Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19230194 | MULTILAYER ELECTRONIC COMPONENT | June 2025 | December 2025 | Allow | 6 | 1 | 0 | Yes | No |
| 19225037 | ELECTRONIC COMPONENT | June 2025 | November 2025 | Allow | 5 | 1 | 0 | No | No |
| 19095567 | MULTILAYER CAPACITOR | March 2025 | February 2026 | Allow | 10 | 1 | 0 | No | No |
| 19055737 | CAPACITOR MANUFACTURING PROCESS CAPABLE OF CONTROLLING CAPACITOR RESISTANCE AND WITHOUT WELDING TIN-COPPER CONDUCTIVE SHEET | February 2025 | April 2025 | Allow | 2 | 0 | 0 | No | No |
| 19031085 | FLEXIBLE DISPLAY DEVICE | January 2025 | October 2025 | Allow | 9 | 0 | 0 | No | No |
| 19009142 | MULTILAYER ELECTRONIC COMPONENT | January 2025 | January 2026 | Allow | 13 | 1 | 0 | No | No |
| 19003078 | ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON CIRCUIT BOARD | December 2024 | February 2026 | Allow | 13 | 1 | 0 | No | No |
| 18980465 | CERAMIC ELECTRONIC DEVICE INCLUDING A MULTILAYER STRUCTURE WITH INTERNAL ELECTRODE LAYERS HAVING CERTAIN Sn CONCENTRATION | December 2024 | December 2025 | Allow | 12 | 1 | 0 | No | No |
| 18733322 | ELECTRONIC COMPONENT | June 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18659657 | Systems and Methods Providing High-Density Memory Arrangements with High-Speed Interconnects in a Condensed Form Factor | May 2024 | January 2025 | Allow | 8 | 0 | 0 | No | No |
| 18657890 | MULTILAYER CERAMIC CAPACITOR | May 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18657339 | MULTI-PIN MICROCONTROLLER MODULE | May 2024 | February 2026 | Allow | 21 | 0 | 0 | No | No |
| 18649416 | CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME | April 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18646890 | MULTILAYER CERAMIC CAPACITOR | April 2024 | February 2025 | Allow | 10 | 1 | 0 | No | No |
| 18643092 | ELECTRONIC COMPONENT | April 2024 | December 2024 | Allow | 7 | 0 | 0 | No | No |
| 18641923 | PRINTED CIRCUIT BOARD | April 2024 | February 2026 | Allow | 21 | 0 | 0 | No | No |
| 18635700 | CAPACITOR COMPONENT AND PASTE FOR EXTERNAL ELECTRODE | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18631625 | DIELECTRIC COMPOSITION AND MULTILAYERED ELECTRONIC COMPONENT COMPRISING THE SAME | April 2024 | March 2025 | Allow | 11 | 1 | 0 | No | No |
| 18625318 | MULTILAYER CERAMIC CAPACITOR | April 2024 | January 2025 | Allow | 10 | 1 | 0 | No | No |
| 18610464 | ELECTRONIC COMPONENT | March 2024 | October 2024 | Allow | 6 | 0 | 0 | No | No |
| 18691654 | WINDING-TYPE DISPLAY DEVICE AND METHOD FOR DETECTING LIGHT EMISSION INFORMATION OF WINDING-TYPE DISPLAY DEVICE | March 2024 | December 2025 | Allow | 21 | 0 | 0 | No | No |
| 18599856 | MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | March 2024 | January 2025 | Allow | 11 | 1 | 0 | No | No |
| 18593625 | CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME | March 2024 | September 2024 | Allow | 7 | 0 | 0 | No | No |
| 18591622 | M.2 WLAN MODULE HOLDER | February 2024 | October 2025 | Allow | 20 | 0 | 0 | No | No |
| 18589491 | ELECTRONIC CIRCUIT DEVICE HAVING CLOSED-CORE INDUCTORS IN SIDE-BY-SIDE RELATION AND ASSOCIATED METHODS | February 2024 | February 2026 | Allow | 23 | 0 | 0 | No | No |
| 18588729 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD | February 2024 | February 2026 | Allow | 23 | 1 | 0 | No | No |
| 18588905 | PRINTED CIRCUIT BOARD | February 2024 | March 2026 | Allow | 24 | 1 | 0 | No | No |
| 18443519 | MODIFIED TACTILE INPUT ATTACHMENT AND DEVICE | February 2024 | February 2026 | Allow | 24 | 1 | 0 | Yes | No |
| 18436162 | MULTILAYER CERAMIC CAPACITOR | February 2024 | November 2024 | Allow | 9 | 1 | 0 | No | No |
| 18422421 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | January 2024 | November 2024 | Allow | 10 | 1 | 0 | No | No |
| 18417803 | Conductive Adhesive Sheet | January 2024 | October 2025 | Allow | 21 | 0 | 0 | No | No |
| 18409713 | MAGNETIC APPARATUS WITH SHEET-SHAPED PIN ASSEMBLIES, POWER MODULE, AND METHOD OF MAKING | January 2024 | October 2025 | Allow | 21 | 0 | 0 | No | No |
| 18391057 | WIDE BAND GAP (WBG) DEVICES BASED THREE-LEVEL NEUTRAL POINT CLAMPED (NPC) POWER MODULE DESIGNS | December 2023 | December 2025 | Allow | 24 | 0 | 0 | No | No |
| 18571984 | Fully Printed Sensor with Internal Ion Reservoirs | December 2023 | March 2026 | Allow | 27 | 1 | 0 | No | No |
| 18524673 | MULTILAYER CERAMIC CAPACITOR | November 2023 | June 2024 | Allow | 7 | 0 | 0 | No | No |
| 18498080 | ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING THE ELECTRONIC MODULE | October 2023 | July 2025 | Allow | 20 | 0 | 0 | Yes | No |
| 18497429 | CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF | October 2023 | October 2025 | Allow | 24 | 0 | 0 | No | No |
| 18379687 | ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON CIRCUIT BOARD | October 2023 | September 2024 | Allow | 12 | 1 | 0 | No | No |
| 18486009 | GUIDED PAD STRUCTURES FORMED IN CIRCUIT BOARD | October 2023 | February 2026 | Allow | 28 | 1 | 0 | Yes | No |
| 18286647 | FACEPLATE AND ELECTRONIC DEVICE | October 2023 | July 2025 | Allow | 21 | 0 | 0 | No | No |
| 18485673 | CIRCUIT BOARD WITH ANGLED BEVEL | October 2023 | March 2026 | Abandon | 29 | 1 | 0 | No | No |
| 18484616 | CIRCUIT BOARD WELD STRUCTURE | October 2023 | August 2025 | Allow | 22 | 0 | 0 | No | No |
| 18553623 | ANTENNA BACKPLANE WITH REDUCED CROSSTALK AND METHOD FOR MAKING SAME | October 2023 | June 2025 | Allow | 21 | 0 | 0 | No | No |
| 18375681 | MULTILAYER CERAMIC CAPACITOR | October 2023 | April 2024 | Allow | 7 | 0 | 0 | No | No |
| 18477863 | Package Structure and Electronic Device | September 2023 | October 2025 | Allow | 25 | 0 | 0 | No | No |
| 18469534 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT | September 2023 | June 2025 | Allow | 20 | 0 | 0 | No | No |
| 18464259 | CHIP ON FILMS AND DISPLAY MODULES | September 2023 | May 2025 | Allow | 20 | 0 | 0 | No | No |
| 18459949 | WIRING BOARD AND MODULE | September 2023 | May 2025 | Allow | 21 | 0 | 0 | No | No |
| 18239916 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | August 2023 | July 2024 | Allow | 10 | 1 | 0 | No | No |
| 18239001 | MOUNTING ASSEMBLY AND CIRCUIT BOARD ASSEMBLY | August 2023 | June 2025 | Allow | 21 | 0 | 0 | No | No |
| 18456065 | FLEXIBLE DISPLAY DEVICE | August 2023 | March 2024 | Allow | 7 | 1 | 0 | No | No |
| 18237555 | CERAMIC ELECTRONIC COMPONENT | August 2023 | May 2024 | Allow | 9 | 1 | 0 | No | No |
| 18451741 | ELECTRONIC DEVICE INCLUDING FLEXIBLE DISPLAY | August 2023 | June 2025 | Allow | 22 | 0 | 0 | No | No |
| 18447721 | SANDWICH STRUCTURE POWER SUPPLY MODULE | August 2023 | January 2026 | Allow | 29 | 0 | 0 | No | No |
| 18446820 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME | August 2023 | May 2025 | Allow | 21 | 0 | 0 | No | No |
| 18351423 | BACKLIGHT UNIT AND DISPLAY DEVICE | July 2023 | April 2025 | Allow | 21 | 0 | 0 | No | No |
| 18351029 | MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME | July 2023 | January 2025 | Allow | 19 | 0 | 0 | No | No |
| 18349737 | LEAF SPRING CONNECTOR FOR LITHIUM-ION BATTERY CELLS | July 2023 | June 2025 | Allow | 23 | 0 | 0 | No | No |
| 18218714 | MULTILAYER CERAMIC CAPACITOR | July 2023 | April 2025 | Allow | 21 | 0 | 0 | No | No |
| 18218300 | MULTILAYER CERAMIC CAPACITOR | July 2023 | February 2024 | Allow | 7 | 0 | 0 | No | No |
| 18216862 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COMPRISING THE SAME | June 2023 | July 2025 | Allow | 25 | 1 | 0 | No | No |
| 18342046 | CERAMIC ELECTRONIC COMPONENT | June 2023 | December 2024 | Allow | 18 | 0 | 0 | No | No |
| 18214856 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME | June 2023 | April 2024 | Allow | 10 | 1 | 0 | No | No |
| 18211707 | MULTILAYER ELECTRONIC COMPONENT | June 2023 | April 2024 | Allow | 10 | 1 | 0 | No | No |
| 18210936 | MULTILAYER ELECTRONIC COMPONENT | June 2023 | May 2025 | Allow | 23 | 0 | 0 | No | No |
| 18198533 | MULTILAYER ELECTRONIC COMPONENT | May 2023 | March 2025 | Allow | 22 | 0 | 0 | No | No |
| 18315563 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT | May 2023 | March 2025 | Allow | 23 | 0 | 0 | No | No |
| 18144805 | MULTILAYERED CAPACITOR | May 2023 | December 2025 | Allow | 32 | 1 | 0 | No | No |
| 18311477 | ELECTRONIC DEVICE COMPRISING SOLDER WALL | May 2023 | September 2025 | Allow | 28 | 0 | 0 | No | No |
| 18139444 | MULTILAYER ELECTRONIC COMPONENT | April 2023 | November 2024 | Allow | 19 | 0 | 0 | No | No |
| 18135328 | MULTILAYER ELECTRONIC COMPONENT | April 2023 | May 2025 | Allow | 25 | 0 | 1 | No | No |
| 18134074 | ELECTRONIC COMPONENT | April 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18133153 | MULTILAYER CERAMIC CAPACITOR | April 2023 | December 2023 | Allow | 8 | 0 | 0 | No | No |
| 18131032 | MULTILAYER ELECTRONIC COMPONENT | April 2023 | October 2024 | Allow | 18 | 0 | 0 | No | No |
| 18192785 | SWITCHING POWER SUPPLY INCLUDING HEAT SINK | March 2023 | August 2025 | Allow | 29 | 0 | 0 | No | No |
| 18189142 | CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME | March 2023 | January 2025 | Allow | 22 | 1 | 0 | No | No |
| 18187276 | ELECTRONIC DEVICE INCLUDING SHIELD MEMBER FOR SHIELDING AT LEAST PART OF MAGNETIC FORCE GENERATED BY MAGNETIC SUBSTANCE AND CONNECTION PORTION INCLUDING PROPERTY OF NONMAGNETIC SUBSTANCE CONNECTED TO SHIELD MEMBER | March 2023 | October 2023 | Allow | 6 | 0 | 0 | No | No |
| 18124019 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | March 2023 | October 2023 | Allow | 7 | 1 | 0 | No | No |
| 18122841 | MULTILAYER CERAMIC CAPACITOR | March 2023 | January 2025 | Allow | 23 | 0 | 1 | No | No |
| 18121629 | MULTILAYER CERAMIC CAPACITOR | March 2023 | November 2023 | Allow | 8 | 1 | 0 | No | No |
| 18044789 | METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD | March 2023 | February 2026 | Allow | 36 | 2 | 0 | No | No |
| 18043955 | MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE | March 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18115218 | FLEXIBLE CIRCUIT BOARD, COF MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME | February 2023 | August 2023 | Allow | 5 | 0 | 0 | No | No |
| 18175295 | SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE | February 2023 | April 2025 | Allow | 25 | 0 | 0 | No | No |
| 18022262 | COMPOSITE HEAT DISSIPATION STRUCTURE AND DISPLAY APPARATUS | February 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18109309 | MULTILAYER CERAMIC CAPACITOR | February 2023 | May 2025 | Allow | 27 | 1 | 1 | No | No |
| 18107541 | MULTILAYER CERAMIC CAPACITOR | February 2023 | October 2024 | Allow | 20 | 0 | 0 | No | No |
| 18163815 | METHOD FOR PRODUCING A PULSE INVERTER, CURRENT MEASURING DEVICE FOR A PULSE INVERTER, PULSE INVERTER AND MOTOR VEHICLE | February 2023 | October 2024 | Allow | 21 | 0 | 0 | No | No |
| 18163211 | MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME | February 2023 | July 2024 | Allow | 18 | 0 | 0 | No | No |
| 18104321 | MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR | February 2023 | October 2024 | Allow | 20 | 0 | 0 | No | No |
| 18103735 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME | January 2023 | October 2023 | Allow | 9 | 1 | 0 | No | No |
| 18162588 | DIELECTRIC MATERIAL, MULTILAYER CERAMIC ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC ELECTRONIC DEVICE | January 2023 | October 2024 | Allow | 20 | 0 | 0 | No | No |
| 18098786 | ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON CIRCUIT BOARD | January 2023 | July 2023 | Allow | 6 | 0 | 0 | No | No |
| 18156373 | Component Carrier With Connected Component Having Redistribution Layer at Main Surface | January 2023 | March 2026 | Allow | 38 | 1 | 1 | No | No |
| 18154165 | ELECTRONIC COMPONENT | January 2023 | February 2025 | Allow | 25 | 1 | 0 | No | No |
| 18092496 | MOUNTING STRUCTURE OF A MULTILAYER CERAMIC CAPACITOR | January 2023 | July 2023 | Allow | 6 | 0 | 0 | No | No |
| 18012809 | THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME | December 2022 | June 2024 | Allow | 18 | 0 | 0 | No | No |
| 18012530 | THIN FILM CAPACITOR, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE THIN FILM CAPACITOR | December 2022 | May 2025 | Allow | 29 | 0 | 0 | No | No |
| 18012145 | THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME | December 2022 | September 2024 | Allow | 21 | 1 | 0 | No | No |
| 18084075 | MULTILAYER ELECTRONIC COMPONENT | December 2022 | December 2024 | Allow | 24 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner MILAKOVICH, NATHAN J.
With a 0.0% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 0.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner MILAKOVICH, NATHAN J works in Art Unit 2848 and has examined 621 patent applications in our dataset. With an allowance rate of 82.4%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 26 months.
Examiner MILAKOVICH, NATHAN J's allowance rate of 82.4% places them in the 55% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by MILAKOVICH, NATHAN J receive 1.52 office actions before reaching final disposition. This places the examiner in the 27% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by MILAKOVICH, NATHAN J is 26 months. This places the examiner in the 76% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a +15.1% benefit to allowance rate for applications examined by MILAKOVICH, NATHAN J. This interview benefit is in the 54% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 38.7% of applications are subsequently allowed. This success rate is in the 88% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 25.6% of cases where such amendments are filed. This entry rate is in the 35% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 66.7% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 55% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 57.1% of appeals filed. This is in the 30% percentile among all examiners. Of these withdrawals, 50.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 21.9% are granted (fully or in part). This grant rate is in the 11% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 25% percentile). This examiner makes examiner's amendments less often than average. You may need to make most claim amendments yourself.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 6.2% of allowed cases (in the 83% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.