Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18634508 | APPARATUS FOR PREVENTING CONTAMINATION OF SELF-PLASMA CHAMBER | April 2024 | February 2025 | Allow | 10 | 0 | 1 | Yes | No |
| 18413533 | EXHAUST COMPONENT CLEANING METHOD AND SUBSTRATE PROCESSING APPARATUS INCLUDING EXHAUST COMPONENT | January 2024 | June 2025 | Abandon | 17 | 1 | 1 | No | No |
| 18469208 | METHODS OF PROCESSING SUBSTRATES AND APPARATUSES THEREOF | September 2023 | May 2025 | Abandon | 20 | 2 | 1 | Yes | No |
| 18238522 | CLEANING METHOD AND PLASMA PROCESSING APPARATUS | August 2023 | August 2024 | Allow | 11 | 1 | 0 | Yes | No |
| 18210318 | SUBSTRATE PROCESSING APPARATUS AND TEMPERATURE REGULATION METHOD | June 2023 | February 2025 | Allow | 20 | 1 | 1 | No | No |
| 18142066 | ANTENNA UNIT FOR INDUCTIVELY COUPLED PLASMA, INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS AND METHOD THEREFOR | May 2023 | March 2025 | Abandon | 22 | 3 | 1 | No | No |
| 18245543 | COLLECTION ASSEMBLY AND SEMICONDUCTOR PRE-CLEANING CHAMBER | March 2023 | June 2025 | Allow | 27 | 4 | 1 | Yes | No |
| 18022550 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR ALIGNING DIELECTRIC PLATE USING THE SAME | February 2023 | June 2025 | Allow | 28 | 0 | 0 | Yes | No |
| 18088828 | TECHNIQUES AND APPARATUS FOR SELECTIVE SHAPING OF MASK FEATURES USING ANGLED BEAMS | December 2022 | May 2025 | Allow | 29 | 0 | 0 | Yes | No |
| 18087187 | Hermetic Tubular Linear Motor Based Wafer Lift Actuator | December 2022 | May 2025 | Allow | 29 | 0 | 0 | Yes | No |
| 17987259 | MULTI-ANTENNA UNIT FOR LARGE AREA INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS | November 2022 | May 2025 | Allow | 40 | 0 | 0 | No | No |
| 17981575 | CERAMIC COATED QUARTZ LID FOR PROCESSING CHAMBER | November 2022 | February 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 17980527 | TO AN INDUCTIVELY COUPLED PLASMA SOURCE | November 2022 | September 2024 | Allow | 23 | 1 | 0 | Yes | No |
| 17975012 | PLASMA PROCESSING APPARATUS | October 2022 | July 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17904774 | SEMICONDUCTOR PROCESSING CHAMBER WITH DUAL-LIFT MECHANISM FOR EDGE RING ELEVATION MANAGEMENT | August 2022 | May 2025 | Allow | 32 | 0 | 0 | Yes | No |
| 17817338 | PLASMA PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | August 2022 | June 2025 | Allow | 34 | 0 | 0 | Yes | No |
| 17744000 | RECOMBINATION CHANNELS FOR ANGLE CONTROL OF NEUTRAL REACTIVE SPECIES | May 2022 | March 2025 | Abandon | 34 | 2 | 1 | Yes | No |
| 17737224 | PLASMA PROCESSING APPARATUS AND METHOD THEREFOR | May 2022 | November 2024 | Abandon | 31 | 1 | 0 | No | No |
| 17713666 | APPARATUS FOR INDIRECT ATMOSPHERIC PRESSURE PLASMA PROCESSING | April 2022 | May 2024 | Allow | 25 | 2 | 0 | Yes | No |
| 17704844 | TEMPERATURE CONTROLLER, SUBSTRATE PROCESSING APPARATUS, AND PRESSURE CONTROL METHOD | March 2022 | May 2025 | Allow | 37 | 1 | 1 | Yes | No |
| 17701673 | PLASMA PROCESSING SYSTEM AND METHOD OF MOUNTING ANNULAR MEMBER | March 2022 | April 2025 | Allow | 36 | 0 | 1 | Yes | No |
| 17697023 | FILM FORMING APPARATUS | March 2022 | March 2025 | Allow | 36 | 2 | 1 | Yes | No |
| 17696496 | VIBRATING DEPOSITION DEVICE | March 2022 | December 2023 | Allow | 21 | 0 | 0 | No | No |
| 17696594 | INTEGRATED SHOWERHEAD | March 2022 | May 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17682745 | SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | February 2022 | May 2025 | Allow | 39 | 2 | 1 | Yes | No |
| 17552208 | PLASMA-ENHANCED THIN-FILM-DEPOSITION EQUIPMENT | December 2021 | October 2024 | Abandon | 34 | 1 | 0 | No | No |
| 17510704 | PLASMA PROCESSING APPARATUS | October 2021 | February 2025 | Allow | 39 | 2 | 0 | Yes | No |
| 17509200 | APPARATUS FOR CONTROLLING IMPEDANCE AND SYSTEM FOR TREATING SUBSTRATE WITH THE APPARATUS | October 2021 | September 2024 | Abandon | 34 | 2 | 0 | Yes | No |
| 17469895 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | September 2021 | March 2025 | Allow | 42 | 2 | 2 | Yes | No |
| 17470294 | ATOMIC LAYER DEPOSITION PART COATING CHAMBER | September 2021 | April 2024 | Allow | 31 | 2 | 2 | Yes | No |
| 17468839 | PLASMA PROCESSING APPARATUS | September 2021 | January 2024 | Allow | 29 | 0 | 1 | Yes | No |
| 17466285 | SEMICONDUCTOR MANUFACTURING APPARATUS | September 2021 | April 2025 | Abandon | 43 | 2 | 1 | Yes | No |
| 17458872 | SUBSTRATE TREATING APPARATUS AND COVER RING THEREOF | August 2021 | April 2025 | Abandon | 43 | 6 | 0 | No | No |
| 17412969 | Pressure Control System for a Multi-Head Processing Chamber of a Plasma Processing Apparatus | August 2021 | March 2025 | Allow | 43 | 2 | 1 | No | No |
| 17395529 | SUBSTRATE PROCESSING APPARATUS AND GAS SWITCHING METHOD FOR SUBSTRATE PROCESSING APPARATUS | August 2021 | August 2024 | Allow | 37 | 2 | 1 | No | No |
| 17392259 | SUBSTRATE PROCESSING APPARATUS | August 2021 | July 2024 | Abandon | 35 | 1 | 0 | No | No |
| 17357006 | PLASMA PROCESSING APPARATUS | June 2021 | October 2024 | Abandon | 40 | 4 | 0 | Yes | No |
| 17354879 | VENTED SUSCEPTOR | June 2021 | June 2025 | Allow | 48 | 2 | 1 | Yes | No |
| 17304406 | PLASMA PROCESSING APPARATUS | June 2021 | June 2024 | Abandon | 36 | 4 | 0 | Yes | No |
| 17349027 | PLASMA PROCESSING APPARATUS | June 2021 | March 2024 | Allow | 33 | 1 | 1 | No | No |
| 17348897 | COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS | June 2021 | March 2024 | Abandon | 33 | 3 | 1 | No | No |
| 17337067 | Plasma Processing Apparatus with Tunable Electrical Characteristic | June 2021 | June 2025 | Allow | 49 | 0 | 2 | No | No |
| 17317880 | MAGNETICALLY COUPLED RF FILTER FOR SUBSTRATE PROCESSING CHAMBERS | May 2021 | September 2024 | Allow | 40 | 1 | 1 | No | No |
| 17199277 | WAFER SUPPORT AND EQUIPMENT FOR THIN-FILM DEPOSITION OR PRE-CLEANING USING THE SAME | March 2021 | April 2025 | Abandon | 49 | 2 | 1 | No | No |
| 17173702 | SUBSTRATE PROCESSING APPARATUS | February 2021 | February 2024 | Abandon | 36 | 2 | 1 | Yes | No |
| 17153862 | SYSTEMS AND METHODS FOR STABILIZING REACTION CHAMBER PRESSURE | January 2021 | August 2024 | Allow | 42 | 4 | 0 | Yes | No |
| 17130770 | PLASMA PROCESSING APPARATUS | December 2020 | May 2024 | Abandon | 41 | 2 | 1 | No | No |
| 17047617 | FOCUS-RING CONVEYING MEMBER AND PLASMA PROCESSING DEVICE INCLUDING FOCUS-RING CONVEYING MEMBER | October 2020 | June 2024 | Abandon | 44 | 2 | 1 | Yes | No |
| 17063088 | PLASMA PROCESSING APPARATUS | October 2020 | February 2024 | Abandon | 41 | 4 | 1 | Yes | No |
| 17010561 | EXHAUST COMPONENT CLEANING METHOD AND SUBSTRATE PROCESSING APPARATUS INCLUDING EXHAUST COMPONENT | September 2020 | April 2025 | Abandon | 55 | 6 | 1 | No | No |
| 17004260 | PLASMA PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE | August 2020 | February 2024 | Allow | 42 | 3 | 1 | Yes | No |
| 16987674 | PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS | August 2020 | March 2025 | Abandon | 55 | 6 | 0 | Yes | No |
| 16956387 | SYSTEM FOR ELECTRICALLY DECOUPLED, HOMOGENEOUS TEMPERATURE CONTROL OF AN ELECTRODE BY MEANS OF HEAT CONDUCTION TUBES, AND PROCESSING FACILITY COMPRISING SUCH A SYSTEM | June 2020 | September 2024 | Allow | 51 | 4 | 1 | Yes | No |
| 16905018 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING SYSTEM HAVING THE SAME | June 2020 | April 2024 | Allow | 46 | 3 | 1 | Yes | No |
| 16898259 | MODULAR MICROWAVE SOURCE WITH MULTIPLE METAL HOUSINGS | June 2020 | March 2024 | Allow | 45 | 1 | 1 | No | No |
| 16894293 | PLASMA ELECTRIC FIELD MONITOR, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | June 2020 | October 2024 | Abandon | 52 | 4 | 1 | No | No |
| 16891626 | BAFFLE IMPLEMENTATION FOR IMPROVING BOTTOM PURGE GAS FLOW UNIFORMITY | June 2020 | August 2024 | Allow | 51 | 2 | 1 | Yes | No |
| 16888557 | Ring Structures and Systems for Use in a Plasma Chamber | May 2020 | October 2024 | Abandon | 52 | 3 | 1 | Yes | No |
| 16863541 | METAL OXIDE PRECLEAN CHAMBER WITH IMPROVED SELECTIVITY AND FLOW CONDUCTANCE | April 2020 | May 2024 | Allow | 49 | 3 | 0 | Yes | No |
| 16855559 | PRECLEAN CHAMBER UPPER SHIELD WITH SHOWERHEAD | April 2020 | April 2024 | Allow | 48 | 3 | 1 | Yes | No |
| 16646408 | APPARATUS FOR PREVENTING CONTAMINATION OF SELF-PLASMA CHAMBER | March 2020 | January 2024 | Allow | 46 | 3 | 1 | Yes | No |
| 16812075 | CAPACITIVE SENSORS AND CAPACITIVE SENSING LOCATIONS FOR PLASMA CHAMBER CONDITION MONITORING | March 2020 | June 2025 | Allow | 60 | 6 | 1 | No | No |
| 16774409 | VAPOR DEPOSITION APPARATUS | January 2020 | April 2024 | Allow | 51 | 5 | 1 | No | No |
| 16664155 | HIGH CONDUCTANCE LOWER SHIELD FOR PROCESS CHAMBER | October 2019 | April 2024 | Abandon | 53 | 4 | 1 | Yes | No |
| 16664117 | HIGH CONDUCTANCE INNER SHIELD FOR PROCESS CHAMBER | October 2019 | May 2024 | Allow | 55 | 5 | 1 | Yes | No |
| 16497091 | MOVEABLE EDGE RING DESIGNS | September 2019 | October 2024 | Allow | 60 | 2 | 1 | No | Yes |
| 16418274 | PROCESS CHAMBER PROCESS KIT WITH PROTECTIVE COATING | May 2019 | May 2025 | Allow | 60 | 6 | 1 | Yes | Yes |
| 16170119 | Tailored Electron Energy Distribution Function by New Plasma Source: Hybrid Electron Beam and RF Plasma | October 2018 | February 2024 | Allow | 60 | 9 | 1 | Yes | No |
| 16030489 | PLASMA PROCESSING DEVICES HAVING MULTI-PORT VALVE ASSEMBLIES | July 2018 | May 2024 | Allow | 60 | 6 | 1 | Yes | No |
| 15981089 | SEMICONDUCTOR PROCESSING CHAMBER FOR IMPROVED PRECURSOR FLOW | May 2018 | February 2025 | Allow | 60 | 10 | 1 | Yes | No |
| 15260876 | Plasma Module With Slotted Ground Plate | September 2016 | January 2025 | Abandon | 60 | 6 | 1 | Yes | Yes |
| 14844784 | Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium | September 2015 | July 2024 | Abandon | 60 | 8 | 1 | Yes | No |
| 13785539 | OPTICS FOR CONTROLLING LIGHT TRANSMITTED THROUGH A CONICAL QUARTZ DOME | March 2013 | November 2017 | Allow | 57 | 2 | 1 | Yes | Yes |
| 12984528 | SYSTEM FOR BATCH PROCESSING OF MAGNETIC MEDIA | January 2011 | September 2014 | Allow | 44 | 2 | 1 | Yes | No |
| 12947809 | COATING APPARATUS | November 2010 | November 2013 | Allow | 36 | 0 | 1 | Yes | No |
| 12844969 | ELECTRODE FOR USE IN PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS | July 2010 | May 2014 | Allow | 47 | 4 | 0 | Yes | No |
| 12843604 | GAS INJECTION UNIT FOR CHEMICAL VAPOR DESPOSITION APPARATUS | July 2010 | April 2014 | Allow | 44 | 2 | 1 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner KENDALL, BENJAMIN R.
With a 75.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 75.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner KENDALL, BENJAMIN R works in Art Unit 2896 and has examined 75 patent applications in our dataset. With an allowance rate of 68.0%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 41 months.
Examiner KENDALL, BENJAMIN R's allowance rate of 68.0% places them in the 22% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.
On average, applications examined by KENDALL, BENJAMIN R receive 2.63 office actions before reaching final disposition. This places the examiner in the 88% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.
The median time to disposition (half-life) for applications examined by KENDALL, BENJAMIN R is 41 months. This places the examiner in the 6% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.
Conducting an examiner interview provides a +19.0% benefit to allowance rate for applications examined by KENDALL, BENJAMIN R. This interview benefit is in the 66% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 21.2% of applications are subsequently allowed. This success rate is in the 16% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 5.4% of cases where such amendments are filed. This entry rate is in the 2% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.
This examiner withdraws rejections or reopens prosecution in 42.9% of appeals filed. This is in the 6% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 61% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 26% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 30% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.