Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18737527 | SEMICONDUCTOR PACKAGE | June 2024 | April 2025 | Allow | 10 | 0 | 1 | No | No |
| 18678306 | SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER | May 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18645786 | SEMICONDUCTOR PACKAGE STRUCTURE | April 2024 | May 2025 | Allow | 13 | 0 | 1 | No | No |
| 18637737 | SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS | April 2024 | June 2025 | Allow | 14 | 1 | 1 | No | No |
| 18587981 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | February 2024 | March 2025 | Allow | 12 | 0 | 1 | No | No |
| 18440068 | Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering | February 2024 | July 2025 | Allow | 17 | 2 | 1 | No | No |
| 18433228 | METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT | February 2024 | June 2025 | Allow | 17 | 1 | 1 | No | No |
| 18421198 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | January 2024 | March 2025 | Allow | 13 | 1 | 1 | No | No |
| 18415143 | SEMICONDUCTOR DEVICE HAVING EPITAXY SOURCE/DRAIN REGIONS | January 2024 | May 2025 | Allow | 16 | 1 | 1 | No | No |
| 18407410 | ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANNEL INTERFACE | January 2024 | August 2024 | Allow | 7 | 1 | 1 | No | No |
| 18401769 | SELF-ALIGNED SPACERS FOR MULTI-GATE DEVICES AND METHOD OF FABRICATION THEREOF | January 2024 | March 2025 | Allow | 15 | 1 | 1 | No | No |
| 18397898 | METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD | December 2023 | May 2025 | Allow | 16 | 1 | 1 | No | No |
| 18536773 | mmWAVE ANTENNA-FILTER MODULE | December 2023 | June 2025 | Allow | 18 | 1 | 0 | No | No |
| 18513866 | SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN | November 2023 | May 2025 | Allow | 18 | 1 | 1 | No | No |
| 18494897 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | October 2023 | April 2025 | Allow | 18 | 1 | 0 | No | No |
| 18494827 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE | October 2023 | June 2025 | Allow | 19 | 1 | 1 | No | No |
| 18482743 | PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF | October 2023 | February 2025 | Allow | 16 | 1 | 1 | No | No |
| 18475926 | SEMICONDUCTOR PACKAGE | September 2023 | August 2024 | Allow | 11 | 0 | 1 | No | No |
| 18472244 | FILTER PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME | September 2023 | March 2024 | Allow | 6 | 1 | 1 | No | No |
| 18459248 | RF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR | August 2023 | September 2024 | Allow | 13 | 0 | 1 | No | No |
| 18231871 | IMAGING DEVICE AND ELECTRONIC DEVICE | August 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18231382 | DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME | August 2023 | October 2024 | Allow | 14 | 0 | 1 | No | No |
| 18361122 | Methods for Fabricating FinFETs Having Different Fin Numbers and Corresponding FinFETs Thereof | July 2023 | July 2024 | Allow | 11 | 0 | 1 | No | No |
| 18226264 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18226262 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | July 2023 | October 2024 | Allow | 15 | 2 | 0 | No | No |
| 18359688 | Semiconductor Device and Method of Forming a Slot in EMI Shielding with Improved Removal Depth | July 2023 | January 2025 | Allow | 18 | 1 | 1 | No | No |
| 18355524 | HYBRID BOND PAD STRUCTURE | July 2023 | January 2025 | Allow | 18 | 1 | 1 | No | No |
| 18346767 | METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY DEVICE | July 2023 | December 2024 | Allow | 18 | 1 | 1 | No | No |
| 18217721 | SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS | July 2023 | August 2024 | Allow | 13 | 1 | 1 | No | No |
| 18210392 | INTEGRATED FUSE | June 2023 | June 2024 | Allow | 12 | 0 | 1 | No | No |
| 18204505 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | June 2023 | January 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18323239 | SEMICONDUCTOR PACKAGES INCLUDING DAM PATTERNS AND METHODS FOR MANUFACTURING THE SAME | May 2023 | March 2025 | Allow | 21 | 1 | 1 | No | No |
| 18322440 | SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER | May 2023 | November 2024 | Allow | 18 | 1 | 1 | No | No |
| 18321391 | Semiconductor Device and Method of Forming Bump Pad Array on Substrate for Ground Connection for Heat Sink/Shielding Structure | May 2023 | November 2024 | Allow | 18 | 1 | 1 | No | No |
| 18303595 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | April 2023 | February 2025 | Allow | 22 | 2 | 1 | Yes | No |
| 18135067 | EMIB PATCH ON GLASS LAMINATE SUBSTRATE | April 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18297469 | SUBSTRATE POLISHING APPARATUS AND POLISHING LIQUID DISCHARGE METHOD IN SUBSTRATE POLISHING APPARATUS | April 2023 | August 2024 | Allow | 17 | 1 | 0 | No | No |
| 18187786 | POLISHING METHOD AND POLISHING APPARATUS | March 2023 | April 2024 | Allow | 13 | 0 | 1 | No | No |
| 18124069 | ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PACKAGE STRUCTURE | March 2023 | April 2024 | Allow | 13 | 0 | 0 | No | No |
| 18185602 | FinFET Device and Methods of Forming the Same | March 2023 | July 2024 | Allow | 16 | 1 | 1 | No | No |
| 18182111 | SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN | March 2023 | November 2024 | Allow | 21 | 2 | 1 | Yes | No |
| 18174790 | Selective EMI Shielding Using Preformed Mask with Fang Design | February 2023 | December 2024 | Allow | 22 | 3 | 1 | No | No |
| 18113062 | METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE | February 2023 | July 2024 | Allow | 17 | 1 | 1 | No | No |
| 18106203 | SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE | February 2023 | September 2024 | Allow | 19 | 1 | 1 | No | No |
| 18162878 | SEMICONDUCTOR PACKAGE | February 2023 | July 2024 | Allow | 18 | 1 | 0 | Yes | No |
| 18103584 | SEMICONDUCTOR PACKAGE | January 2023 | July 2024 | Allow | 17 | 1 | 1 | No | No |
| 18099136 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | January 2023 | July 2024 | Allow | 18 | 1 | 1 | No | No |
| 18097965 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | January 2023 | February 2024 | Allow | 13 | 0 | 1 | No | No |
| 18097847 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | January 2023 | December 2024 | Allow | 23 | 2 | 1 | No | No |
| 18151917 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MAKING | January 2023 | August 2024 | Allow | 20 | 1 | 1 | No | No |
| 18149472 | Process Control for Package Formation | January 2023 | August 2024 | Allow | 19 | 2 | 1 | No | No |
| 18149205 | CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CERAMIC LAMINATED SUBSTRATE | January 2023 | September 2024 | Allow | 20 | 2 | 1 | No | No |
| 18090801 | MICROELECTRONIC ASSEMBLIES | December 2022 | June 2024 | Allow | 17 | 1 | 1 | No | No |
| 18086610 | ISOLATED TRANSFORMER WITH INTEGRATED SHIELD TOPOLOGY FOR REDUCED EMI | December 2022 | December 2023 | Allow | 12 | 0 | 1 | No | No |
| 18064027 | INTEGRATED CIRCUIT HAVING NON-INTEGRAL MULTIPLE PITCH | December 2022 | July 2024 | Allow | 19 | 1 | 1 | No | No |
| 18054295 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | November 2022 | March 2024 | Allow | 16 | 2 | 1 | Yes | No |
| 18050772 | DEVICES COMPRISING CRYSTALLINE MATERIALS | October 2022 | March 2024 | Allow | 17 | 1 | 0 | No | No |
| 17975223 | COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES | October 2022 | June 2024 | Allow | 19 | 2 | 1 | Yes | No |
| 17961372 | Low Leakage FET | October 2022 | May 2024 | Allow | 20 | 1 | 1 | No | No |
| 17960568 | LASER DICING FOR SINGULATION | October 2022 | September 2024 | Allow | 23 | 1 | 1 | No | No |
| 17929858 | VERTICAL SEMICONDUCTOR DEVICE WITH IMPROVED RUGGEDNESS | September 2022 | April 2024 | Allow | 20 | 1 | 1 | No | No |
| 17819271 | Semiconductor Device and Method of Compartment Shielding Using Bond Wires | August 2022 | February 2024 | Allow | 19 | 1 | 1 | No | No |
| 17885048 | MICROELECTRONIC ASSEMBLIES | August 2022 | February 2025 | Allow | 30 | 3 | 1 | No | No |
| 17884515 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2022 | April 2024 | Allow | 20 | 1 | 1 | No | No |
| 17818135 | METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE | August 2022 | February 2024 | Allow | 18 | 1 | 0 | No | No |
| 17817690 | METHODS OF FORMING MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES | August 2022 | August 2024 | Allow | 25 | 2 | 1 | No | No |
| 17878599 | SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES | August 2022 | February 2024 | Allow | 19 | 1 | 0 | No | No |
| 17816376 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | July 2022 | April 2024 | Allow | 21 | 1 | 1 | No | No |
| 17816264 | SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF | July 2022 | March 2024 | Allow | 20 | 1 | 0 | No | No |
| 17815713 | Bonding Through Multi-Shot Laser Reflow | July 2022 | March 2024 | Allow | 19 | 1 | 1 | No | No |
| 17875026 | METAL INSULATOR METAL CAPACITOR STRUCTURE HAVING HIGH CAPACITANCE | July 2022 | December 2023 | Allow | 17 | 1 | 0 | Yes | No |
| 17873274 | Epitaxies of a Chemical Compound Semiconductor | July 2022 | April 2024 | Allow | 21 | 1 | 1 | No | No |
| 17873835 | SEMICONDUCTOR STRUCTURE | July 2022 | February 2024 | Allow | 19 | 1 | 1 | No | No |
| 17872731 | RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS | July 2022 | March 2024 | Allow | 20 | 1 | 1 | No | No |
| 17814152 | Via for Semiconductor Device Connection and Methods of Forming the Same | July 2022 | December 2023 | Allow | 17 | 1 | 1 | No | No |
| 17870222 | Semiconductor Device and Method of Manufacture | July 2022 | July 2024 | Allow | 24 | 2 | 1 | No | No |
| 17869296 | Forming Large Chips Through Stitching | July 2022 | July 2024 | Allow | 24 | 2 | 1 | No | No |
| 17813000 | STRUCTURE AND FORMATION METHOD OF FIN-LIKE FIELD EFFECT TRANSISTOR | July 2022 | May 2024 | Allow | 22 | 1 | 1 | No | No |
| 17850225 | MAGNETIC RANDOM ACCESS MEMORY | June 2022 | May 2024 | Allow | 22 | 1 | 1 | No | No |
| 17789119 | STACKED SEMICONDUCTOR DEVICE | June 2022 | March 2025 | Allow | 33 | 1 | 0 | No | No |
| 17847573 | PIXEL STRUCTURE, IMAGE SENSOR DEVICE AND SYSTEM WITH PIXEL STRUCTURE, AND METHOD OF OPERATING THE PIXEL STRUCTURE | June 2022 | October 2024 | Allow | 28 | 1 | 1 | No | No |
| 17838412 | SEMICONDUCTOR PACKAGE STRUCTURE | June 2022 | February 2024 | Allow | 20 | 1 | 1 | Yes | No |
| 17832019 | THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO BOND LINE THICKNESS | June 2022 | February 2024 | Allow | 21 | 1 | 1 | No | No |
| 17832488 | INTERCONNECT STRUCTURES IN INTEGRATED CIRCUIT CHIPS | June 2022 | June 2025 | Allow | 37 | 0 | 1 | No | No |
| 17825405 | MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE | May 2022 | December 2023 | Allow | 18 | 1 | 1 | No | No |
| 17775735 | METHOD FOR MANUFACTURING ARRAY SUBSTRATE, ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE | May 2022 | May 2025 | Allow | 36 | 1 | 1 | No | No |
| 17739329 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | May 2022 | May 2025 | Allow | 36 | 1 | 1 | Yes | No |
| 17733998 | MULTILAYER PACKAGE SUBSTRATE WITH IMPROVED CURRENT DENSITY DISTRIBUTION | April 2022 | February 2025 | Allow | 33 | 1 | 1 | No | No |
| 17727586 | Triple-Sided Module | April 2022 | May 2025 | Allow | 37 | 1 | 1 | No | No |
| 17721745 | SEMICONDUCTOR PACKAGE | April 2022 | February 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17718662 | SEMICONDUCTOR PACKAGE | April 2022 | October 2024 | Allow | 30 | 1 | 1 | Yes | No |
| 17715056 | ELECTRIC CONTACT STRUCTURE FOR THREE-DIMENSIONAL CHIP PACKAGE MODULE | April 2022 | December 2024 | Abandon | 32 | 1 | 0 | No | No |
| 17655801 | APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING | March 2022 | November 2024 | Allow | 32 | 1 | 1 | No | No |
| 17698611 | Semiconductor Packages with Thermal Lid and Methods of Forming the Same | March 2022 | February 2025 | Allow | 35 | 2 | 1 | No | No |
| 17697243 | SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUFACTURING THE SAME | March 2022 | September 2024 | Allow | 30 | 1 | 1 | Yes | No |
| 17655157 | Scalable Large System Based on Organic Interconnect | March 2022 | October 2024 | Allow | 31 | 1 | 1 | No | No |
| 17692693 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | March 2022 | January 2025 | Allow | 34 | 1 | 1 | No | No |
| 17654271 | MODULE | March 2022 | October 2024 | Allow | 31 | 1 | 1 | Yes | No |
| 17680617 | SEMICONDUCTOR PACKAGE | February 2022 | September 2024 | Allow | 31 | 1 | 1 | No | No |
| 17680410 | SEMICONDUCTOR PACKAGE | February 2022 | January 2025 | Allow | 35 | 1 | 1 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PHAM, LONG.
With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 41.2% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner PHAM, LONG works in Art Unit 2897 and has examined 585 patent applications in our dataset. With an allowance rate of 99.7%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 22 months.
Examiner PHAM, LONG's allowance rate of 99.7% places them in the 98% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by PHAM, LONG receive 1.17 office actions before reaching final disposition. This places the examiner in the 19% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by PHAM, LONG is 22 months. This places the examiner in the 82% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +0.4% benefit to allowance rate for applications examined by PHAM, LONG. This interview benefit is in the 13% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 38.0% of applications are subsequently allowed. This success rate is in the 84% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 53.7% of cases where such amendments are filed. This entry rate is in the 75% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 66.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 54% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 88.2% of appeals filed. This is in the 79% percentile among all examiners. Of these withdrawals, 40.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 45.2% are granted (fully or in part). This grant rate is in the 50% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 9.4% of allowed cases (in the 95% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 14.8% of allowed cases (in the 91% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.