Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18800057 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH SLITS | August 2024 | June 2025 | Allow | 10 | 0 | 0 | No | No |
| 18749542 | JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | June 2024 | March 2025 | Allow | 9 | 0 | 0 | No | No |
| 18738281 | SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS | June 2024 | May 2025 | Allow | 12 | 0 | 0 | No | No |
| 18734765 | EDGE INTERFACE PLACEMENTS TO ENABLE CHIPLET ROTATION INTO MULTI-CHIPLET CLUSTER | June 2024 | June 2025 | Allow | 13 | 1 | 0 | No | No |
| 18675785 | CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER | May 2024 | April 2025 | Allow | 11 | 1 | 0 | No | No |
| 18674950 | SEMICONDUCTOR DEVICE | May 2024 | May 2025 | Allow | 11 | 1 | 0 | No | No |
| 18668922 | BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18661658 | DISPLAY PANEL AND DISPLAY APPARATUS | May 2024 | March 2025 | Allow | 10 | 1 | 0 | No | No |
| 18632047 | PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18629670 | PACKAGE BONDING STRUCTURES AND METHOD OF FORMATION | April 2024 | June 2025 | Allow | 15 | 1 | 0 | No | No |
| 18618432 | FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18603483 | SEMICONDUCTOR DEVICE STRUCTURES | March 2024 | March 2025 | Allow | 12 | 1 | 0 | Yes | No |
| 18594816 | SEMICONDUCTOR DEVICE | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18443368 | METAL LANDING ON TOP ELECTRODE OF RRAM | February 2024 | November 2024 | Allow | 9 | 1 | 0 | No | No |
| 18432788 | SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT | February 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18402611 | SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES | January 2024 | December 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18519538 | APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS | November 2023 | December 2024 | Allow | 13 | 0 | 1 | No | No |
| 18515657 | Standard Cell Layout for Better Routability | November 2023 | March 2025 | Allow | 16 | 1 | 0 | No | No |
| 18491661 | HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HAVING INTERCONNECTION TUNING CIRCUITS | October 2023 | April 2025 | Allow | 18 | 1 | 0 | No | No |
| 18488440 | PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | October 2023 | March 2025 | Allow | 17 | 1 | 1 | No | No |
| 18378733 | Semiconductor Device and Method for Fabricating a Semiconductor Device | October 2023 | November 2024 | Allow | 13 | 1 | 0 | No | No |
| 18374396 | SEMICONDUCTOR PACKAGE | September 2023 | May 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18373295 | MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME | September 2023 | August 2024 | Allow | 10 | 1 | 0 | No | No |
| 18473412 | SEMICONDUCTOR DEVICES | September 2023 | March 2025 | Allow | 17 | 2 | 1 | Yes | No |
| 18244716 | DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE | September 2023 | October 2024 | Allow | 13 | 1 | 0 | Yes | No |
| 18232523 | SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH | August 2023 | September 2024 | Allow | 14 | 1 | 0 | No | No |
| 18448117 | MEMORY CELL ARRAY CIRCUIT AND METHOD OF FORMING THE SAME | August 2023 | February 2025 | Allow | 18 | 2 | 0 | No | No |
| 18230546 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | August 2023 | September 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18346511 | SOURCE/DRAIN REGIONS OF FINFET DEVICES AND METHODS OF FORMING SAME | July 2023 | September 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 18345259 | MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME | June 2023 | May 2025 | Allow | 22 | 2 | 0 | No | No |
| 18342749 | INTEGRATED CIRCUIT PACKAGES | June 2023 | December 2024 | Allow | 17 | 1 | 1 | No | No |
| 18336100 | EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION | June 2023 | September 2024 | Allow | 15 | 1 | 0 | No | No |
| 18197245 | FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME | May 2023 | April 2024 | Allow | 11 | 0 | 0 | No | No |
| 18140427 | MULTI-LEVEL MICRO-DEVICE TETHERS | April 2023 | November 2024 | Allow | 18 | 1 | 1 | No | No |
| 18306832 | Flip-Chip Package Assembly | April 2023 | December 2024 | Allow | 19 | 1 | 0 | No | No |
| 18306194 | PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HAVING GROUND PLATES AND SIGNAL LINES | April 2023 | November 2024 | Allow | 18 | 1 | 0 | No | No |
| 18133970 | INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME | April 2023 | June 2024 | Allow | 14 | 0 | 0 | No | No |
| 18295942 | POWER MODULE AND RELATED METHODS | April 2023 | September 2024 | Allow | 18 | 1 | 1 | No | No |
| 18126759 | INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP HAVING PADS OF DIFFERENT WIDTHS AND SEMICONDUCTOR PACKAGE INCLUDING THE INTERCONNETION STRUCTURE | March 2023 | January 2025 | Allow | 22 | 2 | 0 | Yes | No |
| 18190935 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE | March 2023 | August 2024 | Allow | 17 | 0 | 0 | No | No |
| 18025971 | RESISTIVE RANDOM-ACCESS MEMORY USING STACKED TECHNOLOGY | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18182314 | HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HAVING INTERCONNECTION TUNING CIRCUITS | March 2023 | September 2023 | Allow | 6 | 2 | 0 | Yes | No |
| 18113070 | MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME | February 2023 | June 2024 | Allow | 16 | 1 | 0 | No | No |
| 18103505 | OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR | January 2023 | April 2024 | Allow | 15 | 1 | 0 | No | No |
| 18160631 | ORGANIC LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS INCLUDING THE SAME | January 2023 | March 2024 | Allow | 14 | 1 | 0 | No | No |
| 18156123 | Reduction of Line Wiggling | January 2023 | May 2025 | Allow | 28 | 2 | 1 | No | No |
| 18091781 | MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS | December 2022 | September 2024 | Allow | 21 | 2 | 0 | No | No |
| 18091509 | FAN-OUT SEMICONDUCTOR PACKAGE INCLUDING UNDER-BUMP METALLURGY | December 2022 | December 2023 | Allow | 11 | 0 | 0 | No | No |
| 17983469 | NON-VOLATILE MEMORY DEVICE | November 2022 | June 2025 | Allow | 31 | 0 | 0 | No | No |
| 18051459 | METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING SOURCE STRUCTURES OVERLYING STACK STRUCTURES | October 2022 | December 2023 | Allow | 13 | 0 | 0 | No | No |
| 17949325 | ELECTRICAL COMPONENT WITH A DIELECTRIC PASSIVATION STACK | September 2022 | June 2024 | Allow | 21 | 1 | 0 | No | No |
| 17931284 | STACKED INTERPOSER STRUCTURES | September 2022 | September 2024 | Allow | 24 | 1 | 1 | No | No |
| 17930149 | SEMICONDUCTOR DEVICE | September 2022 | June 2025 | Allow | 33 | 0 | 0 | No | No |
| 17887385 | SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT | August 2022 | December 2023 | Allow | 16 | 0 | 1 | No | No |
| 17886945 | IMAGE SENSOR STRUCTURE FOR REDUCED PIXEL PITCH AND METHODS THEREOF | August 2022 | June 2025 | Allow | 34 | 0 | 0 | No | No |
| 17818595 | Method of Modulating Stress of Dielectric Layers | August 2022 | June 2024 | Allow | 23 | 0 | 1 | No | No |
| 17817429 | DISPLAY PANEL | August 2022 | December 2023 | Allow | 17 | 0 | 0 | No | No |
| 17815177 | Semiconductor Device Structures | July 2022 | February 2024 | Allow | 19 | 1 | 0 | No | No |
| 17814840 | SEMICONDUCTOR DEVICE | July 2022 | February 2024 | Allow | 19 | 1 | 0 | No | No |
| 17872023 | JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | July 2022 | April 2024 | Allow | 21 | 1 | 0 | No | No |
| 17813872 | SILICON PHOTOMULTIPLIERS WITH SPLIT MICROCELLS | July 2022 | March 2024 | Allow | 20 | 1 | 0 | No | No |
| 17869571 | SEMICONDUCTOR ARRANGEMENT WITH AIRGAP AND METHOD OF FORMING | July 2022 | May 2025 | Allow | 34 | 4 | 0 | Yes | No |
| 17813820 | Bump Joint Structure with Distortion and Method Forming Same | July 2022 | February 2024 | Allow | 19 | 1 | 0 | No | No |
| 17856154 | PACKAGE STRUCTURE WITH FAN-OUT FEATURE | July 2022 | June 2024 | Allow | 24 | 2 | 0 | No | No |
| 17808889 | Semiconductor Package Including Cavity-Mounted Device | June 2022 | July 2024 | Allow | 25 | 2 | 0 | No | No |
| 17844590 | Distributed FET Back-Bias Network | June 2022 | March 2024 | Allow | 21 | 1 | 1 | No | No |
| 17844200 | CHIP PACKAGE STRUCTURE AND STORAGE SYSTEM | June 2022 | March 2025 | Allow | 33 | 1 | 0 | No | No |
| 17842600 | MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS | June 2022 | October 2023 | Allow | 16 | 1 | 0 | No | No |
| 17842103 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | June 2022 | June 2025 | Allow | 36 | 1 | 0 | No | No |
| 17841683 | SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES | June 2022 | October 2023 | Allow | 16 | 1 | 0 | Yes | No |
| 17835986 | MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME | June 2022 | August 2023 | Allow | 14 | 1 | 1 | No | No |
| 17827159 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | May 2022 | June 2025 | Allow | 36 | 1 | 1 | No | No |
| 17826491 | OLED DISPLAY PANEL, PREPARATION METHOD THEREOF AND OLED DISPLAY DEVICE | May 2022 | September 2023 | Allow | 16 | 1 | 0 | No | No |
| 17749918 | Flexible Substrate, Manufacturing Method for Flexible Substrate and Display Device | May 2022 | October 2023 | Allow | 17 | 1 | 0 | No | No |
| 17744884 | CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER | May 2022 | January 2024 | Allow | 20 | 1 | 1 | Yes | No |
| 17734156 | Standard Cell Layout for Better Routability | May 2022 | September 2023 | Allow | 16 | 1 | 0 | No | No |
| 17731807 | FLEXIBLE DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, DISPLAY PANEL AND DISPLAY APPARATUS | April 2022 | August 2023 | Allow | 15 | 1 | 0 | No | No |
| 17729321 | TITANIUM LAYER AS GETTER LAYER FOR HYDROGEN IN A MIM DEVICE | April 2022 | August 2024 | Allow | 27 | 2 | 1 | No | No |
| 17728048 | INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE | April 2022 | January 2025 | Allow | 33 | 1 | 3 | No | No |
| 17726238 | PROTECTIVE FILM, DISPLAY MODULE, DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY MODULE, AND METHOD OF MANUFACTURING DISPLAY DEVICE | April 2022 | August 2023 | Allow | 16 | 1 | 0 | No | No |
| 17724124 | WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MANUFACTURING THE IMAGING SYSTEM, AND ELECTRONIC APPARATUS INCLUDING THE IMAGING SYSTEM | April 2022 | December 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17717194 | SEMICONDUCTOR DEVICE | April 2022 | July 2023 | Allow | 15 | 1 | 0 | No | No |
| 17714940 | DISPLAY DEVICE | April 2022 | March 2025 | Allow | 35 | 0 | 0 | No | No |
| 17712300 | QUANTUM DEVICE | April 2022 | June 2025 | Allow | 39 | 2 | 1 | No | No |
| 17657446 | HIGH DENSITY STACKED VERTICAL TRANSISTOR STATIC RANDOM ACCESS MEMORY STRUCTURE | March 2022 | June 2025 | Allow | 39 | 1 | 0 | Yes | No |
| 17705121 | PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVE IN HORIZONTAL DIRECTION AND VERTICAL DIRECTION AND METHOD MAKING THE SAME | March 2022 | March 2024 | Allow | 24 | 0 | 0 | No | No |
| 17702659 | COLOR CHANGING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME | March 2022 | April 2025 | Allow | 37 | 0 | 1 | No | No |
| 17694913 | METAL LANDING ON TOP ELECTRODE OF RRAM | March 2022 | November 2023 | Allow | 20 | 2 | 0 | No | No |
| 17691792 | SEMICONDUCTOR DEVICE | March 2022 | February 2025 | Allow | 35 | 2 | 0 | No | No |
| 17687342 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIP HAVING ELONGATED BUMPS | March 2022 | September 2024 | Allow | 31 | 1 | 1 | Yes | No |
| 17687350 | SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEMICONDUCTOR DIE AND HEAT SPREADING STRUCTURE | March 2022 | December 2023 | Allow | 22 | 1 | 1 | No | No |
| 17640752 | WIRING DESIGN METHOD, WIRING STRUCTURE, AND FLIP CHIP | March 2022 | October 2023 | Allow | 19 | 1 | 0 | No | No |
| 17652782 | SEMICONDUCTOR PACKAGE | February 2022 | August 2024 | Allow | 29 | 1 | 1 | Yes | No |
| 17680531 | TUNABLE WHITE LIGHTING SYSTEMS | February 2022 | September 2023 | Allow | 19 | 1 | 0 | No | No |
| 17673865 | SEMICONDUCTOR PACKAGE HAVING INTERPOSER SUBSTRATE | February 2022 | December 2024 | Allow | 34 | 1 | 1 | Yes | No |
| 17671530 | Method for Fabricating a Semiconductor Device | February 2022 | September 2023 | Abandon | 19 | 2 | 0 | No | No |
| 17665501 | CONTAMINANT COLLECTION ON SOI | February 2022 | October 2023 | Allow | 20 | 0 | 1 | No | No |
| 17582870 | SYSTEM PACKAGING FOR CELLULAR MODEM AND TRANSCEIVER SYSTEM OF HETEROGENEOUS STACKING | January 2022 | January 2025 | Allow | 36 | 2 | 0 | Yes | No |
| 17577834 | ISOLATION IN INTEGRATED CIRCUIT DEVICES | January 2022 | June 2024 | Abandon | 29 | 3 | 0 | No | No |
| 17568740 | IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF | January 2022 | October 2022 | Allow | 9 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner VU, HUNG K.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 20.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner VU, HUNG K works in Art Unit 2897 and has examined 978 patent applications in our dataset. With an allowance rate of 92.8%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 21 months.
Examiner VU, HUNG K's allowance rate of 92.8% places them in the 79% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by VU, HUNG K receive 1.31 office actions before reaching final disposition. This places the examiner in the 26% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by VU, HUNG K is 21 months. This places the examiner in the 86% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +4.9% benefit to allowance rate for applications examined by VU, HUNG K. This interview benefit is in the 29% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 39.7% of applications are subsequently allowed. This success rate is in the 89% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 36.1% of cases where such amendments are filed. This entry rate is in the 47% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 133.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 85% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 80.0% of appeals filed. This is in the 69% percentile among all examiners. Of these withdrawals, 75.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 52.5% are granted (fully or in part). This grant rate is in the 65% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 1.3% of allowed cases (in the 72% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 7.3% of allowed cases (in the 84% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.