Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18768003 | SEMICONDUCTOR DEVICE | July 2024 | October 2025 | Allow | 15 | 1 | 1 | No | No |
| 18761522 | DISPLAY PANEL AND DISPLAY DEVICE | July 2024 | August 2025 | Allow | 14 | 1 | 0 | No | No |
| 18757428 | THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO BOND LINE THICKNESS | June 2024 | March 2026 | Allow | 20 | 2 | 1 | No | No |
| 18744728 | SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF | June 2024 | August 2025 | Allow | 14 | 1 | 0 | No | No |
| 18743810 | METAL INSULATOR METAL CAPACITOR STRUCTURE HAVING HIGH CAPACITANCE | June 2024 | July 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18739424 | SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR | June 2024 | February 2026 | Allow | 20 | 1 | 1 | No | No |
| 18737527 | SEMICONDUCTOR PACKAGE | June 2024 | April 2025 | Allow | 10 | 0 | 1 | No | No |
| 18678306 | SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER | May 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18669118 | SEMICONDUCTOR PACKAGE | May 2024 | February 2026 | Allow | 21 | 1 | 1 | Yes | No |
| 18655932 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | May 2024 | July 2025 | Allow | 15 | 1 | 0 | Yes | No |
| 18648599 | PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER | April 2024 | November 2025 | Allow | 19 | 1 | 1 | No | No |
| 18645786 | SEMICONDUCTOR PACKAGE STRUCTURE | April 2024 | May 2025 | Allow | 13 | 0 | 1 | No | No |
| 18644953 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | April 2024 | August 2025 | Allow | 15 | 1 | 1 | No | No |
| 18643424 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | April 2024 | August 2025 | Allow | 15 | 1 | 1 | No | No |
| 18637737 | SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS | April 2024 | June 2025 | Allow | 14 | 1 | 1 | No | No |
| 18617492 | PLATED WALLS DEFINING MOLD COMPOUND CAVITIES | March 2024 | September 2025 | Allow | 18 | 1 | 1 | No | No |
| 18613954 | BONDING THROUGH MULTI-SHOT LASER REFLOW | March 2024 | November 2025 | Allow | 20 | 1 | 1 | No | No |
| 18602665 | VIA FOR SEMICONDUCTOR DEVICE CONNECTION | March 2024 | February 2026 | Allow | 23 | 1 | 1 | No | No |
| 18601094 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | March 2024 | October 2025 | Allow | 19 | 1 | 1 | No | No |
| 18599734 | EMBEDDED STRESS ABSORBER IN PACKAGE | March 2024 | October 2025 | Allow | 19 | 1 | 1 | No | No |
| 18595421 | DIE AND PACKAGE STRUCTURE | March 2024 | September 2025 | Allow | 18 | 1 | 1 | Yes | No |
| 18587981 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | February 2024 | March 2025 | Allow | 12 | 0 | 1 | No | No |
| 18587998 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | February 2024 | August 2025 | Allow | 18 | 1 | 1 | No | No |
| 18581162 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | February 2024 | November 2025 | Allow | 21 | 1 | 1 | No | No |
| 18440068 | Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering | February 2024 | July 2025 | Allow | 17 | 2 | 1 | No | No |
| 18439132 | POWER REDUCTION IN FINFET STRUCTURES | February 2024 | September 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18433228 | METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT | February 2024 | June 2025 | Allow | 17 | 1 | 1 | No | No |
| 18421198 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | January 2024 | March 2025 | Allow | 13 | 1 | 1 | No | No |
| 18415143 | SEMICONDUCTOR DEVICE HAVING EPITAXY SOURCE/DRAIN REGIONS | January 2024 | May 2025 | Allow | 16 | 1 | 1 | No | No |
| 18407410 | ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANNEL INTERFACE | January 2024 | August 2024 | Allow | 7 | 1 | 1 | No | No |
| 18403974 | SEMICONDUCTOR PACKAGE STRUCTURE | January 2024 | September 2025 | Allow | 20 | 2 | 1 | No | No |
| 18401769 | SELF-ALIGNED SPACERS FOR MULTI-GATE DEVICES AND METHOD OF FABRICATION THEREOF | January 2024 | March 2025 | Allow | 15 | 1 | 1 | No | No |
| 18397898 | METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD | December 2023 | May 2025 | Allow | 16 | 1 | 1 | No | No |
| 18541305 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | December 2023 | September 2025 | Allow | 21 | 1 | 1 | No | No |
| 18536773 | mmWAVE ANTENNA-FILTER MODULE | December 2023 | June 2025 | Allow | 18 | 1 | 0 | No | No |
| 18530423 | SELECTIVE ETCHES FOR REDUCING CONE FORMATION IN SHALLOW TRENCH ISOLATIONS | December 2023 | July 2025 | Allow | 20 | 1 | 0 | No | No |
| 18522890 | SEMICONDUCTOR STRUCTURE WITH SUPERLATTICES | November 2023 | March 2026 | Allow | 27 | 1 | 1 | No | No |
| 18519862 | CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE | November 2023 | July 2025 | Allow | 20 | 1 | 1 | No | No |
| 18513866 | SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN | November 2023 | May 2025 | Allow | 18 | 1 | 1 | No | No |
| 18506327 | Memory Arrays, and Methods of Forming Memory Arrays | November 2023 | July 2025 | Allow | 20 | 1 | 1 | No | No |
| 18494827 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE | October 2023 | June 2025 | Allow | 19 | 1 | 1 | No | No |
| 18494897 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | October 2023 | April 2025 | Allow | 18 | 1 | 0 | No | No |
| 18482743 | PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF | October 2023 | February 2025 | Allow | 16 | 1 | 1 | No | No |
| 18475926 | SEMICONDUCTOR PACKAGE | September 2023 | August 2024 | Allow | 11 | 0 | 1 | No | No |
| 18472244 | FILTER PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME | September 2023 | March 2024 | Allow | 6 | 1 | 1 | No | No |
| 18459248 | RF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR | August 2023 | September 2024 | Allow | 13 | 0 | 1 | No | No |
| 18231871 | IMAGING DEVICE AND ELECTRONIC DEVICE | August 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18231382 | DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME | August 2023 | October 2024 | Allow | 14 | 0 | 1 | No | No |
| 18361122 | Methods for Fabricating FinFETs Having Different Fin Numbers and Corresponding FinFETs Thereof | July 2023 | July 2024 | Allow | 11 | 0 | 1 | No | No |
| 18226264 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18359688 | Semiconductor Device and Method of Forming a Slot in EMI Shielding with Improved Removal Depth | July 2023 | January 2025 | Allow | 18 | 1 | 1 | No | No |
| 18226262 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | July 2023 | October 2024 | Allow | 15 | 2 | 0 | No | No |
| 18355524 | HYBRID BOND PAD STRUCTURE | July 2023 | January 2025 | Allow | 18 | 1 | 1 | No | No |
| 18346767 | METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY DEVICE | July 2023 | December 2024 | Allow | 18 | 1 | 1 | No | No |
| 18217721 | SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS | July 2023 | August 2024 | Allow | 13 | 1 | 1 | No | No |
| 18210392 | INTEGRATED FUSE | June 2023 | June 2024 | Allow | 12 | 0 | 1 | No | No |
| 18204505 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | June 2023 | January 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18323239 | SEMICONDUCTOR PACKAGES INCLUDING DAM PATTERNS AND METHODS FOR MANUFACTURING THE SAME | May 2023 | March 2025 | Allow | 21 | 1 | 1 | No | No |
| 18322440 | SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER | May 2023 | November 2024 | Allow | 18 | 1 | 1 | No | No |
| 18322374 | PLANARIZED MEMBRANE AND METHODS FOR SUBSTRATE PROCESSING SYSTEMS | May 2023 | October 2025 | Allow | 29 | 2 | 1 | No | No |
| 18321391 | Semiconductor Device and Method of Forming Bump Pad Array on Substrate for Ground Connection for Heat Sink/Shielding Structure | May 2023 | November 2024 | Allow | 18 | 1 | 1 | No | No |
| 18303595 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | April 2023 | February 2025 | Allow | 22 | 2 | 1 | Yes | No |
| 18135541 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE | April 2023 | March 2026 | Allow | 35 | 0 | 1 | No | No |
| 18134796 | MATERIALS, STRUCTURES, AND METHODS FOR OPTICAL AND ELECTRICAL III-NITRIDE SEMICONDUCTOR DEVICES | April 2023 | February 2025 | Allow | 22 | 0 | 1 | No | No |
| 18135067 | EMIB PATCH ON GLASS LAMINATE SUBSTRATE | April 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18297469 | SUBSTRATE POLISHING APPARATUS AND POLISHING LIQUID DISCHARGE METHOD IN SUBSTRATE POLISHING APPARATUS | April 2023 | August 2024 | Allow | 17 | 1 | 0 | No | No |
| 18188720 | Semiconductor Device and Method of Partial Shielding with Embedded Graphene Core Shells | March 2023 | January 2026 | Allow | 34 | 1 | 1 | No | No |
| 18188844 | Semiconductor Device and Method of Forming a 3-D Stacked Semiconductor Package Structure | March 2023 | January 2026 | Allow | 34 | 1 | 1 | No | No |
| 18124653 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | March 2023 | March 2026 | Allow | 35 | 1 | 1 | No | No |
| 18187786 | POLISHING METHOD AND POLISHING APPARATUS | March 2023 | April 2024 | Allow | 13 | 0 | 1 | No | No |
| 18124069 | ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PACKAGE STRUCTURE | March 2023 | April 2024 | Allow | 13 | 0 | 0 | No | No |
| 18185602 | FinFET Device and Methods of Forming the Same | March 2023 | July 2024 | Allow | 16 | 1 | 1 | No | No |
| 18182111 | SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN | March 2023 | November 2024 | Allow | 21 | 2 | 1 | Yes | No |
| 18024109 | CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTRONIC DEVICE | March 2023 | February 2026 | Abandon | 35 | 0 | 1 | No | No |
| 18176695 | SEMICONDUCTOR PACKAGE | March 2023 | October 2025 | Allow | 32 | 0 | 1 | No | No |
| 18174790 | Selective EMI Shielding Using Preformed Mask with Fang Design | February 2023 | December 2024 | Allow | 22 | 3 | 1 | No | No |
| 18113062 | METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE | February 2023 | July 2024 | Allow | 17 | 1 | 1 | No | No |
| 18106203 | SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE | February 2023 | September 2024 | Allow | 19 | 1 | 1 | No | No |
| 18162878 | SEMICONDUCTOR PACKAGE | February 2023 | July 2024 | Allow | 18 | 1 | 0 | Yes | No |
| 18103584 | SEMICONDUCTOR PACKAGE | January 2023 | July 2024 | Allow | 17 | 1 | 1 | No | No |
| 18103175 | STORAGE DEVICE INCLUDING CONFIGURABLE PRINTED CIRCUIT BOARD | January 2023 | September 2025 | Allow | 32 | 1 | 1 | Yes | No |
| 18099136 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | January 2023 | July 2024 | Allow | 18 | 1 | 1 | No | No |
| 18097965 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | January 2023 | February 2024 | Allow | 13 | 0 | 1 | No | No |
| 18097847 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | January 2023 | December 2024 | Allow | 23 | 2 | 1 | No | No |
| 18151917 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MAKING | January 2023 | August 2024 | Allow | 20 | 1 | 1 | No | No |
| 18150634 | Semiconductor Device and Method of Making a Semiconductor Package with Graphene-Coated Interconnects | January 2023 | December 2025 | Allow | 35 | 1 | 1 | No | No |
| 18149205 | CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CERAMIC LAMINATED SUBSTRATE | January 2023 | September 2024 | Allow | 20 | 2 | 1 | No | No |
| 18149472 | Process Control for Package Formation | January 2023 | August 2024 | Allow | 19 | 2 | 1 | No | No |
| 18148440 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | December 2022 | January 2026 | Allow | 37 | 1 | 1 | No | No |
| 18090801 | MICROELECTRONIC ASSEMBLIES | December 2022 | June 2024 | Allow | 17 | 1 | 1 | No | No |
| 18086610 | ISOLATED TRANSFORMER WITH INTEGRATED SHIELD TOPOLOGY FOR REDUCED EMI | December 2022 | December 2023 | Allow | 12 | 0 | 1 | No | No |
| 18085859 | FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | December 2022 | January 2026 | Allow | 37 | 1 | 1 | Yes | No |
| 18067494 | ARRAY SUBSTRATE AND DISPLAY PANEL | December 2022 | March 2026 | Allow | 39 | 1 | 1 | No | No |
| 18067565 | THROUGH MOLDING CONTACT ENABLED EMI SHIELDING | December 2022 | January 2026 | Allow | 37 | 1 | 1 | No | No |
| 18066448 | INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS | December 2022 | March 2026 | Allow | 39 | 1 | 1 | No | No |
| 18082012 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | December 2022 | March 2026 | Allow | 39 | 1 | 1 | No | No |
| 18064027 | INTEGRATED CIRCUIT HAVING NON-INTEGRAL MULTIPLE PITCH | December 2022 | July 2024 | Allow | 19 | 1 | 1 | No | No |
| 18063442 | ELECTRONIC PACKAGE | December 2022 | September 2025 | Allow | 33 | 0 | 1 | No | No |
| 18063065 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | December 2022 | March 2026 | Allow | 39 | 1 | 1 | No | No |
| 18071797 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | November 2022 | March 2026 | Allow | 40 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PHAM, LONG.
With a 33.3% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 45.8% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner PHAM, LONG works in Art Unit 2897 and has examined 537 patent applications in our dataset. With an allowance rate of 99.6%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 24 months.
Examiner PHAM, LONG's allowance rate of 99.6% places them in the 94% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by PHAM, LONG receive 1.30 office actions before reaching final disposition. This places the examiner in the 18% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by PHAM, LONG is 24 months. This places the examiner in the 84% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +0.4% benefit to allowance rate for applications examined by PHAM, LONG. This interview benefit is in the 17% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 37.3% of applications are subsequently allowed. This success rate is in the 85% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 50.3% of cases where such amendments are filed. This entry rate is in the 76% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 114.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 81% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 88.0% of appeals filed. This is in the 81% percentile among all examiners. Of these withdrawals, 45.5% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 48.6% are granted (fully or in part). This grant rate is in the 44% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 12.5% of allowed cases (in the 95% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 22.4% of allowed cases (in the 94% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.