Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18781633 | METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT | July 2024 | October 2025 | Allow | 14 | 1 | 1 | Yes | No |
| 18596978 | SEMICONDUCTOR DEVICE WITH ADJUSTMENT LAYERS AND METHOD FOR FABRICATING THE SAME | March 2024 | August 2025 | Allow | 17 | 2 | 1 | No | No |
| 18432064 | INTERLEVEL DIELECTRIC STRUCTURE IN SEMICONDUCTOR DEVICE | February 2024 | December 2025 | Allow | 22 | 2 | 1 | No | No |
| 18421155 | BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES | January 2024 | May 2025 | Allow | 15 | 2 | 0 | Yes | No |
| 18369224 | DISPLAY APPARATUS HAVING A REPAIR WIRING | September 2023 | January 2026 | Allow | 28 | 0 | 0 | No | No |
| 18469374 | Method for Forming a Buried Metal Line in a Semiconductor Substrate | September 2023 | November 2024 | Allow | 14 | 1 | 0 | No | No |
| 18449047 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH DIFFUSION BARRIER LAYERS | August 2023 | February 2026 | Allow | 30 | 1 | 1 | No | No |
| 18231471 | SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS | August 2023 | April 2025 | Allow | 20 | 1 | 1 | Yes | No |
| 18446217 | DEVICES WITH REDUCED CAPACITANCES | August 2023 | June 2025 | Allow | 22 | 2 | 0 | No | No |
| 18230338 | SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME | August 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18359414 | SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME | July 2023 | October 2025 | Allow | 27 | 1 | 1 | No | No |
| 18347264 | SOURCE/DRAIN CONTACT FOR SEMICONDUCTOR DEVICE STRUCTURE | July 2023 | September 2025 | Allow | 27 | 1 | 0 | Yes | No |
| 18175902 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | February 2023 | January 2026 | Allow | 34 | 1 | 0 | No | No |
| 18108338 | METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT | February 2023 | February 2024 | Allow | 12 | 0 | 0 | No | No |
| 18150275 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | January 2023 | February 2026 | Allow | 37 | 0 | 1 | No | No |
| 18089773 | DOPING BARRIER LAYER TO FACILITATE METAL FILL WITH LARGE GRAIN SIZE | December 2022 | February 2026 | Allow | 37 | 1 | 1 | No | No |
| 18068088 | Method for Manufacturing Semiconductor Package with Connection Structures Including Via Groups | December 2022 | July 2025 | Allow | 31 | 1 | 0 | No | No |
| 18070482 | SEMICONDUCTOR DEVICE | November 2022 | June 2025 | Allow | 31 | 0 | 1 | No | No |
| 17979750 | Conductive Interconnects and Methods of Forming Conductive Interconnects | November 2022 | July 2025 | Allow | 32 | 3 | 1 | No | No |
| 17971639 | LIGHT EMITTING DEVICE INCLUDING LIGHT SHIELDING LAYER | October 2022 | August 2025 | Allow | 33 | 1 | 1 | No | No |
| 17916935 | Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE | October 2022 | September 2025 | Allow | 35 | 2 | 0 | Yes | No |
| 17957847 | GALVANIC ISOLATION DEVICE | September 2022 | February 2026 | Allow | 40 | 0 | 1 | No | No |
| 17913391 | PREVENTING ELECTRODE DISCONTINUATION ON MICRODEVICE SIDEWALL | September 2022 | September 2025 | Allow | 36 | 1 | 0 | No | No |
| 17942378 | WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCONNECTS | September 2022 | October 2025 | Allow | 37 | 0 | 1 | No | No |
| 17940000 | WIRINGS FOR SEMICONDUCTOR DEVICE ARRANGED AT DIFFERENT INTERVALS AND HAVING DIFFERENT WIDTHS | September 2022 | November 2025 | Allow | 38 | 1 | 1 | No | No |
| 17889894 | METHOD TO ENLARGE AN OPENING IN AIR GAP FORMATION | August 2022 | September 2025 | Allow | 37 | 1 | 1 | No | No |
| 17885164 | DISPLAY MODULE AND METHOD FOR REPAIRING DISPLAY MODULE | August 2022 | October 2025 | Allow | 38 | 1 | 1 | No | No |
| 17813654 | METAL GRINDING PRETREATMENT IN SEMICONDUCTOR DEVICE FABRICATION METHOD | July 2022 | July 2025 | Allow | 36 | 1 | 0 | No | No |
| 17867791 | VIA STRUCTURE AND METHODS FOR FORMING THE SAME | July 2022 | February 2026 | Allow | 43 | 4 | 1 | No | No |
| 17793882 | APPARATUS AND METHOD FOR SELF-ASSEMBLY OF SEMICONDUCTOR LIGHT-EMITTING ELEMENT | July 2022 | March 2025 | Allow | 32 | 0 | 0 | No | No |
| 17864143 | Barrier Schemes for Metallization Using Manganese and Graphene | July 2022 | September 2025 | Allow | 39 | 1 | 1 | No | No |
| 17858336 | TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS | July 2022 | August 2025 | Allow | 37 | 2 | 1 | Yes | No |
| 17806726 | INTERCONNECT STRUCTURES INCLUDING AIR GAPS | June 2022 | January 2025 | Allow | 31 | 2 | 0 | No | No |
| 17727495 | METHOD FOR FORMING SEMICONDUCTOR PACKAGES USING DIELECTRIC ALIGNMENT MARKS AND LASER LIFTOFF PROCESS | April 2022 | January 2026 | Allow | 45 | 2 | 1 | Yes | No |
| 17770653 | SUBSTRATE PROCESSING METHOD INCLUDING THICKNESS MONITORING | April 2022 | April 2025 | Allow | 36 | 1 | 0 | Yes | No |
| 17716117 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH COVERING LINERS | April 2022 | November 2023 | Allow | 20 | 1 | 0 | No | No |
| 17701380 | LIQUID-RESISTANT AIR INLET PASSIVE DEVICE AND METHODS OF MAKING SAME | March 2022 | November 2025 | Abandon | 43 | 1 | 1 | No | No |
| 17698564 | SEMICONDUCTOR DEVICE WITH ADJUSTMENT LAYERS AND METHOD FOR FABRICATING THE SAME | March 2022 | April 2025 | Allow | 37 | 2 | 1 | Yes | No |
| 17687379 | SEMICONDUCTOR MEMORY DEVICE | March 2022 | June 2025 | Allow | 39 | 0 | 1 | No | No |
| 17685539 | INTERCONNECT FEATURE CONTACTED WITHIN A RECESS | March 2022 | January 2026 | Allow | 47 | 1 | 1 | Yes | No |
| 17679234 | Selective Barrier Layer Deposition Using Blocking Layers | February 2022 | February 2026 | Allow | 48 | 1 | 1 | No | No |
| 17650843 | BIT LINE SPACER STRUCTURES INCLUDING AIR GAPS AND METHOD FOR FORMING THE SAME | February 2022 | May 2025 | Allow | 39 | 1 | 1 | No | No |
| 17584383 | METHOD FOR MANUFACTURING THROUGH-SILICON VIA WITH LINER | January 2022 | June 2023 | Allow | 16 | 1 | 0 | No | No |
| 17579974 | TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS | January 2022 | March 2025 | Abandon | 38 | 1 | 1 | Yes | No |
| 17646770 | Interconnect with Redeposited Metal Capping and Method Forming Same | January 2022 | October 2025 | Allow | 46 | 2 | 1 | No | No |
| 17565443 | LIGHT EMITTING DEVICE INCLUDING SHAPED BONDING MEMBER FOR ATTACHING LIGHT TRANSMISSIVE MEMBER TO LIGHT EMITING ELEMENT | December 2021 | July 2024 | Allow | 30 | 1 | 0 | No | No |
| 17558423 | FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASSEMBLED MONOLAYER | December 2021 | December 2025 | Allow | 48 | 1 | 1 | No | No |
| 17555420 | DOUBLE PATTERNING WITH SELECTIVELY DEPOSITED SPACER | December 2021 | August 2025 | Allow | 44 | 2 | 1 | Yes | No |
| 17529355 | SEMICONDUCTOR SUBSTRATE POLISHING METHOD | November 2021 | February 2025 | Allow | 39 | 0 | 1 | Yes | No |
| 17516696 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP | November 2021 | March 2023 | Allow | 17 | 0 | 0 | No | No |
| 17486164 | DISPLAY APPARATUS HAVING SELF-ALIGNED STRUCTURES | September 2021 | December 2023 | Allow | 26 | 3 | 0 | No | No |
| 17472705 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE WITH EXPOSED INPUT/OUTPUT PAD IN RECESS | September 2021 | March 2023 | Allow | 18 | 1 | 0 | No | No |
| 17458884 | SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME | August 2021 | April 2025 | Allow | 43 | 4 | 1 | No | No |
| 17412787 | Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package | August 2021 | September 2022 | Allow | 13 | 0 | 0 | No | No |
| 17398899 | Treatment methods for titanium nitride films | August 2021 | April 2025 | Allow | 44 | 2 | 0 | Yes | No |
| 17392733 | BONDED SEMICONDUCTOR DEVICES WITH JAGGED-SHAPED BONDING INTERFACE | August 2021 | March 2025 | Abandon | 44 | 2 | 0 | No | No |
| 17382873 | Devices with Reduced Capacitances | July 2021 | January 2024 | Allow | 30 | 2 | 1 | Yes | No |
| 17373885 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | July 2021 | September 2025 | Abandon | 50 | 2 | 1 | No | No |
| 17361522 | METHOD FOR MANUFACTURING WIRING SUBSTRATE | June 2021 | March 2024 | Allow | 32 | 0 | 0 | No | No |
| 17340410 | METHODS FOR RELIABLY FORMING MICROELECTRONIC DEVICES WITH CONDUCTIVE CONTACTS TO SILICIDE REGIONS | June 2021 | October 2025 | Allow | 52 | 2 | 1 | No | No |
| 17329247 | STEP HEIGHT MITIGATION IN RESISTIVE RANDOM ACCESS MEMORY STRUCTURES | May 2021 | January 2023 | Allow | 19 | 0 | 1 | No | No |
| 17317890 | DISPLAY DEVICE | May 2021 | April 2023 | Abandon | 23 | 1 | 0 | No | No |
| 17293276 | NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION OF DIELECTRIC MATERIALS USING A FOCUSED ION BEAM | May 2021 | July 2024 | Allow | 38 | 1 | 1 | Yes | No |
| 17237699 | PATTERNING METHOD | April 2021 | June 2022 | Allow | 14 | 0 | 0 | No | No |
| 17284106 | METHOD FOR CONTROLLING CURRENT PATH BY USING ELECTRIC FIELD, AND ELECTRONIC ELEMENT | April 2021 | August 2022 | Allow | 16 | 3 | 0 | No | No |
| 17225450 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | April 2021 | October 2023 | Allow | 31 | 0 | 0 | No | No |
| 17223876 | FORMING VIAS IN A SEMICONDUCTOR DEVICE | April 2021 | June 2025 | Allow | 51 | 3 | 0 | No | No |
| 17281966 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING LASER TREATMENT FOR CONTACT PLUG | March 2021 | April 2024 | Allow | 37 | 1 | 0 | No | No |
| 17189839 | SEMICONDUCTOR DEVICE HAVING SYMMETRIC CONDUCTIVE INTERCONNECTION PATTERNS | March 2021 | May 2022 | Allow | 15 | 0 | 0 | No | No |
| 17188414 | INTEGRATED CIRCUITS INCLUDING VIA ARRAY AND METHODS OF MANUFACTURING THE SAME | March 2021 | December 2024 | Allow | 46 | 2 | 1 | Yes | No |
| 17174827 | BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING | February 2021 | May 2024 | Allow | 39 | 4 | 1 | No | No |
| 17171210 | SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME | February 2021 | June 2023 | Allow | 28 | 1 | 1 | Yes | No |
| 17170268 | Method for Manufacturing Semiconductor Package with Connection Structures Including Via Groups | February 2021 | September 2022 | Allow | 20 | 1 | 0 | No | No |
| 17248594 | LOW-RESISTANCE COPPER INTERCONNECTS | January 2021 | October 2025 | Allow | 56 | 3 | 2 | Yes | No |
| 17263503 | ALTERNATIVE INTEGRATION FOR REDISTRIBUTION LAYER PROCESS | January 2021 | May 2022 | Allow | 15 | 1 | 0 | No | No |
| 17257207 | ZINCATING AND DOPING OF METAL LINER FOR LINER PASSIVATION AND ADHESION IMPROVEMENT | December 2020 | January 2024 | Allow | 36 | 1 | 0 | No | No |
| 17137657 | SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND MANUFACTURING METHOD | December 2020 | September 2022 | Allow | 20 | 2 | 0 | No | No |
| 17137320 | FORMING CONTACT HOLES USING LITHO-ETCH-LITHO-ETCH APPROACH | December 2020 | September 2022 | Allow | 21 | 3 | 0 | Yes | No |
| 17118697 | ULTRALOW-K DIELECTRIC-GAP WRAPPED CONTACTS AND METHOD | December 2020 | February 2024 | Allow | 38 | 3 | 1 | No | No |
| 17106990 | LIGHT EMITTING CHIP AND ASSOCIATED PACKAGE STRUCTURE | November 2020 | February 2022 | Abandon | 14 | 1 | 0 | No | No |
| 17102623 | SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS | November 2020 | June 2024 | Allow | 42 | 2 | 1 | Yes | No |
| 16951584 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | November 2020 | November 2024 | Allow | 48 | 3 | 1 | Yes | No |
| 17097409 | METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH SOURCE/DRAIN CONTACT | November 2020 | March 2023 | Allow | 29 | 1 | 1 | No | No |
| 17021776 | METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION | September 2020 | November 2023 | Allow | 38 | 2 | 1 | Yes | No |
| 17017464 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THEREOF | September 2020 | January 2023 | Abandon | 28 | 1 | 1 | No | No |
| 17007626 | VIA CONNECTION TO WIRING IN A SEMICONDUCTOR DEVICE | August 2020 | October 2023 | Allow | 38 | 3 | 1 | No | No |
| 16997092 | METHOD OF PRODUCING ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE | August 2020 | April 2022 | Allow | 20 | 0 | 0 | No | No |
| 16937237 | BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES | July 2020 | September 2023 | Allow | 38 | 4 | 0 | Yes | No |
| 16934200 | Method for Forming a Buried Metal Line in a Semiconductor Substrate | July 2020 | December 2023 | Abandon | 41 | 3 | 1 | No | No |
| 16902692 | SEMICONDUCTOR DEVICE WITH COVERING LINERS AND METHOD FOR FABRICATING THE SAME | June 2020 | January 2023 | Allow | 31 | 2 | 1 | No | No |
| 16895620 | SEMICONDUCTOR DEVICE WITH ADJUSTMENT LAYER AND METHOD FOR FABRICATING THE SAME | June 2020 | December 2023 | Abandon | 42 | 4 | 1 | No | No |
| 16885278 | DAMASCENE PROCESS USING CAP LAYER | May 2020 | November 2023 | Allow | 41 | 3 | 2 | Yes | No |
| 16877670 | VIA STRUCTURE AND METHODS FOR FORMING THE SAME | May 2020 | September 2022 | Allow | 28 | 1 | 1 | No | No |
| 16878241 | METHOD FOR ATTACHING LIGHT TRANSMISSIVE MEMBER TO LIGHT EMITTING ELEMENT | May 2020 | September 2021 | Allow | 16 | 1 | 0 | No | No |
| 16868217 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | May 2020 | April 2023 | Allow | 35 | 4 | 0 | Yes | No |
| 16866709 | COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE SAME | May 2020 | January 2023 | Abandon | 32 | 2 | 0 | No | No |
| 16859345 | ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABRICATION METHODS | April 2020 | June 2021 | Allow | 14 | 0 | 0 | No | No |
| 16848784 | METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT | April 2020 | November 2022 | Allow | 31 | 2 | 1 | No | No |
| 16842862 | SEMICONDUCTOR DEVICE | April 2020 | November 2021 | Allow | 19 | 1 | 0 | Yes | No |
| 16826566 | FULLY ALIGNED INTERCONNECTS WITH SELECTIVE AREA DEPOSITION | March 2020 | January 2022 | Allow | 22 | 1 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner LUKE, DANIEL M.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner LUKE, DANIEL M works in Art Unit 2896 and has examined 181 patent applications in our dataset. With an allowance rate of 90.1%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 28 months.
Examiner LUKE, DANIEL M's allowance rate of 90.1% places them in the 73% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by LUKE, DANIEL M receive 1.80 office actions before reaching final disposition. This places the examiner in the 40% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by LUKE, DANIEL M is 28 months. This places the examiner in the 70% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +12.6% benefit to allowance rate for applications examined by LUKE, DANIEL M. This interview benefit is in the 49% percentile among all examiners. Recommendation: Interviews provide a below-average benefit with this examiner.
When applicants file an RCE with this examiner, 32.3% of applications are subsequently allowed. This success rate is in the 68% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 43.8% of cases where such amendments are filed. This entry rate is in the 67% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.
This examiner withdraws rejections or reopens prosecution in 33.3% of appeals filed. This is in the 5% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 0.0% are granted (fully or in part). This grant rate is in the 5% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 4.4% of allowed cases (in the 84% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 2.5% of allowed cases (in the 71% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.