Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18783980 | PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL (TIM) AND SEAL RING AROUND THE LIQUID ALLOY TIM AND METHODS OF FORMING THE SAME | July 2024 | October 2025 | Allow | 15 | 1 | 0 | No | No |
| 18768963 | SEMICONDUCTOR DEVICE INCLUDING LOWER SEMICONDUCTOR PACKAGE HAVING HEAT SINCE PATTERN | July 2024 | January 2026 | Allow | 18 | 1 | 0 | No | No |
| 18767481 | SEAL RING STRUCTURE IN THE PERIPHERAL OF DEVICE DIES AND WITH ZIGZAG PATTERNS AND METHOD FORMING SAME | July 2024 | September 2025 | Allow | 15 | 1 | 0 | No | No |
| 18739366 | THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS OF MAKING THE SAME | June 2024 | November 2025 | Allow | 17 | 1 | 0 | No | No |
| 18673596 | FET WITH WRAP-AROUND SILICIDE AND FABRICATION METHODS THEREOF | May 2024 | June 2025 | Allow | 12 | 1 | 0 | No | No |
| 18667449 | METHOD OF FORMING TOP SELECT GATE TRENCHES | May 2024 | September 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18636446 | SEMICONDUCTOR DEVICE INCLUDING DETECTION ELECTRODES APPLICABLE FOR A TOUCH SENSOR | April 2024 | July 2025 | Allow | 15 | 1 | 0 | No | No |
| 18620993 | ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS AND SYSTEMS | March 2024 | August 2025 | Allow | 17 | 1 | 0 | No | No |
| 18615338 | SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF | March 2024 | November 2025 | Allow | 20 | 1 | 0 | No | No |
| 18615067 | PACKAGE STRUCTURE WITH CAVITY SUBSTRATE | March 2024 | September 2025 | Allow | 18 | 1 | 0 | No | No |
| 18604310 | STRUCTURE AND METHOD FOR INTERLEVEL DIELECTRIC LAYER WITH REGIONS OF DIFFERING DIELECTRIC CONSTANT | March 2024 | June 2025 | Allow | 15 | 1 | 0 | No | No |
| 18603099 | STRESS RELIEF STRUCTURE FOR FLIP-CHIP PACKAGED DEVICES | March 2024 | October 2025 | Allow | 20 | 2 | 0 | No | No |
| 18591755 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE | February 2024 | July 2025 | Allow | 16 | 1 | 1 | No | No |
| 18441533 | BACKSIDE CONDUCTIVE SEGMENTS COVER A FIRST ACTIVE REGION AND DEFINE AN OPENING ABOVE A SECOND ACTIVE REGION | February 2024 | April 2025 | Allow | 14 | 1 | 0 | No | No |
| 18433436 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING LID STRUCTURE | February 2024 | April 2025 | Allow | 14 | 1 | 0 | No | No |
| 18428245 | SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN | January 2024 | April 2025 | Allow | 14 | 1 | 0 | No | No |
| 18413153 | SEMICONDUCTOR DEVICE COMPRISING FIRST AND SECOND CONDUCTIVE LAYERS | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18397830 | SEMICONDUCTOR DEVICES HAVING EXPOSED CLIP TOP SIDES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | December 2023 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18508801 | METHODS OF TSV FORMATION FOR ADVANCED PACKAGING | November 2023 | April 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18498042 | DISPLAY DEVICE HAVING POWER LINE | October 2023 | February 2025 | Allow | 16 | 1 | 0 | No | No |
| 18488981 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH GROOVE ON DIE PAD | October 2023 | July 2025 | Allow | 21 | 2 | 0 | No | No |
| 18482006 | SEMICONDUCTOR PACKAGE HAVING COMPOSITE SEED-BARRIER LAYER AND METHOD OF FORMING THE SAME | October 2023 | February 2025 | Allow | 16 | 1 | 0 | Yes | No |
| 18447769 | DUAL-SIDED ROUTING IN 3D SEMICONDUCTOR SYSTEM-IN-PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME | August 2023 | January 2025 | Allow | 17 | 1 | 0 | No | No |
| 18363311 | POWER ELECTRONICS MODULE | August 2023 | October 2025 | Allow | 27 | 0 | 0 | No | No |
| 18360974 | MULTI-GATE DEVICE WITH AIR GAP SPACER AND FABRICATION METHODS THEREOF | July 2023 | January 2025 | Allow | 18 | 1 | 0 | No | No |
| 18361769 | DISPLAY APPARATUS INCLUDING A HEAT-DISSIPATION MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME | July 2023 | July 2024 | Allow | 12 | 1 | 0 | No | No |
| 18351733 | ELECTRONIC MODULE | July 2023 | October 2025 | Allow | 27 | 0 | 0 | No | No |
| 18216005 | SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE | June 2023 | February 2025 | Allow | 20 | 2 | 0 | No | No |
| 18338372 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SUB-INTERPOSER SUBSTRATES | June 2023 | December 2024 | Allow | 18 | 1 | 0 | Yes | No |
| 18212160 | SEMICONDUCTOR DEVICE PACKAGE | June 2023 | September 2024 | Allow | 15 | 1 | 0 | No | No |
| 18337767 | FINFET AND GATE-ALL-AROUND FET WITH SELECTIVE HIGH-K OXIDE DEPOSITION | June 2023 | December 2024 | Allow | 18 | 1 | 0 | No | No |
| 18335294 | Integrated Fan Out Device with a Filler-Free Insulating Material | June 2023 | August 2024 | Allow | 14 | 1 | 0 | No | No |
| 18203849 | SEMICONDUCTOR DEVICE IN A CONTAINMENT STRUCTURE INCLUDING A BURIED LAYER | May 2023 | July 2024 | Allow | 14 | 1 | 0 | No | No |
| 18325205 | SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF FORMING THE SAME | May 2023 | March 2025 | Allow | 22 | 2 | 0 | Yes | No |
| 18322481 | FUSIBLE STRUCTURES | May 2023 | October 2024 | Allow | 17 | 1 | 0 | No | No |
| 18196833 | METHOD OF FORMING A MEOL CONTACT STRUCTURE | May 2023 | September 2025 | Allow | 29 | 0 | 0 | No | No |
| 18196590 | SEMICONDUCTOR PACKAGE WITH FRONT SIDE AND BACK SIDE REDISTRIBUTION STRUCTURES AND FABRICATING METHOD THEREOF | May 2023 | July 2024 | Allow | 15 | 1 | 0 | No | No |
| 18314984 | SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF | May 2023 | November 2024 | Allow | 18 | 1 | 0 | No | No |
| 18143170 | CONNECTOR FOR IMPLEMENTING MULTI-FACETED INTERCONNECTION | May 2023 | May 2024 | Allow | 13 | 0 | 0 | No | No |
| 18306765 | SEMICONDUCTOR DEVICE COMPRISING SUBMODULE HAVING AT LEAST AN UPPER SURFACE EXPOSED AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | April 2023 | December 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 18135828 | ELECTRICAL CONNECTION ELEMENT AND CORRESPOND METHOD AND APPARATUS WITH OUTGASSING GROOVES THAT REMOVE TRAPPED GASSES | April 2023 | December 2025 | Allow | 32 | 0 | 0 | No | No |
| 18134437 | DOUBLE-SIDED COOLING POWER MODULE INCLUDING REVERSE-MOUNTED CHIPS | April 2023 | October 2025 | Allow | 30 | 1 | 0 | No | No |
| 18029330 | OPTICAL DEVICE PACKAGE PREPARATION METHOD AND OPTICAL DEVICE PACKAGE | March 2023 | October 2025 | Allow | 31 | 1 | 0 | No | No |
| 18191092 | SEMICONDUCTOR DEVICE WITH BRIDGE DIE ELECTRICALLY CONNECTING TWO CHIPS AND MANUFACTURING METHOD THEREOF | March 2023 | November 2025 | Allow | 31 | 1 | 0 | No | No |
| 18188360 | MEMRISTOR DEVICE, METHOD OF FABRICATING THE SAME, SYNAPTIC DEVICE INCLUDING THE SAME, AND NEUROMORPHIC DEVICE INCLUDING THE SYNAPTIC DEVICE | March 2023 | December 2025 | Allow | 33 | 1 | 0 | No | No |
| 18185514 | FULL AG SINTER DISCRETE PREMIUM PACKAGE | March 2023 | January 2026 | Allow | 34 | 1 | 0 | Yes | No |
| 18185865 | SEMICONDUCTOR DEVICE COMPRISING AN ELECTRODE TERMINAL AND AN ELECTRODE EXPOSED IN AN OPENING PROVIDED IN A MOLD RESIN, SEMICONDUCTOR DEVICE GROUP COMPRISING AN ELECTRODE TERMINAL AND AN ELECTRODE EXPOSED IN AN OPENING PROVIDED IN A MOLD RESIN, AND POWER CONVERSION APPARATUS COMPRISING AN ELECTRODE TERMINAL AND AN ELECTRODE EXPOSED IN AN OPENING PROVIDED IN A MOLD RESIN | March 2023 | September 2025 | Allow | 30 | 1 | 0 | Yes | No |
| 18181618 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE | March 2023 | June 2025 | Allow | 27 | 0 | 0 | No | No |
| 18178170 | SEMICONDUCTOR DEVICES INCLUDING A LOWER SEMICONDUCTOR PACKAGE, AN UPPER SEMICONDUCTOR PACKAGE ON THE LOWER SEMICONDUCTOR PACKAGE, AND A CONNECTION PATTERN BETWEEN THE LOWER SEMICONDUCTOR PACKAGE AND THE UPPER SEMICONDUCTOR PACKAGE | March 2023 | April 2024 | Allow | 13 | 1 | 0 | No | No |
| 18115743 | SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT | February 2023 | May 2024 | Allow | 15 | 1 | 0 | No | No |
| 18112616 | SEMICONDUCTOR DEVICE INCLUDING THROUGH-INSULATOR VIA STRUCTURE | February 2023 | July 2025 | Allow | 29 | 1 | 0 | No | No |
| 18022153 | LIGHT-EMITTING DEVICE WITH ELECTRON TRANSPORT LAYER AND INTERVENING LAYER, MANUFACTURING METHOD THEREOF, DISPLAY SUBSTRATE AND DISPLAY APPARATUS | February 2023 | October 2025 | Allow | 32 | 0 | 0 | No | No |
| 18170672 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING DIFFERENT TYPES OF PLATING FILMS | February 2023 | August 2025 | Allow | 30 | 0 | 0 | No | No |
| 18168633 | WAFER WARPAGE ADJUSTMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | February 2023 | July 2025 | Allow | 29 | 0 | 0 | No | No |
| 18109108 | THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS OF MAKING THE SAME | February 2023 | March 2024 | Allow | 13 | 1 | 0 | No | No |
| 18108590 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | February 2023 | August 2023 | Allow | 6 | 0 | 0 | No | No |
| 18165825 | LED WITH SMALL MESA WIDTH | February 2023 | June 2024 | Allow | 16 | 1 | 0 | No | No |
| 18150831 | ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS | January 2023 | September 2025 | Allow | 33 | 1 | 0 | No | No |
| 18084144 | BUS BAR, POWER SEMICONDUCTOR MODULE ARRANGEMENT INCLUDING A BUS BAR, AND METHOD FOR PRODUCING A BUS BAR | December 2022 | July 2025 | Allow | 31 | 1 | 0 | No | No |
| 18066141 | FET WITH WRAP-AROUND SILICIDE AND FABRICATION METHODS THEREOF | December 2022 | January 2024 | Allow | 13 | 1 | 0 | No | No |
| 17928724 | SEMICONDUCTOR DEVICE WITH FIRST AND SECOND CONDUCTORS AND PLATED LAYER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2022 | September 2025 | Allow | 33 | 1 | 0 | No | No |
| 18057326 | SEMICONDUCTOR DEVICE WITH PROTECTIVE FILM FOR REDUCING ALUMINUM SLIDE IN ALUMINUM WIRING AND MANUFACTURING METHOD THEREOF | November 2022 | April 2025 | Allow | 29 | 1 | 0 | No | No |
| 17998999 | ARRAY SUBSTRATE HAVING AN ACTIVE LAYER STRUCTURE WITH TWO LAYERS IN PARALLEL AND DISPLAY PANEL HAVING AN ACTIVE LAYER STRUCTURE WITH TWO LAYERS IN PARALLEL | November 2022 | June 2025 | Allow | 31 | 1 | 0 | No | No |
| 18054965 | SEMICONDUCTOR DEVICE | November 2022 | August 2023 | Allow | 9 | 1 | 0 | No | No |
| 17980044 | LIGHT EMITTING DISPLAY APPARATUS INCLUDING AN UNDERCUT ALONG AN OUTER PERIPHERY OF AN ANODE | November 2022 | December 2025 | Allow | 37 | 1 | 1 | No | No |
| 17978269 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | November 2022 | September 2023 | Allow | 11 | 1 | 0 | No | No |
| 18051670 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG | November 2022 | December 2025 | Allow | 37 | 1 | 1 | No | No |
| 17976228 | PACKAGE SUBSTRATE | October 2022 | July 2023 | Allow | 9 | 1 | 0 | No | No |
| 17967015 | POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL | October 2022 | September 2025 | Allow | 35 | 1 | 0 | No | No |
| 18046927 | Heat dissipation optimization method of silicon-based SU-8 thin film package | October 2022 | July 2025 | Allow | 33 | 1 | 0 | No | No |
| 17936959 | METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE | September 2022 | December 2023 | Allow | 15 | 2 | 0 | No | No |
| 17955572 | DISPLAY PANEL INCLUDING BLACK MATRIX OPENING AND LIGHT EXTRACTION OPENING, AND DISPLAY DEVICE | September 2022 | July 2025 | Allow | 34 | 1 | 0 | No | No |
| 17956082 | DISPLAY APPARATUS | September 2022 | April 2025 | Allow | 31 | 0 | 0 | No | No |
| 17915819 | PEROVSKITE DISPLAYS AND METHODS OF FORMATION | September 2022 | September 2025 | Allow | 36 | 2 | 0 | Yes | No |
| 17951739 | STACKED FET CONTACT FORMATION | September 2022 | April 2025 | Allow | 31 | 0 | 1 | No | No |
| 17947948 | LED ASSEMBLY | September 2022 | November 2023 | Allow | 14 | 2 | 0 | No | No |
| 17902035 | SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF | September 2022 | November 2023 | Allow | 14 | 1 | 0 | No | No |
| 17821679 | SEMICONDUCTOR DEVICE WITH BENT TERMINALS | August 2022 | July 2025 | Allow | 34 | 1 | 0 | Yes | No |
| 17891921 | RECESSED METAL ETCHING METHODS | August 2022 | March 2025 | Allow | 31 | 0 | 0 | No | No |
| 17888523 | HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) DEVICE FOR INCREASING THE SCHOTTKY DIODE CURRENT AND METHOD OF FORMING THE SAME | August 2022 | July 2025 | Allow | 35 | 1 | 1 | No | No |
| 17887926 | SEMICONDUCTOR DEVICE WITH CONDUCTORS DISPOSED IN INSULATING FILMS AND METHOD FOR MANUFACTURING THE SAME | August 2022 | April 2025 | Allow | 32 | 1 | 1 | No | No |
| 17885321 | METHODS OF MANUFACTURING FUSIBLE STRUCTURES | August 2022 | September 2024 | Allow | 25 | 1 | 0 | No | No |
| 17885184 | SEMICONDUCTOR PACKAGE HAVING A METAL CLIP AND RELATED METHODS OF MANUFACTURING | August 2022 | December 2024 | Allow | 28 | 0 | 0 | No | No |
| 17883153 | SEMICONDUCTOR DEVICES WITH FLEXIBLE SPACER INCLUDING A SUPPORT STRUCTURE AND METHODS OF MAKING THE SAME | August 2022 | March 2025 | Allow | 31 | 1 | 0 | No | No |
| 17879638 | Fin Shape Modification | August 2022 | May 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17873369 | METHODS FOR SELECTIVELY FORMING A TARGET FILM ON A SUBSTRATE COMPRISING A FIRST DIELECTRIC SURFACE AND A SECOND METALIC SURFACE | July 2022 | October 2023 | Allow | 15 | 1 | 0 | No | No |
| 17874234 | OPTICAL ELEMENT, INFRARED SENSOR, SOLID-STATE IMAGING ELEMENT, AND MANUFACTURING METHOD FOR OPTICAL ELEMENT | July 2022 | February 2025 | Allow | 31 | 0 | 0 | No | No |
| 17865846 | SEMICONDUCTOR DEVICE WITH TUNABLE THRESHOLD VOLTAGE AND METHOD FOR MANUFACTURING THE SAME | July 2022 | June 2025 | Allow | 35 | 1 | 1 | No | No |
| 17862926 | SEMICONDUCTOR DEVICE INCLUDING DETECTION ELECTRODES APPLICABLE FOR A TOUCH SENSOR | July 2022 | January 2024 | Allow | 18 | 1 | 0 | No | No |
| 17811080 | SEMICONDUCTOR STRUCTURE HAVING RELIABLE LINE PATTERN DESIGNS AND METHOD OF MANUFACTURING THE SAME | July 2022 | September 2025 | Allow | 38 | 1 | 1 | No | No |
| 17790101 | DISPLAY DEVICE INCLUDING AN INORGANIC-INSULATING-FILM-FREE REGION PROVIDED ALONG A NOTCH TO STRENGTHEN THE STRUCTURE OF THE DISPLAY DEVICE | June 2022 | April 2025 | Allow | 33 | 0 | 0 | No | No |
| 17808997 | SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF | June 2022 | February 2023 | Allow | 8 | 0 | 0 | No | No |
| 17847419 | METHODS OF TSV FORMATION FOR ADVANCED PACKAGING | June 2022 | August 2023 | Allow | 14 | 1 | 0 | No | No |
| 17845835 | SECONDARY DIE WITH A GROUND PLANE FOR STRIP LINE ROUTING | June 2022 | November 2025 | Allow | 41 | 1 | 0 | No | No |
| 17843319 | SEMICONDUCTOR DEVICE FOR SUPPRESSING EXCESSIVE WETTING AND SPREADING OF BONDING LAYER | June 2022 | April 2025 | Allow | 34 | 2 | 0 | No | No |
| 17786655 | TWO-DIMENSIONAL SEMICONDUCTOR TRANSISTOR WITH REDUCED HYSTERESIS AND METHOD OF MANUFACTURING THE SAME | June 2022 | August 2025 | Allow | 38 | 2 | 0 | No | No |
| 17787050 | ENCAPSULATION FILM HAVING EXCELLENT RELIABILITY, ORGANIC ELECTRONIC DEVICE COMPRISING THE SAME, AND METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE | June 2022 | March 2025 | Allow | 33 | 1 | 0 | No | No |
| 17838485 | ENHANCED CASCADE FIELD EFFECT TRANSISTOR | June 2022 | July 2024 | Allow | 25 | 1 | 0 | No | No |
| 17806570 | HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION | June 2022 | October 2024 | Allow | 28 | 1 | 1 | Yes | No |
| 17835768 | METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES | June 2022 | June 2023 | Allow | 13 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner HOANG, QUOC DINH.
With a 11.1% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 23.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner HOANG, QUOC DINH works in Art Unit 2892 and has examined 1,398 patent applications in our dataset. With an allowance rate of 93.1%, this examiner allows applications at a higher rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 20 months.
Examiner HOANG, QUOC DINH's allowance rate of 93.1% places them in the 80% percentile among all USPTO examiners. This examiner is more likely to allow applications than most examiners at the USPTO.
On average, applications examined by HOANG, QUOC DINH receive 1.19 office actions before reaching final disposition. This places the examiner in the 14% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by HOANG, QUOC DINH is 20 months. This places the examiner in the 93% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +3.0% benefit to allowance rate for applications examined by HOANG, QUOC DINH. This interview benefit is in the 24% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 30.3% of applications are subsequently allowed. This success rate is in the 60% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 38.3% of cases where such amendments are filed. This entry rate is in the 58% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
When applicants request a pre-appeal conference (PAC) with this examiner, 94.1% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 68% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 71.0% of appeals filed. This is in the 58% percentile among all examiners. Of these withdrawals, 59.1% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.
When applicants file petitions regarding this examiner's actions, 27.2% are granted (fully or in part). This grant rate is in the 15% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 6.7% of allowed cases (in the 89% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 4.3% of allowed cases (in the 78% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.