Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18601003 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | March 2024 | June 2025 | Allow | 15 | 1 | 0 | No | No |
| 18592048 | MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE | February 2024 | February 2025 | Allow | 12 | 0 | 0 | No | No |
| 18590337 | LIGHT-EMITTING DIODE DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | February 2024 | March 2025 | Allow | 12 | 0 | 0 | No | No |
| 18587823 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | February 2024 | June 2025 | Allow | 16 | 1 | 0 | No | No |
| 18429789 | CHIP STRUCTURE | February 2024 | May 2025 | Allow | 16 | 0 | 1 | No | No |
| 18404708 | MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES | January 2024 | May 2025 | Allow | 17 | 1 | 0 | No | No |
| 18395058 | INNER SPACERS FOR GATE-ALL-AROUND SEMICONDUCTOR DEVICES | December 2023 | February 2025 | Allow | 14 | 0 | 1 | No | No |
| 18535342 | SOLDER JOINT | December 2023 | December 2024 | Allow | 12 | 0 | 0 | No | No |
| 18518798 | THREE-DIMENSIONAL MEMORY DEVICE HAVING SOURCE-SELECT-GATE CUT STRUCTURES AND METHODS FOR FORMING THE SAME | November 2023 | February 2025 | Allow | 15 | 1 | 0 | No | No |
| 18514466 | ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS | November 2023 | January 2025 | Allow | 14 | 0 | 0 | Yes | No |
| 18502389 | SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNECTION | November 2023 | April 2025 | Allow | 18 | 1 | 1 | No | No |
| 18489871 | ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE | October 2023 | March 2025 | Allow | 17 | 1 | 0 | No | No |
| 18489389 | SEMICONDUCTOR DEVICE | October 2023 | October 2024 | Allow | 12 | 0 | 0 | No | No |
| 18484310 | PLATED METAL LAYER IN POWER PACKAGES | October 2023 | April 2025 | Allow | 18 | 1 | 0 | No | No |
| 18482944 | MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER | October 2023 | June 2025 | Allow | 20 | 2 | 0 | No | No |
| 18474275 | HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES | September 2023 | December 2024 | Allow | 15 | 1 | 0 | Yes | No |
| 18469469 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | September 2023 | February 2025 | Allow | 17 | 1 | 0 | No | No |
| 18236545 | SEMICONDUCTOR PACKAGE | August 2023 | September 2024 | Allow | 13 | 1 | 0 | No | No |
| 18446834 | POLYIMIDE PROFILE CONTROL | August 2023 | December 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18231032 | Semiconductor Device and Method | August 2023 | October 2024 | Allow | 15 | 1 | 0 | No | No |
| 18357757 | Package Substrate Insulation Opening Design | July 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18354859 | METHOD FOR FORMING AN IMAGE SENSOR | July 2023 | March 2025 | Allow | 20 | 1 | 1 | No | No |
| 18339865 | ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS | June 2023 | October 2024 | Allow | 16 | 1 | 0 | No | No |
| 18212665 | SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND ASSOCIATED SYSTEMS AND METHODS | June 2023 | September 2024 | Allow | 15 | 1 | 0 | No | No |
| 18210132 | SEMICONDUCTOR PACKAGE | June 2023 | May 2024 | Allow | 11 | 0 | 0 | No | No |
| 18327178 | SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR | June 2023 | December 2024 | Abandon | 19 | 1 | 0 | No | No |
| 18325136 | SEMICONDUCTOR PACKAGE | May 2023 | October 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18324673 | CONDUCTIVE MEMBER CAVITIES | May 2023 | September 2024 | Allow | 16 | 1 | 0 | No | No |
| 18313560 | SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME | May 2023 | April 2024 | Allow | 11 | 0 | 0 | No | No |
| 18138752 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | April 2023 | October 2024 | Allow | 18 | 2 | 0 | No | No |
| 18180599 | SiC SEMICONDUCTOR DEVICE | March 2023 | February 2024 | Allow | 11 | 0 | 0 | No | No |
| 18177876 | Superconducting Bump Bonds for Quantum Computing Systems | March 2023 | September 2024 | Allow | 19 | 1 | 0 | Yes | No |
| 18167369 | SEMICONDUCTOR PACKAGE | February 2023 | September 2024 | Allow | 19 | 1 | 0 | No | No |
| 18166869 | METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES | February 2023 | March 2024 | Allow | 13 | 0 | 0 | No | No |
| 18092140 | THERMAL MANAGEMENT SOLUTIONS FOR EMBEDDED INTEGRATED CIRCUIT DEVICES | December 2022 | July 2024 | Allow | 19 | 1 | 0 | No | No |
| 18145976 | FRONT-SIDE TYPE IMAGE SENSORS | December 2022 | December 2024 | Allow | 23 | 2 | 1 | No | No |
| 18080683 | SEMICONDUCTOR PACKAGE | December 2022 | June 2024 | Allow | 18 | 1 | 0 | Yes | No |
| 18064910 | MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL | December 2022 | May 2024 | Allow | 18 | 0 | 1 | No | No |
| 17958007 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | September 2022 | April 2025 | Allow | 31 | 1 | 0 | No | No |
| 17956029 | ELECTRONIC DEVICE | September 2022 | February 2024 | Allow | 16 | 1 | 0 | No | No |
| 17947401 | Array Of Vertical Transistors And Method Used In Forming An Array Of Vertical Transistors | September 2022 | February 2025 | Allow | 29 | 1 | 2 | No | No |
| 17933272 | SEMICONDUCTOR PACKAGE | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17944645 | DISPLAY APPARATUS | September 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17944018 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | September 2022 | June 2024 | Allow | 21 | 1 | 0 | Yes | No |
| 17930304 | MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17898777 | SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROVED RELIABILITY | August 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17896097 | PACKAGE STRUCTURE | August 2022 | March 2025 | Allow | 30 | 0 | 0 | No | No |
| 17895397 | SEMICONDUCTOR DEVICE, SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | August 2022 | June 2025 | Allow | 34 | 1 | 0 | No | No |
| 17799918 | Display Substrate and Preparation Method Therefor, and Display Apparatus | August 2022 | June 2025 | Allow | 34 | 0 | 0 | No | No |
| 17796657 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERMINAL | July 2022 | January 2025 | Allow | 29 | 0 | 0 | No | No |
| 17873673 | CHIP PACKAGE STRUCTURE | July 2022 | March 2024 | Allow | 19 | 1 | 0 | No | No |
| 17873804 | INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF | July 2022 | September 2024 | Allow | 26 | 2 | 0 | No | No |
| 17794658 | ORGANIC EL DISPLAY DEVICE, PRODUCTION METHOD FOR CURED PRODUCT, AND PRODUCTION METHOD FOR ORGANIC EL DISPLAY DEVICE | July 2022 | June 2025 | Allow | 35 | 1 | 0 | No | No |
| 17868226 | INTEGRATED FAN-OUT STRUCTURES AND METHODS FOR FORMING THE SAME | July 2022 | July 2024 | Allow | 24 | 2 | 0 | No | No |
| 17791652 | CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING BONDED STRUCTURE | July 2022 | March 2025 | Allow | 32 | 1 | 0 | No | No |
| 17809854 | EFFICIENT REDISTRIBUTION LAYER TOPOLOGY | June 2022 | July 2024 | Allow | 24 | 2 | 0 | No | No |
| 17850932 | DEVICES AND METHODS FOR REDUCING STRESS ON CIRCUIT COMPONENTS | June 2022 | January 2025 | Allow | 31 | 2 | 1 | No | No |
| 17850999 | METHOD OF MANUFACTURING ELECTRONIC DEVICE WITH REDUCED SUBSTRATE WARPAGE | June 2022 | February 2025 | Allow | 32 | 1 | 0 | No | No |
| 17838701 | NANOMATERIAL, PREPARATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | June 2022 | October 2024 | Allow | 28 | 0 | 0 | No | No |
| 17839413 | SEMICONDUCTOR PACKAGE | June 2022 | February 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 17805008 | PHOTOSENSITIVE RESIN COMPOSITION, FILM PREPARED FROM THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE FILM | June 2022 | November 2024 | Allow | 29 | 0 | 0 | No | No |
| 17664749 | SUBMODULE SEMICONDUCTOR PACKAGE | May 2022 | September 2024 | Allow | 27 | 0 | 0 | No | No |
| 17751976 | DIELECTRIC SILICON NITRIDE BARRIER DEPOSITION PROCESS FOR IMPROVED METAL LEAKAGE AND ADHESION | May 2022 | January 2025 | Allow | 32 | 0 | 1 | No | No |
| 17750140 | THREE DIMENSIONAL SEMICONDUCTOR TRACE LENGTH MATCHING AND ASSOCIATED SYSTEMS AND METHODS | May 2022 | June 2025 | Allow | 37 | 1 | 1 | No | No |
| 17664113 | PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION | May 2022 | July 2024 | Allow | 26 | 1 | 0 | No | No |
| 17747540 | INTEGRATED CIRCUIT COMPRISING AT LEAST ONE BIPOLAR TRANSISTOR AND A CORRESPONDING METHOD OF PRODUCTION | May 2022 | December 2024 | Allow | 31 | 0 | 1 | No | No |
| 17745182 | BONDED SEMICONDUCTOR STRUCTURES | May 2022 | June 2024 | Allow | 25 | 1 | 2 | No | No |
| 17776817 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL AND DISPLAY DEVICE | May 2022 | January 2025 | Allow | 33 | 1 | 0 | No | No |
| 17741219 | SEMICONDUCTOR DEVICE | May 2022 | November 2024 | Allow | 30 | 0 | 1 | No | No |
| 17741373 | QUANTUM DOT COMPOSITION, METHOD OF MANUFACTURING DISPLAY DEVICE INCLUDING THE SAME, AND DISPLAY DEVICE MANUFACTURED BY THE DISPLAY DEVICE MANUFACTURING METHOD | May 2022 | August 2024 | Allow | 28 | 0 | 0 | No | No |
| 17774864 | Method for creating shunt free translucent flexible thin-film photovoltaic module | May 2022 | January 2025 | Allow | 32 | 1 | 0 | No | No |
| 17738016 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | May 2022 | October 2024 | Allow | 29 | 1 | 1 | No | No |
| 17737903 | CIRCUIT PACKAGES AND FABRICATION METHODS USING BOND-ON-PAD (BOP) SUBSTRATE TECHNOLOGY | May 2022 | March 2025 | Allow | 34 | 1 | 0 | Yes | No |
| 17661858 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | May 2022 | July 2024 | Allow | 27 | 1 | 0 | Yes | No |
| 17735075 | PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRISING A TRAPEZOID SHAPED CROSS SECTION | May 2022 | December 2024 | Abandon | 31 | 1 | 0 | No | No |
| 17732140 | Semiconductor Devices And Methods Of Fabricating The Same | April 2022 | August 2024 | Allow | 28 | 0 | 0 | No | No |
| 17772024 | SEMICONDUCTOR DEVICE | April 2022 | August 2024 | Allow | 27 | 0 | 0 | No | No |
| 17771481 | DISPLAY PANEL | April 2022 | July 2024 | Allow | 27 | 0 | 0 | No | No |
| 17726975 | IMAGE SENSING DEVICE | April 2022 | January 2025 | Allow | 33 | 1 | 0 | No | No |
| 17719390 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | April 2022 | May 2024 | Allow | 25 | 1 | 0 | Yes | No |
| 17658232 | OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES | April 2022 | April 2024 | Allow | 24 | 2 | 0 | Yes | No |
| 17711705 | Semiconductor Device And Method Of Manufacturing The Same | April 2022 | July 2024 | Allow | 28 | 1 | 0 | No | No |
| 17657541 | Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers | March 2022 | July 2024 | Allow | 27 | 0 | 1 | No | No |
| 17656499 | IC MODULE AND METHOD OF MANUFACTURING IC MODULE | March 2022 | September 2024 | Allow | 30 | 1 | 1 | No | No |
| 17763217 | FLEXIBLE HYBRID ELECTRONIC SYSTEM PROCESSING METHOD AND FLEXIBLE HYBRID ELECTRONIC SYSTEM | March 2022 | December 2024 | Allow | 32 | 1 | 0 | No | No |
| 17702812 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | March 2022 | September 2024 | Allow | 30 | 1 | 0 | No | No |
| 17655573 | SEMICONDUCTOR PACKAGE | March 2022 | December 2024 | Allow | 33 | 1 | 0 | Yes | No |
| 17698743 | SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE SAME | March 2022 | December 2024 | Allow | 33 | 0 | 1 | No | No |
| 17694007 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | March 2022 | March 2025 | Allow | 36 | 1 | 0 | No | No |
| 17753599 | IMAGING ELEMENT AND IMAGING DEVICE | March 2022 | November 2024 | Allow | 32 | 1 | 0 | No | No |
| 17688099 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DIES FORMED THEREFROM INCLUDING GROOVES ALONG LONG EDGES OF THE SEMICONDUCTOR DIES | March 2022 | October 2024 | Allow | 32 | 1 | 0 | No | No |
| 17687407 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | March 2022 | January 2025 | Allow | 35 | 0 | 1 | No | No |
| 17653091 | ANTI-REFLECTIVE OPTICAL FILM AND BENDABLE DISPLAY APPARATUS INCLUDING THE OPTICAL FILM | March 2022 | January 2025 | Allow | 35 | 2 | 0 | No | No |
| 17652730 | ELECTRONIC COMPONENT MODULE | February 2022 | November 2024 | Allow | 32 | 1 | 0 | No | No |
| 17637458 | Display Substrate and Preparation Method thereof, and Display Apparatus | February 2022 | November 2024 | Allow | 33 | 2 | 0 | No | No |
| 17677624 | CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES | February 2022 | May 2024 | Allow | 26 | 1 | 1 | No | No |
| 17670758 | SEMICONDUCTOR DEVICE WITH COMPOSITE GATE DIELECTRIC AND METHOD FOR PREPARING THE SAME | February 2022 | September 2024 | Allow | 31 | 2 | 0 | No | No |
| 17670924 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | February 2022 | September 2024 | Allow | 31 | 0 | 1 | No | No |
| 17668724 | PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF | February 2022 | April 2024 | Allow | 26 | 0 | 0 | No | No |
| 17668144 | Self-Aligned Contact Hard Mask Structure of Semiconductor Device and Method of Forming Same | February 2022 | April 2024 | Allow | 26 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner OWENS, DOUGLAS W.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner OWENS, DOUGLAS W works in Art Unit 2897 and has examined 140 patent applications in our dataset. With an allowance rate of 97.9%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 30 months.
Examiner OWENS, DOUGLAS W's allowance rate of 97.9% places them in the 93% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by OWENS, DOUGLAS W receive 0.91 office actions before reaching final disposition. This places the examiner in the 10% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by OWENS, DOUGLAS W is 30 months. This places the examiner in the 42% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +2.5% benefit to allowance rate for applications examined by OWENS, DOUGLAS W. This interview benefit is in the 20% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 25.9% of applications are subsequently allowed. This success rate is in the 32% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 81.2% of cases where such amendments are filed. This entry rate is in the 96% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
This examiner withdraws rejections or reopens prosecution in 100.0% of appeals filed. This is in the 94% percentile among all examiners. Of these withdrawals, 100.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 28.6% are granted (fully or in part). This grant rate is in the 20% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 26% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 13.1% of allowed cases (in the 90% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.