Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18731940 | INTEGRATED ASSEMBLIES, AND METHODS OF FORMING INTEGRATED ASSEMBLIES | June 2024 | January 2026 | Allow | 19 | 2 | 0 | No | No |
| 18675406 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18668329 | ETCH STOP LAYER FOR MEMORY DEVICE FORMATION | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18668038 | SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS | May 2024 | August 2025 | Allow | 15 | 1 | 0 | No | No |
| 18664508 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | May 2024 | May 2025 | Allow | 12 | 1 | 0 | No | No |
| 18655495 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARRIER LAYER AND AIR GAP | May 2024 | October 2025 | Allow | 17 | 2 | 0 | No | No |
| 18655763 | Polishing Interconnect Structures In Semiconductor Devices | May 2024 | August 2025 | Allow | 16 | 1 | 0 | No | No |
| 18635387 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE CONTACTS OF DIFFERENT WIDTHS AND METHOD FOR PREPARING THE SAME | April 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18634628 | METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE | April 2024 | December 2024 | Allow | 8 | 0 | 0 | No | No |
| 18634809 | METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYSTEMS | April 2024 | April 2025 | Allow | 12 | 0 | 0 | No | No |
| 18618058 | CAPACITOR ELEMENT, MODULE, AND SEMICONDUCTOR COMPOSITE DEVICE | March 2024 | December 2024 | Allow | 9 | 0 | 0 | No | No |
| 18609908 | AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME | March 2024 | February 2025 | Allow | 11 | 0 | 0 | No | No |
| 18417555 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | January 2024 | November 2024 | Allow | 10 | 0 | 0 | No | No |
| 18407517 | PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW FOR OVERLYING INTERCONNECT VIA | January 2024 | September 2025 | Allow | 20 | 2 | 0 | Yes | No |
| 18402992 | HEAT DISSIPATION FOR FIELD EFFECT TRANSISTORS | January 2024 | March 2026 | Allow | 26 | 0 | 0 | No | No |
| 18401988 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD | January 2024 | August 2025 | Allow | 20 | 2 | 0 | No | No |
| 18400680 | MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | December 2023 | January 2025 | Allow | 13 | 1 | 0 | No | No |
| 18395126 | SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END OF LINE (BEOL) SPACER-BASED INTERCONNECTS | December 2023 | August 2024 | Allow | 8 | 0 | 0 | No | No |
| 18521210 | DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS | November 2023 | April 2025 | Allow | 16 | 0 | 0 | No | No |
| 18517706 | DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT | November 2023 | April 2025 | Allow | 17 | 1 | 0 | No | No |
| 18515130 | SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | November 2023 | July 2025 | Allow | 20 | 1 | 0 | Yes | No |
| 18500370 | DUAL ETCH-STOP LAYER STRUCTURE | November 2023 | June 2025 | Allow | 19 | 1 | 0 | Yes | No |
| 18384582 | ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES | October 2023 | September 2024 | Allow | 11 | 1 | 0 | No | No |
| 18288083 | DISPLAY APPARATUS AND ELECTRONIC DEVICE | October 2023 | February 2026 | Allow | 27 | 0 | 0 | No | No |
| 18491334 | WINDOW, DISPLAY DEVICE INCLUDING THE SAME AND METHOD FOR MANUFACTURING THE WINDOW | October 2023 | January 2026 | Allow | 27 | 0 | 0 | No | No |
| 18489864 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | October 2023 | June 2024 | Allow | 8 | 0 | 0 | No | No |
| 18487957 | UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD FOR THE SAME | October 2023 | February 2025 | Allow | 16 | 0 | 0 | No | No |
| 18487092 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | October 2023 | January 2026 | Allow | 27 | 0 | 0 | No | No |
| 18378472 | CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CONTACT RESISTANCE | October 2023 | October 2024 | Allow | 12 | 1 | 0 | No | No |
| 18480567 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE | October 2023 | February 2024 | Allow | 5 | 1 | 0 | No | No |
| 18371816 | LIGHT EMITTING DISPLAY APPARATUS | September 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18464332 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | September 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18236996 | SEMICONDUCTOR DEVICE | August 2023 | December 2025 | Allow | 27 | 0 | 0 | No | No |
| 18236503 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN TREATMENT | August 2023 | December 2025 | Allow | 28 | 0 | 0 | No | No |
| 18234218 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | August 2023 | May 2024 | Allow | 9 | 0 | 0 | No | No |
| 18450255 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | August 2023 | May 2024 | Allow | 9 | 0 | 0 | No | No |
| 18447561 | SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATERIAL AND METHOD FOR MANUFACTURING THE SAME | August 2023 | March 2026 | Allow | 31 | 1 | 0 | No | No |
| 18447889 | SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | August 2023 | April 2025 | Allow | 20 | 1 | 0 | No | No |
| 18362739 | SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE | July 2023 | August 2024 | Allow | 12 | 0 | 1 | No | No |
| 18228324 | Antenna Package For Signal Transmission | July 2023 | February 2025 | Allow | 18 | 2 | 0 | Yes | No |
| 18227726 | ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES | July 2023 | November 2024 | Allow | 16 | 2 | 0 | Yes | No |
| 18360901 | Contact Via Formation | July 2023 | September 2024 | Allow | 14 | 0 | 0 | No | No |
| 18361567 | NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION | July 2023 | April 2025 | Allow | 20 | 2 | 0 | No | No |
| 18361743 | CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING | July 2023 | April 2025 | Allow | 20 | 1 | 0 | No | No |
| 18358216 | EMBEDDED FERROELECTRIC MEMORY IN HIGH-K FIRST TECHNOLOGY | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18225736 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | July 2023 | April 2024 | Allow | 9 | 0 | 0 | No | No |
| 18224592 | SEMICONDUCTOR DEVICE HAVING INTER-METAL DIELECTRIC PATTERNS AND METHOD FOR FABRICATING THE SAME | July 2023 | July 2024 | Allow | 12 | 2 | 0 | No | No |
| 18354012 | BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE | July 2023 | November 2024 | Allow | 16 | 1 | 0 | No | No |
| 18220886 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | July 2023 | October 2025 | Allow | 27 | 0 | 0 | No | No |
| 18346999 | TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES | July 2023 | March 2026 | Allow | 32 | 1 | 0 | No | No |
| 18217724 | SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTION STRUCTURE | July 2023 | January 2026 | Allow | 31 | 1 | 0 | Yes | No |
| 18339569 | INTEGRATED CIRCUIT DEVICE | June 2023 | December 2025 | Allow | 30 | 0 | 0 | No | No |
| 18331789 | CHIP AND ITS MANUFACTURING, MOUNTING METHOD AND PRINTED CIRCUIT BOARD | June 2023 | March 2026 | Abandon | 33 | 1 | 0 | No | No |
| 18325905 | PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUCTURES MADE THEREFROM | May 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18202131 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | May 2023 | March 2026 | Allow | 34 | 1 | 0 | No | No |
| 18322607 | SEMICONDUCTOR DEVICES INCLUDING CONTACT PLUGS HAVING SILICIDE LAYERS AND METHODS FOR FABRICATING THE SAME | May 2023 | March 2026 | Allow | 33 | 1 | 0 | No | No |
| 18318044 | METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIRCUIT | May 2023 | October 2025 | Allow | 29 | 0 | 0 | No | No |
| 18317759 | PASSIVATION LAYER FOR INTEGRATED CIRCUIT STRUCTURE AND FORMING THE SAME | May 2023 | June 2024 | Allow | 13 | 0 | 0 | No | No |
| 18252459 | CMOS-COMPATIBLE GRAPHENE STRUCTURES, INTERCONNECTS AND FABRICATION METHODS | May 2023 | August 2025 | Allow | 28 | 0 | 0 | No | No |
| 18313480 | HYBRID METAL LINE STRUCTURE | May 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18310527 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | May 2023 | November 2024 | Allow | 18 | 1 | 1 | No | No |
| 18308785 | RAISED SOURCE/DRAIN TRANSISTOR | April 2023 | November 2025 | Allow | 31 | 1 | 0 | No | No |
| 18303839 | ETCH PROFILE CONTROL OF GATE CONTACT OPENING | April 2023 | May 2024 | Allow | 13 | 0 | 0 | No | No |
| 18032700 | SEMICONDUCTOR LIGHT EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | April 2023 | October 2025 | Allow | 30 | 1 | 0 | No | No |
| 18300613 | SEMICONDUCTOR DEVICES INCLUDING AN AIR GAP ADJACENT TO AN INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | April 2023 | March 2026 | Allow | 35 | 1 | 0 | No | No |
| 18300700 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | April 2023 | September 2024 | Allow | 17 | 2 | 0 | No | No |
| 18133061 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN TREATMENT AND SEMICONDUCTOR STRUCTURE THEREOF | April 2023 | October 2025 | Allow | 30 | 1 | 0 | No | No |
| 18190328 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | March 2023 | July 2024 | Allow | 16 | 1 | 0 | No | No |
| 18190297 | Reducing Spacing Between Conductive Features Through Implantation | March 2023 | May 2024 | Allow | 14 | 1 | 0 | No | No |
| 18186348 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | March 2023 | February 2024 | Allow | 11 | 0 | 0 | No | No |
| 18183004 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARRIER LAYER AND AIR GAP | March 2023 | January 2024 | Allow | 10 | 0 | 0 | No | No |
| 18179676 | ALUMINUM STRUCTURES | March 2023 | March 2026 | Allow | 36 | 1 | 0 | Yes | No |
| 18179518 | METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH AIR GAPS FOR LOW CAPACITANCE INTERCONNECTS | March 2023 | February 2026 | Allow | 36 | 0 | 1 | No | No |
| 18118372 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | March 2023 | May 2024 | Allow | 14 | 1 | 0 | No | No |
| 18178773 | AIR GAPS IN MEMORY ARRAY STRUCTURES | March 2023 | April 2024 | Allow | 14 | 1 | 0 | No | No |
| 18116433 | DISPLAY APPARATUS AND ELECTRONIC APPARATUS INCLUDING THE SAME | March 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18174692 | PASS-THROUGH WIRING IN NOTCHED INTERCONNECT | February 2023 | August 2025 | Allow | 29 | 0 | 0 | No | No |
| 18174431 | SEMICONDUCTOR DEVICE | February 2023 | March 2026 | Abandon | 37 | 2 | 0 | No | No |
| 18167944 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING THE SAME | February 2023 | February 2026 | Allow | 36 | 1 | 0 | No | No |
| 18107085 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | February 2023 | August 2024 | Allow | 19 | 0 | 0 | No | No |
| 18106697 | SELECTIVE ETCHING OF SILICON-CONTAINING MATERIAL RELATIVE TO METAL-DOPED BORON FILMS | February 2023 | October 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 18164903 | APPARATUSES INCLUDING DEVICE STRUCTURES INCLUDING PILLAR STRUCTURES | February 2023 | July 2024 | Allow | 17 | 1 | 0 | No | No |
| 18163856 | METHOD FOR FORMING CONTACT STRUCTURE, SEMICONDUCTOR STRUCTURE AND MEMORY | February 2023 | January 2026 | Allow | 35 | 1 | 0 | No | No |
| 18163580 | METHOD OF PROCESSING SUBSTRATE, RECORDING MEDIUM, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | February 2023 | May 2024 | Allow | 15 | 2 | 1 | No | No |
| 18160793 | DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH | January 2023 | November 2024 | Allow | 21 | 3 | 0 | No | No |
| 18157962 | MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING COMPOSITIONS | January 2023 | August 2024 | Allow | 18 | 1 | 0 | No | No |
| 18099229 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | January 2023 | February 2026 | Allow | 37 | 2 | 0 | No | No |
| 18155751 | METHOD FOR FORMING INTEGRATED CIRCUIT | January 2023 | April 2024 | Allow | 15 | 0 | 1 | No | No |
| 18097418 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | January 2023 | February 2024 | Allow | 13 | 1 | 0 | No | No |
| 18151743 | Semiconductor Devices and Methods of Forming the Same | January 2023 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18093763 | METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE | January 2023 | December 2023 | Allow | 12 | 0 | 0 | No | No |
| 18090031 | GATELINE MASK DESIGN FOR REMOVING SACRIFICIAL GATELINE POLYSILICON WITHIN STAIR STEP AREA | December 2022 | July 2025 | Allow | 31 | 0 | 0 | No | No |
| 18086569 | MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF | December 2022 | April 2024 | Allow | 16 | 1 | 0 | No | No |
| 18068615 | Nitrogen Plasma Treatment For Improving Interface Between Etch Stop Layer And Copper Interconnect | December 2022 | July 2024 | Allow | 19 | 2 | 0 | Yes | No |
| 18083818 | FLEXIBLE MOL AND/OR BEOL STRUCTURE | December 2022 | February 2026 | Allow | 38 | 2 | 0 | No | No |
| 18078454 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE METALLIZATION LAYERS | December 2022 | August 2025 | Allow | 32 | 1 | 0 | No | No |
| 18075087 | VIA MANUFACTURING METHOD | December 2022 | June 2025 | Allow | 30 | 0 | 0 | No | No |
| 18061676 | CAPPING LAYER FOR LINER-FREE CONDUCTIVE STRUCTURES | December 2022 | March 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18061642 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | December 2022 | October 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 18059698 | HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSITION AND STRUCTURES FORMED BY THE SAME | November 2022 | September 2025 | Allow | 34 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner KUSUMAKAR, KAREN M.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 33.3% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner KUSUMAKAR, KAREN M works in Art Unit 2897 and has examined 973 patent applications in our dataset. With an allowance rate of 93.4%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 16 months.
Examiner KUSUMAKAR, KAREN M's allowance rate of 93.4% places them in the 81% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by KUSUMAKAR, KAREN M receive 0.95 office actions before reaching final disposition. This places the examiner in the 7% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by KUSUMAKAR, KAREN M is 16 months. This places the examiner in the 98% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +2.3% benefit to allowance rate for applications examined by KUSUMAKAR, KAREN M. This interview benefit is in the 23% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 37.3% of applications are subsequently allowed. This success rate is in the 85% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 63.7% of cases where such amendments are filed. This entry rate is in the 88% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
When applicants request a pre-appeal conference (PAC) with this examiner, 50.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 45% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 77.8% of appeals filed. This is in the 69% percentile among all examiners. Of these withdrawals, 14.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 48.1% are granted (fully or in part). This grant rate is in the 44% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.3% of allowed cases (in the 56% percentile). This examiner makes examiner's amendments more often than average to place applications in condition for allowance (MPEP § 1302.04).
Quayle Actions: This examiner issues Ex Parte Quayle actions in 3.1% of allowed cases (in the 74% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.