Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18969220 | Vertical Power Semiconductor Device and Manufacturing Method Thereof | December 2024 | September 2025 | Allow | 9 | 1 | 1 | No | No |
| 18640636 | SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN VIA | April 2024 | October 2025 | Allow | 18 | 3 | 0 | No | No |
| 18602533 | INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS | March 2024 | March 2025 | Allow | 12 | 1 | 0 | No | No |
| 18600278 | MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT BONDING OF A SUBSTRATE | March 2024 | July 2025 | Allow | 16 | 2 | 0 | Yes | No |
| 18593536 | INTEGRATED CIRCUIT PACKAGE AND METHOD | March 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18544416 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18521947 | Foldable Display Apparatus | November 2023 | November 2025 | Allow | 23 | 2 | 0 | No | No |
| 18380754 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | October 2023 | July 2024 | Allow | 9 | 1 | 0 | No | No |
| 18377639 | DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCONNECT | October 2023 | October 2024 | Allow | 13 | 1 | 0 | No | No |
| 18375133 | ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES | September 2023 | July 2025 | Allow | 22 | 2 | 0 | No | No |
| 18232759 | INTEGRATED CIRCUIT WITH MIXED ROW HEIGHTS | August 2023 | November 2024 | Allow | 15 | 2 | 0 | No | No |
| 18361384 | MEMORY DEVICE | July 2023 | March 2025 | Allow | 20 | 1 | 0 | No | No |
| 18359377 | SEMICONDUCTOR STRUCTURE WITH EMBEDDED MEMORY DEVICE | July 2023 | September 2024 | Allow | 14 | 2 | 0 | Yes | No |
| 18359425 | HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION | July 2023 | May 2024 | Allow | 10 | 1 | 0 | No | No |
| 18225064 | MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING SAME | July 2023 | April 2024 | Allow | 8 | 2 | 0 | No | No |
| 18213852 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | June 2023 | February 2026 | Allow | 32 | 1 | 0 | Yes | No |
| 18210808 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | June 2023 | August 2024 | Allow | 14 | 1 | 0 | No | No |
| 18329721 | SEMICONDUCTOR PACKAGE STRUCTURE | June 2023 | August 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18201134 | PHOTOELECTRIC CONVERSION ELEMENT AND SOLID-STATE IMAGING DEVICE | May 2023 | November 2024 | Allow | 18 | 2 | 0 | No | No |
| 18197254 | IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING DEVICE | May 2023 | August 2024 | Allow | 15 | 1 | 0 | No | No |
| 18195090 | MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS AND METHOD FOR THE SAME | May 2023 | February 2024 | Allow | 9 | 1 | 0 | No | No |
| 18195304 | MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS AND METHOD FOR THE SAME | May 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18312748 | ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS | May 2023 | March 2025 | Abandon | 22 | 2 | 0 | No | No |
| 18131402 | ORGANIC ELECTROLUMINESCENT DEVICES | April 2023 | June 2024 | Allow | 14 | 1 | 0 | No | No |
| 18295192 | SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18167879 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | February 2023 | June 2024 | Allow | 16 | 1 | 0 | No | No |
| 18167102 | PACKAGE | February 2023 | April 2024 | Allow | 14 | 1 | 0 | No | No |
| 18161066 | SEMICONDUCTOR PACKAGE | January 2023 | June 2024 | Allow | 16 | 1 | 0 | No | No |
| 18160498 | SEMICONDUCTOR PACKAGES | January 2023 | February 2024 | Allow | 13 | 1 | 0 | No | No |
| 18099663 | SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER | January 2023 | March 2024 | Allow | 14 | 1 | 0 | Yes | No |
| 18151517 | SEMICONDUCTOR PACKAGE | January 2023 | March 2024 | Allow | 14 | 1 | 0 | No | No |
| 18091982 | ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES | December 2022 | May 2025 | Allow | 28 | 2 | 0 | No | No |
| 18090876 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | December 2022 | February 2024 | Allow | 14 | 2 | 0 | No | No |
| 18063384 | METAL POCKET FANOUT PACKAGE | December 2022 | March 2026 | Allow | 39 | 3 | 0 | No | No |
| 18074027 | Heat Dissipation in Semiconductor Packages and Methods of Forming Same | December 2022 | April 2024 | Allow | 17 | 2 | 0 | No | No |
| 18060812 | SEMICONDUCTOR PACKAGE | December 2022 | July 2025 | Allow | 31 | 2 | 0 | Yes | No |
| 18072276 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES | November 2022 | February 2026 | Allow | 39 | 1 | 1 | Yes | No |
| 17994409 | PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF | November 2022 | February 2026 | Allow | 39 | 3 | 0 | Yes | No |
| 17986169 | SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | November 2022 | February 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 17983018 | SEMICONDUCTOR PACKAGE | November 2022 | February 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 17979233 | SEMICONDUCTOR PACKAGES HAVING UPPER CONDUCTIVE PATTERNS | November 2022 | February 2026 | Allow | 39 | 2 | 0 | Yes | No |
| 17973057 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | October 2022 | February 2024 | Allow | 15 | 1 | 0 | No | No |
| 18047113 | METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION | October 2022 | April 2024 | Allow | 18 | 0 | 1 | No | No |
| 17963067 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | October 2022 | March 2024 | Allow | 17 | 1 | 0 | No | No |
| 17957138 | TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR | September 2022 | March 2026 | Allow | 42 | 1 | 1 | No | No |
| 17955557 | ELECTRONIC DEVICE | September 2022 | July 2025 | Allow | 33 | 1 | 0 | No | No |
| 17951474 | INTERCONNECT STRUCTURE INCLUDING GRAPHENE-METAL BARRIER AND METHOD OF MANUFACTURING THE SAME | September 2022 | February 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 17943849 | SEMICONDUCTOR DEVICE WITH DECOUPLING CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | September 2022 | September 2025 | Allow | 36 | 1 | 0 | No | No |
| 17930515 | SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR | September 2022 | March 2026 | Allow | 42 | 1 | 0 | No | No |
| 17929159 | SEMICONDUCTOR PACKAGE | September 2022 | February 2026 | Allow | 42 | 1 | 0 | Yes | No |
| 17896797 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | August 2022 | October 2025 | Allow | 38 | 1 | 0 | Yes | No |
| 17891516 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE DEVICE | August 2022 | October 2025 | Abandon | 38 | 1 | 0 | No | No |
| 17891218 | Package with Improved Heat Dissipation Efficiency and Method for Forming the Same | August 2022 | July 2025 | Allow | 34 | 1 | 0 | No | No |
| 17892036 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGIC-SUPPORTING INTERPOSERS | August 2022 | February 2026 | Allow | 42 | 2 | 0 | No | No |
| 17892007 | HVIC DEVICE WITH COMBINED LEVEL SHIFTER AND BOOST DIODE IN JUNCTION TERMINATION REGION | August 2022 | February 2026 | Allow | 42 | 1 | 1 | No | No |
| 17887557 | SEMICONDUCTOR PACKAGE | August 2022 | May 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17884579 | SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | August 2022 | February 2024 | Allow | 18 | 1 | 0 | Yes | No |
| 17883568 | INTEGRATED FAN-OUT PACKAGING | August 2022 | April 2024 | Allow | 20 | 2 | 0 | No | No |
| 17880687 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | August 2022 | May 2025 | Allow | 33 | 1 | 0 | No | No |
| 17876695 | Device And Method For Detecting Miniature Targets In A Fluid Sample | July 2022 | October 2025 | Allow | 39 | 1 | 1 | Yes | No |
| 17814836 | FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER | July 2022 | July 2025 | Allow | 36 | 1 | 0 | No | No |
| 17867388 | SEMICONDUCTOR PACKAGE | July 2022 | December 2023 | Allow | 17 | 1 | 0 | No | No |
| 17865962 | SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN VIA | July 2022 | February 2024 | Allow | 19 | 2 | 0 | No | No |
| 17863047 | PACKAGE STRUCTURE AND PACKAGE SYSTEM | July 2022 | August 2025 | Allow | 37 | 3 | 0 | No | No |
| 17862586 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | July 2022 | June 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17862300 | ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES | July 2022 | July 2025 | Allow | 37 | 2 | 0 | No | No |
| 17856309 | SEMICONDUCTOR PACKAGE AND CAMERA MODULE | July 2022 | August 2023 | Allow | 14 | 1 | 0 | No | No |
| 17854386 | Integrated Circuit Package and Method | June 2022 | November 2023 | Allow | 17 | 1 | 0 | No | No |
| 17834444 | ELECTRONIC COMPONENT | June 2022 | September 2023 | Allow | 15 | 1 | 0 | No | No |
| 17830830 | TRANSISTOR INTEGRATION ON A SILICON-ON-INSULATOR SUBSTRATE | June 2022 | July 2024 | Allow | 25 | 1 | 1 | No | No |
| 17825240 | MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT BONDING OF A SUBSTRATE | May 2022 | February 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17751234 | Dummy through vias for Integrated Circuit Packages and Methods of Forming the Same | May 2022 | September 2025 | Allow | 39 | 2 | 0 | Yes | No |
| 17746987 | ELECTRONIC DEVICE AND METHOD OF FABRICATING AN ELECTRONIC DEVICE | May 2022 | July 2025 | Allow | 38 | 3 | 0 | No | No |
| 17745577 | DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF | May 2022 | October 2025 | Allow | 41 | 2 | 0 | Yes | No |
| 17739574 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | May 2022 | June 2023 | Allow | 13 | 1 | 0 | No | No |
| 17740085 | Foldable Display Apparatus | May 2022 | August 2023 | Allow | 16 | 1 | 0 | No | No |
| 17725091 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | April 2022 | January 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17722412 | ELECTRONIC DEVICE | April 2022 | January 2025 | Allow | 33 | 1 | 0 | No | No |
| 17769022 | SUBSTRATE, BACKLIGHT MODULE, AND DISPLAY APPARATUS | April 2022 | January 2025 | Allow | 34 | 1 | 0 | No | No |
| 17658600 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE INCLUDING A POWER SUPPLY WIRE | April 2022 | August 2023 | Allow | 16 | 1 | 0 | No | No |
| 17713237 | DISPLAY PANEL AND ELECTRONIC DEVICE INCLUDING THE SAME | April 2022 | December 2025 | Allow | 44 | 2 | 0 | Yes | No |
| 17707953 | SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PRODUCT | March 2022 | March 2025 | Abandon | 35 | 1 | 0 | No | No |
| 17705378 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | March 2022 | August 2023 | Allow | 16 | 1 | 0 | No | No |
| 17703967 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | March 2022 | February 2026 | Allow | 47 | 4 | 0 | Yes | No |
| 17702008 | SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD THEREOF | March 2022 | January 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17702412 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | March 2022 | August 2025 | Allow | 41 | 1 | 1 | No | No |
| 17701468 | Heat-Dissipating Structures for Semiconductor Devices and Methods of Manufacture | March 2022 | December 2024 | Allow | 32 | 1 | 0 | No | No |
| 17696157 | SEMICONDUCTOR DEVICE | March 2022 | June 2023 | Allow | 15 | 1 | 0 | No | No |
| 17654907 | Dicing Process in Packages Comprising Organic Interposers | March 2022 | August 2025 | Allow | 41 | 2 | 0 | No | No |
| 17694759 | SEMICONDUCTOR DEVICE | March 2022 | June 2023 | Allow | 15 | 1 | 0 | No | No |
| 17695110 | SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN | March 2022 | February 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17695478 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE | March 2022 | September 2024 | Allow | 31 | 0 | 0 | No | No |
| 17693358 | SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PRODUCT | March 2022 | March 2025 | Abandon | 36 | 1 | 0 | No | No |
| 17686856 | Heat Dissipation Structures for Integrated Circuit Packages and Methods of Forming the Same | March 2022 | May 2025 | Allow | 38 | 2 | 0 | No | No |
| 17683725 | ENHANCED BONDING BETWEEN III-V MATERIAL AND OXIDE MATERIAL | March 2022 | June 2024 | Allow | 28 | 1 | 1 | No | No |
| 17680194 | METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES | February 2022 | August 2023 | Allow | 18 | 1 | 0 | No | No |
| 17679039 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE COMPRISING SEMICONDUCTOR DEVICE | February 2022 | December 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17585402 | INTEGRATED CIRCUIT WITH MIXED ROW HEIGHTS | January 2022 | July 2023 | Allow | 18 | 1 | 0 | No | No |
| 17583495 | POWER OVERLAY MODULE WITH THERMAL STORAGE | January 2022 | October 2024 | Allow | 33 | 2 | 0 | No | No |
| 17647176 | IC STRUCTURE INCLUDING POROUS SEMICONDUCTOR LAYER IN BULK SUBSTRATE ADJACENT TRENCH ISOLATION | January 2022 | July 2024 | Allow | 30 | 0 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PRASAD, NEIL R.
With a 100.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 40.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner PRASAD, NEIL R works in Art Unit 2897 and has examined 612 patent applications in our dataset. With an allowance rate of 85.1%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 22 months.
Examiner PRASAD, NEIL R's allowance rate of 85.1% places them in the 61% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by PRASAD, NEIL R receive 1.78 office actions before reaching final disposition. This places the examiner in the 39% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by PRASAD, NEIL R is 22 months. This places the examiner in the 89% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +9.8% benefit to allowance rate for applications examined by PRASAD, NEIL R. This interview benefit is in the 42% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 35.4% of applications are subsequently allowed. This success rate is in the 79% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 46.8% of cases where such amendments are filed. This entry rate is in the 71% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 160.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 91% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 94.4% of appeals filed. This is in the 85% percentile among all examiners. Of these withdrawals, 52.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 64.3% are granted (fully or in part). This grant rate is in the 69% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 1.0% of allowed cases (in the 67% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 34% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.