Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18760070 | CERAMIC SUSCEPTOR | July 2024 | May 2025 | Allow | 10 | 3 | 0 | No | No |
| 18652609 | MODULAR HIGH-FREQUENCY SOURCE | May 2024 | March 2026 | Allow | 22 | 3 | 0 | No | No |
| 18600219 | ELECTROSTATIC CHUCK WITH MULTIPLE RADIO FREQUENCY MESHES TO CONTROL PLASMA UNIFORMITY | March 2024 | September 2025 | Allow | 18 | 1 | 1 | Yes | No |
| 18442594 | SUBSTRATE PROCESSING APPARATUS | February 2024 | October 2025 | Allow | 20 | 1 | 1 | Yes | No |
| 18381222 | SUBSTRATE PROCESSING APPARATUS AND SHUTTER | October 2023 | July 2025 | Allow | 21 | 1 | 1 | Yes | No |
| 18381534 | FACEPLATE HAVING A CURVED SURFACE | October 2023 | August 2024 | Allow | 10 | 1 | 0 | Yes | No |
| 18456806 | METHODS AND SYSTEMS FOR INHIBITING PRECURSOR INTERACTIONS DURING RADICAL-ENHANCED ATOMIC LAYER DEPOSITION | August 2023 | January 2026 | Allow | 29 | 1 | 2 | No | No |
| 18205690 | VERTICALLY ADJUSTABLE PLASMA SOURCE | June 2023 | March 2025 | Allow | 21 | 1 | 1 | No | No |
| 18318861 | APPARATUS FOR PRODUCING A WAVEFORM | May 2023 | April 2025 | Allow | 23 | 3 | 0 | No | No |
| 18096104 | ABATEMENT AND STRIP PROCESS CHAMBER IN A LOAD LOCK CONFIGURATION | January 2023 | July 2024 | Allow | 18 | 1 | 1 | No | No |
| 18083173 | FACEPLATE HAVING A CURVED SURFACE | December 2022 | August 2023 | Allow | 8 | 1 | 0 | Yes | No |
| 18054547 | FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING | November 2022 | January 2026 | Allow | 38 | 1 | 2 | No | No |
| 17979099 | LID STACK FOR HIGH FREQUENCY PROCESSING | November 2022 | August 2023 | Allow | 9 | 1 | 0 | No | No |
| 17967035 | SUBSTRATE SUPPORTING UNIT AND A SUBSTRATE PROCESSING DEVICE INCLUDING THE SAME | October 2022 | August 2023 | Allow | 10 | 1 | 0 | No | No |
| 17963704 | PLASMA BAFFLE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME | October 2022 | February 2025 | Allow | 28 | 1 | 2 | Yes | No |
| 17960576 | SYSTEMS FOR COOLING RF HEATED CHAMBER COMPONENTS | October 2022 | September 2023 | Allow | 11 | 1 | 0 | No | No |
| 17950254 | SHOWERHEAD AND SUBSTRATE PROCESSING APPARATUS USING THE SAME | September 2022 | December 2025 | Allow | 39 | 1 | 1 | No | No |
| 17946189 | SYSTEM AND METHOD FOR REMOTE SENSING A PLASMA | September 2022 | December 2024 | Allow | 27 | 2 | 1 | Yes | No |
| 17911416 | SUBSTRATE PROCESSING APPARATUS | September 2022 | June 2025 | Allow | 33 | 1 | 0 | No | No |
| 17902745 | PLASMA TREATMENT APPARATUS, PLASMA TREATMENT METHOD, AND ORIGINAL PLATE MANUFACTURING METHOD | September 2022 | November 2025 | Allow | 38 | 1 | 1 | No | No |
| 17908781 | PLASMA PROCESSING APPARATUS | September 2022 | August 2025 | Allow | 35 | 1 | 0 | Yes | No |
| 17908414 | LINEAR ARRANGEMENT FOR SUBSTRATE PROCESSING TOOLS | August 2022 | November 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17896075 | GAS COOLED HIGH POWER CONNECTION ROD | August 2022 | March 2026 | Allow | 42 | 3 | 0 | No | No |
| 17885543 | APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA | August 2022 | October 2024 | Allow | 26 | 1 | 1 | Yes | No |
| 17819055 | PLASMA PROCESSING APPARATUS AND LID MEMBER | August 2022 | March 2025 | Allow | 31 | 1 | 0 | No | No |
| 17874929 | HIGH-POWER DENSITY RF REMOTE PLASMA SOURCE APPARATUS | July 2022 | November 2025 | Allow | 39 | 3 | 0 | No | No |
| 17759509 | GAS DISTRIBUTION FACEPLATE WITH OBLIQUE FLOW PATHS | July 2022 | February 2026 | Allow | 43 | 1 | 0 | No | No |
| 17872560 | PLASMA PROCESSING APPARATUS | July 2022 | July 2025 | Allow | 35 | 1 | 0 | No | No |
| 17869362 | PLASMA SOURCE AND PLASMA PROCESSING APPARATUS | July 2022 | August 2025 | Allow | 36 | 2 | 1 | Yes | No |
| 17792157 | MULTIZONE GAS DISTRIBUTION PLATE FOR TRENCH PROFILE OPTIMIZATION | July 2022 | April 2025 | Allow | 33 | 1 | 0 | Yes | No |
| 17859623 | PLASMA MONITORING APPARATUS AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME | July 2022 | August 2025 | Allow | 38 | 1 | 1 | Yes | No |
| 17788650 | SEMICONDUCTOR PROCESSING APPARATUS AND DIELECTRIC WINDOW CLEANING METHOD OF SEMICONDUCTOR PROCESSING APPARATUS | June 2022 | January 2025 | Allow | 31 | 1 | 1 | No | No |
| 17788142 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | June 2022 | February 2025 | Allow | 32 | 1 | 2 | Yes | No |
| 17787689 | ELECTRODE FIXING ASSEMBLY AND DRY ETCHING DEVICE | June 2022 | December 2025 | Allow | 42 | 1 | 0 | No | No |
| 17836648 | SUBSTRATE PROCESSING APPARATUS, PLURALITY OF ELECTRODES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | June 2022 | May 2024 | Allow | 23 | 2 | 1 | Yes | No |
| 17825561 | CONTAINER AND SUBSTRATE TREATING SYSTEM | May 2022 | October 2025 | Allow | 41 | 1 | 0 | No | No |
| 17752877 | SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | May 2022 | February 2026 | Allow | 45 | 1 | 1 | Yes | No |
| 17751048 | Plasma Processing Apparatus | May 2022 | June 2025 | Allow | 36 | 2 | 1 | No | No |
| 17747417 | ADJUSTMENT OF POWER AND FREQUENCY BASED ON THREE OR MORE STATES | May 2022 | December 2025 | Allow | 43 | 1 | 1 | Yes | No |
| 17744264 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | May 2022 | March 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17770599 | COATING METHOD AND FILM LAYER THEREOF, AND COATING FIXTURE AND APPLICATION THEREOF | April 2022 | September 2024 | Allow | 29 | 1 | 1 | Yes | No |
| 17721417 | SHOWERHEAD ASSEMBLY WITH HEATED SHOWERHEAD | April 2022 | August 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17720359 | ELECTRODE FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS | April 2022 | August 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17768060 | SUBSTRATE ROTATING APPARATUS | April 2022 | July 2024 | Allow | 27 | 1 | 0 | No | No |
| 17716853 | SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS | April 2022 | March 2025 | Allow | 36 | 3 | 0 | Yes | No |
| 17715453 | PLASMA PROCESSING SYSTEM | April 2022 | August 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17657999 | PLASMA GENERATION APPARATUS, DEPOSITION APPARATUS USING THE SAME, AND DEPOSITION METHOD | April 2022 | July 2023 | Allow | 15 | 1 | 1 | No | No |
| 17712046 | PLASMA SHOWERHEAD WITH IMPROVED UNIFORMITY | April 2022 | April 2025 | Allow | 37 | 1 | 0 | No | No |
| 17712055 | APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA | April 2022 | August 2024 | Allow | 29 | 1 | 0 | No | No |
| 17704582 | FILMS OF DESIRED COMPOSITION AND FILM PROPERTIES | March 2022 | March 2023 | Allow | 11 | 1 | 1 | No | No |
| 17704585 | FILMS OF DESIRED COMPOSITION AND FILM PROPERTIES | March 2022 | January 2023 | Allow | 10 | 1 | 1 | No | No |
| 17696067 | ETCHING APPARATUS AND ETCHING METHOD | March 2022 | January 2025 | Allow | 34 | 1 | 1 | Yes | No |
| 17641415 | PLASMA SYSTEM AND FILTER DEVICE | March 2022 | February 2023 | Allow | 12 | 1 | 0 | Yes | No |
| 17666906 | PAIRED DYNAMIC PARALLEL PLATE CAPACITIVELY COUPLED PLASMAS | February 2022 | December 2023 | Allow | 22 | 1 | 0 | Yes | No |
| 17577204 | SEMICONDUCTOR MANUFACTURING METHOD | January 2022 | October 2025 | Allow | 45 | 1 | 1 | Yes | No |
| 17565183 | ETCHING METHOD, PLASMA PROCESSING APPARATUS, AND PROCESSING SYSTEM | December 2021 | September 2025 | Allow | 44 | 1 | 1 | Yes | No |
| 17554269 | PLASMA REACTOR | December 2021 | July 2024 | Allow | 31 | 1 | 1 | No | No |
| 17540016 | FILM FORMING SYSTEM, METHOD FOR CONTROLLING FILM FORMING SYSTEM, AND ARTICLE MANUFACTURING METHOD | December 2021 | March 2024 | Allow | 27 | 1 | 1 | Yes | No |
| 17455994 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR CLEANING OFF DEPOSIT IN CHAMBER OF SAME | November 2021 | April 2024 | Allow | 29 | 1 | 1 | Yes | No |
| 17520212 | FRAME-INTEGRATED MASK | November 2021 | March 2025 | Abandon | 40 | 0 | 1 | No | No |
| 17516727 | CARRIER RING USED IN A DEPOSITION CHAMBER | November 2021 | June 2023 | Allow | 20 | 1 | 0 | Yes | No |
| 17505944 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | October 2021 | August 2023 | Allow | 22 | 1 | 0 | No | No |
| 17604231 | TREATMENT ASSEMBLY FOR TREATING THE SURFACE OF A BODY WITH A DIELECTRICALLY LIMITED PLASMA | October 2021 | May 2025 | Allow | 43 | 2 | 0 | No | No |
| 17497559 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | October 2021 | September 2024 | Allow | 35 | 1 | 1 | Yes | No |
| 17601911 | COOLING FOR A PLASMA-BASED REACTOR | October 2021 | January 2023 | Allow | 16 | 2 | 1 | No | No |
| 17494621 | PLASMA PROCESSING APPARATUS | October 2021 | February 2024 | Abandon | 29 | 1 | 0 | No | No |
| 17442136 | ACTIVE GAS GENERATION APPARATUS | September 2021 | January 2025 | Allow | 40 | 1 | 0 | No | No |
| 17483346 | Plasma Processing Methods Using Low Frequency Bias Pulses | September 2021 | April 2025 | Allow | 43 | 1 | 1 | Yes | No |
| 17478510 | SUBSTRATE PROCESSING APPARATUS, REACTION CONTAINER, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | September 2021 | July 2024 | Allow | 34 | 1 | 1 | No | No |
| 17472891 | PROCESSING APPARATUS AND PROCESSING METHOD | September 2021 | August 2024 | Allow | 35 | 3 | 1 | Yes | No |
| 17468935 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | September 2021 | September 2024 | Allow | 36 | 1 | 1 | No | No |
| 17305209 | CVD SYSTEM WITH FLANGE ASSEMBLY FOR FACILITATING UNIFORM AND LAMINAR FLOW | July 2021 | November 2024 | Allow | 40 | 2 | 0 | Yes | No |
| 17359318 | MODULAR HIGH-FREQUENCY SOURCE | June 2021 | January 2024 | Allow | 31 | 1 | 0 | Yes | No |
| 17418635 | ULTRA-LARGE AREA SCANNING REACTIVE ION ETCHING MACHINE AND ETCHING METHOD THEREOF | June 2021 | February 2025 | Allow | 43 | 4 | 0 | No | No |
| 17329883 | SUBSTRATE HALO ARRANGEMENT FOR IMPROVED PROCESS UNIFORMITY | May 2021 | May 2024 | Allow | 36 | 1 | 1 | Yes | No |
| 17324229 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING A SUBSTRATE | May 2021 | August 2023 | Allow | 27 | 1 | 1 | Yes | No |
| 17314486 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | May 2021 | July 2023 | Allow | 26 | 1 | 0 | No | No |
| 17232226 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | April 2021 | July 2023 | Allow | 27 | 1 | 0 | Yes | No |
| 17229122 | Microwave Plasma Source, Microwave Plasma Processing Apparatus and Plasma Processing Method | April 2021 | November 2023 | Allow | 31 | 1 | 0 | No | No |
| 17214772 | NANOSECOND PULSER RF ISOLATION FOR PLASMA SYSTEMS | March 2021 | July 2025 | Allow | 52 | 2 | 1 | No | No |
| 17279626 | SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD | March 2021 | August 2024 | Allow | 41 | 1 | 0 | Yes | No |
| 17275420 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | March 2021 | July 2024 | Allow | 40 | 1 | 1 | Yes | No |
| 17191383 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PLASMA GENERATOR | March 2021 | April 2024 | Allow | 37 | 1 | 1 | No | No |
| 17271433 | HOT FILAMENT CVD DEVICE | February 2021 | September 2023 | Allow | 31 | 1 | 0 | Yes | No |
| 17163523 | ETCHING APPARATUS AND ETCHING METHOD THEREOF | January 2021 | June 2022 | Allow | 17 | 2 | 1 | No | No |
| 17263256 | COMPACT HEAD AND COMPACT SYSTEM FOR VAPOR DEPOSITION | January 2021 | April 2024 | Allow | 39 | 1 | 0 | Yes | No |
| 17153459 | APPARATUS WITH OPTICAL CAVITY FOR DETERMINING PROCESS RATE | January 2021 | August 2024 | Abandon | 43 | 2 | 1 | No | No |
| 17258706 | REACTION CHAMBER AND PLASMA APPARATUS | January 2021 | March 2023 | Allow | 26 | 2 | 0 | Yes | No |
| 17135086 | METHOD TO PRINT ORGANIC ELECTRONICS WITHOUT CHANGING ITS PROPERTIES | December 2020 | September 2023 | Allow | 33 | 1 | 0 | Yes | No |
| 17134280 | VERTICALLY ADJUSTABLE PLASMA SOURCE | December 2020 | March 2023 | Allow | 26 | 1 | 1 | Yes | No |
| 17133612 | NANOSECOND PULSER RF ISOLATION FOR PLASMA SYSTEMS | December 2020 | September 2022 | Allow | 20 | 1 | 1 | Yes | No |
| 17113031 | MEASURING DEVICE, MEASURING METHOD, AND VACUUM PROCESSING APPARATUS | December 2020 | January 2024 | Allow | 38 | 1 | 1 | Yes | No |
| 16950179 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING SYSTEM | November 2020 | February 2024 | Allow | 39 | 1 | 0 | No | No |
| 17090863 | Sensor Apparatus and Plasma Ashing System | November 2020 | April 2023 | Abandon | 29 | 2 | 1 | No | No |
| 17090821 | METHOD TO CLEAN SNO2 FILM FROM CHAMBER | November 2020 | October 2023 | Allow | 36 | 1 | 1 | Yes | No |
| 17089041 | APPARATUS FOR MONITORING PULSED HIGH-FREQUENCY POWER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | November 2020 | August 2022 | Allow | 22 | 1 | 0 | No | No |
| 17084938 | PLASMA ETCHING METHOD | October 2020 | July 2024 | Allow | 45 | 2 | 1 | Yes | No |
| 17084103 | SYSTEMS FOR COOLING RF HEATED CHAMBER COMPONENTS | October 2020 | July 2022 | Allow | 20 | 1 | 0 | No | No |
| 17081709 | RADICAL-ACTIVATED ETCHING OF METAL OXIDES | October 2020 | November 2021 | Allow | 12 | 1 | 1 | Yes | No |
| 17079947 | GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND CONTROL METHOD FOR GAS SUPPLY SYSTEM | October 2020 | August 2022 | Allow | 22 | 1 | 0 | No | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner YU, YUECHUAN.
With a 33.3% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is below the USPTO average, indicating that appeals face more challenges here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 37.5% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is above the USPTO average, suggesting that filing an appeal can be an effective strategy for prompting reconsideration.
⚠ Appeals to PTAB face challenges. Ensure your case has strong merit before committing to full Board review.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner YU, YUECHUAN works in Art Unit 1718 and has examined 505 patent applications in our dataset. With an allowance rate of 65.9%, this examiner has a below-average tendency to allow applications. Applications typically reach final disposition in approximately 37 months.
Examiner YU, YUECHUAN's allowance rate of 65.9% places them in the 27% percentile among all USPTO examiners. This examiner has a below-average tendency to allow applications.
On average, applications examined by YU, YUECHUAN receive 2.22 office actions before reaching final disposition. This places the examiner in the 61% percentile for office actions issued. This examiner issues a slightly above-average number of office actions.
The median time to disposition (half-life) for applications examined by YU, YUECHUAN is 37 months. This places the examiner in the 32% percentile for prosecution speed. Prosecution timelines are slightly slower than average with this examiner.
Conducting an examiner interview provides a +18.9% benefit to allowance rate for applications examined by YU, YUECHUAN. This interview benefit is in the 62% percentile among all examiners. Recommendation: Interviews provide an above-average benefit with this examiner and are worth considering.
When applicants file an RCE with this examiner, 18.7% of applications are subsequently allowed. This success rate is in the 18% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 13.0% of cases where such amendments are filed. This entry rate is in the 13% percentile among all examiners. Strategic Recommendation: This examiner rarely enters after-final amendments compared to other examiners. You should generally plan to file an RCE or appeal rather than relying on after-final amendment entry. Per MPEP § 714.12, primary examiners have discretion in entering after-final amendments, and this examiner exercises that discretion conservatively.
When applicants request a pre-appeal conference (PAC) with this examiner, 28.6% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 30% percentile among all examiners. Note: Pre-appeal conferences show below-average success with this examiner. Consider whether your arguments are strong enough to warrant a PAC request.
This examiner withdraws rejections or reopens prosecution in 60.0% of appeals filed. This is in the 35% percentile among all examiners. Of these withdrawals, 33.3% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 46.7% are granted (fully or in part). This grant rate is in the 41% percentile among all examiners. Strategic Note: Petitions show below-average success regarding this examiner's actions. Ensure you have a strong procedural basis before filing.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 4% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 0.0% of allowed cases (in the 4% percentile). This examiner rarely issues Quayle actions compared to other examiners. Allowances typically come directly without a separate action for formal matters.
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.