Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19022335 | MICROCHANNEL HEAT SINK WITH TPMS FINNED STRUCTURES FOR ENHANCED THERMAL EFFICIENCY | January 2025 | October 2025 | Allow | 9 | 1 | 0 | No | No |
| 18789496 | SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD OF MANUFACTURING THE SAME | July 2024 | October 2025 | Allow | 14 | 0 | 0 | No | No |
| 18770232 | POWER MODULE WITH IMPROVED CONDUCTIVE PATHS | July 2024 | October 2025 | Allow | 15 | 0 | 0 | Yes | No |
| 18742204 | DIE SIDEWALL COATINGS AND RELATED METHODS | June 2024 | April 2025 | Allow | 10 | 0 | 0 | Yes | No |
| 18654125 | PACKAGED SEMICONDUCTOR DEVICES WITH LEADFRAMES HAVING TIE BAR WITH RECESSED CAVITY | May 2024 | August 2025 | Allow | 15 | 1 | 0 | No | No |
| 18637063 | DISPLAY APPARATUS WITH PENETRATING PORTION AND METHOD OF MANUFACTURING SAME | April 2024 | March 2025 | Allow | 11 | 0 | 0 | Yes | No |
| 18635186 | INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18623992 | SEMICONDUCTOR DEVICE INCLUDING THROUGH DIE VIA | April 2024 | March 2025 | Allow | 12 | 0 | 0 | Yes | No |
| 18581104 | Method Of Making a FINFET Device Including a Step of Removing a Portion of a Fin | February 2024 | July 2025 | Allow | 17 | 1 | 0 | Yes | No |
| 18444951 | ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER AND METHODS OF MANUFACTURING ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER | February 2024 | February 2026 | Allow | 23 | 2 | 0 | Yes | No |
| 18444180 | FLEXIBLE CLIP WITH ALIGNER STRUCTURE | February 2024 | August 2025 | Allow | 18 | 1 | 0 | Yes | No |
| 18437017 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS | February 2024 | September 2025 | Abandon | 20 | 1 | 0 | No | No |
| 18427796 | PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT | January 2024 | October 2025 | Allow | 20 | 1 | 0 | No | No |
| 18424535 | DISPLAY DEVICE WITH OVERLAP LAYER | January 2024 | April 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18416760 | SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18416579 | THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE | January 2024 | December 2025 | Allow | 22 | 2 | 0 | No | No |
| 18415587 | PACKAGE STRUCTURE COMPRISING A SEMICONDUCTOR DIE WITH THERMOELECTRIC ELEMENTS AND MANUFACTURING METHOD THEREOF | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18409808 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT | January 2024 | January 2025 | Allow | 12 | 0 | 0 | No | No |
| 18409337 | DISPLAY DEVICE WITH METAL LAYER HAVING A SLOPE | January 2024 | December 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18394985 | EMBEDDED COOLING SYSTEMS WITH COOLANT CHANNEL FOR DEVICE PACKAGING | December 2023 | December 2024 | Allow | 12 | 2 | 0 | Yes | No |
| 18393016 | INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18542781 | HIGH ELECTRON MOBILITY TRANSISTOR WITH IMPROVED BARRIER LAYER | December 2023 | January 2025 | Allow | 13 | 0 | 0 | No | No |
| 18507176 | SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS | November 2023 | June 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18384025 | SEMICONDUCTOR DEVICE INCLUDING BONDED SUBSTRATES AND MANUFACTURING METHOD THEREOF | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18485385 | SEMICONDUCTOR DEVICE | October 2023 | February 2026 | Allow | 28 | 0 | 0 | No | No |
| 18373427 | POWER MODULE | September 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18469840 | SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR | September 2023 | June 2024 | Allow | 9 | 0 | 0 | No | No |
| 18239874 | SEMICONDUCTOR DEVICE WITH RECESSED GATE AND METHOD FOR FABRICATING THE SAME | August 2023 | February 2026 | Allow | 29 | 0 | 1 | No | No |
| 18458489 | TRANSISTOR DEVICE WITH HIGHLY DOPED SOURCE AND DRAIN REGIONS | August 2023 | October 2025 | Allow | 26 | 0 | 0 | Yes | No |
| 18451952 | STACKED FET WITH BOTTOM EPI SIZE CONTROL AND WRAPAROUND BACKSIDE CONTACT | August 2023 | October 2025 | Allow | 26 | 0 | 0 | No | No |
| 18366843 | Method Of Manufacturing A Package Using A Clip Having At Least One Locking Recess | August 2023 | January 2025 | Allow | 17 | 1 | 0 | No | No |
| 18357931 | POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN | July 2023 | June 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18351713 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING RING PORTION WITH RECESS FOR ADHESIVE | July 2023 | December 2024 | Allow | 18 | 1 | 0 | No | No |
| 18345384 | FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE | June 2023 | July 2024 | Allow | 12 | 0 | 0 | No | No |
| 18344150 | TUNNEL MAGNETORESISTIVE EFFECT ELEMENT, MAGNETIC MEMORY, AND BUILT-IN MEMORY | June 2023 | June 2024 | Allow | 11 | 0 | 0 | No | No |
| 18342889 | DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESISTANCE | June 2023 | March 2025 | Allow | 21 | 1 | 1 | No | No |
| 18342877 | IMAGE SENSOR WITH SHALLOW TRENCH EDGE DOPING | June 2023 | June 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18342644 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | June 2023 | June 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18336960 | SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD FORMING THE SAME | June 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18329220 | TRANSISTOR PACKAGE COMPRISING THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING LAYER | June 2023 | March 2024 | Allow | 10 | 2 | 0 | Yes | No |
| 18327232 | SEMICONDUCTOR DEVICE WITH IMPROVED INTERNAL AND EXTERNAL ELECTRODE STRUCTURE | June 2023 | April 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18324479 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | May 2023 | March 2024 | Allow | 10 | 0 | 0 | No | No |
| 18304083 | SEMICONDUCTOR DEVICE WITH A SUPPORTING MEMBER AND BONDED METAL LAYERS | April 2023 | October 2024 | Allow | 17 | 1 | 0 | No | No |
| 18302176 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS WITH PENETRATING PORTION | April 2023 | January 2024 | Allow | 9 | 0 | 0 | Yes | No |
| 18133276 | POWER DEVICE AND METHOD OF MANUFACTURING THE SAME | April 2023 | February 2026 | Allow | 34 | 0 | 1 | No | No |
| 18298368 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | April 2023 | December 2023 | Allow | 9 | 0 | 0 | No | No |
| 18132497 | SMALL OUTLINE TVS PACKAGE COMPROMISING LEAD CLIP COIN STRUCTURE TO SUPPORT A SEMICONDUCTOR DEVICE | April 2023 | January 2026 | Allow | 34 | 1 | 0 | No | No |
| 18130662 | Method of Manufacturing a Package Having an Adhesion Promoter | April 2023 | October 2024 | Allow | 18 | 2 | 0 | No | No |
| 18129956 | HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE | April 2023 | October 2025 | Allow | 30 | 0 | 0 | No | No |
| 18193293 | SEMICONDUCTOR DEVICE WITH IMPROVED CONTROL CIRCUIT PATTERN PLACEMENT | March 2023 | October 2025 | Allow | 31 | 0 | 0 | Yes | No |
| 18192725 | FLEXIBLE SUBSTRATE | March 2023 | August 2025 | Allow | 29 | 0 | 0 | No | No |
| 18192277 | SEMICONDUCTOR DEVICE WITH SEALING SURFACES OF DIFFERENT HEIGHT AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | March 2023 | October 2025 | Allow | 31 | 0 | 0 | Yes | No |
| 18125120 | SWITCHING DEVICE AND SWITCHING MODULE INCLUDING A COMMON MODE CURRENT SUPPRESSION STRUCTURE | March 2023 | October 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 18188350 | LEADFRAME WITH SACRIFICIAL ANODE | March 2023 | October 2025 | Allow | 31 | 1 | 0 | No | No |
| 18188368 | SEMICONDUCTOR PACKAGES | March 2023 | July 2025 | Allow | 27 | 0 | 0 | No | No |
| 18027456 | POWER CONVERSION DEVICE WITH REFRIGERANT | March 2023 | June 2025 | Allow | 27 | 0 | 0 | Yes | No |
| 18185385 | SEMICONDUCTOR DEVICE WITH FIXED RESISTANCE ELEMENT AND VARIABLE RESISTANCE ELEMENT | March 2023 | June 2025 | Allow | 27 | 0 | 0 | Yes | No |
| 18185627 | HIGH FREQUENCY CIRCUIT | March 2023 | January 2026 | Abandon | 34 | 1 | 0 | Yes | No |
| 18108520 | IC PACKAGE WITH TOP-SIDE MEMORY MODULE | February 2023 | December 2023 | Allow | 10 | 0 | 1 | No | No |
| 18099337 | Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies | January 2023 | June 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18157786 | METHOD FOR PATTERNING A COATING ON A SURFACE AND DEVICE INCLUDING A PATTERNED COATING | January 2023 | January 2024 | Allow | 12 | 0 | 1 | No | No |
| 18099347 | ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER AND METHODS OF MANUFACTURING ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER | January 2023 | October 2023 | Allow | 9 | 1 | 0 | No | No |
| 18153397 | DISPLAY DEVICE COMPRISING A LIGHT SHIELDING LAYER | January 2023 | October 2023 | Allow | 9 | 1 | 0 | No | No |
| 18090121 | SEMICONDUCTOR APPARATUS COMPRISING LEAD FRAME WITH RECESS FOR WIRES, AND VEHICLE USING THE SAME | December 2022 | October 2025 | Allow | 33 | 1 | 0 | No | No |
| 18084143 | SEMICONDUCTOR DEVICES WITH FLOATING PAD AND THEIR METHODS OF MANUFACTURING | December 2022 | June 2025 | Allow | 30 | 0 | 0 | Yes | No |
| 18075673 | DISPLAY DEVICE WITH AIR LAYER DISPOSED IN COLOR FILTER LAYER | December 2022 | January 2026 | Allow | 38 | 1 | 1 | No | No |
| 17985912 | QFN PACKAGE AND FABRICATING METHOD OF THE SAME | November 2022 | June 2025 | Allow | 31 | 0 | 0 | No | No |
| 18053871 | Thin-Film Sensor and Method of Fabricating Thin-Film Sensor | November 2022 | October 2025 | Allow | 35 | 0 | 1 | No | No |
| 17982619 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | November 2022 | March 2026 | Allow | 40 | 1 | 1 | Yes | No |
| 18052643 | SUSPENDED SEMICONDUCTOR DIES | November 2022 | June 2023 | Allow | 7 | 0 | 0 | No | No |
| 18052234 | PACKAGE STRUCTURE WITH AT LEAST TWO DIES AND AT LEAST ONE SPACER | November 2022 | October 2025 | Allow | 36 | 1 | 0 | No | No |
| 17997823 | SEMICONDUCTOR DEVICE | November 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 17978968 | PHYSICAL UNCLONABLE FUNCTION GENERATOR STRUCTURE AND OPERATION METHOD THEREOF | November 2022 | January 2026 | Allow | 39 | 1 | 1 | Yes | No |
| 17977995 | LIGHT EMITTING DISPLAY DEVICE WITH A TANDEM EMISSION PART | October 2022 | June 2025 | Allow | 32 | 0 | 0 | Yes | No |
| 17977632 | INTEGRATED CIRCUIT (IC) PROTECTIONS COMPRISING ELECTROMAGNETIC RADIATION BLOCKING MATERIAL | October 2022 | October 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 18050832 | DISPLAY PANEL WITH IMPROVED CHARGE GENERATION LAYER | October 2022 | November 2025 | Allow | 37 | 1 | 0 | No | No |
| 17971087 | Direct Liquid Cooling With O-Ring Sealing | October 2022 | July 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17960871 | STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM | October 2022 | June 2025 | Allow | 33 | 0 | 0 | Yes | No |
| 17936845 | ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS | September 2022 | October 2024 | Allow | 24 | 0 | 0 | No | No |
| 17912013 | SEMICONDUCTOR DEVICE | September 2022 | June 2025 | Allow | 33 | 0 | 0 | No | No |
| 17902778 | SEMICONDUCTOR DEVICE WITH HAVING A SPRING PORTION | September 2022 | April 2025 | Allow | 31 | 2 | 0 | Yes | No |
| 17897217 | HIGH ELECTRON MOBILITY TRANSISTOR WITH IMPROVED BARRIER LAYER | August 2022 | October 2023 | Allow | 13 | 1 | 0 | No | No |
| 17821294 | Protecting Circuitry Under Laser Programmable Fuses | August 2022 | October 2025 | Allow | 38 | 2 | 0 | No | No |
| 17891244 | PROTECTIVE STRUCTURE WITH DEPLETION-MODE AND ENHANCEMENT-MODE TRANSISTORS | August 2022 | June 2025 | Allow | 34 | 0 | 0 | No | No |
| 17891184 | METHOD OF FABRICATING A FLIP-CHIP PACKAGE CORE SUBSTRATE WITH BUILD-UP LAYERS | August 2022 | October 2024 | Allow | 25 | 2 | 1 | Yes | No |
| 17886552 | PHOTOELECTRIC CONVERSION DEVICE, MANUFACTURING METHOD THEREOF, AND EQUIPMENT | August 2022 | October 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17883074 | SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR | August 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17881921 | SEMICONDUCTOR DEVICE AND ASSORTMENT OF SEMICONDUCTOR DEVICES WITH ELECTRICALLY CONDUCTIVE RIBBON CONFIGURATIONS | August 2022 | July 2025 | Allow | 35 | 2 | 0 | No | No |
| 17816346 | PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES | July 2022 | January 2025 | Allow | 29 | 2 | 0 | Yes | No |
| 17813357 | MULTIDIE SUPPORTS AND RELATED METHODS | July 2022 | June 2024 | Allow | 23 | 0 | 0 | Yes | No |
| 17813348 | DIE SIDEWALL COATINGS AND RELATED METHODS | July 2022 | April 2023 | Allow | 9 | 1 | 0 | Yes | No |
| 17813351 | SEMICONDUCTOR PACKAGES WITH DIE SUPPORT STRUCTURE FOR THIN DIE | July 2022 | October 2023 | Allow | 15 | 1 | 0 | No | No |
| 17866788 | CHIP MODULE WITH ELECTRICALLY CONDUCTIVE REGION WITH A LAYER OF ORGANIC SILICON COMPOUND AND/OR FORM OF CARBON | July 2022 | January 2026 | Abandon | 42 | 2 | 0 | Yes | No |
| 17792201 | LIGHT-EMITTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT-EMITTING APPARATUS | July 2022 | July 2025 | Allow | 36 | 0 | 1 | Yes | No |
| 17862487 | LASER-DETECTION DEVICES INCLUDING A VOLTAGE-CONTROLLED MAGNETIC-TUNNELING-JUNCTION LAYER STACK | July 2022 | March 2024 | Allow | 21 | 0 | 0 | No | No |
| 17857261 | IMPROVED DESIGN OF TIP CONNECTION PORTION OF TERMINAL MEMBER AND ASSOCIATED SEMICONDUCTOR DEVICE | July 2022 | March 2025 | Allow | 32 | 1 | 0 | No | No |
| 17853924 | SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT | June 2022 | October 2023 | Allow | 15 | 1 | 0 | Yes | No |
| 17854125 | METAL-INSULATOR-METAL CAPACITOR (MIMCAP)-BASED PHYSICALLY UNCLONABLE FUNCTION | June 2022 | September 2025 | Allow | 39 | 0 | 0 | No | No |
| 17851313 | TERMINAL CONFIGURATION AND SEMICONDUCTOR DEVICE | June 2022 | March 2023 | Allow | 9 | 0 | 0 | Yes | No |
| 17852356 | SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND METHOD OF MAKING THE SAME | June 2022 | December 2024 | Allow | 30 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ARORA, AJAY.
With a 42.9% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 23.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner ARORA, AJAY works in Art Unit 2892 and has examined 1,037 patent applications in our dataset. With an allowance rate of 84.9%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 25 months.
Examiner ARORA, AJAY's allowance rate of 84.9% places them in the 61% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by ARORA, AJAY receive 1.67 office actions before reaching final disposition. This places the examiner in the 34% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by ARORA, AJAY is 25 months. This places the examiner in the 80% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +2.7% benefit to allowance rate for applications examined by ARORA, AJAY. This interview benefit is in the 23% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 27.1% of applications are subsequently allowed. This success rate is in the 46% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 28.4% of cases where such amendments are filed. This entry rate is in the 40% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 11.8% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 25% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.
This examiner withdraws rejections or reopens prosecution in 65.9% of appeals filed. This is in the 47% percentile among all examiners. Of these withdrawals, 25.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 48% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 5.8% of allowed cases (in the 87% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.2% of allowed cases (in the 52% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.