Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18794738 | DISPLAY ASSEMBLY WITH DIVIDED INTERIOR SPACE | August 2024 | October 2024 | Allow | 3 | 0 | 0 | Yes | No |
| 18636967 | Modular Liquid Cooling Architecture for Liquid Cooling | April 2024 | May 2025 | Allow | 13 | 1 | 0 | Yes | No |
| 18609478 | DISPLAY ASSEMBLY WITH DIVIDED INTERIOR SPACE | March 2024 | May 2024 | Allow | 2 | 0 | 0 | Yes | No |
| 18408317 | DOUBLE SIDED DISPLAY ASSEMBLY WITH BI-DIRECTIONAL FLOW THROUGH A COMMON, PARTITIONED HEAT EXCHANGER | January 2024 | December 2025 | Allow | 23 | 0 | 0 | Yes | No |
| 18389821 | PRINTED CIRCUIT BOARD WITH A BUILT-IN VAPOR CHAMBER | December 2023 | March 2026 | Abandon | 27 | 1 | 0 | No | No |
| 18535612 | SYSTEMS AND METHODS FOR ELECTRONICS COOLING | December 2023 | November 2025 | Allow | 23 | 0 | 0 | Yes | No |
| 18509886 | Display Apparatus | November 2023 | August 2025 | Allow | 21 | 0 | 0 | Yes | No |
| 18510509 | POWER DISTRIBUTION ROOM AND REFRIGERATION SYSTEM | November 2023 | February 2026 | Abandon | 27 | 1 | 0 | No | No |
| 18373973 | HEAT-DISSIPATING HEAD UP DISPLAY | September 2023 | February 2026 | Abandon | 29 | 1 | 0 | No | No |
| 18244712 | LIQUID COOLING PLATE ASSEMBLY AND SERVER | September 2023 | August 2025 | Allow | 23 | 1 | 0 | No | No |
| 18463959 | COOLING ARRANGEMENT | September 2023 | March 2026 | Allow | 30 | 1 | 0 | No | No |
| 18233047 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING SAME | August 2023 | July 2025 | Allow | 23 | 1 | 0 | No | No |
| 18263969 | IN-VEHICLE DEVICE INCLUDING COOLING APPARATUS | August 2023 | December 2025 | Allow | 29 | 1 | 0 | No | No |
| 18274861 | HYBRID DATACENTRE MODULE | July 2023 | September 2025 | Allow | 25 | 1 | 0 | No | No |
| 18348396 | HEAT SINK AND COMMUNICATION DEVICE | July 2023 | March 2025 | Allow | 20 | 1 | 0 | No | No |
| 18211363 | OPTIMIZED MICRO DATA CENTER | June 2023 | March 2026 | Allow | 33 | 1 | 0 | Yes | No |
| 18326412 | ELECTRONIC EQUIPMENT WITH IMMERSION COOLING SYSTEM | May 2023 | September 2025 | Allow | 28 | 1 | 0 | Yes | No |
| 18311788 | PORTABLE AUTONOMOUSLY POWERED COMPUTER WITH THERMALLY SEPARATED HEAT ENERGY SOURCES IN VORTICITY-INDUCING CAVITY | May 2023 | January 2025 | Allow | 21 | 0 | 0 | No | No |
| 18310568 | CASING FOR COMPUTERS AND RACK FOR COMPUTERS | May 2023 | May 2025 | Abandon | 25 | 1 | 0 | No | No |
| 18136415 | COOLING DEVICE | April 2023 | October 2025 | Allow | 30 | 1 | 0 | No | No |
| 18127115 | SYSTEMS AND METHODS FOR COOLING POWER ELECTRONICS USING A THERMOSYPHON | March 2023 | November 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 18187894 | SYSTEMS AND METHODS FOR COOLING MODULE WITH PROGRESSIVE COOLING FINS | March 2023 | September 2025 | Allow | 30 | 3 | 0 | No | No |
| 18184479 | HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE | March 2023 | March 2026 | Allow | 36 | 2 | 0 | No | No |
| 18026526 | Power Conversion Unit, Power Conversion Device, and Method for Inspecting Power Conversion Unit | March 2023 | February 2026 | Abandon | 35 | 2 | 0 | No | No |
| 18116617 | Ship-and-Install Electronics Assembly with Multifunctional Interface Chassis and Liquid-Fluid Heat Exchange | March 2023 | January 2026 | Abandon | 35 | 1 | 0 | No | No |
| 18104221 | COMPOSITE POWER ELECTRONICS COVER | January 2023 | October 2025 | Allow | 32 | 1 | 0 | Yes | No |
| 18006182 | Housing and Electronic Device | January 2023 | January 2026 | Allow | 36 | 3 | 0 | No | No |
| 18154929 | Heat Exchanger | January 2023 | February 2026 | Allow | 37 | 1 | 0 | No | No |
| 18145052 | TURBOMACHINE WITH E-MACHINE CONTROLLER HAVING COOLED BUS BAR MEMBER | December 2022 | March 2025 | Allow | 27 | 1 | 0 | No | No |
| 18063977 | POWER CONTROL APPARATUS | December 2022 | September 2024 | Allow | 21 | 0 | 0 | No | No |
| 17977709 | ELECTRONIC CONTROL MODULE COOLING SYSTEM | October 2022 | June 2025 | Allow | 31 | 1 | 0 | Yes | No |
| 17967425 | POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES | October 2022 | August 2024 | Allow | 21 | 0 | 0 | No | No |
| 17965944 | ELECTRONIC DEVICE WITH ACTIVE COOLING | October 2022 | January 2025 | Allow | 27 | 1 | 0 | No | No |
| 17963200 | PORTABLE ELECTRONIC DEVICE | October 2022 | September 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17951274 | MOBILE TERMINAL AND MIDDLE FRAME ASSEMBLY | September 2022 | May 2025 | Allow | 32 | 1 | 0 | No | No |
| 17933116 | CIRCUIT BOARD MODULE | September 2022 | July 2025 | Allow | 34 | 2 | 0 | Yes | No |
| 17910489 | ELECTRONIC APPARATUS | September 2022 | February 2025 | Allow | 29 | 2 | 0 | Yes | No |
| 17900511 | ELECTRIFIED VEHICLE INDUCTOR COOLING SYSTEM | August 2022 | May 2025 | Allow | 33 | 0 | 1 | No | No |
| 17889400 | OPTICAL ENGINE MODULE | August 2022 | October 2025 | Allow | 38 | 3 | 0 | Yes | No |
| 17885400 | TWO-PHASE LIQUID-COOLED ELECTRICAL POWER APPARATUS | August 2022 | April 2025 | Allow | 32 | 2 | 1 | No | No |
| 17818893 | APPARATUS COMPRISING A HEAT SINK FOR A PLUGGABLE MODULE | August 2022 | January 2025 | Allow | 29 | 1 | 1 | Yes | No |
| 17884632 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | August 2022 | August 2025 | Allow | 36 | 1 | 1 | Yes | No |
| 17885033 | THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME | August 2022 | April 2025 | Allow | 32 | 1 | 1 | No | No |
| 17881975 | HEAT SINK AND ELECTRONIC DEVICE HAVING THE HEAT SINK | August 2022 | July 2025 | Abandon | 36 | 2 | 0 | No | No |
| 17881104 | POWER CONVERTER APPARATUS FOR VEHICLE | August 2022 | March 2026 | Allow | 43 | 3 | 0 | Yes | No |
| 17864370 | FLEXIBLE METAL CHIP COOLING INTERFACE | July 2022 | May 2025 | Abandon | 34 | 1 | 1 | No | No |
| 17790793 | Integration Component, Temperature-Control System, and Motor Vehicle | July 2022 | June 2025 | Allow | 36 | 5 | 0 | Yes | No |
| 17810501 | Power Conductor and Vehicle Power Distribution Circuit Incorporating the Same | July 2022 | March 2024 | Allow | 20 | 2 | 0 | Yes | No |
| 17789467 | DISCHARGE UNIT AND ELECTRIC POWER APPARATUS | June 2022 | February 2024 | Allow | 20 | 0 | 0 | No | No |
| 17848583 | METHODS AND APPARATUS TO COOL ELECTRONIC DEVICES | June 2022 | February 2026 | Allow | 43 | 3 | 0 | Yes | No |
| 17784382 | COOLING DEVICE FOR SEMICONDUCTOR SWITCHING ELEMENTS, POWER INVERTER DEVICE AND ARRANGEMENT WITH A POWER INVERTER DEVICE AND AN ELECTRIC MACHINE | June 2022 | September 2025 | Allow | 40 | 3 | 0 | Yes | No |
| 17834060 | LIQUID-COOLED NOTEBOOK COMPUTER AND POWER SUPPLY DEVICE THEREOF | June 2022 | August 2024 | Abandon | 27 | 1 | 0 | No | No |
| 17832707 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | June 2022 | April 2025 | Allow | 35 | 4 | 1 | Yes | No |
| 17781655 | A VEHICLE-MOUNTED INVERTER SKID | June 2022 | December 2024 | Allow | 31 | 0 | 0 | Yes | No |
| 17824693 | INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE | May 2022 | April 2025 | Allow | 35 | 2 | 1 | Yes | No |
| 17779074 | CIRCUIT ASSEMBLY | May 2022 | February 2025 | Abandon | 33 | 2 | 0 | Yes | No |
| 17748207 | IMMERSION COOLING APPARATUS | May 2022 | August 2024 | Allow | 27 | 1 | 0 | Yes | No |
| 17776857 | IN-VEHICLE ELECTRONIC CONTROL DEVICE | May 2022 | April 2024 | Abandon | 24 | 2 | 0 | No | No |
| 17663192 | ELECTRONICS BOX FOR IN-FLIGHT ENTERTAINMENT SYSTEM | May 2022 | May 2025 | Allow | 36 | 3 | 0 | Yes | Yes |
| 17737220 | IMMERSION TANK, INFORMATION PROCESSING APPARATUS, AND METHOD OF COOLING | May 2022 | May 2025 | Abandon | 36 | 1 | 0 | No | No |
| 17735391 | ASSEMBLY FOR FACILITATING ELECTRICAL CONNECTION BETWEEN A CIRCUIT BREAKER AND CABLES INSIDE A PANELBOARD | May 2022 | March 2025 | Abandon | 34 | 1 | 0 | No | No |
| 17730596 | INFORMATION PROCESSING APPARATUS AND COOLING METHOD | April 2022 | April 2024 | Allow | 23 | 1 | 0 | Yes | No |
| 17730983 | COOLING MODULE COMPRISING A COOLING STRUCTURE FOR DISSIPATION OF HEAT | April 2022 | July 2025 | Allow | 38 | 4 | 0 | Yes | No |
| 17726520 | POWER SUPPLY UNIT, LIQUID COOLED ENCLOSURE AND METHOD THEREOF | April 2022 | February 2025 | Abandon | 34 | 2 | 1 | No | No |
| 17754683 | COMPUTING CENTER AND METHOD | April 2022 | October 2024 | Allow | 31 | 0 | 1 | Yes | No |
| 17701086 | ELECTRONICS ASSEMBLIES WITH POWER ELECTRONIC DEVICES AND THREE-DIMENSIONALLY PRINTED CIRCUIT BOARDS HAVING REDUCED JOULE HEATING | March 2022 | January 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17697452 | RACK SYSTEM FOR HOUSING AN ELECTRONIC DEVICE | March 2022 | August 2025 | Abandon | 41 | 4 | 0 | Yes | Yes |
| 17696824 | LIQUID-COOLING HEAT DISSIPATION DEVICE AND POWER MODULE | March 2022 | June 2024 | Abandon | 27 | 2 | 0 | No | No |
| 17691087 | HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS | March 2022 | March 2025 | Allow | 36 | 4 | 0 | No | No |
| 17688280 | COOLING DEVICE | March 2022 | May 2024 | Abandon | 27 | 1 | 1 | No | No |
| 17640535 | PLASTIC COVER FOR CLOSING A FLUID-BASED COOLING CIRCUIT FOR AN ITEM OF ELECTRICAL EQUIPMENT | March 2022 | March 2025 | Allow | 36 | 3 | 0 | Yes | No |
| 17682186 | Heat Radiator, Electronic Device, and Vehicle | February 2022 | April 2024 | Abandon | 26 | 2 | 0 | No | No |
| 17669480 | TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION SUBSTRATE STRUCTURE | February 2022 | February 2024 | Abandon | 24 | 1 | 0 | No | No |
| 17668864 | POWER MODULE FOR THE OPERATION OF AN ELECTRIC VEHICLE DRIVE WITH DIRECT COOLING OF THE POWER SEMICONDUCTOR | February 2022 | August 2025 | Abandon | 42 | 4 | 0 | Yes | No |
| 17632447 | AIR HEAT EXCHANGER AND METHOD FOR PRODUCTION THEREOF AND ELECTRONIC ASSEMBLY EQUIPPED THEREWITH | February 2022 | October 2024 | Abandon | 32 | 1 | 1 | No | No |
| 17590232 | POWER DEVICE ASSEMBLIES AND METHODS OF FABRICATING THE SAME | February 2022 | February 2024 | Allow | 24 | 0 | 1 | No | No |
| 17585597 | VAPOR CHAMBER | January 2022 | March 2024 | Allow | 25 | 1 | 1 | Yes | No |
| 17583400 | TWO-PHASE IMMERSION COOLING DEVICE WITH IMPROVED CONDENSATION HEAT TRANSFER | January 2022 | April 2024 | Abandon | 27 | 2 | 0 | No | No |
| 17580409 | SYSTEMS AND METHODS FOR COOLING ELECTRONIC COMPONENTS OF A VEHICLE | January 2022 | January 2024 | Allow | 23 | 3 | 0 | Yes | No |
| 17578960 | Conformal Cooling Assembly with Substrate Fluid-Proofing for Multi-Die Electronic Assemblies | January 2022 | March 2025 | Allow | 38 | 3 | 0 | Yes | No |
| 17627305 | POWER CONVERSION APPARATUS | January 2022 | July 2024 | Allow | 30 | 1 | 0 | No | No |
| 17597618 | COOLING DEVICE, A RECEPTACLE ASSEMBLY, A SYSTEM AND A PRINTED BOARD ASSEMBLY | January 2022 | September 2024 | Allow | 32 | 2 | 0 | No | No |
| 17572951 | STRUCTURE OF UNIFORM-TEMPERATURE HEAT DISSIPATION DEVICE | January 2022 | November 2023 | Abandon | 23 | 1 | 0 | No | No |
| 17624955 | POWER CONVERTER | January 2022 | July 2024 | Allow | 30 | 1 | 0 | Yes | No |
| 17560702 | APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING | December 2021 | June 2025 | Abandon | 42 | 4 | 1 | No | No |
| 17556946 | TWO-PHASE IMMERSION TYPE HEAT DISSIPATION SUBSTRATE | December 2021 | August 2023 | Abandon | 20 | 1 | 0 | No | No |
| 17620628 | Two-Phase Flow Active and Passive Multi-Level Data Center Cabinet Cooling Device and Method | December 2021 | February 2024 | Allow | 26 | 1 | 0 | Yes | No |
| 17620185 | ELECTRONIC APPARATUS COOLING DEVICE, WATER-COOLED INFORMATION PROCESSING DEVICE, COOLING MODULE, AND ELECTRONIC APPARATUS COOLING METHOD | December 2021 | November 2024 | Abandon | 35 | 2 | 0 | Yes | No |
| 17644500 | HYBRID SYSTEM FOR SERVERS | December 2021 | February 2025 | Allow | 38 | 4 | 1 | Yes | No |
| 17618666 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING THE SAME | December 2021 | January 2025 | Allow | 37 | 3 | 0 | No | No |
| 17547701 | Hybrid liquid and air cooling in networking equipment | December 2021 | September 2024 | Allow | 33 | 4 | 0 | Yes | No |
| 17617708 | A COOLING UNIT FOR COOLING A HEAT-GENERATING COMPONENT AND A METHOD THEREFOR | December 2021 | November 2024 | Abandon | 35 | 2 | 0 | No | No |
| 17545054 | IMMERSION-TYPE POROUS HEAT DISSIPATION STRUCTURE | December 2021 | February 2024 | Abandon | 27 | 2 | 0 | No | No |
| 17538881 | HEAT DISSIPATION APPARATUS AND PROCESSOR | November 2021 | August 2025 | Allow | 44 | 5 | 0 | Yes | No |
| 17534868 | SYSTEMS AND METHODS FOR RECOVERING FLUID IN IMMERSION-COOLED DATACENTERS | November 2021 | November 2024 | Allow | 35 | 3 | 1 | Yes | No |
| 17534157 | HEAT DIFFUSION STRUCTURE AND ELECTRONIC DEVICE WITH THE SAME | November 2021 | August 2025 | Abandon | 45 | 4 | 0 | Yes | No |
| 17533609 | DISPLAY ASSEMBLY WITH DIVIDED INTERIOR SPACE | November 2021 | January 2024 | Allow | 26 | 1 | 1 | Yes | No |
| 17532031 | MODULAR LIQUID COOLING ARCHITECTURE FOR LIQUID COOLING | November 2021 | January 2024 | Allow | 26 | 1 | 1 | Yes | No |
| 17523403 | Multi-Rack Immersion Cooling Distribution System | November 2021 | April 2025 | Allow | 41 | 4 | 1 | Yes | No |
| 17607487 | POWER ELECTRONICS SYSTEM WITH BUSBARS OF HOLLOW DESIGN FOR DIRECT CAPACITOR COOLING; AND ELECTRIC MOTOR | October 2021 | March 2024 | Abandon | 29 | 1 | 0 | No | No |
No appeal data available for this record. This may indicate that no appeals have been filed or decided for applications in this dataset.
Examiner MUIR, MATTHEW SINCLAIR works in Art Unit 2835 and has examined 36 patent applications in our dataset. With an allowance rate of 63.9%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 31 months.
Examiner MUIR, MATTHEW SINCLAIR's allowance rate of 63.9% places them in the 24% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.
On average, applications examined by MUIR, MATTHEW SINCLAIR receive 2.39 office actions before reaching final disposition. This places the examiner in the 68% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by MUIR, MATTHEW SINCLAIR is 31 months. This places the examiner in the 56% percentile for prosecution speed. Prosecution timelines are slightly faster than average with this examiner.
Conducting an examiner interview provides a +43.0% benefit to allowance rate for applications examined by MUIR, MATTHEW SINCLAIR. This interview benefit is in the 89% percentile among all examiners. Recommendation: Interviews are highly effective with this examiner and should be strongly considered as a prosecution strategy. Per MPEP § 713.10, interviews are available at any time before the Notice of Allowance is mailed or jurisdiction transfers to the PTAB.
When applicants file an RCE with this examiner, 26.2% of applications are subsequently allowed. This success rate is in the 43% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.
This examiner enters after-final amendments leading to allowance in 30.0% of cases where such amendments are filed. This entry rate is in the 43% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants file petitions regarding this examiner's actions, 200.0% are granted (fully or in part). This grant rate is in the 99% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 24% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 31% percentile). This examiner issues Quayle actions less often than average. Allowances may come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.