Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18884085 | Method for Packaging Stacking Flip Chip | September 2024 | January 2025 | Allow | 4 | 0 | 1 | No | No |
| 18826815 | ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF | September 2024 | November 2025 | Allow | 14 | 0 | 0 | No | No |
| 18765653 | METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BONDING TOOLS | July 2024 | April 2025 | Allow | 9 | 0 | 0 | Yes | No |
| 18746055 | INTERCONNECTION STRUCTURE | June 2024 | October 2025 | Allow | 16 | 0 | 0 | No | No |
| 18733947 | TRENCH ISOLATION STRUCTURE FOR SCALED PIXEL REGION | June 2024 | February 2026 | Allow | 21 | 0 | 1 | No | No |
| 18663124 | BONDING STRUCTURE AND METHOD THEREOF | May 2024 | February 2026 | Allow | 21 | 0 | 1 | No | No |
| 18657968 | DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUCTOR DIE | May 2024 | October 2025 | Allow | 17 | 1 | 1 | Yes | No |
| 18654016 | BONDING TOOL AND BONDING METHOD THEREOF | May 2024 | June 2025 | Allow | 13 | 0 | 1 | Yes | No |
| 18650172 | ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF IMAGE SENSOR | April 2024 | August 2025 | Allow | 15 | 1 | 1 | Yes | No |
| 18643860 | IMAGE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF | April 2024 | September 2025 | Allow | 17 | 1 | 1 | No | No |
| 18602185 | METHOD FOR FORMING A PACKAGE STRUCTURE | March 2024 | October 2025 | Allow | 19 | 1 | 1 | No | No |
| 18597172 | CHIP BONDING APPARATUS AND SECURING ASSEMBLY THEREFOR | March 2024 | May 2024 | Allow | 2 | 0 | 0 | No | No |
| 18596488 | ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY | March 2024 | September 2025 | Allow | 19 | 1 | 1 | Yes | No |
| 18591803 | Epitaxial Structure And Transistor Including The Same | February 2024 | November 2024 | Allow | 8 | 1 | 0 | No | No |
| 18685871 | BONDING WIRE FOR SEMICONDUCTOR DEVICES | February 2024 | June 2024 | Allow | 4 | 0 | 0 | No | No |
| 18582381 | WAFER BONDING APPARATUS AND METHOD | February 2024 | June 2025 | Allow | 16 | 1 | 0 | No | No |
| 18422017 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | January 2024 | January 2025 | Allow | 12 | 1 | 0 | No | No |
| 18422346 | DIELECTRIC LINERS ON THROUGH GLASS VIAS | January 2024 | July 2024 | Allow | 5 | 0 | 1 | Yes | No |
| 18414740 | ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF | January 2024 | February 2026 | Allow | 25 | 1 | 0 | No | No |
| 18399127 | EMBEDDED LIQUID COOLING | December 2023 | July 2024 | Allow | 7 | 0 | 0 | No | No |
| 18398124 | MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE | December 2023 | May 2025 | Allow | 17 | 2 | 0 | No | No |
| 18397505 | EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME | December 2023 | July 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18530496 | PACKAGE FOR POWER ELECTRONICS | December 2023 | June 2025 | Allow | 18 | 1 | 0 | No | No |
| 18523457 | METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME | November 2023 | January 2026 | Allow | 26 | 2 | 1 | No | No |
| 18518636 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | November 2023 | February 2025 | Allow | 14 | 0 | 1 | No | No |
| 18513924 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD FOR LIGHT-EMITTING DEVICE | November 2023 | July 2024 | Allow | 8 | 0 | 1 | No | No |
| 18511444 | SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS | November 2023 | March 2025 | Allow | 16 | 0 | 1 | No | No |
| 18505325 | POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR HYBRID ELECTRIC VEHICLE | November 2023 | May 2025 | Allow | 18 | 1 | 1 | No | No |
| 18387093 | METHOD OF USING PROCESSING OVEN | November 2023 | April 2025 | Allow | 18 | 1 | 1 | No | No |
| 18487068 | BONDING SYSTEM AND BONDING METHOD | October 2023 | June 2025 | Allow | 20 | 1 | 1 | No | No |
| 18487071 | BONDING SYSTEM AND BONDING METHOD | October 2023 | February 2025 | Allow | 16 | 0 | 1 | No | No |
| 18483564 | MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD | October 2023 | September 2025 | Allow | 23 | 0 | 1 | No | No |
| 18370476 | IMAGE SENSOR AND DISPLAY DEVICE HAVING THE SAME | September 2023 | August 2024 | Allow | 11 | 0 | 1 | Yes | No |
| 18240462 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | August 2023 | July 2024 | Allow | 10 | 1 | 1 | Yes | No |
| 18279608 | LEAD FRAME AND MANUFACTURING METHOD THEREOF | August 2023 | February 2026 | Abandon | 30 | 4 | 1 | Yes | No |
| 18240235 | SEMICONDUCTOR DEVICE | August 2023 | November 2024 | Allow | 15 | 0 | 1 | No | No |
| 18238049 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | August 2023 | March 2026 | Allow | 31 | 0 | 1 | No | No |
| 18229071 | SCALABLE QUANTUM PROCESSOR DESIGN | August 2023 | May 2024 | Allow | 9 | 0 | 0 | No | No |
| 18358969 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG | July 2023 | September 2024 | Allow | 14 | 0 | 1 | No | No |
| 18225249 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | July 2023 | October 2024 | Allow | 14 | 1 | 0 | No | No |
| 18357780 | SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA SURROUNDINGS | July 2023 | July 2024 | Allow | 12 | 0 | 1 | Yes | No |
| 18355481 | IMAGE SENSOR WITH OVERLAP OF BACKSIDE TRENCH ISOLATION STRUCTURE AND VERTICAL TRANSFER GATE | July 2023 | November 2024 | Allow | 16 | 0 | 1 | No | No |
| 18260352 | HEAT EXCHANGE DEVICE AND POWER CONVERSION DEVICE | July 2023 | December 2025 | Allow | 29 | 0 | 1 | No | No |
| 18342091 | METHOD OF MANUFACTURING A DISPLAY APPARATUS | June 2023 | June 2025 | Allow | 24 | 1 | 1 | Yes | No |
| 18340323 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | June 2023 | January 2026 | Allow | 31 | 0 | 1 | Yes | No |
| 18211898 | ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS | June 2023 | February 2025 | Allow | 20 | 0 | 2 | No | No |
| 18332990 | Semiconductor Die Connection System and Method | June 2023 | September 2024 | Allow | 15 | 2 | 0 | No | No |
| 18208415 | REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE | June 2023 | November 2025 | Allow | 29 | 0 | 1 | No | No |
| 18206363 | HERMETICALLY SEALED MEMS MIRROR AND METHOD OF MANUFACTURE | June 2023 | April 2024 | Allow | 11 | 1 | 0 | No | No |
| 18327195 | IMAGE SENSING DEVICE | June 2023 | December 2024 | Allow | 18 | 1 | 1 | No | No |
| 18199988 | METHOD OF MANUFACTURING A FLUORESCENT SUBSTANCE | May 2023 | August 2025 | Allow | 26 | 1 | 1 | No | No |
| 18144691 | POWER MODULE | May 2023 | December 2025 | Allow | 31 | 0 | 1 | No | No |
| 18309122 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | April 2023 | May 2024 | Allow | 13 | 0 | 1 | No | No |
| 18140568 | DISPLAY DEVICE | April 2023 | May 2024 | Allow | 13 | 0 | 0 | No | No |
| 18250633 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BONDING STRUCTURE | April 2023 | December 2025 | Allow | 32 | 0 | 1 | Yes | No |
| 18304641 | Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge | April 2023 | December 2025 | Allow | 32 | 2 | 0 | No | No |
| 18303302 | Bonding Structure and Method of Forming Same | April 2023 | June 2024 | Allow | 14 | 1 | 0 | No | No |
| 18300379 | CHIP PACKAGING DEVICE, CHIP PACKAGING METHOD, AND PACKAGE CHIP | April 2023 | July 2023 | Allow | 3 | 0 | 1 | No | No |
| 18298780 | Wafer Level Chip Scale Packaging Intermediate Structure Apparatus and Method | April 2023 | March 2024 | Allow | 12 | 1 | 0 | No | No |
| 18132629 | SEMICONDUCTOR DIE PACKAGE | April 2023 | December 2025 | Allow | 32 | 2 | 1 | No | Yes |
| 18132496 | Image Sensors With Dummy Pixel Structures | April 2023 | October 2023 | Allow | 6 | 0 | 0 | No | No |
| 18295512 | CUTTING APPARATUS | April 2023 | January 2026 | Allow | 33 | 1 | 0 | Yes | No |
| 18130014 | MANUFACTURING METHOD OF IMAGE SENSOR | April 2023 | November 2025 | Allow | 32 | 0 | 1 | No | No |
| 18123296 | INTEGRATED CIRCUIT HAVING CONTACT JUMPER | March 2023 | July 2025 | Allow | 28 | 0 | 0 | No | No |
| 18182434 | PACKAGED CURRENT SENSOR INTEGRATED CIRCUIT | March 2023 | July 2025 | Allow | 28 | 1 | 1 | No | No |
| 18182482 | SYSTEMS AND METHODS FOR A TOP SIDE COOLED POWER SEMICONDUCTOR THERMAL INTERFACE SPACER | March 2023 | October 2025 | Allow | 31 | 0 | 1 | No | No |
| 18119560 | INTEGRATED CIRCUIT HAVING CONTACT JUMPER | March 2023 | September 2023 | Allow | 7 | 0 | 0 | Yes | No |
| 18179894 | MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE | March 2023 | September 2023 | Allow | 6 | 0 | 0 | Yes | No |
| 18043950 | SOLID-STATE IMAGING DEVICE | March 2023 | February 2026 | Allow | 36 | 2 | 0 | No | No |
| 18175980 | POWER MODULES FOR CIRCUIT PROTECTION | February 2023 | November 2025 | Allow | 32 | 0 | 1 | No | No |
| 18111134 | Apparatus and Method for Wafer Oxide Removal and Reflow Treatment | February 2023 | September 2025 | Allow | 31 | 0 | 1 | Yes | No |
| 18166116 | BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY | February 2023 | February 2026 | Allow | 36 | 1 | 1 | No | No |
| 18105856 | 3D MEMORY DEVICES AND STRUCTURES WITH CONTROL CIRCUITS | February 2023 | May 2023 | Allow | 4 | 0 | 0 | Yes | No |
| 18103385 | SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER | January 2023 | October 2024 | Abandon | 21 | 0 | 1 | Yes | No |
| 18155928 | MULTIPATTERNING GATE PROCESSING | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18097128 | DISPLAY DEVICE | January 2023 | September 2025 | Allow | 32 | 0 | 1 | Yes | No |
| 18096332 | DISPLAY APPARATUS HAVING DISPLAY MODULE AND MANUFACTURING METHOD THEREOF | January 2023 | May 2025 | Allow | 28 | 0 | 0 | No | No |
| 18088204 | ANTI-DIFFUSION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF | December 2022 | January 2026 | Allow | 37 | 0 | 1 | No | No |
| 18083963 | SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION | December 2022 | July 2025 | Abandon | 31 | 4 | 0 | No | No |
| 18066292 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | December 2022 | October 2023 | Allow | 10 | 1 | 0 | No | No |
| 18063268 | IMAGE SENSOR PACKAGE | December 2022 | July 2025 | Allow | 32 | 0 | 1 | No | No |
| 18071845 | DISC CELL ASSEMBLY CLAMP | November 2022 | October 2025 | Allow | 34 | 0 | 1 | No | No |
| 17994153 | SEMICONDUCTOR STRUCTURE WITH DOPED VIA PLUG | November 2022 | October 2023 | Allow | 11 | 1 | 0 | No | No |
| 18057222 | SEMICONDUCTOR DEVICE | November 2022 | February 2025 | Allow | 27 | 4 | 1 | Yes | No |
| 17989894 | SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD | November 2022 | March 2024 | Allow | 16 | 1 | 1 | No | No |
| 18056393 | INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN | November 2022 | March 2025 | Allow | 28 | 0 | 1 | No | No |
| 17925377 | MULTILAYER TAPE INCLUDING PLURALITY OF MAGNETIC METAL PARTICLES AND ELECTRONIC ASSEMBLY INCLUDING THE SAME | November 2022 | July 2025 | Allow | 32 | 0 | 1 | No | No |
| 17984748 | CHIPLETS WITH CONNECTION POSTS | November 2022 | November 2023 | Allow | 12 | 0 | 1 | Yes | No |
| 18053480 | PACKAGED CURRENT SENSOR INTEGRATED CIRCUIT | November 2022 | October 2024 | Allow | 23 | 1 | 1 | No | No |
| 18053410 | CHIP CHUCK AND A METHOD OF USING THE SAME | November 2022 | July 2025 | Allow | 33 | 0 | 1 | No | No |
| 18053570 | LUMIPHORIC MATERIAL STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES AND RELATED METHODS | November 2022 | March 2026 | Allow | 40 | 3 | 1 | Yes | No |
| 17979550 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | November 2022 | July 2024 | Abandon | 20 | 2 | 0 | No | No |
| 17976908 | DISPLAY MODULE | October 2022 | August 2023 | Allow | 10 | 0 | 1 | No | No |
| 17971854 | DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT IN FLIP CHIP AMPLIFIERS | October 2022 | May 2025 | Allow | 31 | 0 | 0 | Yes | No |
| 17969709 | ON-CHIP INTEGRATION OF OPTICAL COMPONENTS WITH PHOTONIC WIRE BONDS AND/OR LENSES | October 2022 | February 2026 | Allow | 40 | 1 | 1 | No | No |
| 18047049 | MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES | October 2022 | February 2024 | Allow | 16 | 2 | 0 | No | No |
| 17949988 | 3D MEMORY DEVICES AND STRUCTURES WITH CONTROL CIRCUITS | September 2022 | January 2023 | Allow | 4 | 1 | 0 | No | No |
| 17947702 | IMAGE SENSOR AND METHOD OF MANUFACTURING SAME | September 2022 | May 2024 | Allow | 20 | 1 | 0 | No | No |
| 17944114 | WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | September 2022 | April 2025 | Abandon | 31 | 4 | 0 | No | No |
| 17941461 | METAL-DIELECTRIC BONDING METHOD AND STRUCTURE | September 2022 | January 2024 | Allow | 16 | 1 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner ZARNEKE, DAVID A.
With a 20.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 34.1% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner ZARNEKE, DAVID A works in Art Unit 2891 and has examined 1,404 patent applications in our dataset. With an allowance rate of 80.2%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 27 months.
Examiner ZARNEKE, DAVID A's allowance rate of 80.2% places them in the 50% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by ZARNEKE, DAVID A receive 1.66 office actions before reaching final disposition. This places the examiner in the 33% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by ZARNEKE, DAVID A is 27 months. This places the examiner in the 73% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a -0.8% benefit to allowance rate for applications examined by ZARNEKE, DAVID A. This interview benefit is in the 11% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 23.6% of applications are subsequently allowed. This success rate is in the 33% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 20.6% of cases where such amendments are filed. This entry rate is in the 25% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 131.2% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 84% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences are highly effective with this examiner compared to others. Before filing a full appeal brief, strongly consider requesting a PAC. The PAC provides an opportunity for the examiner and supervisory personnel to reconsider the rejection before the case proceeds to the PTAB.
This examiner withdraws rejections or reopens prosecution in 85.3% of appeals filed. This is in the 78% percentile among all examiners. Of these withdrawals, 69.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner frequently reconsiders rejections during the appeal process compared to other examiners. Per MPEP § 1207.01, all appeals must go through a mandatory appeal conference. Filing a Notice of Appeal may prompt favorable reconsideration even before you file an Appeal Brief.
When applicants file petitions regarding this examiner's actions, 50.0% are granted (fully or in part). This grant rate is in the 48% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 10.5% of allowed cases (in the 94% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 2.0% of allowed cases (in the 68% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.