Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 19185695 | LIQUID-COOLING SERVER SYSTEM INCLUDE AT LEAST ONE POWER-SIGNAL BRIDGE ADJUSTABLY MOUNTED AND A LIQUID-COOLED SERVER WITH A SEALED HEAT DISSIPATING FINNED HOUSING | April 2025 | July 2025 | Allow | 3 | 0 | 0 | No | No |
| 18686138 | DISPLAY DEVICE WITH AN INNER PLATE OF A CORRESPONDING SIZE TO A MOUNTING PORTION | February 2024 | January 2026 | Allow | 23 | 0 | 0 | Yes | No |
| 18427824 | COOLING SYSTEM WITH A PLURALITY OF SUBSTRATES AND PROJECTION DEVICE | January 2024 | December 2025 | Allow | 23 | 0 | 0 | Yes | No |
| 18285291 | LIQUID-COOLING HEAT DISSIPATION DEVICE, CABINET, AND SYSTEM | October 2023 | November 2025 | Allow | 25 | 1 | 0 | No | No |
| 18279750 | ELECTRICALLY ISOLATING THERMAL INTERFACE MODULES FOR ELECTRICAL DEVICES WITH HEAT DISSIPATION DEVICES | August 2023 | March 2026 | Abandon | 30 | 4 | 0 | Yes | No |
| 18446617 | SERVER | August 2023 | February 2026 | Abandon | 30 | 1 | 0 | No | No |
| 18259737 | CONVERTER WITH A GROOVE TO ACCOMMODATE A SECOND ELECTRONIC COMPONENT WITH A HEAT DISSIPATION PERPENDICULAR TO A HEAT DISSIPATION OF A FIRST ELECTRONIC COMPONENT | June 2023 | February 2026 | Abandon | 32 | 2 | 0 | No | No |
| 18338865 | VEHICLE POWER ELECTRONICS COOLER WITH INTEGRATED HEATING ELEMENT | June 2023 | September 2025 | Allow | 27 | 1 | 0 | Yes | No |
| 18203609 | Circuit Board Arrangement | May 2023 | October 2025 | Abandon | 29 | 0 | 1 | No | No |
| 18137996 | LIQUID COOLING RADIATOR WITH AIR BARRIER SPACE BETWEEN BENDING PARTITIONS | April 2023 | May 2025 | Allow | 25 | 0 | 0 | No | No |
| 18133503 | ERROR-UNLOCKING PROTECTION STRUCTURE FOR HEAT DISSIPATION BASE SEAT | April 2023 | March 2025 | Allow | 23 | 0 | 0 | No | No |
| 18190950 | DISTRIBUTED FUEL CELL POWER SUPPLY CABINET | March 2023 | July 2025 | Allow | 28 | 0 | 0 | No | No |
| 18164889 | OPTICAL MODULE WITH INTEGRATED HEATSINKS | February 2023 | July 2025 | Allow | 29 | 1 | 0 | Yes | No |
| 18153857 | THERMAL COUPLING ELEMENT | January 2023 | January 2025 | Allow | 25 | 0 | 1 | Yes | No |
| 18153853 | VEHICLE CHARGING SYSTEM AND METHOD, WITH POWER CONVERTERS DIRECTLY COUPLED TO LIQUID COOLED COLD PLATE | January 2023 | December 2025 | Allow | 35 | 2 | 0 | Yes | No |
| 18013950 | ELECTRIC DEVICE WITH IMMERSED ELECTRONIC COMPONENTS AND ELONGATED BUSBAR FORMING AN UPWARD FLOW | December 2022 | August 2025 | Allow | 32 | 2 | 0 | Yes | No |
| 18088194 | OIL-COOLED RECTIFIER DIODE ASSEMBLY | December 2022 | April 2025 | Allow | 28 | 1 | 0 | Yes | No |
| 18085129 | DUAL-MODE DATACENTER COOLING SYSTEM WITH COOLING LOOPS AND HEAT EXCHANGERS | December 2022 | July 2025 | Allow | 31 | 2 | 0 | Yes | No |
| 18080850 | EV Charging Connector and EV Charging Station | December 2022 | February 2026 | Abandon | 38 | 1 | 0 | No | No |
| 18072843 | ELECTRONIC DEVICE WITH HEAT RADIATING FINS AND A SLOPED PORTION ON AN OUTER SURFACE OF A CHASSIS | December 2022 | October 2025 | Abandon | 34 | 2 | 0 | Yes | No |
| 18060642 | COOLING ARRANGEMENT WITH COOLING FLUID CIRCUIT AND POWER ELECTRONICS | December 2022 | February 2025 | Allow | 27 | 1 | 0 | Yes | No |
| 17992752 | METHOD FOR ASSEMBLING A LIQUID COOLING ASSEMBLY OF A FAMILY OF LIQUID COOLING ASSEMBLIES | November 2022 | September 2024 | Allow | 22 | 0 | 0 | Yes | No |
| 17984382 | STORAGE DEVICE AND COOLING SYSTEM OF THE STORAGE DEVICE WITH SPIRALLY GUIDE MEMBERS | November 2022 | March 2025 | Allow | 28 | 1 | 0 | Yes | No |
| 17919635 | Vapor Chamber and Manufacturing Method Thereof, Middle Frame Assembly and Manufacturing Method Thereof, and Electronic Device | October 2022 | February 2025 | Allow | 28 | 1 | 0 | No | No |
| 17916923 | CONVERTER MODULE WITH HEAT DISSIPATION MEMBER HAVING A FLOW PATH FORMED THEREIN | October 2022 | January 2026 | Abandon | 39 | 3 | 0 | No | No |
| 17958523 | COOLING SYSTEM FOR A CIRCUIT BOARD THAT HOUSES A PLURALITY OF ELECTRONIC COMPONENTS THEREIN | October 2022 | March 2025 | Abandon | 29 | 1 | 0 | No | No |
| 17934572 | COLD PLATE MODULE WITH A PLURALITY OF CONNECTING PIECES AND CONNECTING PORTIONS | September 2022 | June 2025 | Abandon | 33 | 2 | 0 | No | No |
| 17901187 | TELECOMMUNICATIONS HOUSING WITH IMPROVED THERMAL LOAD MANAGEMENT | September 2022 | February 2025 | Abandon | 30 | 1 | 0 | No | No |
| 17891208 | Heat Sink Component With Land Grid Array Connections | August 2022 | January 2026 | Allow | 41 | 4 | 0 | Yes | No |
| 17798602 | POWER CONVERSION APPARATUS WITH THERMAL RESISTANCE PATHS AND ADDITIONAL HIGH HEAT CAPACITY DEVICE | August 2022 | August 2025 | Abandon | 37 | 2 | 0 | No | No |
| 17816767 | ADJUSTABLE RETENTION DEVICE FOR HEAT SINK ASSEMBLY | August 2022 | November 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17816517 | ELECTRONIC DEVICE WITH DISCHARGE HEAD AND PROTRUDING PORTIONS IN CONTACT WITH HEAT CONDUCTIVE MEMBERS | August 2022 | August 2025 | Abandon | 36 | 3 | 0 | No | No |
| 17795681 | Cable inlet device for a switchgear cabinet and arrangement and method for operating same | July 2022 | August 2024 | Allow | 24 | 1 | 0 | Yes | No |
| 17864424 | COOLING APPARATUS FOR ELECTRONIC ELEMENT | July 2022 | August 2024 | Allow | 25 | 0 | 0 | No | No |
| 17861139 | FANLESS COMPUTER CASE | July 2022 | April 2024 | Allow | 21 | 0 | 0 | No | No |
| 17846494 | COMPRESSIBLE THERMAL LINK | June 2022 | August 2024 | Allow | 25 | 1 | 0 | Yes | No |
| 17786454 | ELECTRONIC CONTROL DEVICE WITH HEAT-DISSIPATING MEMBERS AND SUPPORTING MEMBERS | June 2022 | July 2024 | Allow | 25 | 1 | 0 | No | No |
| 17840198 | HEAT DISSIPATION DEVICE | June 2022 | October 2024 | Abandon | 28 | 1 | 0 | No | No |
| 17832705 | PORTABLE ELECTRONIC DEVICE | June 2022 | May 2024 | Abandon | 24 | 1 | 0 | No | No |
| 17826730 | SERVER AND COOLING SYSTEM FOR ENHANCED IMMERSION COOLING | May 2022 | May 2024 | Allow | 23 | 1 | 1 | Yes | No |
| 17663817 | SYSTEMS FOR A HEAT EXCHANGER WITH A BIASING BRACKET AND MOUNTING PLATE | May 2022 | February 2025 | Allow | 33 | 2 | 1 | Yes | No |
| 17738552 | INVERTER APPARATUS OF A MOBILITY WITH STACKED COOLERS | May 2022 | July 2024 | Allow | 26 | 1 | 0 | No | No |
| 17773994 | CIRCUIT ASSEMBLY WITH BUS BAR AND ELASTIC HEAT CONDUCTIVE MEMBER | May 2022 | July 2024 | Allow | 26 | 1 | 0 | No | No |
| 17773596 | HEAT DISSIPATION SUBRACK, HEAT DISSIPATION CABINET, AND BACKPLANE COMMUNICATION SYSTEM | April 2022 | May 2024 | Allow | 25 | 1 | 0 | No | No |
| 17722407 | POWER MODULE WITH CIRCUIT BOARD ASSEMBLY AND HEAT DISSIPATION ENCAPSULATION | April 2022 | February 2026 | Abandon | 46 | 7 | 0 | No | No |
| 17701536 | Container for One or More Electronic Devices and Methods of Use Thereof | March 2022 | June 2024 | Allow | 26 | 2 | 0 | Yes | No |
| 17699777 | DISTRIBUTION HARDWARE FOR TWO PHASE SYSTEM RECIRCULATION | March 2022 | March 2024 | Allow | 24 | 2 | 0 | Yes | No |
| 17691047 | ELECTRONIC DEVICE INCLUDING ACCOMMODATION CAVITY AND FLOW CHANNEL IN HOUSING | March 2022 | January 2025 | Allow | 35 | 4 | 0 | Yes | No |
| 17684561 | HEAT DISSIPATION DEVICE AND COOLING UNIT | March 2022 | November 2023 | Allow | 21 | 1 | 0 | Yes | No |
| 17679867 | SEMICONDUCTOR MODULE WITH COOLING FINS IN A MATRIX FORM | February 2022 | June 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17678786 | Heatsink assembly for unmanned aerial vehicle | February 2022 | January 2024 | Allow | 23 | 0 | 0 | Yes | No |
| 17673950 | HEAT DISSIPATION STRUCTURE WITH STACKED THERMAL INTERFACE MATERIALS | February 2022 | August 2023 | Allow | 18 | 0 | 0 | Yes | No |
| 17585008 | HEAT DISSIPATION DEVICE AND GRAPHICS CARD ASSEMBLY | January 2022 | January 2024 | Allow | 24 | 2 | 0 | No | No |
| 17579224 | SYSTEM AND METHOD FOR A THERMALLY CONDUCTIVE AND RADIO FREQUENCY TRANSPARENT ANTENNA WINDOW FOR AN ACTIVE 5G ANTENNA | January 2022 | May 2024 | Allow | 27 | 1 | 0 | Yes | No |
| 17575337 | Device for Transferring Heat Between a First Module and a Second Module | January 2022 | January 2024 | Allow | 24 | 0 | 0 | No | No |
| 17573445 | COOLING AUTOMOTIVE POWER ELECTRONICS | January 2022 | February 2024 | Allow | 25 | 1 | 1 | Yes | No |
| 17572468 | ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE | January 2022 | June 2025 | Abandon | 41 | 4 | 0 | Yes | No |
| 17571607 | AN ELECTRONIC SYSTEM WITH A COOLING DEVICE WITH AT LEAST A PRESSING PORTION | January 2022 | April 2024 | Allow | 27 | 1 | 0 | Yes | No |
| 17644645 | COOLING MODULE FOR AN ELECTRICAL ASSEMBLY | December 2021 | February 2024 | Abandon | 26 | 1 | 0 | No | No |
| 17617167 | CONTROL DEVICE FOR ROBOT WITH BLOWER DEVICE AT OPENING | December 2021 | December 2023 | Allow | 24 | 1 | 0 | Yes | No |
| 17539910 | BOARD STRUCTURE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING BOARD STRUCTURE | December 2021 | November 2023 | Allow | 23 | 1 | 0 | No | No |
| 17612010 | FLEXIBLE CIRCUIT BOARD WITH THERMALLY CONDUCTIVE CONNECTION TO A HEAT SINK | November 2021 | July 2024 | Allow | 32 | 2 | 0 | No | No |
| 17516098 | HEAT DISSIPATION STRUCTURE ASSEMBLY | November 2021 | August 2023 | Allow | 22 | 1 | 0 | No | No |
| 17496494 | POWER INVERTER WITH EXTRUSION COOLER WITH FLOW HOLES | October 2021 | August 2024 | Allow | 34 | 3 | 0 | Yes | No |
| 17489957 | COMPACT CHARGER WITH HEAT DISSIPATION COMPONENTS | September 2021 | September 2024 | Abandon | 35 | 2 | 0 | Yes | No |
| 17476492 | ENERGY VEHICLE AND ELECTRICAL CONTROL BOX THEREOF | September 2021 | May 2024 | Abandon | 31 | 2 | 0 | No | No |
| 17474802 | COOLING IN CONDUCTORS FOR CHIPS | September 2021 | April 2024 | Allow | 31 | 1 | 0 | Yes | No |
| 17472095 | POWER CONVERTER WITH ELECTRICALLY CONDUCTIVE COOLERS AND INSULATION MEMBERS | September 2021 | October 2024 | Abandon | 38 | 2 | 0 | No | No |
| 17090624 | INTERLEAVED HETEROGENEOUS HEAT PIPES WITH DIFFERENT QMAX | November 2020 | May 2025 | Allow | 54 | 2 | 1 | Yes | No |
| 16825821 | MOTOR CONTROLLER HEAT DISSIPATING SYSTEMS AND METHODS | March 2020 | November 2024 | Allow | 56 | 2 | 0 | Yes | No |
No appeal data available for this record. This may indicate that no appeals have been filed or decided for applications in this dataset.
Examiner NGO, STEVEN works in Art Unit 2835 and has examined 12 patent applications in our dataset. With an allowance rate of 66.7%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 32 months.
Examiner NGO, STEVEN's allowance rate of 66.7% places them in the 28% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by NGO, STEVEN receive 1.67 office actions before reaching final disposition. This places the examiner in the 34% percentile for office actions issued. This examiner issues fewer office actions than average, which may indicate efficient prosecution or a more lenient examination style.
The median time to disposition (half-life) for applications examined by NGO, STEVEN is 32 months. This places the examiner in the 52% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +33.3% benefit to allowance rate for applications examined by NGO, STEVEN. This interview benefit is in the 81% percentile among all examiners. Recommendation: Interviews are highly effective with this examiner and should be strongly considered as a prosecution strategy. Per MPEP § 713.10, interviews are available at any time before the Notice of Allowance is mailed or jurisdiction transfers to the PTAB.
When applicants file an RCE with this examiner, 50.0% of applications are subsequently allowed. This success rate is in the 97% percentile among all examiners. Strategic Insight: RCEs are highly effective with this examiner compared to others. If you receive a final rejection, filing an RCE with substantive amendments or arguments has a strong likelihood of success.
This examiner enters after-final amendments leading to allowance in 0.0% of cases where such amendments are filed. This entry rate is in the 2% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 24% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 31% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.