Detailed information about the 100 most recent patent applications.
| Application Number | Title | Filing Date | Disposal Date | Disposition | Time (months) | Office Actions | Restrictions | Interview | Appeal |
|---|---|---|---|---|---|---|---|---|---|
| 18723129 | SUBSTRATE ROTATING APPARATUS, PROCESSING SYSTEM, AND PROCESSING METHOD | June 2024 | May 2025 | Allow | 11 | 1 | 0 | Yes | No |
| 18699311 | CHEMICAL VAPOR DEPOSITION DEVICE CAPABLE OF RECIPROCATING ROTATION AND LIFTING | April 2024 | November 2024 | Allow | 7 | 1 | 0 | No | No |
| 18692172 | APPARATUS FOR PLASMA SURFACE TREATMENT | March 2024 | April 2025 | Allow | 13 | 1 | 1 | Yes | No |
| 18414914 | SUBSTRATE SUPPORTING PLATE, THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME, AND THIN FILM DEPOSITION METHOD | January 2024 | December 2024 | Allow | 11 | 0 | 1 | No | No |
| 18402969 | SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND METHOD OF USING SAME | January 2024 | February 2025 | Allow | 14 | 1 | 0 | No | No |
| 18510680 | PLASMA PROCESSING APPARATUS, CALCULATION METHOD, AND CALCULATION PROGRAM | November 2023 | January 2025 | Allow | 14 | 2 | 0 | Yes | No |
| 18499589 | METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR PROCESSING APPARATUS, AND RECORDING MEDIUM | November 2023 | February 2025 | Allow | 15 | 1 | 1 | No | No |
| 18481886 | ELECTROSTATIC CHUCK FOR USE IN SEMICONDUCTOR PROCESSING | October 2023 | May 2025 | Allow | 19 | 2 | 0 | Yes | No |
| 18456589 | APPARATUS FOR PROCESSING SUBSTRATE | August 2023 | June 2025 | Abandon | 22 | 2 | 0 | Yes | No |
| 18356553 | COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING | July 2023 | March 2025 | Abandon | 20 | 2 | 0 | Yes | No |
| 18356579 | COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING | July 2023 | April 2025 | Abandon | 23 | 2 | 0 | Yes | No |
| 18207322 | GAS DISTRIBUTION SYSTEM AND REACTOR SYSTEM INCLUDING SAME | June 2023 | March 2024 | Allow | 9 | 1 | 0 | No | No |
| 18123153 | SUBSTRATE PEDESTAL INCLUDING BACKSIDE GAS-DELIVERY TUBE | March 2023 | April 2025 | Allow | 25 | 4 | 0 | Yes | No |
| 18100660 | SUBSTRATE LIFT MECHANISM AND REACTOR INCLUDING SAME | January 2023 | May 2024 | Allow | 15 | 1 | 0 | No | No |
| 18085583 | PLASMA PROCESSING APPARATUS | December 2022 | May 2025 | Allow | 29 | 0 | 0 | No | No |
| 17992995 | FAST RESPONSE PEDESTAL ASSEMBLY FOR SELECTIVE PRECLEAN | November 2022 | January 2024 | Allow | 13 | 1 | 0 | No | No |
| 17990481 | APPARATUS FOR PROCESSING A SUBSTRATE AND METHOD OF OPERATING THE SAME | November 2022 | April 2025 | Allow | 29 | 0 | 0 | Yes | No |
| 17985764 | HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING | November 2022 | December 2023 | Allow | 13 | 1 | 1 | Yes | No |
| 17958962 | PLASMA PROCESSING APPARATUS, CALCULATION METHOD, AND CALCULATION PROGRAM | October 2022 | August 2023 | Allow | 10 | 1 | 0 | No | No |
| 17956110 | PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF | September 2022 | January 2025 | Allow | 27 | 4 | 0 | Yes | No |
| 17889054 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | August 2022 | November 2023 | Allow | 15 | 1 | 1 | Yes | No |
| 17870893 | METHOD FOR PROCESSING SUBSTRATE | July 2022 | October 2023 | Allow | 15 | 1 | 0 | No | No |
| 17809096 | METHOD OF ETCHING FILM AND PLASMA PROCESSING APPARATUS | June 2022 | September 2024 | Allow | 27 | 0 | 0 | No | No |
| 17843652 | WAFER EDGE RING LIFTING SOLUTION | June 2022 | May 2024 | Allow | 23 | 2 | 1 | Yes | No |
| 17804027 | PLASMA PROCESSING APPARATUS | May 2022 | October 2024 | Allow | 29 | 1 | 0 | No | No |
| 17778923 | SUBSTRATE SUPPORT DEVICE FOR A REACTION CHAMBER OF AN EPITAXIAL REACTOR WITH GAS FLOW ROTATION, REACTION CHAMBER AND EPITAXIAL REACTOR | May 2022 | September 2024 | Allow | 28 | 4 | 1 | Yes | No |
| 17730967 | SUSCEPTORS WITH FILM DEPOSITION CONTROL FEATURES | April 2022 | April 2025 | Allow | 35 | 3 | 1 | Yes | Yes |
| 17768814 | STRUCTURAL BODY AND HEATING APPARATUS | April 2022 | August 2024 | Allow | 28 | 1 | 0 | Yes | No |
| 17766379 | PLASMA PROCESSING APPARATUS AND CEILING WALL | April 2022 | January 2025 | Allow | 34 | 1 | 0 | No | No |
| 17708217 | APPARATUS TRAPPING AN EXHAUST MATERIAL FROM A SUBSTRATE-PROCESSING PROCESS AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE TRAPPING APPARATUS | March 2022 | April 2025 | Allow | 37 | 1 | 1 | Yes | No |
| 17764141 | COMPONENT FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS INCLUDING COMPONENT | March 2022 | September 2024 | Allow | 30 | 1 | 0 | No | No |
| 17696361 | WORK PROCESSING APPARATUS | March 2022 | November 2024 | Allow | 32 | 1 | 0 | No | No |
| 17653180 | SEMICONDUCTOR MANUFACTURING APPARATUS | March 2022 | November 2024 | Abandon | 32 | 1 | 0 | No | No |
| 17682436 | METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR PROCESSING APPARATUS, AND RECORDING MEDIUM | February 2022 | July 2023 | Allow | 17 | 2 | 1 | No | No |
| 17681606 | BOTTOM AND MIDDLE EDGE RINGS | February 2022 | August 2024 | Allow | 30 | 4 | 0 | Yes | No |
| 17652243 | ELECTROSTATIC CHUCK FOR USE IN SEMICONDUCTOR PROCESSING | February 2022 | July 2023 | Allow | 16 | 1 | 0 | No | No |
| 17547303 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE | December 2021 | May 2025 | Allow | 41 | 1 | 1 | Yes | No |
| 17544139 | Cooled Shield for ICP Source | December 2021 | July 2024 | Allow | 32 | 1 | 1 | Yes | No |
| 17595928 | WINDOW FOR PLASMA OES DIAGNOSIS, AND PLASMA APPARATUS USING SAME | November 2021 | October 2024 | Allow | 34 | 1 | 0 | No | No |
| 17534329 | SUPPORT UNIT, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME AND TEMPERATURE CONTROL METHOD | November 2021 | September 2024 | Allow | 34 | 1 | 1 | Yes | No |
| 17455978 | SYSTEM AND METHOD FOR WAFER BREAKAGE PREVENTION | November 2021 | December 2024 | Abandon | 37 | 1 | 1 | No | No |
| 17520735 | SUBSTRATE PROCESSING APPARATUS | November 2021 | October 2024 | Abandon | 35 | 2 | 0 | No | No |
| 17520353 | SUBSTRATE SUPPORTING ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS | November 2021 | January 2025 | Allow | 38 | 4 | 0 | Yes | No |
| 17500494 | COOLING SHEET ATTACHMENT APPARATUS TO FOCUSING RING FOR SEMICONDUCTOR MANUFACTURING APPARATUS | October 2021 | October 2024 | Allow | 36 | 1 | 0 | Yes | No |
| 17601792 | VAPOR DEPOSITION DEVICE AND CARRIER USED IN SAME | October 2021 | June 2025 | Allow | 44 | 3 | 0 | Yes | No |
| 17438354 | LAMELLAR CERAMIC STRUCTURE | September 2021 | March 2025 | Allow | 42 | 4 | 0 | Yes | No |
| 17593081 | SUSCEPTOR ARRANGEMENT OF A CVD REACTOR | September 2021 | July 2024 | Allow | 34 | 2 | 0 | Yes | No |
| 17463834 | ELECTROSTATIC CHUCK APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS | September 2021 | August 2023 | Allow | 23 | 0 | 0 | No | No |
| 17408002 | METHOD AND APPARATUS TO ELIMINATE CONTAMINANT PARTICLES FROM AN ACCELERATED NEUTRAL ATOM BEAM AND THEREBY PROTECT A BEAM TARGET | August 2021 | December 2023 | Allow | 28 | 1 | 1 | Yes | No |
| 17397530 | PLASMA PROCESSING APPARATUS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | August 2021 | February 2025 | Allow | 42 | 3 | 1 | Yes | No |
| 17386191 | RECIPROCATING ROTARY CVD EQUIPMENT AND APPLICATION METHOD | July 2021 | February 2025 | Allow | 42 | 4 | 1 | Yes | No |
| 17423687 | APPARATUS FOR PROCESSING SUBSTRATE | July 2021 | December 2023 | Abandon | 29 | 1 | 0 | No | No |
| 17377079 | SEMICONDUCTOR WAFER CARRIER STRUCTURE AND METAL-ORGANIC CHEMICAL VAPOR DEPOSITION DEVICE | July 2021 | February 2025 | Abandon | 43 | 4 | 1 | Yes | No |
| 17355020 | SHIELDING MECHANISM AND SUBSTRATE-PROCESSING DEVICE WITH THE SAME | June 2021 | November 2023 | Abandon | 28 | 1 | 0 | No | No |
| 17353643 | SUBSTRATE SUPPORT WITH MULTIPLE EMBEDDED ELECTRODES | June 2021 | March 2024 | Abandon | 33 | 2 | 1 | No | No |
| 17311599 | SUSCEPTOR OF A CVD REACTOR | June 2021 | February 2025 | Allow | 44 | 2 | 1 | Yes | No |
| 17242150 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | April 2021 | December 2024 | Allow | 43 | 2 | 1 | Yes | No |
| 17231299 | METHOD OF FORMING AN ENHANCED UNEXPOSED PHOTORESIST LAYER | April 2021 | October 2024 | Allow | 43 | 2 | 0 | No | No |
| 17230047 | INJECTOR CONFIGURED FOR ARRANGEMENT WITHIN A REACTOR OF A VERTICAL FURNACE AND VERTICAL FURNACE | April 2021 | June 2025 | Allow | 50 | 3 | 0 | Yes | No |
| 17221891 | PLASMA PROCESSING EQUIPMENT | April 2021 | July 2023 | Allow | 28 | 1 | 1 | Yes | No |
| 17219316 | STAGE, FILM-FORMING APPARATUS, AND FILM-PROCESSING APPARATUS | March 2021 | September 2024 | Allow | 42 | 3 | 0 | Yes | No |
| 17218882 | LEVEL MONITORING AND ACTIVE ADJUSTMENT OF A SUBSTRATE SUPPORT ASSEMBLY | March 2021 | October 2024 | Allow | 42 | 4 | 1 | Yes | Yes |
| 17211951 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | March 2021 | May 2022 | Allow | 14 | 2 | 1 | Yes | No |
| 17209259 | COATING PROCESSES FOR VACUUM CHAMBER ARRANGEMENTS AND APPARATUS THEREOF | March 2021 | January 2023 | Allow | 22 | 0 | 0 | No | No |
| 17202131 | METHOD AND APPARATUS FOR SELECTIVE NITRIDATION PROCESS | March 2021 | October 2022 | Allow | 19 | 0 | 0 | Yes | No |
| 17200981 | MAGAZINE SUPPORTING EQUIPMENT AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING THE SAME | March 2021 | November 2023 | Allow | 32 | 1 | 1 | Yes | No |
| 17186873 | SUBSTRATE SUPPORT WITH MULTIPLE EMBEDDED ELECTRODES | February 2021 | September 2024 | Allow | 43 | 4 | 1 | Yes | Yes |
| 17167820 | MULTIPLE TEMPERATURE RANGE SUSCEPTOR, ASSEMBLY, REACTOR AND SYSTEM INCLUDING THE SUSCEPTOR, AND METHODS OF USING THE SAME | February 2021 | June 2023 | Allow | 28 | 2 | 0 | No | No |
| 17263078 | LIFT THIMBLE SYSTEM, REACTION CHAMBER, AND SEMICONDUCTOR PROCESSING EQUIPMENT | January 2021 | February 2023 | Allow | 25 | 1 | 1 | No | No |
| 17151366 | SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY | January 2021 | January 2024 | Allow | 36 | 2 | 0 | Yes | No |
| 17145171 | EDGE RING AND SUBSTRATE PROCESSING APPARATUS | January 2021 | August 2024 | Abandon | 43 | 3 | 1 | No | No |
| 17250221 | ARRANGEMENT FOR MEASURING THE SURFACE TEMPERATURE OF A SUSCEPTOR IN A CVD REACTOR | December 2020 | April 2025 | Allow | 52 | 3 | 1 | Yes | No |
| 17113848 | CARRIER PLATE FOR USE IN PLASMA PROCESSING SYSTEMS | December 2020 | January 2023 | Allow | 25 | 1 | 0 | No | No |
| 17092599 | SUBSTRATE SUPPORTING PLATE, THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME, AND THIN FILM DEPOSITION METHOD | November 2020 | January 2024 | Allow | 38 | 1 | 1 | No | No |
| 17070821 | PLASMA ENHANCED CVD WITH PERIODIC HIGH VOLTAGE BIAS | October 2020 | May 2024 | Allow | 43 | 5 | 0 | No | No |
| 17033177 | PROCESS KIT WITH ADJUSTABLE TUNING RING FOR EDGE UNIFORMITY CONTROL | September 2020 | March 2023 | Allow | 60 | 1 | 1 | Yes | No |
| 17032099 | SUBSTRATE PROCESSING SYSTEM INCLUDING ELECTROSTATIC CHUCK AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK | September 2020 | May 2023 | Allow | 31 | 2 | 0 | No | No |
| 17042091 | APPARATUS FOR PROCESSING SUBSTRATE | September 2020 | August 2024 | Allow | 46 | 4 | 0 | Yes | No |
| 17021643 | COMPONENT FOR USE IN PLASMA PROCESSING APPARATUS, PLASMA PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING THE COMPONENT | September 2020 | June 2022 | Allow | 21 | 1 | 0 | No | No |
| 17017487 | EDGE RING AND PLASMA PROCESSING APPARATUS | September 2020 | August 2023 | Allow | 35 | 2 | 1 | Yes | No |
| 17000701 | METHOD AND DEVICE TO REDUCE EPITAXIAL DEFECTS DUE TO CONTACT STRESS UPON A SEMICONDCUTOR WAFER | August 2020 | December 2024 | Allow | 52 | 5 | 1 | Yes | No |
| 16944271 | SUBSTRATE LIFT MECHANISM AND REACTOR INCLUDING SAME | July 2020 | October 2022 | Allow | 26 | 1 | 0 | No | No |
| 16965419 | SAMPLE HOLDER | July 2020 | December 2022 | Allow | 29 | 1 | 0 | Yes | No |
| 16939683 | Thermal Reflector Device for Semiconductor Fabrication Tool | July 2020 | December 2022 | Allow | 29 | 2 | 0 | No | No |
| 16939160 | SHEATH AND TEMPERATURE CONTROL OF PROCESS KIT | July 2020 | September 2023 | Allow | 38 | 3 | 1 | Yes | No |
| 16960818 | REPLACEABLE AND/OR COLLAPSIBLE EDGE RING ASSEMBLIES FOR PLASMA SHEATH TUNING INCORPORATING EDGE RING POSITIONING AND CENTERING FEATURES | July 2020 | June 2023 | Allow | 35 | 2 | 1 | Yes | No |
| 16918299 | SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | July 2020 | October 2023 | Allow | 40 | 3 | 1 | Yes | No |
| 16903505 | DEPOSITION SYSTEM WITH VACUUM PRE-LOADED DEPOSITION HEAD | June 2020 | August 2022 | Allow | 26 | 2 | 0 | Yes | No |
| 16878582 | HEATING APPARATUS AND CHEMICAL VAPOR DEPOSITION SYSTEM | May 2020 | November 2023 | Abandon | 42 | 3 | 0 | Yes | No |
| 16878443 | SEMICONDUCTOR REACTION CHAMBER SHOWERHEAD | May 2020 | July 2022 | Allow | 26 | 4 | 0 | No | No |
| 16871567 | SUBSTRATE PROCESSING APPARATUS | May 2020 | August 2023 | Abandon | 39 | 2 | 1 | No | No |
| 16868539 | HEATING APPARATUS AND CHEMICAL VAPOR DEPOSITION SYSTEM | May 2020 | November 2022 | Allow | 30 | 2 | 0 | Yes | No |
| 16864282 | SEMICONDUCTOR MANUFACTURING DEVICE MEMBER, METHOD FOR MANUFACTURING THE SAME, AND FORMING DIE | May 2020 | April 2024 | Abandon | 48 | 4 | 1 | Yes | No |
| 16863835 | SUBSTRATE PEDESTAL INCLUDING BACKSIDE GAS-DELIVERY TUBE | April 2020 | December 2022 | Allow | 31 | 3 | 1 | Yes | No |
| 16852154 | APPARATUS, SYSTEMS, AND METHODS OF MEASURING EDGE RING DISTANCE FOR THERMAL PROCESSING CHAMBERS | April 2020 | October 2023 | Allow | 45 | 2 | 1 | Yes | No |
| 16848211 | SUBSTRATE PROCESSING APPARATUS | April 2020 | October 2023 | Abandon | 43 | 3 | 1 | Yes | No |
| 16834132 | WAFER INSPECTION APPARATUSES | March 2020 | February 2023 | Allow | 34 | 1 | 0 | Yes | No |
| 16834597 | ELECTROSTATIC HOLDING APPARATUS WITH A LAYERED COMPOSITE ELECTRODE DEVICE AND METHOD FOR THE PRODUCTION THEREOF | March 2020 | July 2022 | Allow | 28 | 1 | 0 | No | No |
| 16825352 | VACUUM CHUCK, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME AND RELATED METHOD OF MANUFACTURE | March 2020 | August 2022 | Allow | 29 | 1 | 0 | Yes | No |
| 16823462 | Temperature control roller, transporting arrangement and vacuum arrangement | March 2020 | September 2022 | Allow | 30 | 2 | 1 | Yes | No |
This analysis examines appeal outcomes and the strategic value of filing appeals for examiner BENNETT, CHARLEE.
With a 50.0% reversal rate, the PTAB reverses the examiner's rejections in a meaningful percentage of cases. This reversal rate is above the USPTO average, indicating that appeals have better success here than typical.
Filing a Notice of Appeal can sometimes lead to allowance even before the appeal is fully briefed or decided by the PTAB. This occurs when the examiner or their supervisor reconsiders the rejection during the mandatory appeal conference (MPEP § 1207.01) after the appeal is filed.
In this dataset, 48.7% of applications that filed an appeal were subsequently allowed. This appeal filing benefit rate is in the top 25% across the USPTO, indicating that filing appeals is particularly effective here. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
✓ Appeals to PTAB show good success rates. If you have a strong case on the merits, consider fully prosecuting the appeal to a Board decision.
✓ Filing a Notice of Appeal is strategically valuable. The act of filing often prompts favorable reconsideration during the mandatory appeal conference.
Examiner BENNETT, CHARLEE works in Art Unit 1718 and has examined 505 patent applications in our dataset. With an allowance rate of 54.3%, this examiner allows applications at a lower rate than most examiners at the USPTO. Applications typically reach final disposition in approximately 43 months.
Examiner BENNETT, CHARLEE's allowance rate of 54.3% places them in the 10% percentile among all USPTO examiners. This examiner is less likely to allow applications than most examiners at the USPTO.
On average, applications examined by BENNETT, CHARLEE receive 3.05 office actions before reaching final disposition. This places the examiner in the 96% percentile for office actions issued. This examiner issues more office actions than most examiners, which may indicate thorough examination or difficulty in reaching agreement with applicants.
The median time to disposition (half-life) for applications examined by BENNETT, CHARLEE is 43 months. This places the examiner in the 3% percentile for prosecution speed. Applications take longer to reach final disposition with this examiner compared to most others.
Conducting an examiner interview provides a +39.0% benefit to allowance rate for applications examined by BENNETT, CHARLEE. This interview benefit is in the 88% percentile among all examiners. Recommendation: Interviews are highly effective with this examiner and should be strongly considered as a prosecution strategy. Per MPEP § 713.10, interviews are available at any time before the Notice of Allowance is mailed or jurisdiction transfers to the PTAB.
When applicants file an RCE with this examiner, 11.7% of applications are subsequently allowed. This success rate is in the 3% percentile among all examiners. Strategic Insight: RCEs show lower effectiveness with this examiner compared to others. Consider whether a continuation application might be more strategic, especially if you need to add new matter or significantly broaden claims.
This examiner enters after-final amendments leading to allowance in 28.1% of cases where such amendments are filed. This entry rate is in the 31% percentile among all examiners. Strategic Recommendation: This examiner shows below-average receptiveness to after-final amendments. You may need to file an RCE or appeal rather than relying on after-final amendment entry.
When applicants request a pre-appeal conference (PAC) with this examiner, 88.9% result in withdrawal of the rejection or reopening of prosecution. This success rate is in the 65% percentile among all examiners. Strategic Recommendation: Pre-appeal conferences show above-average effectiveness with this examiner. If you have strong arguments, a PAC request may result in favorable reconsideration.
This examiner withdraws rejections or reopens prosecution in 68.9% of appeals filed. This is in the 49% percentile among all examiners. Of these withdrawals, 41.9% occur early in the appeal process (after Notice of Appeal but before Appeal Brief). Strategic Insight: This examiner shows below-average willingness to reconsider rejections during appeals. Be prepared to fully prosecute appeals if filed.
When applicants file petitions regarding this examiner's actions, 72.7% are granted (fully or in part). This grant rate is in the 88% percentile among all examiners. Strategic Note: Petitions are frequently granted regarding this examiner's actions compared to other examiners. Per MPEP § 1002.02(c), various examiner actions are petitionable to the Technology Center Director, including prematureness of final rejection, refusal to enter amendments, and requirement for information. If you believe an examiner action is improper, consider filing a petition.
Examiner's Amendments: This examiner makes examiner's amendments in 0.0% of allowed cases (in the 3% percentile). This examiner rarely makes examiner's amendments compared to other examiners. You should expect to make all necessary claim amendments yourself through formal amendment practice.
Quayle Actions: This examiner issues Ex Parte Quayle actions in 1.5% of allowed cases (in the 61% percentile). This examiner issues Quayle actions more often than average when claims are allowable but formal matters remain (MPEP § 714.14).
Based on the statistical analysis of this examiner's prosecution patterns, here are tailored strategic recommendations:
Not Legal Advice: The information provided in this report is for informational purposes only and does not constitute legal advice. You should consult with a qualified patent attorney or agent for advice specific to your situation.
No Guarantees: We do not provide any guarantees as to the accuracy, completeness, or timeliness of the statistics presented above. Patent prosecution statistics are derived from publicly available USPTO data and are subject to data quality limitations, processing errors, and changes in USPTO practices over time.
Limitation of Liability: Under no circumstances will IronCrow AI be liable for any outcome, decision, or action resulting from your reliance on the statistics, analysis, or recommendations presented in this report. Past prosecution patterns do not guarantee future results.
Use at Your Own Risk: While we strive to provide accurate and useful prosecution statistics, you should independently verify any information that is material to your prosecution strategy and use your professional judgment in all patent prosecution matters.