USPTO Examiner VU HUNG K - Art Unit 2897

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
188000573D SEMICONDUCTOR DEVICES AND STRUCTURES WITH SLITSAugust 2024June 2025Allow1000NoNo
18749542JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFJune 2024March 2025Allow900NoNo
18738281SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMSJune 2024May 2025Allow1200NoNo
18734765EDGE INTERFACE PLACEMENTS TO ENABLE CHIPLET ROTATION INTO MULTI-CHIPLET CLUSTERJune 2024June 2025Allow1310NoNo
18675785CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYERMay 2024April 2025Allow1110NoNo
18674950SEMICONDUCTOR DEVICEMay 2024May 2025Allow1110NoNo
18668922BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAMEMay 2024May 2025Allow1210NoNo
18661658DISPLAY PANEL AND DISPLAY APPARATUSMay 2024March 2025Allow1010NoNo
18632047PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROLApril 2024March 2025Allow1110NoNo
18629670PACKAGE BONDING STRUCTURES AND METHOD OF FORMATIONApril 2024June 2025Allow1510NoNo
18618432FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUTMarch 2024March 2025Allow1210NoNo
18603483SEMICONDUCTOR DEVICE STRUCTURESMarch 2024March 2025Allow1210YesNo
18594816SEMICONDUCTOR DEVICEMarch 2024September 2024Allow700NoNo
18443368METAL LANDING ON TOP ELECTRODE OF RRAMFebruary 2024November 2024Allow910NoNo
18432788SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENTFebruary 2024September 2024Allow700NoNo
18402611SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACESJanuary 2024December 2024Allow1110YesNo
18519538APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKSNovember 2023December 2024Allow1301NoNo
18515657Standard Cell Layout for Better RoutabilityNovember 2023March 2025Allow1610NoNo
18491661HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HAVING INTERCONNECTION TUNING CIRCUITSOctober 2023April 2025Allow1810NoNo
18488440PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTUREOctober 2023March 2025Allow1711NoNo
18378733Semiconductor Device and Method for Fabricating a Semiconductor DeviceOctober 2023November 2024Allow1310NoNo
18374396SEMICONDUCTOR PACKAGESeptember 2023May 2025Allow1911YesNo
18373295MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAMESeptember 2023August 2024Allow1010NoNo
18473412SEMICONDUCTOR DEVICESSeptember 2023March 2025Allow1721YesNo
18244716DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATESeptember 2023October 2024Allow1310YesNo
18232523SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCHAugust 2023September 2024Allow1410NoNo
18448117MEMORY CELL ARRAY CIRCUIT AND METHOD OF FORMING THE SAMEAugust 2023February 2025Allow1820NoNo
18230546SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAMEAugust 2023September 2024Allow1410YesNo
18346511SOURCE/DRAIN REGIONS OF FINFET DEVICES AND METHODS OF FORMING SAMEJuly 2023September 2024Allow1510YesNo
18345259MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAMEJune 2023May 2025Allow2220NoNo
18342749INTEGRATED CIRCUIT PACKAGESJune 2023December 2024Allow1711NoNo
18336100EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATIONJune 2023September 2024Allow1510NoNo
18197245FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAMEMay 2023April 2024Allow1100NoNo
18140427MULTI-LEVEL MICRO-DEVICE TETHERSApril 2023November 2024Allow1811NoNo
18306832Flip-Chip Package AssemblyApril 2023December 2024Allow1910NoNo
18306194PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HAVING GROUND PLATES AND SIGNAL LINESApril 2023November 2024Allow1810NoNo
18133970INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAMEApril 2023June 2024Allow1400NoNo
18295942POWER MODULE AND RELATED METHODSApril 2023September 2024Allow1811NoNo
18126759INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP HAVING PADS OF DIFFERENT WIDTHS AND SEMICONDUCTOR PACKAGE INCLUDING THE INTERCONNETION STRUCTUREMarch 2023January 2025Allow2220YesNo
18190935MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGEMarch 2023August 2024Allow1700NoNo
18025971RESISTIVE RANDOM-ACCESS MEMORY USING STACKED TECHNOLOGYMarch 2023June 2025Allow2700NoNo
18182314HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HAVING INTERCONNECTION TUNING CIRCUITSMarch 2023September 2023Allow620YesNo
18113070MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAMEFebruary 2023June 2024Allow1610NoNo
18103505OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTORJanuary 2023April 2024Allow1510NoNo
18160631ORGANIC LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS INCLUDING THE SAMEJanuary 2023March 2024Allow1410NoNo
18156123Reduction of Line WigglingJanuary 2023May 2025Allow2821NoNo
18091781MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTSDecember 2022September 2024Allow2120NoNo
18091509FAN-OUT SEMICONDUCTOR PACKAGE INCLUDING UNDER-BUMP METALLURGYDecember 2022December 2023Allow1100NoNo
17983469NON-VOLATILE MEMORY DEVICENovember 2022June 2025Allow3100NoNo
18051459METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING SOURCE STRUCTURES OVERLYING STACK STRUCTURESOctober 2022December 2023Allow1300NoNo
17949325ELECTRICAL COMPONENT WITH A DIELECTRIC PASSIVATION STACKSeptember 2022June 2024Allow2110NoNo
17931284STACKED INTERPOSER STRUCTURESSeptember 2022September 2024Allow2411NoNo
17930149SEMICONDUCTOR DEVICESeptember 2022June 2025Allow3300NoNo
17887385SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENTAugust 2022December 2023Allow1601NoNo
17886945IMAGE SENSOR STRUCTURE FOR REDUCED PIXEL PITCH AND METHODS THEREOFAugust 2022June 2025Allow3400NoNo
17818595Method of Modulating Stress of Dielectric LayersAugust 2022June 2024Allow2301NoNo
17817429DISPLAY PANELAugust 2022December 2023Allow1700NoNo
17815177Semiconductor Device StructuresJuly 2022February 2024Allow1910NoNo
17814840SEMICONDUCTOR DEVICEJuly 2022February 2024Allow1910NoNo
17872023JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFJuly 2022April 2024Allow2110NoNo
17813872SILICON PHOTOMULTIPLIERS WITH SPLIT MICROCELLSJuly 2022March 2024Allow2010NoNo
17869571SEMICONDUCTOR ARRANGEMENT WITH AIRGAP AND METHOD OF FORMINGJuly 2022May 2025Allow3440YesNo
17813820Bump Joint Structure with Distortion and Method Forming SameJuly 2022February 2024Allow1910NoNo
17856154PACKAGE STRUCTURE WITH FAN-OUT FEATUREJuly 2022June 2024Allow2420NoNo
17808889Semiconductor Package Including Cavity-Mounted DeviceJune 2022July 2024Allow2520NoNo
17844590Distributed FET Back-Bias NetworkJune 2022March 2024Allow2111NoNo
17844200CHIP PACKAGE STRUCTURE AND STORAGE SYSTEMJune 2022March 2025Allow3310NoNo
17842600MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTSJune 2022October 2023Allow1610NoNo
17842103SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAMEJune 2022June 2025Allow3610NoNo
17841683SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACESJune 2022October 2023Allow1610YesNo
17835986MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAMEJune 2022August 2023Allow1411NoNo
17827159DISPLAY DEVICE AND METHOD OF FABRICATING THE SAMEMay 2022June 2025Allow3611NoNo
17826491OLED DISPLAY PANEL, PREPARATION METHOD THEREOF AND OLED DISPLAY DEVICEMay 2022September 2023Allow1610NoNo
17749918Flexible Substrate, Manufacturing Method for Flexible Substrate and Display DeviceMay 2022October 2023Allow1710NoNo
17744884CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYERMay 2022January 2024Allow2011YesNo
17734156Standard Cell Layout for Better RoutabilityMay 2022September 2023Allow1610NoNo
17731807FLEXIBLE DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, DISPLAY PANEL AND DISPLAY APPARATUSApril 2022August 2023Allow1510NoNo
17729321TITANIUM LAYER AS GETTER LAYER FOR HYDROGEN IN A MIM DEVICEApril 2022August 2024Allow2721NoNo
17728048INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCEApril 2022January 2025Allow3313NoNo
17726238PROTECTIVE FILM, DISPLAY MODULE, DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY MODULE, AND METHOD OF MANUFACTURING DISPLAY DEVICEApril 2022August 2023Allow1610NoNo
17724124WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MANUFACTURING THE IMAGING SYSTEM, AND ELECTRONIC APPARATUS INCLUDING THE IMAGING SYSTEMApril 2022December 2024Allow3211YesNo
17717194SEMICONDUCTOR DEVICEApril 2022July 2023Allow1510NoNo
17714940DISPLAY DEVICEApril 2022March 2025Allow3500NoNo
17712300QUANTUM DEVICEApril 2022June 2025Allow3921NoNo
17657446HIGH DENSITY STACKED VERTICAL TRANSISTOR STATIC RANDOM ACCESS MEMORY STRUCTUREMarch 2022June 2025Allow3910YesNo
17705121PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVE IN HORIZONTAL DIRECTION AND VERTICAL DIRECTION AND METHOD MAKING THE SAMEMarch 2022March 2024Allow2400NoNo
17702659COLOR CHANGING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAMEMarch 2022April 2025Allow3701NoNo
17694913METAL LANDING ON TOP ELECTRODE OF RRAMMarch 2022November 2023Allow2020NoNo
17691792SEMICONDUCTOR DEVICEMarch 2022February 2025Allow3520NoNo
17687342SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIP HAVING ELONGATED BUMPSMarch 2022September 2024Allow3111YesNo
17687350SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEMICONDUCTOR DIE AND HEAT SPREADING STRUCTUREMarch 2022December 2023Allow2211NoNo
17640752WIRING DESIGN METHOD, WIRING STRUCTURE, AND FLIP CHIPMarch 2022October 2023Allow1910NoNo
17652782SEMICONDUCTOR PACKAGEFebruary 2022August 2024Allow2911YesNo
17680531TUNABLE WHITE LIGHTING SYSTEMSFebruary 2022September 2023Allow1910NoNo
17673865SEMICONDUCTOR PACKAGE HAVING INTERPOSER SUBSTRATEFebruary 2022December 2024Allow3411YesNo
17671530Method for Fabricating a Semiconductor DeviceFebruary 2022September 2023Abandon1920NoNo
17665501CONTAMINANT COLLECTION ON SOIFebruary 2022October 2023Allow2001NoNo
17582870SYSTEM PACKAGING FOR CELLULAR MODEM AND TRANSCEIVER SYSTEM OF HETEROGENEOUS STACKINGJanuary 2022January 2025Allow3620YesNo
17577834ISOLATION IN INTEGRATED CIRCUIT DEVICESJanuary 2022June 2024Abandon2930NoNo
17568740IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOFJanuary 2022October 2022Allow900NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner VU, HUNG K.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
2
Examiner Affirmed
2
(100.0%)
Examiner Reversed
0
(0.0%)
Reversal Percentile
13.9%
Lower than average

What This Means

With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.

Strategic Value of Filing an Appeal

Total Appeal Filings
10
Allowed After Appeal Filing
2
(20.0%)
Not Allowed After Appeal Filing
8
(80.0%)
Filing Benefit Percentile
22.7%
Lower than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 20.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.

Strategic Recommendations

Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.

Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.

Examiner VU, HUNG K - Prosecution Strategy Guide

Executive Summary

Examiner VU, HUNG K works in Art Unit 2897 and has examined 978 patent applications in our dataset. With an allowance rate of 92.8%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 21 months.

Allowance Patterns

Examiner VU, HUNG K's allowance rate of 92.8% places them in the 79% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.

Office Action Patterns

On average, applications examined by VU, HUNG K receive 1.31 office actions before reaching final disposition. This places the examiner in the 26% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by VU, HUNG K is 21 months. This places the examiner in the 86% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a +4.9% benefit to allowance rate for applications examined by VU, HUNG K. This interview benefit is in the 29% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 39.7% of applications are subsequently allowed. This success rate is in the 89% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 36.1% of cases where such amendments are filed. This entry rate is in the 47% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 133.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 85% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 80.0% of appeals filed. This is in the 69% percentile among all examiners. Of these withdrawals, 75.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.

Petition Practice

When applicants file petitions regarding this examiner's actions, 52.5% are granted (fully or in part). This grant rate is in the 65% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 1.3% of allowed cases (in the 72% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).

Quayle Actions: This examiner issues Ex Parte Quayle actions in 7.3% of allowed cases (in the 84% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

  • RCEs are effective: This examiner has a high allowance rate after RCE compared to others. If you receive a final rejection and have substantive amendments or arguments, an RCE is likely to be successful.
  • Request pre-appeal conferences: PACs are highly effective with this examiner. Before filing a full appeal brief, request a PAC to potentially resolve issues without full PTAB review.

Relevant MPEP Sections for Prosecution Strategy

  • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
  • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
  • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
  • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
  • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
  • MPEP § 1214.07: Reopening prosecution after appeal

Important Disclaimer

Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.