Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18641986 | MULTILAYER CERAMIC CAPACITOR INCLUDING CURVED BOUNDARY | April 2024 | April 2025 | Allow | 12 | 1 | 0 | No | No |
| 18625322 | MULTILAYER CERAMIC CAPACITOR INCLUDING RAISED PORTIONS THICKER FROM MIDDLE PORTION TOWARDS OUTER PERIPHERY | April 2024 | June 2025 | Allow | 14 | 1 | 0 | No | No |
| 18440863 | MULTILAYER ELECTRONIC COMPONENT INCLUDING NON-CONDUCTIVE RESIN LAYER ON BODY THEREOF | February 2024 | December 2024 | Allow | 10 | 1 | 0 | No | No |
| 18435335 | MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY | February 2024 | January 2025 | Allow | 12 | 1 | 0 | No | No |
| 18410081 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING EXTERNAL ELECTRODE WITH MULTILAYER STRUCTURE | January 2024 | December 2024 | Allow | 11 | 1 | 0 | No | No |
| 18409452 | MULTILAYER CAPACITOR HAVING INTERNAL ELECTRODE WITH DOUBLE BOTTLENECK STRUCTURE | January 2024 | March 2025 | Allow | 14 | 2 | 0 | No | No |
| 18515090 | MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH | November 2023 | March 2025 | Allow | 16 | 2 | 0 | No | No |
| 18378364 | MULTILAYER ELECTRONIC COMPONENT INCLUDING A SILICON ORGANIC COMPOUND LAYER ARRANGED BETWEEN LAYERS OF AN EXTERNAL ELECTRODE | October 2023 | November 2024 | Abandon | 14 | 1 | 0 | No | No |
| 18239912 | CAPACITOR COMPONENT | August 2023 | November 2024 | Abandon | 14 | 1 | 0 | No | No |
| 18209255 | MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING SPECIFIED THICKNESS RATIO FOR DIFFERENT PORTIONS OF EXTERNAL ELECTRODE | June 2023 | September 2024 | Allow | 15 | 2 | 0 | No | No |
| 18200971 | CERAMIC ELECTRONIC COMPONENT HAVING EXTERNAL ELECTRODE WHICH INCLUDES BORON WITH HIGH RATIO OF ISOTOPE 10B | May 2023 | June 2025 | Allow | 25 | 1 | 0 | No | No |
| 18131522 | MULTILAYER ELECTRONIC COMPONENT HAVING MOISTURE-PROOF LAYER ON BODY THEREOF | April 2023 | September 2024 | Abandon | 17 | 1 | 0 | No | No |
| 18124620 | COMPONENT BUILT-IN SUBSTRATE INCLUDING MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING PROTRUDING CONNECTION PORTIONS | March 2023 | April 2024 | Allow | 12 | 1 | 0 | Yes | No |
| 18124783 | MULTILAYER CERAMIC CAPACITOR INCLUDING SIDE MARGIN PORTION HAVING MAGNESIUM CONTENT DIFFERENT THAN COVER PORTION | March 2023 | August 2024 | Allow | 16 | 2 | 0 | Yes | No |
| 18121042 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING MULTILAYER EXTERNAL ELECTRODES WITH DIFFUSED METAL IN AN UNDERLYING ELECTRODE LAYER | March 2023 | June 2024 | Allow | 15 | 2 | 0 | No | No |
| 18109899 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | February 2023 | June 2025 | Allow | 28 | 0 | 0 | No | No |
| 18007238 | FILM CAPACITOR, CONNECTED CAPACITOR, INVERTER, AND ELECTRIC VEHICLE | January 2023 | October 2024 | Allow | 21 | 0 | 0 | No | No |
| 18096702 | CERAMIC ELECTRONIC COMPONENT COMPRISING DIELECTRIC GRAINS HAVING A CORE-DUAL SHELL STRUCTURE AND METHOD OF MANUFACTURING THE SAME | January 2023 | October 2023 | Allow | 9 | 1 | 0 | No | No |
| 18094668 | MULTILAYER ELECTRONIC COMPONENT INCLUDING NON-CONDUCTIVE RESIN LAYER ON BODY THEREOF | January 2023 | November 2023 | Allow | 10 | 2 | 0 | Yes | No |
| 18012820 | THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME | December 2022 | November 2024 | Allow | 22 | 1 | 0 | No | No |
| 18012135 | THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME | December 2022 | April 2025 | Allow | 27 | 1 | 0 | No | No |
| 18082065 | HIGH-VOLTAGE FEED-THROUGH CAPACITOR WITH ELEMENT BODY, THROUGH-CONDOCTOR, CASE, COVER, AND TUBE | December 2022 | November 2024 | Allow | 23 | 1 | 0 | No | No |
| 18001672 | SOLID ELECTROLYTIC CAPACITOR ELEMENT, SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING SAME | December 2022 | June 2025 | Allow | 30 | 2 | 0 | No | No |
| 18001679 | SOLID ELECTROLYTIC CAPACITOR ELEMENT HAVING IMPROVED THERMAL STABILITY, AND SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SAME | December 2022 | April 2025 | Allow | 28 | 1 | 0 | No | No |
| 18079449 | MULTILAYER ELECTRONIC COMPONENT WITH CURVED SIDE SURFACES | December 2022 | June 2025 | Allow | 30 | 2 | 1 | Yes | No |
| 18075456 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING EXTERNAL ELECTRODES WITH MULTILAYER STRUCTURE | December 2022 | October 2023 | Allow | 10 | 1 | 0 | No | No |
| 18076291 | MULTILAYER CERAMIC ELECTRONIC COMPONENT WITH GLASS GRAINS IN SIDE MARGIN | December 2022 | January 2025 | Allow | 25 | 1 | 0 | No | No |
| 17994631 | MULTILAYER CAPACITOR INCLUDING A RARE EARTH ELEMENT AND ZIRCONIUM | November 2022 | January 2025 | Allow | 26 | 2 | 0 | Yes | No |
| 17927826 | SEPARATOR FOR ALUMINUM ELECTROLYTIC CAPACITORS, AND ALUMINUM ELECTROLYTIC CAPACITOR | November 2022 | December 2024 | Abandon | 25 | 1 | 0 | No | No |
| 17994042 | CAPACITOR MODULE HAVING A METAL SHEET BETWEEN ADJACENT CAPACITORS | November 2022 | May 2025 | Allow | 40 | 1 | 0 | No | No |
| 17987766 | PARALLEL-CONNECTED TRENCH CAPACITOR STRUCTURE WITH MULTIPLE ELECTRODE LAYERS AND METHOD OF FABRICATING THE SAME | November 2022 | February 2024 | Allow | 15 | 3 | 0 | No | No |
| 17979029 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC CAPACITOR | November 2022 | September 2024 | Allow | 22 | 0 | 0 | No | No |
| 17974438 | MULTILAYER CERAMIC ELECTRONIC DEVICE WITH ZIRCONIUM | October 2022 | June 2025 | Allow | 32 | 2 | 1 | No | No |
| 17972722 | MULTILAYER ELECTRONIC COMPONENT HAVING STRUCTURE FOR IMPROVED ADHESION FORCE AND MOISTURE PROTECTION | October 2022 | March 2025 | Allow | 29 | 2 | 0 | No | No |
| 17966118 | CAPACITOR COMPONENT INCLUDING REINFORCING PATTERN IN A MARGIN/COVER PORTION | October 2022 | July 2023 | Allow | 9 | 1 | 0 | Yes | No |
| 17954380 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING METAL TERMINALS, EXTERIOR MATERIAL, AND ELECTROSTATIC SHIELDING METAL | September 2022 | December 2024 | Allow | 27 | 1 | 0 | No | No |
| 17954099 | MULTILAYER ELECTRONIC COMPONENT WITH IMPROVED RELIABILITY | September 2022 | April 2025 | Allow | 31 | 3 | 0 | Yes | No |
| 17913279 | CAPACITOR AND METHOD FOR MANUFACTURING SAME | September 2022 | December 2024 | Allow | 27 | 1 | 0 | No | No |
| 17902298 | MULTILAYER CAPACITOR HAVING INTERNAL ELECTRODES AND EXTERNAL ELECTRODES | September 2022 | July 2024 | Allow | 22 | 2 | 0 | No | No |
| 17892665 | Capacitor Integrated Structure | August 2022 | July 2023 | Allow | 11 | 1 | 0 | No | No |
| 17799092 | CAPACITOR WITH BARIUM TITANATE DIELECTRIC LAYERS | August 2022 | November 2024 | Allow | 27 | 1 | 0 | No | No |
| 17871841 | METHOD FOR MULTILAYER CERAMIC ELECTRONIC DEVICE WITH PUNCHED OUT SIDE MARGIN PARTS | July 2022 | April 2024 | Allow | 20 | 3 | 0 | No | No |
| 17812325 | SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SOLID ELECTROLYTIC CAPACITOR COMPRISING A BLOCK LAYER FORMED USING A CONDUCTIVE POLYMER HETEROGENEOUSLY DOPED WITH A POLYMER DOPANT | July 2022 | February 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 17859557 | CERAMIC ELECTRONIC COMPONENT HAVING A DIELECTRIC WITH SECONDARY PHASES, METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, AND METHOD OF PRODUCING DIELECTRIC POWDER | July 2022 | March 2025 | Allow | 32 | 2 | 1 | Yes | No |
| 17837243 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING INTERNAL CONDUCTIVE LAYER INCLUDING A PLURALITY OF HOLES | June 2022 | June 2024 | Allow | 24 | 1 | 0 | No | No |
| 17829747 | MULTILAYER ELECTRONIC COMPONENT INCLUDING A SILICON ORGANIC COMPOUND LAYER ARRANGED BETWEEN LAYERS OF AN EXTERNAL ELECTRODE | June 2022 | July 2023 | Allow | 14 | 2 | 0 | Yes | No |
| 17825289 | MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH | May 2022 | August 2023 | Allow | 15 | 2 | 0 | Yes | No |
| 17661709 | CATHODE FOIL COMPRISING POROUS METAL AND COATING FILM COVERING THE POROUS METAL AND ELECTROLYTIC CAPACITOR INCLUDING THE SAME | May 2022 | February 2025 | Allow | 34 | 3 | 1 | Yes | No |
| 17733068 | MULTILAYER ELECTRONIC COMPONENT INCLUDING NON-CONDUCTIVE RESIN LAYER ON BODY THEREOF | April 2022 | January 2023 | Allow | 9 | 0 | 0 | Yes | No |
| 17729845 | CAPACITOR AND METHOD FOR PRODUCING THE SAME | April 2022 | February 2025 | Allow | 34 | 0 | 1 | No | No |
| 17726885 | MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING SPECIFIED STANDARD DEVIATION RATIO FOR INTERNAL ELECTRODE AND DIELECTRIC LAYER THICKNESSES | April 2022 | May 2023 | Allow | 13 | 2 | 0 | Yes | No |
| 17726888 | MANUFACTURING METHOD OF MULTILAYER CERAMIC ELECTRONIC COMPONENT | April 2022 | January 2023 | Allow | 9 | 1 | 0 | No | No |
| 17725866 | CERAMIC ELECTRONIC COMPONENT HAVING DIELECTRIC LAYERS INCLUDING A PLURALITY OF DIELECTRIC CRYSTAL GRAINS | April 2022 | October 2024 | Abandon | 30 | 2 | 0 | Yes | No |
| 17718714 | CAPACITOR COMPONENT HAVING PROTECTIVE LAYER WHICH INCLUDES OXIDE CERAMIC AND METAL | April 2022 | April 2024 | Allow | 25 | 1 | 1 | Yes | No |
| 17712424 | CAPACITOR COMPONENT INCLUDING THROUGH-HOLE STRUCTURE TO INCREASE CAPACITANCE | April 2022 | March 2024 | Allow | 24 | 2 | 0 | Yes | No |
| 17712357 | CAPACITOR | April 2022 | April 2024 | Allow | 24 | 0 | 0 | No | No |
| 17707390 | CERAMIC ELECTRONIC COMPONENT INCLUDING BONDING LAYER BETWEEN BODY AND SINTERED EXTERNAL ELECTRODE | March 2022 | July 2024 | Allow | 28 | 2 | 1 | Yes | No |
| 17707396 | CERAMIC ELECTRONIC COMPONENT INCLUDING INSULATING LAYER | March 2022 | January 2025 | Allow | 34 | 4 | 0 | Yes | No |
| 17763338 | FILM CAPACITOR DEVICE | March 2022 | December 2023 | Allow | 21 | 0 | 0 | No | No |
| 17572723 | PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE | January 2022 | January 2025 | Abandon | 36 | 1 | 0 | No | No |
| 17569698 | CERAMIC ELECTRONIC COMPONENT INCLUDING DIELECTRIC LAYERS HAVING DIFFERENT DIELECTRIC COMPOSITIONS | January 2022 | April 2024 | Allow | 27 | 2 | 0 | Yes | No |
| 17569815 | MULTILAYER CAPACITOR HAVING SINTERED ELECTRODE LAYER WITH WRAPAROUND PORTION | January 2022 | February 2024 | Allow | 26 | 2 | 0 | No | No |
| 17528575 | CONDUCTIVE PASTE INCLUDING METAL PORTIONS HAVING DIFFERENT MELTING POINTS AND MULTILAYER CERAMIC COMPONENT USING THE SAME | November 2021 | March 2024 | Allow | 28 | 2 | 0 | Yes | No |
| 17523179 | MULTILAYER CAPACITOR INCLUDING INTERNAL ELECTRODES HAVING PORES ON ENDS THEREOF AND BOARD HAVING THE SAME MOUNTED THEREON | November 2021 | January 2024 | Allow | 26 | 1 | 0 | No | No |
| 17521305 | MULTILAYER ELECTRONIC COMPONENT WITH ALTERNATING DIELECTRIC AND INTERNAL ELECTRODE LAYERS | November 2021 | October 2023 | Allow | 23 | 2 | 0 | No | No |
| 17518489 | CERAMIC ELECTRONIC COMPONENT WITHOUT EXTERNAL ELECTRODES ON TOP SURFACE, SUBSTRATE ARRANGEMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING SUCH CERAMIC ELECTRONIC COMPONENT | November 2021 | October 2023 | Allow | 23 | 1 | 1 | No | No |
| 17517142 | MULTILAYER CAPACITOR WITH CORE-SHELL DIELECTRIC | November 2021 | January 2024 | Allow | 26 | 2 | 0 | Yes | No |
| 17516774 | Capacitor Having A Through-Hole Exposing An Electrode And At Least One Protrusion In The Through-Hole | November 2021 | April 2025 | Allow | 42 | 2 | 0 | No | No |
| 17506925 | MULTILAYER CERAMIC CAPACITOR WITH REDUCED EQUIVALENT SERIES INDUCTANCE | October 2021 | March 2024 | Allow | 28 | 2 | 1 | Yes | No |
| 17506047 | CAPACITOR COMPONENT HAVING NICKEL AND CARBON BETWEEN INTERNAL ELECTRODE AND DIELECTRIC LAYERS | October 2021 | March 2024 | Allow | 28 | 2 | 1 | Yes | No |
| 17501001 | THREE-TERMINAL CAPACITOR WITH CYLINDRICAL MAIN BODY AND ELECTRONIC COMPONENT INCLUDING THE SAME | October 2021 | February 2024 | Allow | 28 | 1 | 0 | No | No |
| 17499103 | MULTILAYER ELECTRONIC COMPONENT INCLUDING SIDE MARGIN PORTION HAVING COMPOSITION GRADIENT ACROSS THICKNESS THEREOF | October 2021 | October 2023 | Allow | 24 | 2 | 0 | Yes | No |
| 17499117 | CAPACITOR COMPONENT INCLUDING INDIUM AND TIN, AND METHOD OF MANUFACTURING THE CAPACITOR COMPONENT | October 2021 | January 2024 | Allow | 27 | 1 | 1 | Yes | No |
| 17496659 | ELECTRONIC COMPONENT HAVING A BODY AND SEALING THIN FILM DISPOSED IN A MICROHOLE OF THE BODY | October 2021 | February 2024 | Allow | 28 | 2 | 1 | Yes | No |
| 17489876 | MULTILAYER CERAMIC CAPACITOR WITH CHANGING DISTANCE BETWEEN CAPACITOR MAIN BODY AND INTERPOSERS | September 2021 | January 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17479055 | MULTILAYER CERAMIC CAPACITOR INCLUDING RAISED PORTIONS THICKER FROM MIDDLE PORTION TOWARDS OUTER PERIPHERY | September 2021 | December 2023 | Allow | 27 | 2 | 0 | Yes | No |
| 17476995 | MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY | September 2021 | November 2023 | Allow | 26 | 2 | 1 | Yes | No |
| 17473402 | MULTILAYER ELECTRONIC COMPONENT WITH DUMMY INTERNAL ELECTRODES | September 2021 | June 2023 | Allow | 21 | 0 | 0 | Yes | No |
| 17438105 | MULTI-TERMINAL CAPACITOR HAVING EXTERNAL TERMINALS PROVIDED IN A SPECIFIC MANNER THEREON, METHOD OF MANUFACTURING MULTI-TERMINAL CAPACITOR, AND MULTI-TERMINAL-CAPACITOR-MOUNTED CIRCUIT BOARD | September 2021 | January 2024 | Allow | 28 | 1 | 0 | No | No |
| 17469136 | MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED ELECTRODE STRUCTURE FOR INCREASED CAPACITY PER UNIT VOLUME | September 2021 | March 2024 | Allow | 30 | 2 | 0 | No | No |
| 17466508 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING EXTERNAL ELECTRODES HAVING IMPROVED RELIABILITY | September 2021 | September 2023 | Allow | 25 | 2 | 0 | Yes | No |
| 17465176 | MULTILAYER CAPACITOR HAVING IMPROVED RELIABILITY BY ADJUSTING GRAIN SIZE OF DIELECTRIC LAYER | September 2021 | October 2023 | Allow | 26 | 2 | 0 | No | No |
| 17411562 | MULTILAYER CERAMIC ELECTRONIC COMPONENT WITH A MULTILAYER EXTERNAL ELECTRODE | August 2021 | January 2025 | Allow | 40 | 5 | 0 | Yes | No |
| 17408191 | MULTILAYER CAPACITOR INCLUDING DIELECTRIC LAYER WITH GRAINS HAVING PORES | August 2021 | May 2023 | Allow | 21 | 1 | 0 | No | No |
| 17405061 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING METAL TERMINALS WITH RECESS PORTIONS AND MOUNTING STRUCTURE OF THE MULTILAYER CERAMIC ELECTRONIC COMPONENT | August 2021 | September 2023 | Allow | 25 | 2 | 0 | No | No |
| 17403041 | HIGH VOLTAGE METAL INSULATOR METAL (MIM) CAPACITOR | August 2021 | April 2025 | Allow | 44 | 0 | 1 | No | No |
| 17427942 | LAMINATED MULTILAYER CERAMIC ELECTRONIC COMPONENT WITH ALTERNATING LAYERS | August 2021 | July 2024 | Allow | 35 | 3 | 0 | No | No |
| 17383485 | COMPONENT BUILT-IN SUBSTRATE | July 2021 | December 2022 | Allow | 17 | 0 | 1 | No | No |
| 17371789 | MULTILAYER CAPACITOR COMPRISING CAPACITOR BODY INCLUDING ACTIVE PORTION AND MARGIN PORTION | July 2021 | May 2023 | Allow | 23 | 2 | 0 | No | No |
| 17370988 | LOW-HEIGHT MUTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | July 2021 | August 2024 | Abandon | 37 | 4 | 1 | No | No |
| 17366141 | ELECTRONIC COMPONENT INCLUDING DIFFUSION REGIONS | July 2021 | December 2022 | Allow | 18 | 1 | 0 | No | No |
| 17338414 | CERAMIC ELECTRONIC DEVICE | June 2021 | October 2022 | Allow | 16 | 0 | 0 | No | No |
| 17331309 | ELECTRONIC COMPONENT WITH EXTERNAL ELECTRODE INCLUDING CONDUCTIVE RESIN LAYER AND METHOD FOR PRODUCING ELECTRONIC COMPONENT | May 2021 | September 2022 | Allow | 16 | 1 | 1 | No | No |
| 17327941 | ELECTRONIC COMPONENT AND BOARD HAVING THE SAME | May 2021 | August 2024 | Abandon | 39 | 4 | 0 | Yes | No |
| 17325357 | ELECTRONIC COMPONENT HAVING METAL FRAME FOR PREVENTING SPARKING AND SHORT CIRCUITS AND BOARD HAVING THE SAME | May 2021 | February 2023 | Allow | 21 | 1 | 0 | No | No |
| 17237085 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF THE MULTILAYER CERAMIC CAPACITOR | April 2021 | August 2022 | Allow | 15 | 0 | 0 | No | No |
| 17205274 | MULTILAYER CAPACITOR HAVING INTERNAL ELECTRODE WITH DOUBLE BOTTLENECK STRUCTURE | March 2021 | October 2023 | Allow | 31 | 3 | 0 | Yes | No |
| 17205067 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING MULTILAYER EXTERNAL ELECTRODES | March 2021 | December 2022 | Allow | 21 | 1 | 0 | No | No |
| 17205069 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING EXTERNAL ELECTRODE WITH MULTILAYER STRUCTURE | March 2021 | September 2022 | Allow | 18 | 1 | 0 | No | No |
| 17165339 | THIN FILM CAPACITOR HAVING A DIELECTRIC LAYER HAVING A THROUGH HOLE WHOSE INNER SURFACE HAS FIRST AND SECOND TAPERED SURFACES, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN FILM CAPACITOR MANUFACTURING METHOD | February 2021 | February 2023 | Allow | 24 | 2 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner DUBUISSON, DANIEL MICHAEL.
With a 100.0% reversal rate, the PTAB has reversed the examiner's rejections more often than affirming them. This reversal rate is in the top 25% across the USPTO, indicating that appeals are more successful here than in most other areas.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 100.0% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner DUBUISSON, DANIEL MICHAEL works in Art Unit 2848 and has examined 131 patent applications in our dataset. With an allowance rate of 88.5%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 26 months.
Examiner DUBUISSON, DANIEL MICHAEL's allowance rate of 88.5% places them in the 66% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by DUBUISSON, DANIEL MICHAEL receive 1.66 office actions before reaching final disposition. This places the examiner in the 46% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by DUBUISSON, DANIEL MICHAEL is 26 months. This places the examiner in the 62% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +2.0% benefit to allowance rate for applications examined by DUBUISSON, DANIEL MICHAEL. This interview benefit is in the 18% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 29.6% of applications are subsequently allowed. This success rate is in the 48% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 73.2% of cases where such amendments are filed. This entry rate is in the 92% percentile among all examiners. Strategic Recommendation: This examiner is highly receptive to after-final amendments compared to other examiners. Per MPEP § 714.12, after-final amendments may be entered "under justifiable circumstances." Consider filing after-final amendments with a clear showing of allowability rather than immediately filing an RCE, as this examiner frequently enters such amendments.
This examiner withdraws rejections or reopens prosecution in 50.0% of appeals filed. This is in the 14% percentile among all examiners. Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 66.7% are granted (fully or in part). This grant rate is in the 84% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 23% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 17.2% of allowed cases (in the 92% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.