Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18742204 | DIE SIDEWALL COATINGS AND RELATED METHODS | June 2024 | April 2025 | Allow | 10 | 0 | 0 | Yes | No |
| 18637063 | DISPLAY APPARATUS WITH PENETRATING PORTION AND METHOD OF MANUFACTURING SAME | April 2024 | March 2025 | Allow | 11 | 0 | 0 | Yes | No |
| 18635186 | INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS | April 2024 | March 2025 | Allow | 11 | 0 | 0 | No | No |
| 18623992 | SEMICONDUCTOR DEVICE INCLUDING THROUGH DIE VIA | April 2024 | March 2025 | Allow | 12 | 0 | 0 | Yes | No |
| 18424535 | DISPLAY DEVICE WITH OVERLAP LAYER | January 2024 | April 2025 | Allow | 14 | 1 | 0 | Yes | No |
| 18416760 | SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18415587 | PACKAGE STRUCTURE COMPRISING A SEMICONDUCTOR DIE WITH THERMOELECTRIC ELEMENTS AND MANUFACTURING METHOD THEREOF | January 2024 | April 2025 | Allow | 15 | 1 | 0 | No | No |
| 18409808 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT | January 2024 | January 2025 | Allow | 12 | 0 | 0 | No | No |
| 18409337 | DISPLAY DEVICE WITH METAL LAYER HAVING A SLOPE | January 2024 | December 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18394985 | EMBEDDED COOLING SYSTEMS WITH COOLANT CHANNEL FOR DEVICE PACKAGING | December 2023 | December 2024 | Allow | 12 | 2 | 0 | Yes | No |
| 18393016 | INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME | December 2023 | December 2024 | Allow | 12 | 1 | 0 | No | No |
| 18542781 | HIGH ELECTRON MOBILITY TRANSISTOR WITH IMPROVED BARRIER LAYER | December 2023 | January 2025 | Allow | 13 | 0 | 0 | No | No |
| 18507176 | SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS | November 2023 | June 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18469840 | SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR | September 2023 | June 2024 | Allow | 9 | 0 | 0 | No | No |
| 18366843 | Method Of Manufacturing A Package Using A Clip Having At Least One Locking Recess | August 2023 | January 2025 | Allow | 17 | 1 | 0 | No | No |
| 18357931 | POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN | July 2023 | June 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18351713 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING RING PORTION WITH RECESS FOR ADHESIVE | July 2023 | December 2024 | Allow | 18 | 1 | 0 | No | No |
| 18345384 | FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE | June 2023 | July 2024 | Allow | 12 | 0 | 0 | No | No |
| 18344150 | TUNNEL MAGNETORESISTIVE EFFECT ELEMENT, MAGNETIC MEMORY, AND BUILT-IN MEMORY | June 2023 | June 2024 | Allow | 11 | 0 | 0 | No | No |
| 18342889 | DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESISTANCE | June 2023 | March 2025 | Allow | 21 | 1 | 1 | No | No |
| 18342877 | IMAGE SENSOR WITH SHALLOW TRENCH EDGE DOPING | June 2023 | June 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18342644 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | June 2023 | June 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18336960 | SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD FORMING THE SAME | June 2023 | July 2024 | Allow | 13 | 1 | 0 | No | No |
| 18329220 | TRANSISTOR PACKAGE COMPRISING THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING LAYER | June 2023 | March 2024 | Allow | 10 | 2 | 0 | Yes | No |
| 18327232 | SEMICONDUCTOR DEVICE WITH IMPROVED INTERNAL AND EXTERNAL ELECTRODE STRUCTURE | June 2023 | April 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18324479 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | May 2023 | March 2024 | Allow | 10 | 0 | 0 | No | No |
| 18304083 | SEMICONDUCTOR DEVICE WITH A SUPPORTING MEMBER AND BONDED METAL LAYERS | April 2023 | October 2024 | Allow | 17 | 1 | 0 | No | No |
| 18302176 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS WITH PENETRATING PORTION | April 2023 | January 2024 | Allow | 9 | 0 | 0 | Yes | No |
| 18298368 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | April 2023 | December 2023 | Allow | 9 | 0 | 0 | No | No |
| 18130662 | Method of Manufacturing a Package Having an Adhesion Promoter | April 2023 | October 2024 | Allow | 18 | 2 | 0 | No | No |
| 18027456 | POWER CONVERSION DEVICE WITH REFRIGERANT | March 2023 | June 2025 | Allow | 27 | 0 | 0 | Yes | No |
| 18185385 | SEMICONDUCTOR DEVICE | March 2023 | June 2025 | Allow | 27 | 0 | 0 | Yes | No |
| 18108520 | IC PACKAGE WITH TOP-SIDE MEMORY MODULE | February 2023 | December 2023 | Allow | 10 | 0 | 1 | No | No |
| 18157786 | METHOD FOR PATTERNING A COATING ON A SURFACE AND DEVICE INCLUDING A PATTERNED COATING | January 2023 | January 2024 | Allow | 12 | 0 | 1 | No | No |
| 18099347 | ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER AND METHODS OF MANUFACTURING ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER | January 2023 | October 2023 | Allow | 9 | 1 | 0 | No | No |
| 18099337 | Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies | January 2023 | June 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18153397 | DISPLAY DEVICE COMPRISING A LIGHT SHIELDING LAYER | January 2023 | October 2023 | Allow | 9 | 1 | 0 | No | No |
| 18084143 | SEMICONDUCTOR DEVICES WITH FLOATING PAD AND THEIR METHODS OF MANUFACTURING | December 2022 | June 2025 | Allow | 30 | 0 | 0 | Yes | No |
| 17985912 | QFN PACKAGE AND FABRICATING METHOD OF THE SAME | November 2022 | June 2025 | Allow | 31 | 0 | 0 | No | No |
| 18052643 | SUSPENDED SEMICONDUCTOR DIES | November 2022 | June 2023 | Allow | 7 | 0 | 0 | No | No |
| 17997823 | SEMICONDUCTOR DEVICE | November 2022 | April 2025 | Allow | 30 | 0 | 0 | No | No |
| 17977995 | LIGHT EMITTING DISPLAY DEVICE WITH A TANDEM EMISSION PART | October 2022 | June 2025 | Allow | 32 | 0 | 0 | Yes | No |
| 17971087 | Direct Liquid Cooling With O-Ring Sealing | October 2022 | July 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17960871 | STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM | October 2022 | June 2025 | Allow | 33 | 0 | 0 | Yes | No |
| 17936845 | ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS | September 2022 | October 2024 | Allow | 24 | 0 | 0 | No | No |
| 17912013 | SEMICONDUCTOR DEVICE | September 2022 | June 2025 | Allow | 33 | 0 | 0 | No | No |
| 17902778 | SEMICONDUCTOR DEVICE WITH HAVING A SPRING PORTION | September 2022 | April 2025 | Allow | 31 | 2 | 0 | Yes | No |
| 17897217 | HIGH ELECTRON MOBILITY TRANSISTOR WITH IMPROVED BARRIER LAYER | August 2022 | October 2023 | Allow | 13 | 1 | 0 | No | No |
| 17891184 | METHOD OF FABRICATING A FLIP-CHIP PACKAGE CORE SUBSTRATE WITH BUILD-UP LAYERS | August 2022 | October 2024 | Allow | 25 | 2 | 1 | Yes | No |
| 17891244 | PROTECTIVE STRUCTURE WITH DEPLETION-MODE AND ENHANCEMENT-MODE TRANSISTORS | August 2022 | June 2025 | Allow | 34 | 0 | 0 | No | No |
| 17883074 | SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR | August 2022 | June 2023 | Allow | 11 | 0 | 0 | No | No |
| 17816346 | PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES | July 2022 | January 2025 | Allow | 29 | 2 | 0 | Yes | No |
| 17813351 | SEMICONDUCTOR PACKAGES WITH DIE SUPPORT STRUCTURE FOR THIN DIE | July 2022 | October 2023 | Allow | 15 | 1 | 0 | No | No |
| 17813357 | MULTIDIE SUPPORTS AND RELATED METHODS | July 2022 | June 2024 | Allow | 23 | 0 | 0 | Yes | No |
| 17813348 | DIE SIDEWALL COATINGS AND RELATED METHODS | July 2022 | April 2023 | Allow | 9 | 1 | 0 | Yes | No |
| 17862487 | LASER-DETECTION DEVICES INCLUDING A VOLTAGE-CONTROLLED MAGNETIC-TUNNELING-JUNCTION LAYER STACK | July 2022 | March 2024 | Allow | 21 | 0 | 0 | No | No |
| 17857261 | IMPROVED DESIGN OF TIP CONNECTION PORTION OF TERMINAL MEMBER AND ASSOCIATED SEMICONDUCTOR DEVICE | July 2022 | March 2025 | Allow | 32 | 1 | 0 | No | No |
| 17853924 | SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT | June 2022 | October 2023 | Allow | 15 | 1 | 0 | Yes | No |
| 17851313 | TERMINAL CONFIGURATION AND SEMICONDUCTOR DEVICE | June 2022 | March 2023 | Allow | 9 | 0 | 0 | Yes | No |
| 17852356 | SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND METHOD OF MAKING THE SAME | June 2022 | December 2024 | Allow | 30 | 1 | 1 | No | No |
| 17848779 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME WITH DIELECTRIC LAYER DISPOSED BETWEEN PROTECTIVE MOLD STRUCTURE AND STEPPED STRUCTURE OF SIDE PORTION OF SEMICONDUCTOR DIE | June 2022 | April 2025 | Allow | 33 | 1 | 1 | Yes | No |
| 17842945 | SEMICONDUCTOR STRUCTURE WITH SHIELDING STRUCTURE FOR THROUGH SILICON VIA AND MANUFACTURING METHOD THEREOF | June 2022 | October 2024 | Allow | 28 | 0 | 1 | Yes | No |
| 17840405 | PRESSING DEVICE FOR DIRECTLY OR INDIRECTLY APPLYING PRESSURE TO POWER-SEMICONDUCTOR COMPONENTS OF A POWER-SEMICONDUCTOR MODULE | June 2022 | June 2024 | Allow | 25 | 0 | 0 | No | No |
| 17839479 | CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | June 2022 | April 2025 | Allow | 34 | 1 | 0 | No | No |
| 17757087 | SEMICONDUCTOR APPARATUS INCLUDING PELTIER ELEMENT | June 2022 | March 2025 | Allow | 34 | 1 | 0 | No | No |
| 17835458 | TUNNEL MAGNETORESISTIVE EFFECT ELEMENT, MAGNETIC MEMORY, AND BUILT-IN MEMORY | June 2022 | March 2023 | Allow | 10 | 0 | 0 | Yes | No |
| 17834148 | DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESISTANCE | June 2022 | March 2023 | Allow | 9 | 0 | 0 | No | No |
| 17827327 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) WITH A LINER LAYER | May 2022 | March 2023 | Allow | 10 | 0 | 0 | No | No |
| 17750665 | SEMICONDUCTOR DEVICES WITH FLEXIBLE CONNECTOR ARRAY | May 2022 | October 2023 | Allow | 17 | 1 | 0 | No | No |
| 17751064 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS COMPRISING QUANTUM DOTS | May 2022 | March 2023 | Allow | 10 | 0 | 0 | No | No |
| 17747900 | Electronic package with multiple electronic components spaced apart by grooves | May 2022 | April 2023 | Allow | 11 | 0 | 0 | Yes | No |
| 17745022 | ELECTRONIC COMPONENT INCLUDING PROTECTIVE LAYER | May 2022 | October 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17741872 | PACKAGED COMPONENT WITH COMPOSITE PIN STRUCTURE AND MANUFACTURING METHOD THEREOF | May 2022 | December 2024 | Allow | 31 | 0 | 1 | Yes | No |
| 17728220 | EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES | April 2022 | June 2023 | Allow | 14 | 1 | 0 | No | No |
| 17660477 | SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES | April 2022 | March 2023 | Allow | 11 | 1 | 0 | Yes | No |
| 17728588 | SEMICONDUCTOR DEVICES WITH GRADED DOPANT REGIONS | April 2022 | March 2025 | Abandon | 35 | 7 | 0 | Yes | No |
| 17771206 | Power Semiconductor Device and Method of Manufacturing the Same, and Power Conversion Device | April 2022 | July 2024 | Allow | 27 | 0 | 0 | No | No |
| 17755149 | OLED DISPLAY PANEL WITH AN OPENING DEFINED IN AN INSULATION LAYER CORRESONDING TO ANODE, AND MANUFACTURING METHOD THEREOF | April 2022 | April 2025 | Allow | 36 | 1 | 0 | No | No |
| 17723856 | LIGHT EMITTING DIODE COMPONENT AND LIGHT EMITTING DIODE CIRCUIT COMPRISING P-N DIODES IN SERIES | April 2022 | March 2025 | Allow | 35 | 1 | 0 | No | No |
| 17658881 | CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION | April 2022 | December 2024 | Allow | 32 | 1 | 0 | Yes | No |
| 17658885 | FLEXIBLE CLIP WITH ALIGNER STRUCTURE | April 2022 | October 2023 | Allow | 18 | 0 | 0 | Yes | No |
| 17717756 | SEMICONDUCTOR DEVICE WITH SENSE TERMINAL | April 2022 | May 2024 | Allow | 26 | 1 | 0 | No | No |
| 17715434 | Current Shunt with Reduced Temperature Relative to Voltage Drop | April 2022 | June 2023 | Allow | 15 | 0 | 0 | No | No |
| 17711362 | SEMICONDUCTOR CHIP WITH SIGNAL BUMP AND DUMMY BUMP, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE | April 2022 | December 2024 | Allow | 33 | 0 | 1 | Yes | No |
| 17765751 | Polarised Emission from Quantum Wires in Cubic GaN | March 2022 | December 2024 | Allow | 33 | 0 | 0 | No | No |
| 17657287 | SEMICONDUCTOR MODULE WITH IMPROVED INSPECTABILITY OF STACKED SEMICONDUCTOR ELEMENTS | March 2022 | February 2025 | Allow | 34 | 1 | 0 | Yes | No |
| 17656891 | FLEXIBLE SUBSTRATE WITH IMPROVED PERFORMANCE UNDER BENDING STRESS | March 2022 | October 2024 | Allow | 30 | 0 | 0 | Yes | No |
| 17701352 | CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES | March 2022 | April 2025 | Allow | 36 | 3 | 1 | Yes | No |
| 17762035 | DISPLAY PANEL INCLUDING LIGHT EMITTING DIODES WITH IMPROVED ELECTRICAL CONNECTION OF CATHODES, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE | March 2022 | October 2024 | Allow | 31 | 1 | 0 | No | No |
| 17698134 | FLEX BONDED INTEGRATED CIRCUITS | March 2022 | June 2025 | Allow | 39 | 3 | 0 | Yes | No |
| 17761549 | THIN FILM TRANSISTOR WITH SILICON NANOWIRE CHANNEL, DISPLAY SUBSTRATE, AND DISPLAY DEVICE | March 2022 | January 2025 | Allow | 34 | 1 | 0 | No | No |
| 17761253 | LIGHT EMITTING SUBSTRATE WITH GROOVE IN ELECTRODE PLANARIZATION LAYER FOR LED AND DISPLAY DEVICE. | March 2022 | September 2024 | Allow | 30 | 1 | 0 | No | No |
| 17653932 | SEMICONDUCTOR DEVICE WITH METAL FILM HAVING OPENINGS | March 2022 | June 2023 | Allow | 15 | 0 | 0 | Yes | No |
| 17685253 | SEMICONDUCTOR DEVICE WITH SPACED APART CONTAINERS | March 2022 | July 2024 | Allow | 29 | 1 | 0 | No | No |
| 17681546 | SEMICONDUCTOR DEVICE WITH PLATE-SHAPED CONDUCTOR | February 2022 | February 2024 | Allow | 23 | 1 | 0 | No | No |
| 17676350 | EXTERNAL CONTACT ELEMENT FOR A POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR MODULE | February 2022 | June 2023 | Allow | 16 | 0 | 0 | No | No |
| 17667818 | CONCAVE REFLECTOR FOR COMPLEMENTARY METAL OXIDE SEMICONDUCTOR IMAGE SENSOR (CIS) | February 2022 | October 2023 | Allow | 20 | 1 | 0 | Yes | No |
| 17575015 | PACKAGE WITH ENCAPSULATED ELECTRONIC COMPONENT BETWEEN LAMINATE AND THERMALLY CONDUCTIVE CARRIER | January 2022 | October 2023 | Allow | 21 | 1 | 0 | No | No |
| 17568626 | SEMICONDUCTOR DEVICE COMPRISING A LEAD ELECTRODE INCLUDING A THROUGH HOLE | January 2022 | July 2023 | Allow | 18 | 0 | 0 | Yes | No |
| 17568535 | THERMAL INTERFACE MATERIAL CONTAINMENT | January 2022 | March 2024 | Allow | 27 | 0 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ARORA, AJAY.
With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 25.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is below the USPTO average, suggesting that filing an appeal has limited effectiveness in prompting favorable reconsideration.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner ARORA, AJAY works in Art Unit 2892 and has examined 1,052 patent applications in our dataset. With an allowance rate of 88.2%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 23 months.
Examiner ARORA, AJAY's allowance rate of 88.2% places them in the 65% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by ARORA, AJAY receive 1.41 office actions before reaching final disposition. This places the examiner in the 31% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by ARORA, AJAY is 23 months. This places the examiner in the 77% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +4.0% benefit to allowance rate for applications examined by ARORA, AJAY. This interview benefit is in the 26% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 30.8% of applications are subsequently allowed. This success rate is in the 54% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 31.0% of cases where such amendments are filed. This entry rate is in the 37% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 0.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 14% percentile among all examiners. Note: Pre-appeal conferences show limited success with this examiner compared to others. While still worth considering, be prepared to proceed with a full appeal brief if the PAC does not result in favorable action.
This examiner withdraws rejections or reopens prosecution in 66.7% of appeals filed. This is in the 45% percentile among all examiners. Of these withdrawals, 30.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 35.8% are granted (fully or in part). This grant rate is in the 31% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 4.1% of allowed cases (in the 87% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.2% of allowed cases (in the 45% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.