Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19115585 | IMMERSION LIQUID-COOLING SYSTEM AND CONTROL METHOD THEREFOR, AND SERVER | March 2025 | June 2025 | Allow | 3 | 0 | 0 | Yes | No |
| 19022096 | EFFICIENT THERMAL CONTROL SYSTEM FOR MICROCIRCUIT BASED ON LIQUID METAL COOLANT | January 2025 | March 2025 | Allow | 2 | 0 | 0 | No | No |
| 18924608 | APPLIANCE IMMERSION COOLING SYSTEM | October 2024 | April 2025 | Allow | 6 | 1 | 1 | No | No |
| 18759193 | CONTAINER BASED DATA CENTER WITH AIR COOLING EQUIPMENTS | June 2024 | February 2025 | Allow | 8 | 1 | 0 | No | No |
| 18725013 | HEIGHT-ADJUSTABLE SERVER AIR GUIDE HOOD AND SERVER | June 2024 | October 2024 | Allow | 3 | 0 | 0 | Yes | No |
| 18718115 | SUBSEA SUBSTATION SYSTEM WITH ONE ENCLOSURE HAVING SEPARATE THERMALS ZONES | June 2024 | January 2025 | Allow | 7 | 1 | 0 | No | No |
| 18734054 | HEAT DISSIPATION STRUCTURE FOR OPTOELECTRONIC MODULE AND ELECTRONIC DEVICE | June 2024 | December 2024 | Allow | 7 | 0 | 0 | Yes | No |
| 18505673 | A HEAT DISSIPATION ASSEMBLY FOR A TERMINAL DEVICE | November 2023 | May 2025 | Allow | 18 | 0 | 0 | No | No |
| 18484287 | THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDUCTIVE LAYER OVER A CIRCUIT BOARD | October 2023 | January 2024 | Allow | 4 | 1 | 0 | No | No |
| 18368026 | Immersion Dual-Cycle Multi-Mode Liquid Cooling Regulation System and Method for Data Center | September 2023 | November 2023 | Allow | 2 | 1 | 0 | No | No |
| 18449329 | SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN A QUBIT PLANE AND A CONTROL SYSTEM FOR THE QUBIT PLANE USING A SUPERCONDUCTING RIGID-FLEX CIRCUIT | August 2023 | June 2025 | Allow | 22 | 0 | 0 | No | No |
| 18272725 | Immersive Cooling Unit for Cooling Electronic Components and Method of Using the Same | July 2023 | April 2025 | Allow | 21 | 0 | 0 | Yes | No |
| 18332847 | SYSTEMS AND METHODS FOR CONTROLLING HEAT TRANSFER BETWEEN COMPONENTS | June 2023 | February 2025 | Allow | 20 | 0 | 0 | No | No |
| 18265059 | COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK | June 2023 | April 2025 | Allow | 22 | 1 | 0 | Yes | No |
| 18201268 | WELDING-TYPE POWER SUPPLIES WITH EXPANDABLE THERMAL INTERFACES | May 2023 | September 2024 | Allow | 15 | 0 | 0 | Yes | No |
| 18199881 | COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS | May 2023 | November 2023 | Allow | 6 | 1 | 0 | Yes | No |
| 18199499 | HANDHELD DEVICE ENCLOSURE WITH AN INTERNAL PLATFORM | May 2023 | March 2025 | Allow | 22 | 2 | 0 | Yes | No |
| 18037595 | SYSTEM FOR COOLING ELECTRONIC DEVICES IN AN ELECTRONIC MODULE | May 2023 | June 2025 | Allow | 25 | 0 | 1 | Yes | No |
| 18196146 | Liquid-Cooled Case and Cooling Circulatory System | May 2023 | September 2023 | Allow | 4 | 1 | 0 | No | No |
| 18138566 | IMMERSION COOLING WITH WATER-BASED FLUID USING NANO-STRUCTURED COATING | April 2023 | June 2025 | Allow | 26 | 1 | 0 | No | No |
| 18301532 | INVERTER HAVING HEAT CONDUCTING COMPONENT | April 2023 | April 2025 | Allow | 24 | 1 | 0 | No | No |
| 18300755 | ISOLATING TEMPERATURE FLUCTUATION IN AN ELECTRONICS ENCLOSURE | April 2023 | May 2025 | Allow | 25 | 0 | 0 | Yes | No |
| 18133481 | STRUCTURE FOR EVENLY APPLYING FORCES ON A HEAT DISSIPATION BASE PLATE | April 2023 | November 2024 | Allow | 20 | 0 | 0 | No | No |
| 18123376 | LIQUID COOLING SYSTEM WITH LIQUID LEAKAGE DETECTING MODULE | March 2023 | February 2025 | Allow | 23 | 1 | 0 | No | No |
| 18122449 | HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING | March 2023 | June 2025 | Allow | 27 | 2 | 0 | Yes | No |
| 18122431 | HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING | March 2023 | February 2024 | Allow | 11 | 0 | 0 | Yes | No |
| 18178686 | LOCALIZED IMMERSION COOLING ENCLOSURE WITH THERMAL EFFICIENCY FEATURES | March 2023 | July 2024 | Allow | 17 | 1 | 0 | Yes | No |
| 18041350 | POWER ELECTRICAL APPARATUS COMPRISING TWO POWER ELECTRONIC MODULES AND AN INTEGRATED COOLING SYSTEM | February 2023 | February 2025 | Allow | 25 | 1 | 0 | No | No |
| 18098090 | LIQUID DEFLECTOR FOR TWO-PHASE IMMERSION COOLING SYSTEM | January 2023 | July 2025 | Abandon | 29 | 1 | 0 | No | No |
| 18095111 | POWER CONVERSION DEVICE WITH BOARD RETENTION MEMBER | January 2023 | March 2025 | Allow | 26 | 2 | 0 | No | No |
| 18094008 | TRANSCEIVER HANDLE HEAT DISSIPATION AIRFLOW CHANNELING SYSTEM | January 2023 | October 2024 | Allow | 21 | 1 | 0 | Yes | No |
| 18091368 | ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL | December 2022 | January 2025 | Allow | 25 | 1 | 0 | Yes | No |
| 18012350 | ELECTRONIC PACKAGE COMPRISING A COMPONENT TO BE COOLED AND ASSOCIATED MOUNTING METHOD | December 2022 | June 2023 | Allow | 6 | 0 | 0 | No | No |
| 17991256 | Electrical Service Adapter for Supply Side Interconnect | November 2022 | April 2024 | Allow | 17 | 0 | 0 | Yes | No |
| 17976276 | THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS | October 2022 | December 2024 | Allow | 25 | 2 | 1 | Yes | No |
| 17972268 | COOLING APPARATUS WITH OFFSET FLOW PATHS | October 2022 | March 2025 | Allow | 29 | 3 | 0 | No | No |
| 17971339 | STANDALONE AND SCALABLE COOLING INFRASTRUCTURE | October 2022 | July 2024 | Allow | 21 | 2 | 0 | No | No |
| 17971348 | STANDALONE AND SCALABLE LIQUID COOLING MODULES | October 2022 | December 2024 | Allow | 26 | 3 | 0 | Yes | No |
| 17964163 | POWER DISTRIBUTION DEVICE | October 2022 | July 2024 | Allow | 21 | 0 | 0 | No | No |
| 17916854 | POWER CONVERSION DEVICE | October 2022 | July 2024 | Allow | 21 | 0 | 0 | No | No |
| 17931901 | HEAT PIPES OF AN ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME | September 2022 | December 2024 | Allow | 27 | 2 | 1 | Yes | No |
| 17911348 | VENTURI-EFFECT HEAT-TRANSFER DEVICE | September 2022 | October 2024 | Allow | 25 | 1 | 0 | Yes | No |
| 17941140 | Liquid cooling high-density pluggable modules for a network element | September 2022 | March 2024 | Allow | 18 | 1 | 0 | No | No |
| 17902747 | HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING | September 2022 | November 2022 | Allow | 2 | 0 | 0 | No | No |
| 17900147 | INTELLIGENT DYNAMIC AIR BAFFLE | August 2022 | September 2024 | Allow | 25 | 0 | 0 | No | No |
| 17892453 | POWER CONVERSION DEVICE INCLUDING COOLING FLOW PATH | August 2022 | October 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17820959 | COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS | August 2022 | October 2024 | Allow | 26 | 1 | 0 | No | No |
| 17820956 | COLD PLATES INCORPORATING S-CELLS | August 2022 | August 2024 | Allow | 24 | 1 | 0 | No | No |
| 17819716 | THERMAL MANAGEMENT OF CIRCUIT BOARDS | August 2022 | March 2024 | Allow | 20 | 1 | 0 | Yes | No |
| 17886891 | ENHANCED INTEGRATION OF POWER INVERTERS USING POLYMER COMPOSITE ENCAPSULATION | August 2022 | October 2024 | Allow | 26 | 1 | 0 | No | No |
| 17878899 | COLD PLATE WITH INTEGRATED CONNECTORS FOR USE IN AN AUTONOMOUS VEHICLE COMPUTING SYSTEM | August 2022 | February 2025 | Abandon | 30 | 2 | 0 | No | No |
| 17875380 | TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING SKIVED FINS | July 2022 | December 2024 | Abandon | 29 | 2 | 0 | No | No |
| 17874462 | POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES | July 2022 | June 2024 | Allow | 23 | 0 | 0 | No | No |
| 17871660 | HEATSINK WITH INCREASED AIR FLOW | July 2022 | July 2024 | Allow | 24 | 1 | 0 | Yes | No |
| 17814037 | COMMUNICATION DEVICE WITH HEAT DISSIPATION BASE | July 2022 | January 2025 | Allow | 30 | 3 | 0 | No | No |
| 17794561 | HEATSINKS FOR MULTIPLE COMPONENTS | July 2022 | November 2024 | Abandon | 27 | 1 | 0 | No | No |
| 17869109 | ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE | July 2022 | September 2024 | Allow | 26 | 2 | 0 | Yes | No |
| 17867774 | POWER MODULE AND HEAT SINK SYSTEM | July 2022 | March 2024 | Allow | 20 | 0 | 0 | No | No |
| 17867862 | CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS | July 2022 | March 2024 | Allow | 20 | 1 | 0 | No | No |
| 17858444 | ELECTRONIC DEVICE | July 2022 | April 2024 | Allow | 21 | 0 | 0 | No | No |
| 17853512 | THERMAL INTERPOSER FOR ELECTRONIC DEVICE | June 2022 | June 2024 | Allow | 23 | 2 | 0 | Yes | No |
| 17848520 | HEAT DISSIPATION DEVICE AND SERVER INCLUDING A FIXING BRACKET AND HEAT SINKS | June 2022 | May 2024 | Allow | 23 | 1 | 0 | No | No |
| 17843790 | LIQUID-COOLED CABINET MANIFOLD AND LIQUID-COOLED CABINET | June 2022 | July 2024 | Allow | 25 | 1 | 0 | No | No |
| 17839721 | SERVER, LIQUID COOLING DEVICE AND COLD PLATE ASSEMBLY | June 2022 | January 2024 | Allow | 19 | 0 | 1 | No | No |
| 17837295 | COOLING SYSTEM PROVIDING COOLING TO AN INFRASTRUCTURE HAVING A PLURALITY OF HEAT-GENERATING UNITS | June 2022 | December 2023 | Allow | 18 | 1 | 0 | No | No |
| 17834998 | CRYOSTAT SUSPENDED SAMPLE BOARD | June 2022 | November 2023 | Allow | 17 | 0 | 0 | No | No |
| 17831533 | POWER CONVERTER APPARATUS FOR VEHICLE | June 2022 | October 2023 | Allow | 16 | 0 | 0 | No | No |
| 17828724 | POWER DISTRIBUTION ENCLOSURE HAVING A COMBINED RECONFIGURABLE SERVICE ENTRANCE AND A DC DISTRIBUTION SECTION | May 2022 | January 2025 | Allow | 32 | 3 | 0 | No | No |
| 17825836 | HIGH EFFICIENCY JET FLOW GENERATOR FOR STORAGE COOLING | May 2022 | November 2023 | Allow | 17 | 1 | 0 | Yes | No |
| 17756442 | COOLING SYSTEM OF ELECTRONIC SYSTEMS, IN PARTICULAR FOR DATA CENTRE | May 2022 | November 2023 | Allow | 18 | 0 | 0 | No | No |
| 17747993 | LIQUID COOLED SERVER CHASSIS | May 2022 | August 2024 | Allow | 27 | 1 | 0 | No | No |
| 17777443 | ELECTRONIC MODULE COMPRISING A PULSATING HEAT PIPE | May 2022 | December 2024 | Allow | 31 | 1 | 1 | Yes | No |
| 17777242 | HEAT SINK FOR LIQUID COOLING | May 2022 | October 2023 | Allow | 17 | 1 | 0 | Yes | No |
| 17742596 | Backing Plate Assembly with Jack Screw for Bare Die Device Heat Sink Applications to Ensure Uniform Loading | May 2022 | July 2024 | Allow | 26 | 3 | 0 | Yes | No |
| 17741014 | Cooling Device for a Power Electronics Module with Cooling Adapter, Power Electronics Module and Motor Vehicle | May 2022 | May 2024 | Allow | 24 | 1 | 0 | Yes | No |
| 17772787 | ELECTRONIC DEVICE | April 2022 | May 2024 | Allow | 24 | 1 | 0 | No | No |
| 17729174 | ELECTRONIC ASSEMBLY HAVING THERMAL PAD WITH POLYMER LAYER | April 2022 | April 2025 | Allow | 36 | 4 | 0 | Yes | No |
| 17729787 | CONFIGURABLE COLD-PLATES OF DATACENTER COOLING SYSTEMS | April 2022 | October 2024 | Allow | 29 | 2 | 1 | Yes | No |
| 17771660 | CIRCUIT STRUCTURE | April 2022 | January 2024 | Allow | 21 | 0 | 0 | No | No |
| 17660631 | Eccentric Heat Dissipation For Fin Cold Plate | April 2022 | August 2023 | Allow | 16 | 1 | 0 | Yes | No |
| 17770766 | CONVERTER INCLUDING HEAT TRANSFER LAYER | April 2022 | September 2024 | Allow | 29 | 2 | 0 | No | No |
| 17659999 | COMPUTER TOWER ARCHITECTURE THERMAL MANAGEMENT | April 2022 | January 2024 | Allow | 21 | 2 | 0 | Yes | No |
| 17724345 | POWER SUPPLY DEVICE WITH A HEAT GENERATING COMPONENT | April 2022 | August 2023 | Allow | 16 | 1 | 0 | No | No |
| 17720976 | AN ELECTRONIC APPARATUS COMPRISING AN INTERFACE UNIT COMPRISING A CONNECTION UNIT, A HEAT TRANSFER UNIT, A HEAT DISSIPATION UNIT, AND A FIXATION MEMBER | April 2022 | July 2023 | Allow | 15 | 0 | 0 | No | No |
| 17714072 | SYSTEM AND METHOD FOR UTILIZING GEOTHERMAL COOLING FOR OPERATIONS OF A DATA CENTER | April 2022 | September 2024 | Abandon | 30 | 2 | 0 | No | No |
| 17709760 | DETACHABLE HEAT SINK | March 2022 | August 2024 | Abandon | 29 | 1 | 0 | No | No |
| 17709107 | BOX TYPE COOLING STRUCTURE FOR CONTROLLER | March 2022 | March 2024 | Allow | 23 | 1 | 0 | No | No |
| 17703595 | Flow-Through, Hot-Spot-Targeting Immersion Cooling Assembly | March 2022 | March 2024 | Allow | 24 | 4 | 0 | Yes | No |
| 17701324 | WATER-COOLING DEVICE FOR SOLID-STATE DISK | March 2022 | October 2024 | Abandon | 31 | 2 | 0 | No | No |
| 17698037 | DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMERSION COOLING | March 2022 | June 2024 | Allow | 27 | 1 | 1 | Yes | No |
| 17698480 | A LIQUID COOLING DEVICE MOUNTED ON A HEAT GENERATING ELECTRONIC COMPONENT | March 2022 | January 2025 | Allow | 34 | 3 | 0 | No | No |
| 17640682 | Mounting System For Mounting An Element To An Aircraft Surface | March 2022 | July 2024 | Allow | 28 | 2 | 0 | No | No |
| 17683698 | Heat-Conducting Assembly and Terminal | March 2022 | August 2023 | Allow | 17 | 1 | 0 | No | No |
| 17678387 | HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING | February 2022 | December 2022 | Allow | 10 | 1 | 0 | Yes | No |
| 17676581 | THERMALIZATION ARRANGEMENT AT CRYOGENIC TEMPERATURES | February 2022 | June 2023 | Allow | 16 | 0 | 0 | Yes | No |
| 17636493 | HEAT DISSIPATION APPARATUS, REMOTE RADIO UNIT, BASEBAND PROCESSING UNIT AND BASE STATION | February 2022 | April 2023 | Allow | 14 | 0 | 0 | Yes | No |
| 17667702 | ELECTRONIC EQUIPMENT AND LIGHT TRANSMISSION DEVICE WITH COLD PLATE FOR COOLING | February 2022 | February 2024 | Allow | 24 | 1 | 0 | No | No |
| 17649529 | THERMAL-CONTROL SYSTEM OF A VIDEO-RECORDING DOORBELL AND ASSOCIATED VIDEO-RECORDING DOORBELLS | January 2022 | July 2023 | Allow | 18 | 1 | 0 | Yes | No |
| 17630248 | POWER CONVERSION DEVICE AND ARRANGEMENT OF A WIRE THEREIN | January 2022 | June 2024 | Allow | 28 | 2 | 0 | No | No |
| 17580447 | SYSTEMS AND METHODS FOR COOLING ELECTRONIC COMPONENTS OF A VEHICLE | January 2022 | December 2023 | Allow | 23 | 1 | 0 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner PAPE, ZACHARY.
With a 13.9% reversal rate, the PTAB affirms the examiner's rejections in the vast majority of cases. This reversal rate is in the bottom 25% across the USPTO, indicating that appeals face significant challenges here.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 15.9% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the bottom 25% across the USPTO, indicating that filing appeals is less effective here than in most other areas.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
⚠ Filing a Notice of Appeal shows limited benefit. Consider other strategies like interviews or amendments before appealing.
Examiner PAPE, ZACHARY works in Art Unit 2835 and has examined 1,426 patent applications in our dataset. With an allowance rate of 75.4%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 26 months.
Examiner PAPE, ZACHARY's allowance rate of 75.4% places them in the 33% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by PAPE, ZACHARY receive 1.76 office actions before reaching final disposition. This places the examiner in the 52% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by PAPE, ZACHARY is 26 months. This places the examiner in the 62% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +15.7% benefit to allowance rate for applications examined by PAPE, ZACHARY. This interview benefit is in the 59% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 24.9% of applications are subsequently allowed. This success rate is in the 28% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 36.7% of cases where such amendments are filed. This entry rate is in the 48% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 33.3% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 31% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 50.7% of appeals filed. This is in the 17% percentile among all examiners. Of these withdrawals, 29.7% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner rarely withdraws rejections during the appeal process compared to other examiners. If you file an appeal, be prepared to fully prosecute it to a PTAB decision. Per MPEP § 1207, the examiner will prepare an Examiner's Answer maintaining the rejections.
When applicants file petitions regarding this examiner's actions, 56.7% are granted (fully or in part). This grant rate is in the 72% percentile among all examiners. Strategic Note: Petitions show above-average success regarding this examiner's actions. Petitionable matters include restriction requirements (MPEP § 1002.02(c)(2)) and various procedural issues.
Examiner's Amendments: This examiner makes examiner's amendments in 8.1% of allowed cases (in the 94% percentile). Per MPEP § 1302.04, examiner's amendments are used to place applications in condition for allowance when only minor changes are needed. This examiner frequently uses this tool compared to other examiners, indicating a cooperative approach to getting applications allowed. Strategic Insight: If you are close to allowance but minor claim amendments are needed, this examiner may be willing to make an examiner's amendment rather than requiring another round of prosecution.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 9.7% of allowed cases (in the 87% percentile). Per MPEP § 714.14, a Quayle action indicates that all claims are allowable but formal matters remain. This examiner frequently uses Quayle actions compared to other examiners, which is a positive indicator that once substantive issues are resolved, allowance follows quickly.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.