USPTO Examiner BERMAN JASON - Art Unit 1794

Recent Applications

Detailed information about the 100 most recent patent applications.

Application NumberTitleFiling DateDisposal DateDispositionTime (months)Office ActionsRestrictionsInterviewAppeal
19014165DYNAMIC VACUUM SEAL SYSTEM FOR PHYSICAL VAPOR DEPOSITION SPUTTER APPLICATIONSJanuary 2025March 2025Allow200NoNo
18945649SUBSTRATE PROCESSING APPARATUSNovember 2024June 2025Allow700NoNo
18923813PVD TARGET AND USE THEREOFOctober 2024March 2025Allow510NoNo
18752780PVD APPARATUS AND METHODJune 2024June 2025Allow1200NoNo
18722727Method for Producing a Substoichiometric Layer of Titanium, Vanadium, Tungsten or Molybdenum OxideJune 2024June 2025Allow1210NoNo
18658455WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHODMay 2024June 2025Allow1320NoNo
18698353SPUTTERING TARGET, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SPUTTERING FILM USING SPUTTERING TARGETApril 2024June 2025Allow1510NoNo
18611678PREPARATION METHOD FOR TUNGSTEN SULFIDE SOLID LUBRICATING FILM BASED ON HIGH POWER IMPULSE MAGNETRON SPUTTERINGMarch 2024March 2025Allow1210NoNo
18435175CALIBRATION JIG AND CALIBRATION METHODFebruary 2024October 2024Allow800NoNo
18430398SUBSTRATE PROCESSING MODULE AND METHOD OF MOVING A WORKPIECEFebruary 2024March 2025Allow1410NoNo
18536612METHODS AND APPARATUS FOR PHYSICAL VAPOR DEPOSITION (PVD) DIELECTRIC DEPOSITIONDecember 2023June 2025Allow1820YesNo
18287318MAGNETRON SPUTTER DEVICEOctober 2023December 2024Allow1410NoNo
18554754SPUTTERING APPARATUS FOR COATING OF 3D-OBJECTSOctober 2023December 2024Allow1410NoNo
18283593ELECTRODE AND METHOD OF PRODUCING THE ELECTRODESeptember 2023March 2025Allow1810NoNo
18548418DEPOSITION OF NON-STOICHIOMETRIC METAL COMPOUND LAYERAugust 2023March 2025Allow1920NoNo
18548404TUNGSTEN SUBOXIDE CERAMIC TARGETAugust 2023March 2025Allow1920NoNo
18337764FILM FORMATION APPARATUSJune 2023March 2025Allow2120YesNo
18311491SPUTTERING TARGET, METHOD OF BONDING TARGET MATERIAL AND BACKING PLATE, AND METHOD OF MANUFACTURING SPUTTERING TARGETMay 2023March 2024Allow1110NoNo
18137855Multi-chamber ConfigurationApril 2023April 2025Abandon2420NoNo
18133408DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAMEApril 2023March 2024Allow1210NoNo
18031071RF SPUTTERING APPARATUS FOR CONTROLLING ATOMIC LAYER OF THIN FILMApril 2023October 2024Allow1810NoNo
18190442PLASMA PROCESSING APPARATUSMarch 2023December 2024Allow2010NoNo
18185626APPARATUS AND METHOD FOR DEPOSITING HARD CARBON LAYERSMarch 2023March 2025Allow2420NoNo
18180132METHOD FOR PRODUCING CHROMIUM SINTERED BODY, METHOD FOR PRODUCING SPUTTERING TARGET, AND METHOD FOR PRODUCING SUBSTRATE WITH CHROMIUM FILMMarch 2023June 2025Allow2720NoNo
18179424SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODMarch 2023July 2024Allow1710NoNo
18177244Magnetic Film and Perpendicular Magnetic Recording MediumMarch 2023December 2023Allow1000NoNo
18041793FREE-STANDING LITHIUM PHOSPHORUS OXYNITRIDE THINK FILMS AND METHODS OF THEIR MANUFACTUREFebruary 2023June 2024Allow1600NoNo
18020017SLIT DIAPHRAGMFebruary 2023September 2024Allow2010NoNo
18097152ORGANIC CONTAMINATION FREE SURFACE MACHININGJanuary 2023November 2023Allow1010NoNo
18093138Programmable Electrostatic Chuck to Enhance Aluminum Film MorphologyJanuary 2023June 2024Allow1710YesNo
18093141Programmable ESC to Enhance Aluminum Film MorphologyJanuary 2023May 2024Allow1710YesNo
18074496Method and Apparatus for Controlling Stress Variation in a Material Layer Formed Via Pulsed DC Physical Vapor DepositionDecember 2022December 2023Allow1210NoNo
18058817DEVICE AND METHOD FOR SPUTTERING AND DEPOSITING METAL ON SURFACE OF MAGNETIC POWDER MATERIALSNovember 2022January 2025Allow2601NoNo
17985175MAGNET SYSTEM, SPUTTERING DEVICE AND HOUSING COVERNovember 2022September 2024Allow2310YesNo
18054562MAGNET SYSTEM, SPUTTERING DEVICE AND METHODNovember 2022August 2024Allow2110YesNo
17924516GOLD NANOPARTICLE MANUFACTURING METHODNovember 2022September 2024Abandon2310NoNo
18048957Sputtering System with a Plurality of Cathode AssembliesOctober 2022September 2023Allow1110NoNo
17996718YTTRIUM INGOT AND SPUTTERING TARGET IN WHICH THE YTTRIUM INGOT IS USEDOctober 2022July 2024Allow2010NoNo
18047350SPUTTERING-BASED CATALYST DEPOSITION ON PARTICLES FOR MEMBRANE ELECTRODE ASSEMBLY (MEA) CATALYST LAYEROctober 2022June 2025Allow3230NoNo
17967556PHYSICAL VAPOR DEPOSITION OF PIEZOELECTRIC FILMSOctober 2022April 2024Allow1810NoNo
18045087SEMICONDUCTOR APPARATUS AND MAGNETIC STRUCTURE OF SEMICONDUCTOR APPARATUSOctober 2022September 2024Allow2410NoNo
17956562FILM FORMING APPARATUS AND FILM FORMING METHODSeptember 2022June 2025Allow3330NoNo
17936471SPUTTERING APPARATUS AND CVD MASK COATING METHOD USING THE SAMESeptember 2022March 2025Allow3020YesNo
17935035Plasma Source Ion Implanter with Preparation Chamber for Linear or Cross Transferring WorkpieceSeptember 2022December 2024Allow2700NoNo
17906927CR-SI SINTERED BODY, SPUTTERING TARGET, AND METHOD FOR PRODUCING THIN FILMSeptember 2022September 2024Allow2410NoNo
17946434DC PLASMA CONTROL FOR ELECTRON ENHANCED MATERIAL PROCESSINGSeptember 2022March 2023Allow610YesNo
17942808DC PLASMA CONTROL FOR ELECTRON ENHANCED MATERIAL PROCESSINGSeptember 2022March 2023Allow610YesNo
17889209ENERGY-SAVING WINDOW FILM USED FOR INSULATING GLASS AND PREPARATION METHOD AND APPLICATION THEREOFAugust 2022September 2024Allow2510NoNo
17760310DEVICE AND METHOD FOR PRODUCING LAYERS WITH IMPROVED UNIFORMITY IN COATING SYSTEMS WITH HORIZONTALLY ROTATING SUBSTRATE AND ADDITIONAL PLASMA SOURCESAugust 2022November 2024Allow2820NoNo
17816781Sputtering TargetAugust 2022July 2024Abandon2410NoNo
17816374METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTUREJuly 2022October 2023Allow1410NoNo
17871810SEALING ARTICLE COMPRISING METAL COATING, METHOD OF MAKING AND METHOD OF USING THE SAMEJuly 2022October 2023Allow1511NoNo
17758782IMPROVED CATHODE ARC SOURCE, FILTERS THEREOF AND METHOD OF FILTERING MACROPARTICLESJuly 2022September 2023Allow1520NoNo
17857370APPARATUS FOR REDUCING TUNGSTEN RESITIVITYJuly 2022March 2023Allow900NoNo
17853911DEPOSITION DEVICE HAVING CONTACT STRUCTURE AND DEPOSITION SYSTEM HAVING SAMEJune 2022March 2025Allow3300NoNo
17848573INTERNALLY DIVISIBLE PROCESS CHAMBER USING A SHUTTER DISK ASSEMBLYJune 2022October 2023Allow1500NoNo
17843076FILM FORMING APPARATUS, PROCESSING CONDITION DETERMINATION METHOD, AND FILM FORMING METHODJune 2022April 2025Allow3410YesNo
17841270Oxide Semiconductor Sputtering Target And Method Of Fabricating Thin-Film Transistor Using SameJune 2022June 2024Allow2410NoNo
17838805METHODS AND APPARATUS FOR PASSIVATING A TARGETJune 2022March 2023Allow900NoNo
17832897PLASMA ETCHING TOOLS AND SYSTEMSJune 2022February 2025Allow3331NoNo
17776291PLASMA GENERATION DEVICE COMPRISING POROUS CERAMIC DIELECTRICMay 2022March 2025Allow3410NoNo
17740563Versatile Vacuum Deposition Sources and System thereofMay 2022September 2024Allow2810YesNo
17737536APPARATUS FOR IMPROVED HIGH PRESSURE PLASMA PROCESSINGMay 2022April 2025Allow3510NoNo
17721428SPUTTERING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAMEApril 2022March 2023Allow1110NoNo
17714502METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE USING IMPROVED SHIELD CONFIGURATIONSApril 2022February 2023Allow1010NoNo
17713603PULSED-DC POWER GENERATOR AND METHOD OF AUTOMATICALLY ADJUSTING ARC EXTINCTION PARAMETERSApril 2022October 2024Allow3010NoNo
17657262FILM FORMATION APPARATUSMarch 2022March 2025Allow3510YesNo
17642462MULTI-LAYER COATINGMarch 2022December 2024Allow3311NoNo
17688120PLASMA PROCESSING TOOL AND OPERATING METHOD THEREOFMarch 2022March 2025Allow3710NoNo
17666703Titanium Sputtering Target, Production Method Therefor, And Method For Producing Titanium-Containing Thin FilmFebruary 2022August 2024Allow3010NoNo
17589498SYSTEM FOR FORMING NANO-LAMINATE OPTICAL COATINGJanuary 2022October 2023Allow2010NoNo
17580813SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODJanuary 2022April 2023Allow1510YesNo
17628065SPUTTERING TARGET FOR MAGNETIC RECORDING MEDIUMJanuary 2022September 2024Allow3220NoNo
17626394FE-PT-BN-BASED SPUTTERING TARGET AND PRODUCTION METHOD THEREFORJanuary 2022December 2023Abandon2300NoNo
17626244MOVEMENT SYSTEMS FOR SPUTTER COATING OF NON-FLAT SUBSTRATESJanuary 2022June 2024Allow2910NoNo
17597191SPUTTERING TARGET AND METHOD OF PRODUCING SPUTTERING TARGETDecember 2021February 2024Allow2510NoNo
17563237IGZO SPUTTERING TARGETDecember 2021August 2023Allow2010NoNo
17552505DEPOSITION SYSTEM WITH A MULTI-CATHODEDecember 2021March 2023Allow1510NoNo
17547626METHOD OF FORMING MATERIAL LAYERDecember 2021March 2025Allow3930YesNo
17524330DC PLASMA CONTROL FOR ELECTRON ENHANCED MATERIAL PROCESSINGNovember 2021August 2022Allow911NoNo
17606199ANODE FOR PVD PROCESSESOctober 2021April 2025Allow4230YesNo
17507122APPARATUS FOR GENERATING MAGNETIC FIELDS ON SUBSTRATES DURING SEMICONDUCTOR PROCESSINGOctober 2021March 2024Allow2910YesNo
17503994Deposition System With Multi-Cathode And Method Of Manufacture ThereofOctober 2021January 2023Allow1500NoNo
17482833SINGLE BEAM PLASMA SOURCESeptember 2021September 2024Allow3610NoNo
17474403FILM FORMATION APPARATUSSeptember 2021January 2024Allow2810YesNo
17433140Vacuum Processing ApparatusAugust 2021December 2023Allow2710YesNo
17433203METHOD FOR PRODUCING TARGETS FOR PHYSICAL VAPOR DEPOSITION (PVD)August 2021December 2024Allow4030NoNo
17445231INITIAL TREATMENT METHOD FOR TARGET MATERIAL FOR PHYSICAL VAPOR DEPOSITION PROCESS, AND CONTROLLERAugust 2021May 2024Abandon3320NoNo
17427730AG ALLOY SPUTTERING TARGET, AND AG ALLOY FILMAugust 2021April 2024Abandon3210NoNo
17426668Ag ALLOY SPUTTERING TARGET, AND Ag ALLOY FILMJuly 2021November 2023Abandon2810NoNo
17388638SPUTTERING APPARATUS AND FILM FORMING METHODJuly 2021April 2023Allow2111NoNo
17384867SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAMEJuly 2021March 2023Allow2010NoNo
17425386Sputtering Target Product And Method For Producing Recycled Sputtering Target ProductJuly 2021April 2024Allow3210NoNo
17384058APPARATUS AND METHOD FOR PERFORMING SPUTTERING PROCESSJuly 2021August 2023Allow2520NoNo
17425280ION BEAM DELAYERING SYSTEM AND METHOD, AND ENDPOINT MONITORING SYSTEM AND METHOD THEREFORJuly 2021July 2024Abandon3610NoNo
17380806APPARATUS AND METHOD FABRICATING SEMICONDUCTOR DEVICEJuly 2021March 2024Allow3210NoNo
17423470METHOD FOR PREPARING BISMUTH OXIDE NANOWIRE FILMS BY HEATING IN UPSIDE DOWN POSITIONJuly 2021December 2024Allow4101NoNo
17369968SPUTTERING EQUIPMENT AND OPERATION METHOD THEREOFJuly 2021December 2022Allow1810NoNo
17354121FILM FORMING APPARATUS AND FILM FORMING METHODJune 2021September 2023Allow2720NoNo
17416001A MAGNET ARRANGEMENT FOR A PLASMA SOURCE FOR PERFORMING PLASMA TREATMENTSJune 2021November 2023Allow2920NoNo

Appeals Overview

This analysis examines appeal outcomes and the strategic value of filing appeals for examiner BERMAN, JASON.

Patent Trial and Appeal Board (PTAB) Decisions

Total PTAB Decisions
8
Examiner Affirmed
4
(50.0%)
Examiner Reversed
4
(50.0%)
Reversal Percentile
70.4%
Higher than average

What This Means

With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.

Strategic Value of Filing an Appeal

Total Appeal Filings
29
Allowed After Appeal Filing
10
(34.5%)
Not Allowed After Appeal Filing
19
(65.5%)
Filing Benefit Percentile
53.7%
Higher than average

Understanding Appeal Filing Strategy

Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.

In this dataset, 34.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.

Strategic Recommendations

Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.

Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.

Examiner BERMAN, JASON - Prosecution Strategy Guide

Executive Summary

Examiner BERMAN, JASON works in Art Unit 1794 and has examined 431 patent applications in our dataset. With an allowance rate of 80.5%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 30 months.

Allowance Patterns

Examiner BERMAN, JASON's allowance rate of 80.5% places them in the 44% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.

Office Action Patterns

On average, applications examined by BERMAN, JASON receive 1.90 office actions before reaching final disposition. This places the examiner in the 60% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.

Prosecution Timeline

The median time to disposition (half-life) for applications examined by BERMAN, JASON is 30 months. This places the examiner in the 40% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.

Interview Effectiveness

Conducting an examiner interview provides a +13.3% benefit to allowance rate for applications examined by BERMAN, JASON. This interview benefit is in the 55% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.

Request for Continued Examination (RCE) Effectiveness

When applicants file an RCE with this examiner, 29.2% of applications are subsequently allowed. This success rate is in the 45% percentile among all examiners. Strategic Insight: RCEs show below-average effectiveness with this examiner. Carefully evaluate whether an RCE or continuation is the better strategy.

After-Final Amendment Practice

This examiner enters after-final amendments leading to allowance in 42.3% of cases where such amendments are filed. This entry rate is in the 58% percentile among all examiners. Strategic Recommendation: This examiner shows above-average receptiveness to after-final amendments. If your amendments clearly overcome the rejections and do not raise new issues, consider filing after-final amendments before resorting to an RCE.

Pre-Appeal Conference Effectiveness

When applicants request a pre-appeal conference (PAC) with this examiner, 40.0% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 34% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.

Appeal Withdrawal and Reconsideration

This examiner withdraws rejections or reopens prosecution in 71.4% of appeals filed. This is in the 53% percentile among all examiners. Of these withdrawals, 35.0% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows above-average willingness to reconsider rejections during appeals. The mandatory appeal conference (MPEP § 1207.01) provides an opportunity for reconsideration.

Petition Practice

When applicants file petitions regarding this examiner's actions, 34.8% are granted (fully or in part). This grant rate is in the 29% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.

Examiner Cooperation and Flexibility

Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 7% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.

Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 7% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.

Prosecution Strategy Recommendations

Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:

    Relevant MPEP Sections for Prosecution Strategy

    • MPEP § 713.10: Examiner interviews - available before Notice of Allowance or transfer to PTAB
    • MPEP § 714.12: After-final amendments - may be entered "under justifiable circumstances"
    • MPEP § 1002.02(c): Petitionable matters to Technology Center Director
    • MPEP § 1004: Actions requiring primary examiner signature (allowances, final rejections, examiner's answers)
    • MPEP § 1207.01: Appeal conferences - mandatory for all appeals
    • MPEP § 1214.07: Reopening prosecution after appeal

    Important Disclaimer

    Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.

    No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.

    Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.

    Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.