Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18775176 | INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY | July 2024 | September 2024 | Allow | 2 | 0 | 0 | No | No |
| 18644647 | INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY | April 2024 | June 2024 | Allow | 2 | 0 | 0 | No | No |
| 18428187 | CIRCUIT BOARD WITH ANTI-CORROSION PROPERTIES AND ELECTRONIC DEVICE HAVING THE SAME | January 2024 | January 2025 | Allow | 12 | 1 | 1 | No | No |
| 18513142 | BUTTON DECK ASSEMBLY FOR AN ELECTRONIC GAMING MACHINE AND METHOD FOR MAKING THE SAME | November 2023 | August 2024 | Allow | 9 | 0 | 0 | No | No |
| 18495763 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | October 2023 | August 2024 | Allow | 10 | 0 | 0 | No | No |
| 18381074 | SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS | October 2023 | July 2024 | Allow | 9 | 0 | 1 | No | No |
| 18373284 | PACKAGE DEVICE | September 2023 | October 2024 | Allow | 12 | 0 | 0 | No | No |
| 18475344 | BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS | September 2023 | September 2024 | Allow | 12 | 1 | 1 | No | No |
| 18368424 | OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES | September 2023 | June 2024 | Allow | 9 | 0 | 0 | No | No |
| 18459989 | EXTENSIBLE AND CONTRACTIBLE WIRING BOARD AND METHOD FOR MANUFACTURING EXTENSIBLE AND CONTRACTIBLE WIRING BOARD | September 2023 | June 2024 | Allow | 10 | 0 | 0 | No | No |
| 18447265 | MANUFACTURING METHOD OF CIRCUIT BOARD | August 2023 | May 2024 | Allow | 10 | 0 | 0 | No | No |
| 18224504 | ELECTRICAL INTERCONNECT BRIDGE | July 2023 | July 2024 | Allow | 12 | 1 | 1 | No | No |
| 18347887 | DISPLAY DEVICE | July 2023 | November 2024 | Allow | 16 | 1 | 0 | Yes | No |
| 18204844 | IMMERSION COOLING TANK | June 2023 | February 2024 | Allow | 8 | 0 | 1 | No | No |
| 18200712 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD | May 2023 | June 2024 | Allow | 13 | 1 | 1 | No | No |
| 18318512 | OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE AND FLEXIBLE PRINTED BOARD | May 2023 | February 2025 | Allow | 21 | 0 | 0 | No | No |
| 18140741 | WIRING STRUCTURE, DISPLAY SUBSTRATE AND DISPLAY DEVICE | April 2023 | August 2024 | Allow | 16 | 1 | 0 | No | No |
| 18193823 | ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PRINTED CIRCUIT BOARDS | March 2023 | September 2024 | Allow | 18 | 1 | 0 | No | No |
| 18193803 | ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PRINTED CIRCUIT BOARDS | March 2023 | September 2024 | Allow | 18 | 1 | 0 | No | No |
| 18128779 | METHOD OF MANUFACTURING WIRING SUBSTRATE | March 2023 | May 2024 | Allow | 14 | 0 | 0 | No | No |
| 18028787 | DISPLAY MODULE AND DISPLAY DEVICE | March 2023 | February 2025 | Allow | 23 | 0 | 0 | No | No |
| 18191427 | METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL NODE MODULE, ELECTRICAL NODE, AND MULTILAYER STRUCTURE | March 2023 | June 2024 | Allow | 15 | 2 | 1 | Yes | No |
| 18121780 | ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCIATED METHOD | March 2023 | February 2024 | Allow | 11 | 1 | 1 | No | No |
| 18120638 | RESISTIVE DEVICE | March 2023 | May 2023 | Allow | 2 | 0 | 0 | No | No |
| 18119711 | SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A REFERENCE TRACE | March 2023 | April 2024 | Allow | 13 | 0 | 0 | No | No |
| 18177215 | FLUOROSCOPIC IMAGING-COMPATIBLE AND X-RAY DOSE REDUCING ELECTROMAGNETIC FIELD GENERATOR FOR ELECTROMAGNETIC TRACKING | March 2023 | September 2024 | Allow | 18 | 1 | 1 | Yes | No |
| 18111738 | CIRCUIT BOARD | February 2023 | February 2025 | Abandon | 24 | 2 | 0 | No | No |
| 18169333 | CIRCUIT MODULE AND METHOD FOR MANUFACTURING SUBMODULE | February 2023 | December 2024 | Allow | 22 | 0 | 1 | No | No |
| 18106435 | DISPLAY UNIT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE ELECTRONIC APPARATUS | February 2023 | March 2024 | Allow | 13 | 2 | 1 | No | No |
| 18104479 | INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY | February 2023 | February 2024 | Allow | 12 | 2 | 1 | No | No |
| 18157228 | DESIGNING A PRINTED CIRCUIT BOARD (PCB) TO DETECT SLIVERS OF CONDUCTIVE MATERIAL INCLUDED WITHIN VIAS OF THE PCB | January 2023 | October 2024 | Abandon | 20 | 3 | 1 | Yes | No |
| 18154856 | INJECTION MOLDED ARTICLE AND METHOD FOR PRODUCING SAME | January 2023 | November 2023 | Allow | 9 | 2 | 1 | No | No |
| 18094995 | PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF | January 2023 | July 2023 | Allow | 6 | 0 | 1 | No | No |
| 18091133 | CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION | December 2022 | April 2024 | Allow | 15 | 0 | 0 | No | No |
| 18084708 | HIGHLY TRANSPARENT AND STRETCHABLE LED DISPLAY STRUCTURE | December 2022 | November 2024 | Allow | 23 | 0 | 0 | No | No |
| 18067859 | ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME | December 2022 | November 2024 | Allow | 23 | 0 | 1 | No | No |
| 17999825 | RF DISTRIBUTION VOLUME AND ELECTRONIC DEVICE | November 2022 | March 2025 | Abandon | 27 | 0 | 1 | No | No |
| 18055946 | CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | November 2022 | October 2024 | Allow | 23 | 0 | 0 | No | No |
| 17985418 | POWER MODULE | November 2022 | January 2025 | Allow | 26 | 1 | 0 | No | No |
| 17979150 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME | November 2022 | June 2024 | Allow | 20 | 1 | 0 | No | No |
| 18052165 | AUTODYNAMIC FLEXIBLE CIRCUITS | November 2022 | August 2024 | Allow | 22 | 0 | 1 | No | No |
| 17975245 | BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE ELECTRONICS FOR BIOMEDICAL IMPLANT | October 2022 | October 2023 | Allow | 12 | 2 | 1 | Yes | No |
| 18049772 | CIRCUIT ASSEMBLY | October 2022 | January 2025 | Allow | 27 | 1 | 0 | No | No |
| 18047337 | ELECTRONIC COMPONENT SUB-MOUNT AND ELECTRONIC DEVICE USING THE SAME | October 2022 | December 2024 | Allow | 25 | 1 | 1 | No | No |
| 17961911 | ELECTRONIC DEVICE | October 2022 | December 2024 | Allow | 26 | 1 | 0 | No | No |
| 17957870 | PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAND AND ELECTRONIC DEVICE COMPRISING SAME | September 2022 | December 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17936924 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE | September 2022 | July 2024 | Allow | 21 | 2 | 1 | No | No |
| 17956858 | DEVICE FOR TEMPERATURE MEASUREMENT | September 2022 | August 2024 | Allow | 22 | 0 | 1 | No | No |
| 17914679 | BACKPLANE MODULE FOR ELECTRICALLY CONNECTING A PLURALITY OF FUNCTIONAL MODULES, AND MODULAR COMMUNICATIONS SYSTEM | September 2022 | July 2024 | Allow | 22 | 0 | 0 | No | No |
| 17914496 | CELL BALANCING MODULE | September 2022 | July 2024 | Allow | 22 | 0 | 1 | No | No |
| 17913212 | INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD | September 2022 | June 2024 | Allow | 21 | 0 | 0 | No | No |
| 17939786 | FORMING WAVEGUIDES AND HEAT TRANSFER ELEMENTS IN PRINTED CIRCUIT BOARDS | September 2022 | February 2025 | Abandon | 29 | 0 | 1 | No | No |
| 17901417 | SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PRODUCTION | September 2022 | March 2024 | Allow | 19 | 0 | 0 | No | No |
| 17900309 | HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF | August 2022 | May 2024 | Allow | 21 | 1 | 0 | No | No |
| 17899553 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | August 2022 | January 2024 | Allow | 17 | 1 | 1 | No | No |
| 17822283 | FILTER DEVICE | August 2022 | June 2024 | Allow | 22 | 0 | 0 | No | No |
| 17821284 | Ultra-Thin Component Carrier Having High Stiffness and Method of Manufacturing the Same | August 2022 | October 2024 | Allow | 26 | 1 | 1 | No | No |
| 17891368 | SEMICONDUCTOR STORAGE DEVICE | August 2022 | October 2024 | Allow | 26 | 1 | 1 | No | No |
| 17889473 | SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTING AND ATTACHMENT | August 2022 | July 2024 | Allow | 23 | 0 | 1 | No | No |
| 17819920 | CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD | August 2022 | November 2023 | Allow | 15 | 0 | 1 | No | No |
| 17886618 | METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS | August 2022 | October 2024 | Allow | 26 | 1 | 1 | Yes | No |
| 17798810 | WIRING CIRCUIT BOARD | August 2022 | June 2024 | Allow | 22 | 0 | 0 | No | No |
| 17884176 | WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT BOARD ASSEMBLY SHEET | August 2022 | August 2024 | Allow | 24 | 3 | 1 | No | Yes |
| 17883287 | METHOD AND SYSTEM FOR ULTRA-WIDEBAND ELECTROMAGNETIC SOURCE | August 2022 | June 2024 | Allow | 22 | 0 | 1 | No | No |
| 17797975 | FLAT CONDUCTOR CONNECTION ELEMENT | August 2022 | April 2024 | Allow | 20 | 0 | 0 | No | No |
| 17879280 | FLEXIBLE PRINTED CIRCUIT BOARD HAVING WATERPROOF STRUCTURE AND FOLDABLE ELECTRONIC DEVICE INCLUDING THE SAME | August 2022 | July 2024 | Allow | 24 | 0 | 1 | No | No |
| 17872082 | BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS | July 2022 | June 2023 | Allow | 11 | 0 | 1 | No | No |
| 17872507 | ELECTRIC POWER CONVERTER | July 2022 | May 2024 | Allow | 22 | 0 | 0 | No | No |
| 17873088 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | July 2022 | December 2023 | Allow | 16 | 1 | 1 | No | No |
| 17869934 | FLEXIBLE CIRCUIT BOARD | July 2022 | May 2024 | Allow | 22 | 1 | 0 | No | No |
| 17865955 | ELECTRONIC DEVICE INCLUDING A STRUCTURE FOR GUIDING AN ARRANGEMENT POSITION OF AN ELECTRONIC COMPONENT | July 2022 | September 2024 | Allow | 26 | 1 | 1 | Yes | No |
| 17855664 | OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES | June 2022 | June 2023 | Allow | 12 | 0 | 1 | No | No |
| 17845985 | ELECTRONIC DEVICE | June 2022 | July 2024 | Allow | 25 | 1 | 0 | No | No |
| 17838763 | METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD | June 2022 | April 2024 | Allow | 22 | 1 | 0 | No | No |
| 17806412 | Sidewall Connections and Button Interconnects for Molded SiPs | June 2022 | July 2024 | Allow | 25 | 0 | 1 | No | No |
| 17752868 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | May 2022 | September 2023 | Allow | 16 | 0 | 1 | No | No |
| 17663418 | Component Carrier With a Magnetic Element and a Manufacturing Method | May 2022 | February 2025 | Allow | 33 | 4 | 2 | Yes | No |
| 17741175 | BUTTON DECK ASSEMBLY FOR AN ELECTRONIC GAMING MACHINE AND METHOD FOR MAKING THE SAME | May 2022 | September 2023 | Allow | 17 | 1 | 1 | No | No |
| 17740975 | CIRCUIT BOARD WITH ANTI-CORROSION PROPERTIES, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME | May 2022 | November 2023 | Allow | 19 | 1 | 1 | No | No |
| 17739945 | THREADED FASTENER RETENTION DETECTION | May 2022 | May 2024 | Allow | 24 | 0 | 1 | Yes | No |
| 17772453 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | April 2022 | December 2023 | Allow | 20 | 0 | 1 | No | No |
| 17728234 | METHOD OF DIRECTLY PATTERNING STRETCHABLE SUBSTRATE AND STRETCHABLE ELECTRODE FABRICATED BY THE SAME | April 2022 | August 2023 | Allow | 16 | 0 | 1 | No | No |
| 17770754 | COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATING CIRCUIT BOARD | April 2022 | December 2022 | Allow | 8 | 0 | 0 | No | No |
| 17717466 | ADAPTIVE INTEGRATED VEHICLE WIRE AND SIGNAL TRANSPORT SYSTEM | April 2022 | May 2024 | Allow | 25 | 0 | 1 | Yes | No |
| 17702804 | ANTENNA SUBSTRATE, ANTENNA MODULE, AND METHOD OF MANUFACTURING ANTENNA SUBSTRATE | March 2022 | May 2024 | Allow | 25 | 0 | 1 | No | No |
| 17703277 | STRETCHABLE SUBSTRATE HAVING IMPROVED STRETCH UNIFORMITY AND METHOD OF MANUFACTURING THE SAME | March 2022 | August 2023 | Allow | 17 | 1 | 1 | No | No |
| 17703520 | STRETCHABLE SUBSTRATE HAVING IMPROVED STRETCH UNIFORMITY AND METHOD OF MANUFACTURING THE SAME | March 2022 | March 2024 | Allow | 24 | 2 | 1 | No | No |
| 17700657 | METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL NODE MODULE, ELECTRICAL NODE, AND MULTILAYER STRUCTURE | March 2022 | June 2023 | Allow | 14 | 5 | 1 | No | No |
| 17699446 | STRETCHABLE 3D-PRINTED CIRCUIT BOARDS | March 2022 | August 2023 | Allow | 17 | 2 | 1 | No | No |
| 17698139 | Panel Molded Electronic Assemblies with Integral Terminals | March 2022 | September 2024 | Allow | 30 | 2 | 1 | No | No |
| 17692486 | DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS | March 2022 | April 2024 | Allow | 25 | 1 | 1 | No | No |
| 17691772 | PRINTED CIRCUIT BOARD | March 2022 | October 2023 | Allow | 19 | 2 | 1 | No | No |
| 17688747 | 3D INTEGRATIONS AND METHODS OF MAKING THEREOF | March 2022 | April 2024 | Allow | 25 | 1 | 0 | No | No |
| 17684421 | CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | March 2022 | January 2024 | Allow | 23 | 3 | 1 | No | No |
| 17680291 | ELECTRONIC DEVICE | February 2022 | November 2023 | Allow | 20 | 0 | 1 | No | No |
| 17679460 | REFERENCE METAL LAYER FOR SETTING THE IMPEDANCE OF METAL CONTACTS OF A CONNECTOR | February 2022 | June 2023 | Allow | 16 | 1 | 1 | No | No |
| 17672980 | CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD | February 2022 | November 2023 | Allow | 21 | 1 | 0 | No | No |
| 17671635 | METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRATE BOARD AND BONDED BODY FOR INSULATION CIRCUIT SUBSTRATE BOARD | February 2022 | October 2023 | Allow | 20 | 0 | 0 | No | No |
| 17634115 | CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE | February 2022 | October 2024 | Abandon | 32 | 2 | 1 | No | No |
| 17650096 | ELECTRONIC DEVICE WITH MULTI-DIAMETER FEMALE CONTACTS AND RELATED METHODS | February 2022 | March 2024 | Allow | 25 | 2 | 1 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner CHEN, XIAOLIANG.
With a 28.6% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 15.8% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner CHEN, XIAOLIANG works in Art Unit 2848 and has examined 559 patent applications in our dataset. With an allowance rate of 91.1%, this examiner has an above-average tendency to allow applications. Applications typically reach final disposition in approximately 20 months.
Examiner CHEN, XIAOLIANG's allowance rate of 91.1% places them in the 74% percentile among all USPTO examiners. This examiner has an above-average tendency to allow applications.
On average, applications examined by CHEN, XIAOLIANG receive 1.25 office actions before reaching final disposition. This places the examiner in the 22% percentile for office actions issued. This examiner issues significantly fewer office actions than most examiners.
The median time to disposition (half-life) for applications examined by CHEN, XIAOLIANG is 20 months. This places the examiner in the 89% percentile for prosecution speed. Applications move through prosecution relatively quickly with this examiner.
Conducting an examiner interview provides a -4.1% benefit to allowance rate for applications examined by CHEN, XIAOLIANG. This interview benefit is in the 4% percentile among all examiners. Note: Interviews show limited statistical benefit with this examiner compared to others, though they may still be valuable for clarifying issues.
When applicants file an RCE with this examiner, 31.4% of applications are subsequently allowed. This success rate is in the 56% percentile among all examiners. Strategic Insight: RCEs show above-average effectiveness with this examiner. Consider whether your amendments or new arguments are strong enough to warrant an RCE versus filing a continuation.
This examiner enters after-final amendments leading to allowance in 25.9% of cases where such amendments are filed. This entry rate is in the 27% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 25.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 27% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 58.8% of appeals filed. This is in the 28% percentile among all examiners. Of these withdrawals, 70.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 20.8% are granted (fully or in part). This grant rate is in the 12% percentile among all examiners. Strategic Note: Petitions are rarely granted regarding this examiner's actions compared to other examiners. Ensure you have a strong procedural basis before filing a petition, as the Technology Center Director typically upholds this examiner's decisions.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 23% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 28% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.