 | November 2025 | Allow | 29 | 2 | 0 | No | No |
| 18328913 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | June 2023 | August 2024 | Allow | 14 | 2 | 0 | Yes | No |
| 18204956 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | June 2023 | December 2025 | Allow | 31 | 1 | 0 | No | No |
| 18325707 | STRUCTURES AND METHODS FOR PHASE DETECTION AUTO FOCUS | May 2023 | December 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 18322579 | WAFER PROCESSING METHOD | May 2023 | September 2025 | Allow | 28 | 1 | 0 | No | No |
| 18317093 | METHODS FOR MAKING SEMICONDUCTOR DEVICES | May 2023 | January 2026 | Allow | 32 | 1 | 0 | No | No |
| 18315991 | Semiconductor Device and Method of Controlling Warpage During LAB | May 2023 | May 2024 | Allow | 12 | 1 | 0 | No | No |
| 18035911 | ADHESIVE TAPE AND PROCESSING METHOD | May 2023 | March 2026 | Abandon | 34 | 1 | 0 | No | No |
| 18312655 | WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANSFER STRUCTURE | May 2023 | October 2024 | Allow | 18 | 2 | 0 | Yes | No |
| 18312641 | WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANSFER STRUCTURE | May 2023 | May 2024 | Allow | 12 | 2 | 0 | Yes | No |
| 18142142 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MANUFACTURE | May 2023 | June 2024 | Allow | 13 | 2 | 0 | No | No |
| 18140425 | SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH CONFIGURATIONS | April 2023 | May 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18137014 | SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE | April 2023 | March 2026 | Allow | 35 | 2 | 0 | No | No |
| 18135623 | SEMICONDUCTOR PACKAGE | April 2023 | November 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 18031735 | METHOD FOR PRODUCING A LIGHT EMITTING DIODE SUPPLY SUBSTRATE, METHOD FOR PRODUCING A LIGHT EMITTING DIODE DISPLAY, METHOD FOR PRODUCING A DIVISION UNIT FOR A LIGHT EMITTING DIODE DISPLAY, AND METHOD FOR PRODUCING A DEVICE SUPPLY SUBSTRATE | April 2023 | February 2026 | Allow | 34 | 1 | 0 | No | No |
| 18132199 | PARTICLE CAPTURE USING TRANSFER STAMP | April 2023 | May 2024 | Allow | 14 | 2 | 0 | No | No |
| 18127539 | NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES | March 2023 | May 2024 | Allow | 14 | 2 | 0 | No | No |
| 18246855 | FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | March 2023 | November 2025 | Allow | 32 | 1 | 0 | No | No |
| 18190949 | TEST METHOD, MANUFACTURING METHOD, PANEL LEVEL PACKAGE, AND TEST APPARATUS | March 2023 | February 2026 | Allow | 35 | 2 | 1 | No | No |
| 18188084 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2023 | November 2025 | Allow | 32 | 1 | 0 | No | No |
| 18186202 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | March 2023 | February 2026 | Allow | 35 | 2 | 0 | Yes | No |
| 18181960 | SYSTEM FOR PLOT-BASED BUILDING SEASONAL FUEL CONSUMPTION FORECASTING WITH THE AID OF A DIGITAL COMPUTER | March 2023 | February 2024 | Allow | 11 | 1 | 0 | No | No |
| 18025443 | WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD | March 2023 | April 2024 | Abandon | 14 | 1 | 0 | No | No |
| 18177739 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | March 2023 | January 2026 | Allow | 35 | 2 | 0 | No | No |
| 18176736 | CONNECTIONS FROM BURIED INTERCONNECTS TO DEVICE TERMINALS IN MULTIPLE STACKED DEVICES STRUCTURES | March 2023 | August 2025 | Allow | 29 | 1 | 0 | Yes | No |
| 18177072 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE | March 2023 | September 2025 | Allow | 31 | 1 | 0 | No | No |
| 18043578 | SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18115043 | CARRIER PLATE FOR PREPARING PACKAGE SUBSTRATE, PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18176143 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE | February 2023 | February 2024 | Allow | 12 | 1 | 0 | No | No |
| 18024042 | BASE PLATE AND SUBSTRATE ASSEMBLY | February 2023 | February 2026 | Allow | 36 | 2 | 0 | No | No |
| 18174866 | SEMICONDUCTOR MODULE | February 2023 | August 2025 | Allow | 30 | 1 | 0 | No | No |
| 18172975 | WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS | February 2023 | September 2025 | Allow | 31 | 1 | 0 | No | No |
| 18112466 | WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING | February 2023 | June 2024 | Allow | 16 | 2 | 0 | No | No |
| 18171662 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | February 2023 | December 2025 | Allow | 33 | 2 | 0 | No | No |
| 18021813 | Substrate and Preparation Method thereof, Integrated Passive Device, and Electronic Apparatus | February 2023 | December 2025 | Allow | 34 | 1 | 0 | No | No |
| 18169625 | FILM FRAME CARRIER FOR A CURVED WAFER STAGE | February 2023 | March 2026 | Allow | 37 | 2 | 0 | No | No |
| 18104982 | INTEGRATED WAFER DEBONDING AND CLEANING APPARATUS AND DEBONDING AND CLEANING METHOD | February 2023 | July 2025 | Allow | 30 | 1 | 0 | No | No |
| 18007103 | HYBRID RELEASE LAYER FOR MICRODEVICE CARTRIDGE | January 2023 | December 2025 | Allow | 34 | 2 | 0 | No | No |
| 18016853 | FLEXIBLE OPTOELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING SAME | January 2023 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18153630 | SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | January 2023 | September 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 18152558 | Three-Dimensional Semiconductor Device and Method | January 2023 | December 2025 | Allow | 35 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner VU, VU A.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 33.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner VU, VU A works in Art Unit 2897 and has examined 101 patent applications in our dataset. With an allowance rate of 96.0%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 31 months.
Examiner VU, VU A's allowance rate of 96.0% places them in the 86% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by VU, VU A receive 1.56 office actions before reaching final disposition. This places the examiner in the 29% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by VU, VU A is 31 months. This places the examiner in the 56% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +4.7% benefit to allowance rate for applications examined by VU, VU A. This interview benefit is in the 29% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 41.5% of applications are subsequently allowed. This success rate is in the 93% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 59.5% of cases where such amendments are filed. This entry rate is in the 85% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 200.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 97% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 75.0% of appeals filed. This is in the 65% percentile among all examiners. Of these withdrawals, 33.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 66.7% are granted (fully or in part). This grant rate is in the 73% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 28% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 2.1% of allowed cases (in the 68% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.